WO2003002784A2 - Electrolysis cell for restoring the concentration of metal ions in electroplating processes - Google Patents

Electrolysis cell for restoring the concentration of metal ions in electroplating processes Download PDF

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Publication number
WO2003002784A2
WO2003002784A2 PCT/EP2002/007182 EP0207182W WO03002784A2 WO 2003002784 A2 WO2003002784 A2 WO 2003002784A2 EP 0207182 W EP0207182 W EP 0207182W WO 03002784 A2 WO03002784 A2 WO 03002784A2
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WO
WIPO (PCT)
Prior art keywords
cell
metal
electroplating
compartment
enrichment
Prior art date
Application number
PCT/EP2002/007182
Other languages
French (fr)
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WO2003002784A3 (en
Inventor
Ulderico Nevosi
Paolo Rossi
Original Assignee
De Nora Elettrodi S.P.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De Nora Elettrodi S.P.A. filed Critical De Nora Elettrodi S.P.A.
Priority to US10/482,089 priority Critical patent/US7264704B2/en
Priority to KR1020037017138A priority patent/KR100954069B1/en
Priority to DE60230061T priority patent/DE60230061D1/en
Priority to JP2003508745A priority patent/JP2004536222A/en
Priority to CA002449512A priority patent/CA2449512C/en
Priority to EP02751092A priority patent/EP1458905B8/en
Priority to AU2002352504A priority patent/AU2002352504A1/en
Priority to BRPI0210684A priority patent/BRPI0210684B1/en
Publication of WO2003002784A2 publication Critical patent/WO2003002784A2/en
Publication of WO2003002784A3 publication Critical patent/WO2003002784A3/en

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/22Regeneration of process solutions by ion-exchange
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/18Regeneration of process solutions of electrolytes

Definitions

  • the positively polarised anode is thus progressively consumed, releasing cations which migrate under the action of the electric field and deposit on the negatively polarised cathodic surface.
  • this process is almost always advantageous in terms of energetic consumption, being characterised by a reversible potential difference close to zero, some definitely negative characteristics make it inconvenient especially when continuous deposited layers having very uniform thickness are desired; the most evident of such characteristics is the progressive variation in the interelectrodic gap due to the anode consumption, usually compensated by means of sophisticated mechanisms.
  • the anodic surface consumption invariably presents a non fully homogeneous profile, affecting the distribution of the lines of current and therefore the quality of the deposit at the cathode.
  • anodes are constituted of valve metals coated with an
  • electrocatalytic layer for instance noble metal oxide coated titanium
  • the direct chemical dissolution of a metal is not always a feasible or easy operation: in some cases of industrial relevance, for instance in the case of copper, simple thermodynamic considerations indicate that a direct dissolution in acid with evolution of hydrogen is not possible, as the reversible potential of the couple Cu(0)/Cu(ll) is more noble (+0.153 V) than the one of the couple HJH * ; for this reason, the baths for copper plating are often prepared by dissolution of copper oxide, that nevertheless has a cost which is prohibitive for the majority of the applications of industrial relevance.
  • the first one is described in the European Patent 0 508 212, relating to a process of copper plating of a steel wire in alkaline environment with insoluble -anode, wherein the electrolyte, based on potassium pyrophosphate forming an anionic complex with copper, is recirculated through the anodic compartment of an enrichment cell, separated from the relative cathodic compartment by means
  • the acidic baths are less subject to metal precipitation inside the membranes and permit to operate at higher current densities with respect to alkaline baths, wherein as already said, the metal species, being present as an anionic complex, is subject to severe limitations of diffusive type.
  • the present invention is aimed at providing an integrated system of galvanic
  • the present invention is directed to an integrated system of galvanic electroplating cell of the insoluble anode type hydraulically connected to an enrichment cell, which may be operated with acidic electrolytes, characterised in that the balance of all the chemical species is self-regulating, and that no auxiliary supply of material is required except the possible addition of water.
  • the invention consists in an insoluble anode electroplating cell integrated with a two-compartment enrichment cell fed with an acidic electrolyte divided by at least one separator consisting of a cation-exchange membrane.
  • the two compartments of the enrichment cell may act alternately as anodic or cathodic compartments.
  • the metal is deposited from the corresponding cation onto a cathodically
  • the dissolution or enrichment cell provides in a self-regulating way, for
  • the cation exchange membrane in the enrichment cell is also constant.
  • the metal whose concentration is to be restored is dissolved in the
  • the metal fraction migrating through' the ion-exchange membrane deposits onto the cathode of the enrichment cell, from where it will be recovered in the subsequent current potential reversal cycle of the two compartments.
  • the remaining current fraction 85-98% of the total current is directed to the transport of hydrogen ions from the anodic compartment to the cathodic compartment of the enrichment cell.
  • the hydrogen ions discharge at the cathode, where hydrogen is evolved;
  • the anolyte of the enrichment cell is electrolyte of the electroplating cell
  • the enrichment cell also the consumption of the excess acidity produced in the electroplating cell takes place.
