WO2002101420A2 - Method for assembling an optical component on a support - Google Patents

Method for assembling an optical component on a support Download PDF

Info

Publication number
WO2002101420A2
WO2002101420A2 PCT/FR2002/001977 FR0201977W WO02101420A2 WO 2002101420 A2 WO2002101420 A2 WO 2002101420A2 FR 0201977 W FR0201977 W FR 0201977W WO 02101420 A2 WO02101420 A2 WO 02101420A2
Authority
WO
WIPO (PCT)
Prior art keywords
base
support
optical module
module according
optical component
Prior art date
Application number
PCT/FR2002/001977
Other languages
French (fr)
Inventor
David Picot
Florian Corbel
Original Assignee
Alcatel Optronics France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Optronics France filed Critical Alcatel Optronics France
Publication of WO2002101420A2 publication Critical patent/WO2002101420A2/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering

Definitions

  • the present invention relates to the field of manufacturing optoelectronic components and more particularly the assembly of such components on supports.
  • the optoelectronic components are constituted by active optical elements, such as laser chips, pumps and / or photodetector diodes for example, which are assembled and electrically connected on bases. These components, consisting of the chip on the base, are then assembled on appropriate supports allowing adequate electronic connections then possibly arranged in housings,
  • FIG. 1 schematically illustrates a first step which consists in assembling a chip 10 on a base 20 to constitute an optical component.
  • the chip 10 can be glued or soldered.
  • a deposit of a thin layer 25 of gold / tin (AuSn) at 80/20 wt% (which indicates the proportions by weight) is produced on the base 20 by spraying or other known technique in order to allow soldering of the chip 10 on said base 20 by a temperature cycle greater than or equal to 283 ° C.
  • FIG. 2 schematically illustrates a second step which consists in placing one or more optical components 30, 30 ′, that is to say one or more chips 10, 10 ′ with their respective bases 20, 20 ′, on a support 40. It may be, for example, a laser chip 10 soldered on a base 20 and arranged opposite a photodetector chip 10 ', itself arranged on a base 20'.
  • FIG. 3 illustrates in more detail the step of assembling a component 30 on the support 40.
  • This step can be carried out by soldering by means of a preform 50 disposed between the support 40 and the base 20 to be brazed.
  • the preform 50 consists of a metal plate, for example made of tin and antimony in the following weight proportions SnSb 95/5 wt%.
  • the soldering of the base 20 on the support 40 is then obtained by exerting a pressure on the base 20 placed on the preform 50 on the support 40 and by passing through a temperature greater than or equal to 240 ° C.
  • the step of assembling the optical component (chip on the base) on the support is carried out manually by an operator who grasps a preform, positions it on the support and then grasps the base with the chip and positions it on the preform. Pressure is then applied to the top of the base to maintain it on the preform and the support, then a temperature cycle is applied to the assembly to allow fusion of said preform and soldering of the base on the support ,
  • the problems mentioned above are further increased in the case of components of small sizes which are difficult to handle and which more particularly entail the delicate manipulation of preforms which are also small.
  • the object of the present invention is to solve the problems of the prior art and more particularly to meet the need for a precise assembly of optical components on a support, in particular when the components are small, Indeed, managing to get rid of the manual manipulation of small preforms would automate the assembly of the component on the base and therefore to obtain better precision of this operation,
  • the invention proposes to replace the generally used preform, a solder film deposited directly on the base of the component to be positioned on the support and capable of allowing the soldering of said component on said support with a melting point included. between 200 and 250 ° C,
  • the invention relates more particularly to a method of assembling at least one optical component on a support, said optical component consisting of a base comprising a chip on a first of its faces, characterized in that said assembly is produced by brazing a second face of the base on the support by means of a welding film deposited on said second face and having a melting point of between 200 and 250 ° C.,
  • the solder film is composed of a gold / tin alloy (AuSn) with a proportion by weight of gold of between 0 and 10 Wt%,
  • the solder is produced by a laser beam focused on the welding film
  • the invention also relates to an optical module comprising an optical component soldered on a support, said optical component consisting of a base comprising a chip on a first of its faces, characterized in that the base also comprises a solder film on a second of its faces distinct from the first,
  • the first and second faces of the base are arranged relative to each other at an angle of 90 °. According to a second embodiment, the first and second faces of the base are arranged relative to each other at an angle of 180 °,
  • FIG. 3 already described, schematically illustrates the step of soldering an optical component on a support according to a method known from the prior art
  • FIG. 4 schematically illustrates a base provided with a welding film according to the present invention
  • FIGS. 5 and 6 respectively illustrate two embodiments of the assembly method according to the present invention.
  • the invention relates to a method of assembling at least one optical component 30 on a support 40.
  • the invention finds a particularly advantageous application in the case of components of small sizes to be assembled on a common support such as for example photodiodes of '' about 1 mm 2 , against 16mm 2 conventionally. In such a case, handling such small preforms becomes complex.
  • the method according to the invention nevertheless applies in the same way to any type of component of any size.
  • the optical component 30 consists of a base 20 comprising a chip 10 on a first A of its faces.
  • this chip 10 may have been soldered on the base 20 as described with reference to FIG. 1 of the prior art.
  • the base 20 can be made of ceramic (AIN) or of a semiconductor material (silicon for example) according to different possible applications.
  • the base 20 further comprises, on a second B of its faces, a welding film 60 having a melting point between 200 and 250 ° C.
  • This welding film 60 is preferably composed of a gold / tin alloy (AuSn) with a proportion by weight of gold included between 0 and 10 Wt%, ie an AuSn alloy at 10 / 90Wt%, or tin at 100Wt%.
  • AuSn gold / tin alloy
  • the welding film 60 has been deposited on the second face B of the base 20 according to any known and well-controlled technique such as sputtering or vacuum evaporation for example. These techniques each make it possible to obtain a welding film 60 having a well controlled thickness and roughness.
  • the component 30 is assembled on a support 40 which can be a pallet, for example made of a metallic material such as iron, nickel, cobalt (FeNiCo), the support 40 can also be directly a case back, metallic or metallized ceramic or plastic with a metallic framework (known under the English term of leadframe).
  • a support 40 which can be a pallet, for example made of a metallic material such as iron, nickel, cobalt (FeNiCo)
  • the support 40 can also be directly a case back, metallic or metallized ceramic or plastic with a metallic framework (known under the English term of leadframe).
  • the welding film 60 is deposited on a second face B of the base arranged at an angle of 90 ° or 180 ° relative to the first face A on which the chip 10 is placed,
  • the optical component 30 is advantageously positioned on the support 40, according to an automatic positioning technique called "pick and place”. Automation ultimately achieves better positioning accuracy.
  • the brazing is then carried out by a temperature cycle heating the welding film 60 to the melting point before cooling it to ensure the fixing of the base 20 on the support 40.
  • this temperature cycle is provided, for example, by heating in an oven or by a laser beam focused on the welding film 60.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention concerns a method for assembling at least an optical component (30) on a support (40), said optical component (30) consisting of a base (20) comprising a chip (10) on one first (A) of its sides. The invention is characterised in that said assembly is produced by soldering a second (B) side of the base (20) on the support (40) using a soldering film (60) deposited on said second side (B) and having a melting point ranging between 200 and 250 °C.

Description

Procédé d'assemblage d'un composant optique sur un support Method of assembling an optical component on a support
La présente invention concerne le domaine de la fabrication de composants optoélectroniques et plus particulièrement l'assemblage de tels composants sur des supports. Les composants optoélectroniques