  • (1) indicates the continuous electroplating cell with insoluble anode
  • (2) indicates the enrichment cell hydraulically connected to the same.
  • the described electroplating treatment refers to a conductive matrix (3) suitable for undergoing the plating process for the metal deposition under continuous cycle, for example a strip or a wire; however, as it will be soon evident from the description, the same considerations apply to pieces subjected to discontinuous-type operation.
  • the matrix (3) is in electrical contact with a cylinder (4) or equivalent electrically conductive and negatively polarised structure.
  • the counter- electrode is an insoluble anode (5), positively polarised.
  • the anode (5) may be made, for example, of a titanium substrate coated by a platinum group metal oxide, or more generally by a conductive substrate non corrodible by the electrolytic bath under the process conditions, coated by a material electrocatalytic towards the oxygen evolution half-reaction.
  • electroplating cell (1) is divided by a cation-exchange membrane (6) into a
  • cathodic compartment (9) provided with a cathode (7) and an anodic
  • anode (8) made of the metal which has to be deposited on the matrix to be coated (3).
  • the anode (8) may
  • the anodic compartment (10) is fed with the solution to be enriched coming from the electroplating cell (1) through the inlet duct (11); the enriched solution is in turn recirculated from the anodic compartment (10) of the enrichment cell (2) to the electroplating cell (1) through the outlet duct (12).
  • the process occurs according to the following scheme: conductive matrix (3) M 2+ + z e * -» M
  • separator (6) selected to divide the compartments (9) and (10) is a cationic
  • the ratio between the portion of the effective current used for the hydrogen ion transport and the total current is defined as the hydrogen ion transport number and it depends on the equilibrium, which is a function of the concentrations of the two competing ions, on the nature of the metal cation, on the current density and on other electrochemical and fluid dynamic parameters, which are usually fixed.
  • a hydrogen ion transport number comprised between 0.85 and 0.98 is typical of the main electroplating process in acidic baths, for example copper and tin
  • metal M is a parasitic process, which causes the decrease of the overall
  • valve metals preferably titanium and zirconium
  • stainless steel for example AISI 316 and AISI 316 L
  • a suitable conductive film optionally coated by a suitable conductive film according to the prior art teachings.
  • the cathodic (9) and anodic (10) compartments of the enrichment cell (2) are temporarily interchangeable, it is convenient to act also on the hydraulic connections between the two cells (1) and (2).
  • the ducts (11 ) and (12) must be switched to the original cathodic compartment (9), which upon current reversal becomes the anodic compartment.
  • the electroplating cell (1 ) must preferably always be in hydraulic connection with the enrichment cell compartment (2) which is time by time anodically polarised, in order to guarantee the self-regulation of the concentrations of
  • compartment shows how, by means of said half-reaction, for each mole M of
  • the water concentration may be
  • the disclosed general scheme can be further implemented with other expedients known to the experts of the field, for instance by delivering the oxygen, which evolves at the anode (5) of the electroplating cell (1), to the cathodic compartment (9) of the enrichment cell (2), to eliminate the hydrogen discharge in the latter and depolarise the overall process with back production of water; in this way a remarkable energy saving is obtained
  • bivalent tin (40 g/l) and organic additives employing as anode a positively polarised titanium sheet, coated with indium and tantalum oxides, directed to the oxygen evolution half-reaction.
  • An enrichment cell has been equipped with a titanium cathode in the form of a flattened expanded sheet provided with a conductive coating and a consumable anode of tin beads, confined by means of a positively polarised titanium expanded mesh basket provided with an electrically conductive film.
  • the exhaust electrolytic bath, recycled from the electroplating cell has been used as anolyte and a methansulphonic acid solution at low concentration of stannous ions, as the catholyte.
  • the catholyte and the anolyte of the enrichment cell have been divided by means of Nafion ® 324 cation-exchange sulphonic membrane, produced by DuPont de Nemours, U.S.A.
  • a steel wire was subjected to a copper plating process in an electroplating cell containing a bath of sulphuric acid (120 g/l), cupric sulphate (50 g/l) and
  • organic additives according to the prior art, using as the anode a positively polarised titanium sheet, coated with iridium and tantalum oxides, deputed to the oxygen evolution half-reaction.
  • An enrichment cell fed at the anodic compartment with the exhaust electrolytic bath coming from the electroplating cell, has been equipped with an AISI 316 stainless steel cathode and a consumable anode of copper shavings, confined by means of a positively polarised titanium mesh basket provided with a conductive coating and enclosed in a highly porous filtering cloth.
  • AISI 316 stainless steel cathode and a consumable anode of copper shavings, confined by means of a positively polarised titanium mesh basket provided with a conductive coating and enclosed in a highly porous filtering cloth.
  • Nafion ® 324 produced by DuPont de Nemours, U.S.A. utilising a current density of 4.55 kA/m 2 in the enrichment cell, a continuous copper plating of
  • the steel wire could be carried out for an overall duration of one week with a faradic efficiency of 88%, without any intervention besides the progressive

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)

Abstract

It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as coppere, or metals with high hydrogen overpotential, for example tin, aimed at restoring both the concentration of said metals, and the Ph in galvanic baths used in electroplating processes with insoluble anodes. The cell of the invention comprises an anodic compartment, wherein the metal to be dissolved acts as a consumable anode, and a cathodic compartment, containing a cathode for hydrogen evolution, separated by a cation-exchange membrane. The coupling of the cell of the invention with the electroplating cell allows a strong simplification of the overall process and a sensible reduction in the relevant costs.

Description

ELECTROLYSIS CELL FOR RESTORING THE CONCENTRATION OF METAL IONS IN ELECTROPLATING PROCESSES DESCRIPTION OF THE INVENTION
The processes of galvanic electroplating with insoluble anodes are increasingly more widespread for the considerable simplicity of their management with respect to the traditional processes with consumable anodes, also due to the recent improvements obtained in the formulation of dimensionally stable anodes for oxygen evolution both in acidic and in alkaline environments. In the traditional processes of galvanic plating, the conductive surface to be coated is employed as the cathode in an electrolytic process carried out in an undivided cell wherein the concentration of the metal ions to be deposited is kept constant by means of the dissolution of a soluble anode under different forms (plates, shavings, spheroids, and so on).
The positively polarised anode is thus progressively consumed, releasing cations which migrate under the action of the electric field and deposit on the negatively polarised cathodic surface. Although this process is almost always advantageous in terms of energetic consumption, being characterised by a reversible potential difference close to zero, some definitely negative characteristics make it inconvenient especially when continuous deposited layers having very uniform thickness are desired; the most evident of such characteristics is the progressive variation in the interelectrodic gap due to the anode consumption, usually compensated by means of sophisticated mechanisms. Furthermore, the anodic surface consumption invariably presents a non fully homogeneous profile, affecting the distribution of the lines of current and therefore the quality of the deposit at the cathode.
In most of the cases, the anode must be replaced once a consumption of 70-
80% is reached; then, a new drawback arises, due to the fact that it is nearly
always necessary to shut-down the process to allow for the replacement, especially in the case, very frequent indeed, that the anode be hardly
accessible. All of this implies higher maintenance costs and loss of productivity, particularly for the continuous cycle manufacturing systems (such as coating of wires, tapes, rods, bars and so on). For the above reasons, in most of the cases it would be desirable to resort to an electroplating cell wherein the metal to be deposited is entirely supplied in ionic form into the electrolyte, and wherein the anode is of the insoluble type, with a geometry which can be optimised, so as to fix the preferred interelectrodic gap to guarantee a quality and homogeneity of the deposit appropriate for the most critical applications, suitable for continuous operations
For this purpose, as the vast majority of the galvanic applications is carried out in an aqueous solution, the use of an electrode suitable to withstand, as the anodic half-reaction, the evolution of oxygen, is convenient. The most
commonly employed anodes are constituted of valve metals coated with an
electrocatalytic layer (for instance noble metal oxide coated titanium), as is
the case of the DSA® anodes commercialised by De Nora Elettrodi S.p.A,
Italy. To maintain a constant concentration of the ion to be deposited in the
electrolytic bath, it is necessary however to continuously supply a solution of
the same to the electroplating cell, accurately monitoring its concentration.
Obtaining the metal in a solution may be a problem in some cases, in
particular, for the majority of the galvanic applications, the added value of
the production is too low to allow the use of oxides or carbonates of adequate purity, and cost considerations demand to directly dissolve the metal to be deposited in an acidic solution.
The direct chemical dissolution of a metal is not always a feasible or easy operation: in some cases of industrial relevance, for instance in the case of copper, simple thermodynamic considerations indicate that a direct dissolution in acid with evolution of hydrogen is not possible, as the reversible potential of the couple Cu(0)/Cu(ll) is more noble (+0.153 V) than the one of the couple HJH*; for this reason, the baths for copper plating are often prepared by dissolution of copper oxide, that nevertheless has a cost which is prohibitive for the majority of the applications of industrial relevance. In other cases it is instead a kinetic type obstacle which makes the direct chemical dissolution problematic; in the case of zinc, for example, even if the reversible potential of the couple Zn(0)/Zn(ll) (-0.76 V) is significantly more negative than the one of the couple Hg/H*. the kinetic penalty of the hydrogen
evolution reaction on the surface of the relevant metal (hydrogen
overpotential) is high enough to inhibit its dissolution, or in any case to make
it proceeding at unacceptable velocity for applications of industrial
relevance. A similar consideration holds true also for tin and lead. This kind of problem may be avoided by acting externally on the electric potential of
the metal to be dissolved, namely carrying out the dissolution in a separate
electrolytic cell (dissolution or enrichment cell) wherein said metal is
anodically polarised so that it may be released in the solution in ionic form,
with concurrent evolution of hydrogen at the cathode. The compartment of such cell must be evidently divided by a suitable separator, to avoid that the
cations released by the metal migrate towards the cathode depositing again on its surface under the effect of the electric field. The prior art discloses two
different embodiments based on said concept; the first one is described in the European Patent 0 508 212, relating to a process of copper plating of a steel wire in alkaline environment with insoluble -anode, wherein the electrolyte, based on potassium pyrophosphate forming an anionic complex with copper, is recirculated through the anodic compartment of an enrichment cell, separated from the relative cathodic compartment by means
of a cation-exchange membrane. Such device provides for continuously restoring the concentration of copper in the electrolytic bath, but the cupric anionic complex formed in the reaction alkaline environment involves some
drawbacks. In particular, the copper released into the solution in the enrichment cell is mostly but not totally engaged in the pyrophosphate
complex. The fraction of copper present in cationic form, even if small, binds
to the functional groups of the membrane itself making its ionic conductivity
decrease dramatically. A further fraction tends then to precipitate inside the
membrane itself in the form of hydrate oxide crystals, extremely dangerous
for the structural integrity of the membrane itself. Finally, in EP 0 508 212 an unwelcome process complication is made
evident, as the electroplating cell tends to be depleted of hydrogen ions
(consumed at the anodic compartment), which must be re-established
through the addition of potassium hydroxide formed in the catholyte of the
enrichment cell. Such re-establishment of the alkalinity requires a
continuous monitoring, implying an increase in the costs both of the system
and its management.
In those cases where the matrix to be coated inside the electroplating cell makes it possible, it may be convenient carrying out the process in an acidic environment rather than in an alkaline environment. In this way, the metal involved in the process is in any case entirely present in the cationic form but the possibilities that it may either bind to the functional groups of the membrane in the dissolution cell or precipitate inside the same, are drastically reduced. The use of an acidic bath, as an alternative to the alkaline bath, is foreseen in a second embodiment of the prior art, described in the international patent application WO 01/92604 whose content is incorporated herein as a reference. In said embodiment, the separator used in the dissolution cell is an anion-exchange membrane,. and in principle there is no limitation to the use of acidic or alkaline baths, as disclosed in the description. The process of WO 01/92604 has the advantage of being completely self-regulating; however, the industrial applications carried out so
far according to the teachings of WO 01/92604 relate to the use in alkaline
environment, even if in principle the process could be likewise applied to an
acidic bath. In fact, although the recent developments in the field of anion- exchange membranes may prospect future improvements in this direction,
today said membrane exhibit an unsatisfactory selectivity in acidic
environments as concerns anion migration, which ideally should be nil, with
respect to cation migration. This situation constitutes quite an undesirable
limitation, as the use of acidic baths is sometimes necessary; in the first place, in some cases the alkaline baths are extremely toxic both for man and
the environment (as in the case of cyanide baths, which constitute the most common types of alkaline baths for many metals), in the second place, the acidic baths are less subject to metal precipitation inside the membranes and permit to operate at higher current densities with respect to alkaline baths, wherein as already said, the metal species, being present as an anionic complex, is subject to severe limitations of diffusive type. Further, in many cases, it is convenient inserting the dissolution cells in existing galvanic plants, where previously dissolution methods, obsolete or less convenient, were utilised, such as for examples, the dissolution in the acidic bath of oxides or carbonates of the metal. In these cases, usually it is not permitted to change the type of bath, especially due to considerations of corrosion stability of the pre-existing materials; therefore, in those cases where acidic baths were used, it may be impossible integrating a dissolution cell suitable for operating in an alkaline environment.
It is therefore necessary to identify an enrichment cell configuration suitable
for coupling with metal electroplating cells capable of operating with acidic
baths and of overcoming the drawbacks of the prior art. It is further
necessary to detect a process for the operation of a dissolution cell coupled to a metal electroplating cell capable of operating in acidic baths in a
substantially self-regulated way.
The present invention is aimed at providing an integrated system of galvanic
electroplating cell of the insoluble anode type hydraulically connected with a dissolution or enrichment cell, overcoming the drawbacks of the prior art, in particular exploiting the non complete selectivity for the metallic
cation/hydrogen ion transport, typical of cation-exchange membranes.
In particular, the present invention is directed to an integrated system of galvanic electroplating cell of the insoluble anode type hydraulically connected to an enrichment cell, which may be operated with acidic electrolytes, characterised in that the balance of all the chemical species is self-regulating, and that no auxiliary supply of material is required except the possible addition of water.
The invention consists in an insoluble anode electroplating cell integrated with a two-compartment enrichment cell fed with an acidic electrolyte divided by at least one separator consisting of a cation-exchange membrane. In a preferred embodiment, the two compartments of the enrichment cell may act alternately as anodic or cathodic compartments. In the electroplating cell, the metal is deposited from the corresponding cation onto a cathodically
polarized matrix and at the same time oxygen is evolved at the anode which act as a counter-electrode, and consequently acidity is developed.
The dissolution or enrichment cell provides in a self-regulating way, for
restoring the deposited metal concentration and at the same time neutralises
the acidity formed in the electroplating cell. Said self-regulation is permitted by the fact that, under given electrochemical and fluid dynamic operating
conditions the ratio between metal ions and hydrogen ions migrating through
the cation exchange membrane in the enrichment cell is also constant. In
particular, the metal whose concentration is to be restored is dissolved in the
anodic compartment of the enrichment cell and recirculated to the
electroplating cell; a fraction of the metal (typically in the range of 2-15% of the total current, depending, as aforesaid, on the process conditions and
nature of the cation) migrates under the electric field effect through the cation-exchange membrane, without however precipitating inside the same or blocking the functional groups of the membrane itself due to the acidic environment. The metal fraction migrating through' the ion-exchange membrane deposits onto the cathode of the enrichment cell, from where it will be recovered in the subsequent current potential reversal cycle of the two compartments. The remaining current fraction (85-98% of the total current) is directed to the transport of hydrogen ions from the anodic compartment to the cathodic compartment of the enrichment cell. The hydrogen ions discharge at the cathode, where hydrogen is evolved;
accordingly, as the anolyte of the enrichment cell is electrolyte of the electroplating cell, in the enrichment cell also the consumption of the excess acidity produced in the electroplating cell takes place. To achieve a
stationary self-regulating condition it is only necessary to apply an excess
current density to the enrichment cell with respect to the electroplating
current, so that the metal dissolved at the anode is equivalent to the sum of the metal deposited in the electroplating cell and the metal migrating through
the membrane and re-deposited at the cathode of the enrichment cell.
The invention will be more readily understood making reference to the figure,
which shows the general layout of the process for the deposition and the
enrichment of a generic metal M present in the acidic bath in the form of a
cation with a charge z+.
Making reference to figure 1, (1) indicates the continuous electroplating cell with insoluble anode, (2) indicates the enrichment cell hydraulically connected to the same. The described electroplating treatment refers to a conductive matrix (3) suitable for undergoing the plating process for the metal deposition under continuous cycle, for example a strip or a wire; however, as it will be soon evident from the description, the same considerations apply to pieces subjected to discontinuous-type operation. The matrix (3) is in electrical contact with a cylinder (4) or equivalent electrically conductive and negatively polarised structure. The counter- electrode is an insoluble anode (5), positively polarised. The anode (5) may be made, for example, of a titanium substrate coated by a platinum group metal oxide, or more generally by a conductive substrate non corrodible by the electrolytic bath under the process conditions, coated by a material electrocatalytic towards the oxygen evolution half-reaction. The enrichment
cell (2), having the function of supplying the metal ions consumed in the
electroplating cell (1), is divided by a cation-exchange membrane (6) into a
cathodic compartment (9) provided with a cathode (7) and an anodic
compartment (10), provided with a soluble anode (8) made of the metal which has to be deposited on the matrix to be coated (3). The anode (8) may
be a planar sheet or another continuous element, or an assembly of
shavings, spheroids or other small pieces, in electric contact with a positively
polarised permeable conductive confining wall, for instance a web of non
corrodible material. In a preferred embodiment of the invention, the anodic
and cathodic compartments may be periodically reversed acting on the polarity of the electrodes and on the hydraulic connections; therefore the electrodic geometry must be such as to permit the current reversal. The anodic compartment (10) is fed with the solution to be enriched coming from the electroplating cell (1) through the inlet duct (11); the enriched solution is in turn recirculated from the anodic compartment (10) of the enrichment cell (2) to the electroplating cell (1) through the outlet duct (12). In the case of an electroplating in acidic environment of metal M from the cation M2+, the process occurs according to the following scheme: conductive matrix (3) M2+ + z e* -» M
- insoluble anode (5) z/2 H20 -» z/4 Oz + z H+ + z e"
The solution depleted of metal ions M2+ and enriched in acidity (for the anodic production of z H+), as afore said, is circulated through the duct (11)
in the anodic compartment (10) of the enrichment cell (2), wherein a soluble anode (8) made of positively polarised M metal, is oxidised according to:
(1+t) M → (1+t) M2++ (1+t) z e*
and the excess acidity is neutralised through the transport, shown in figure 1 ,
of hydrogen ions from the anodic compartment (10) to the cathodic compartment (9), of the enrichment cell (2). Such migration of hydrogen ions is made possible by the fact that the
separator (6) selected to divide the compartments (9) and (10) is a cationic
membrane; the driving force supporting the same is the electric field, to
which the contributions of osmotic pressure and diffusion add up.
The hydrogen ions migrating through the membrane (6) restore the pH of the bath circulating between the anodic compartment (10) of the enrichment
cell (2) and the electroplating ceil (1), without however affecting that of the cathodic compartment (9) of the enrichment cell (2), where they are discharged at the hydrogen evolving cathode. Not all of the electric current flowing in the enrichment cell (2) is directed to the transport of hydrogen ions; as shown in the figure, a minor fraction of the- same is necessarily dissipated in the transport of the metal ion M with a charge z+ through the membrane (6). The ratio between the portion of the effective current used for the hydrogen ion transport and the total current is defined as the hydrogen ion transport number and it depends on the equilibrium, which is a function of the concentrations of the two competing ions, on the nature of the metal cation, on the current density and on other electrochemical and fluid dynamic parameters, which are usually fixed. A hydrogen ion transport number comprised between 0.85 and 0.98 is typical of the main electroplating process in acidic baths, for example copper and tin
electroplating. The metal cation transported through the membrane (6) of the
enrichment cell (2) deposits onto the cathode (7). Therefore the transport of
metal M is a parasitic process, which causes the decrease of the overall
current efficiency of the enrichment cell (2), defined by the ratio 1/(1 +t), and in principle also a loss of the metal to be deposited. This last inconvenience
however may be overcome by periodic current reversals whereby the metal
deposited at the cathode (7) is re-dissolved by operating the latter as an
anode. It is therefore convenient making an accurate choice of the
construction material for the cathode (7), which must be fit for operating as an anode, even if for short periods, without corroding. Therefore, rather than
nickel and alloys thereof, which are traditional materials for cathodes in electrolytic cells, valve metals (preferably titanium and zirconium) and stainless steel, will be adopted (for example AISI 316 and AISI 316 L), optionally coated by a suitable conductive film according to the prior art teachings.
In order to make the cathodic (9) and anodic (10) compartments of the enrichment cell (2) temporarily interchangeable, it is convenient to act also on the hydraulic connections between the two cells (1) and (2). In particular, when the polarity of the enrichment cell (2) is reversed, the ducts (11 ) and (12) must be switched to the original cathodic compartment (9), which upon current reversal becomes the anodic compartment. In other words, the electroplating cell (1 ) must preferably always be in hydraulic connection with the enrichment cell compartment (2) which is time by time anodically polarised, in order to guarantee the self-regulation of the concentrations of
all the species.
In stationary conditions, a simple regulation of the excess current of the
enrichment cell (2), requires the passage of a hydrogen ion mole through the
cation-exchange membrane (6) for each mole of H+ ions generated at the anode (5), in order to perfectly balance the acidity of the system and
automatically restore the Mz+ ions concentration. In particular, for z moles of
electrons transported in the electroplating cell (1 ), it is simply necessary to
apply a current sufficient to provide for the passage of (1+t) «z moles of
electrons to the enrichment cell (2), where the ratio between 1 and (1+t) is the hydrogen ion transport number (equivalent to the faradic efficiency), and the ratio between t and (1+t) is the transport number of the metal cation
(parasitic current fraction). In stationary conditions, therefore, with the passage of z moles of electrons in the electroplating cell (1) one mole of metal M is deposited onto the matrix (3) and z moles of H+ are released at the insoluble anode (5): concurrently, in the enrichment cell (2) the passage of (1+t)»z moles of electrons takes place with the release of (1+t) moles of Mz+ in the anodic compartment (10), the deposition of t moles of M and the consumption of z moles of H* to form z/2 moles of hydrogen at the cathode (7) of the enrichment cell (2). Thus the cathodic compartment of the enrichment cell (2), is deputed to the hydrogen discharge reaction on the surface of the cathode (7), according to z H+ + z e" → z/2 H2
and to the metal deposition according to t Mz+ + t«z e- → t
An immediate check of the balance of matter and of charge in this
compartment shows how, by means of said half-reaction, for each mole M of
metal deposited on the cell (1 ) the consumption of z moles of hydrogen ions
transported through the cation-exchange membrane (6) is exactly effected. Therefore, the above described process is self-regulating and its overall
balance of matter implies only a consumption of water corresponding to the
quantity of oxygen released in the electroplating cell and the quantity of hydrogen released in the enrichment cell: the water concentration may be
easily restored by a simple filling-up, for example in the electroplating cell (1). In any case, this water filling-up does not imply any further complication of the process, as it is normal, in any electroplating process with consumable anode or insoluble anode, evaporation phenomena lead per se to the need for controlling the water concentration by continuous filling-up. As the cation transport through the membrane (6) of the enrichment cell (2). usually takes place in the hydrated form, it is also possible that a slight concentration of the catholyte in the compartment (9) may be required when the evaporation in this compartment is not sufficient to balance said excess transported water.
The disclosed general scheme can be further implemented with other expedients known to the experts of the field, for instance by delivering the oxygen, which evolves at the anode (5) of the electroplating cell (1), to the cathodic compartment (9) of the enrichment cell (2), to eliminate the hydrogen discharge in the latter and depolarise the overall process with back production of water; in this way a remarkable energy saving is obtained
as the electric current consumption imposed by the process is only the
amount necessary for the metal M deposition, whereas no overall consumption of water occurs. The following examples intend to illustrate some industrial embodiments of
the present invention without however limiting the same thereto.
EXAMPLE 1
In this experiment, a steel sheet has been subjected to a tin plating process
in an electroplating cell containing a bath of methansulphonic acid (200 g/l),
bivalent tin (40 g/l) and organic additives according to the prior art, employing as anode a positively polarised titanium sheet, coated with indium and tantalum oxides, directed to the oxygen evolution half-reaction. An enrichment cell has been equipped with a titanium cathode in the form of a flattened expanded sheet provided with a conductive coating and a consumable anode of tin beads, confined by means of a positively polarised titanium expanded mesh basket provided with an electrically conductive film. The exhaust electrolytic bath, recycled from the electroplating cell has been used as anolyte and a methansulphonic acid solution at low concentration of stannous ions, as the catholyte. The catholyte and the anolyte of the enrichment cell have been divided by means of Nafion® 324 cation-exchange sulphonic membrane, produced by DuPont de Nemours, U.S.A.
Utilising a current density of 2.94 kA/m2 in the enrichment cell, a continuous tin plating of the steel sheet could be carried out for an overall duration of one week, with a faradic efficiency of 94%, without any intervention besides the progressive water filling-up in the electrolyte of the electroplating cell,
monitored through a level control, and the forced evaporation in an auxiliary
unit of a small fraction of the catholyte, which received excess water due to the hydrogen ions transport migrating through the cation exchange
membrane with their hydration shell.
After one week, a current reversal was effected on the enrichment cell for
6 hours in order to dissolve the tin deposited at the cathode, reverting then
to normal operation for another week, upon restoring the tin load in the
anodic basket.
EXAMPLE 2
A steel wire was subjected to a copper plating process in an electroplating cell containing a bath of sulphuric acid (120 g/l), cupric sulphate (50 g/l) and
organic additives according to the prior art, using as the anode a positively polarised titanium sheet, coated with iridium and tantalum oxides, deputed to the oxygen evolution half-reaction.
An enrichment cell, fed at the anodic compartment with the exhaust electrolytic bath coming from the electroplating cell, has been equipped with an AISI 316 stainless steel cathode and a consumable anode of copper shavings, confined by means of a positively polarised titanium mesh basket provided with a conductive coating and enclosed in a highly porous filtering cloth. As the catholyte a sulphuric solution with a low concentration of copper
ions has been used. The catholyte and the anolyte of the enrichment cell
have been divided by means of a sulphonic cation exchange membrane,
Nafion® 324 produced by DuPont de Nemours, U.S.A. Utilising a current density of 4.55 kA/m2 in the enrichment cell, a continuous copper plating of
the steel wire could be carried out for an overall duration of one week with a faradic efficiency of 88%, without any intervention besides the progressive
water filling-up in the electroplating cell, monitored through a level control.
After one week, a current reversal was effected on the enrichment cell for 6
hours in order to dissolve the copper deposited at the cathode, reverting
then to normal operation for another week, upon restoring the copper load
in the anodic basket.
In the description and claims of the present application, the word "comprise" and its variation such as "comprising" and "comprises" are not intended to exclude the presence of other elements or additional components.

Claims

1. A cell for the enrichment by anodic dissolution of a metal, comprising
an anodic compartment fed with an acidic electrolyte containing the metal to
be enriched and a cathodic compartment, characterised in that said cathodic
compartment and said anodic compartment are divided by at least one cation-exchange membrane providing for the simultaneous transport of
hydrogen ions and cations of said metal.
2. The cell of claim 1 characterised in that the cathodic compartment contains a cathode providing for the hydrogen evolution reaction and the concurrent discharge of said cations of said metal.
3. The cell of claim 2 characterised in that the metal for the anodic dissolution in the anodic compartment is polarised positively.
4. The cell of claim 3 characterised in that said metal for the anodic dissolution in the anodic compartment has an oxidation potential more positive than that of hydrogen.
5. The cell of claim 4 characterised in that said metal is copper.
6. The cell of claim 3 characterised in that said metal has a high
hydrogen overpotential.
7. The cell of claim 6 characterised in that said high hydrogen overpotential metal is selected in the group consisting of zinc, tin and lead.
8. The cell of claim 3 characterised in that said metal is a continuous
element.
9. The cell of claim 8 characterised in that said continuous element is a
planar sheet.
10. The cell of claim 3 characterised in that said metal is made of an
assembly of small size pieces in electrical contact with a conductive and
permeable, positively polarised confining wall.
11. The cell of claim 10 characterised in that said confining wall is a mesh
or expanded sheet.
12. The cell of claim 10 characterised in that said confining wall is a
perforated basket.
13. The cell of claim 10 characterised in that said assembly of small size pieces comprises shavings, chips or spheroids.
14. The cell of claim 2 characterised in that said cathode comprises at least one metallic material selected in the group consisting of valve metals and stainless steel, optionally provided with a conductive coating.
15. The cell of claim 2 characterised in that the polarity of said anodic compartment and said cathodic compartment may be reversed to dissolve said metal deposited onto the surface of said cathode as a consequence of the discharge of said cations of said metal.
16. The cell of claim 1 characterised in that said cation-exchange membrane comprises a base structure containing at least one polymer and functional groups which comprise sulphonic groups.
17. An apparatus for the electroplating of metal, comprising at least one
metal electroplating cell and at least one cell for the enrichment by the
anodic dissolution of metal of the previous claims, comprising an anodic
compartment and a cathodic compartment divided by at least one anion-
exchange membrane.
18. The apparatus of claim 17 characterised in that said electroplating
cell comprises an electrolytic bath, a conductive negatively polarised matrix
and an insoluble positively polarised anode.
19. The apparatus of claim 18 characterised in that said insoluble anode
comprises a metal coated with a catalyst for oxygen evolution.
20. The apparatus of claim 19 characterised in that said catalyst comprises noble metal oxides.
21. The apparatus of claim 17 characterised in that said electroplating cell and the anodic compartment of said enrichment cell are in mutual hydraulic connection.
22. The apparatus of claim 21 characterised in that said electroplating cell and said anodic compartment of said enrichment cell contain the same electrolytic bath.
23. The apparatus of claims from 17 to 21 characterised in that the metal of the electroplating cell is the same metal of said enrichment cell.
24. The apparatus of claim 22 characterised in that said electrolytic bath comprises sulphuric acid or methansulphonic acid.
25. The apparatus of claim 18 characterised in that said conductive matrix is suitable for a continuous cycle operation.
26. A process for the electroplating of at least one metal onto a
conductive negatively polarised matrix by means of an electroplating cell
comprising an oxygen evolving insoluble anode and an acidic electrolytic
bath containing ions of said metal, wherein the acidity and the ion
concentration in said electrolytic bath are restored by means of an enrichment cell, comprising an anodic compartment and a cathodic
compartment separated by a cation-exchange membrane, characterised in
that said enrichment cell is the cell of any claim from 1 to 16.
27. The process of claim 26 characterised in that the ratio between said transport of hydrogen ions and said transport of cations of said metal is
comprised between 85:15 and 98:2.
28. The process of claim 26 characterised in that said oxygen evolving at the insoluble anode of the electroplating cell is bubbled into the cathodic compartment of said enrichment cell.
29. The process of claims from 26 to 28 characterised in that it comprises restoring only the water consumed by electrolysis or evaporation and the balance of matter of all the other chemical species is self-regulating.
30. A cell for the enrichment by anodic dissolution of a metal characterised in that it comprises the characterising features of the description and the figure.
31. An apparatus for metal electroplating characterised in that it comprises the characterising features of the description and the figure.
32. A process for metal electroplating characterised in that it comprises the characterising features of the description and the figure.
PCT/EP2002/007182 2001-06-29 2002-06-28 Electrolysis cell for restoring the concentration of metal ions in electroplating processes WO2003002784A2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US10/482,089 US7264704B2 (en) 2001-06-29 2002-06-28 Electrolysis cell for restoring the concentration of metal ions in electroplating processes
KR1020037017138A KR100954069B1 (en) 2001-06-29 2002-06-28 A cell for enrichment by anodic dissolution of a metal, an apparatus for the electroplating of metal comprising the same, and a process for the electroplating of a metal using the same
DE60230061T DE60230061D1 (en) 2001-06-29 2002-06-28 ELECTROLYSIS CELL FOR THE RECONSTRUCTION OF METALLION CONCENTRATION IN THE ELECTROPLATING PROCESS
JP2003508745A JP2004536222A (en) 2001-06-29 2002-06-28 Electrolysis cell for recovering metal ion concentration in electroplating process
CA002449512A CA2449512C (en) 2001-06-29 2002-06-28 Electrolysis cell for restoring the concentration of metal ions in electroplating processes
EP02751092A EP1458905B8 (en) 2001-06-29 2002-06-28 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes
AU2002352504A AU2002352504A1 (en) 2001-06-29 2002-06-28 Electrolysis cell for restoring the concentration of metal ions in electroplating processes
BRPI0210684A BRPI0210684B1 (en) 2001-06-29 2002-06-28 cell for enrichment by anodic metal dissolution, metal electroplating apparatus and electroplating process.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT2001MI001374A ITMI20011374A1 (en) 2001-06-29 2001-06-29 ELECTROLYSIS CELL FOR THE RESTORATION OF THE CONCENTRATION OF METAL IONS IN ELECTRODEPOSITION PROCESSES
ITMI2001A001374 2001-06-29

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US20040182694A1 (en) 2004-09-23
CA2449512C (en) 2010-02-02
US7264704B2 (en) 2007-09-04
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RU2004102511A (en) 2005-04-10
TW574428B (en) 2004-02-01
ATE415505T1 (en) 2008-12-15
JP2008069458A (en) 2008-03-27
EP1458905A2 (en) 2004-09-22
ITMI20011374A0 (en) 2001-06-29
DE60230061D1 (en) 2009-01-08
RU2302481C2 (en) 2007-07-10
KR100954069B1 (en) 2010-04-23
EP1458905B1 (en) 2008-11-26
BRPI0210684B1 (en) 2016-04-19
EP1458905B8 (en) 2009-03-25
JP4422751B2 (en) 2010-02-24
KR20040010786A (en) 2004-01-31

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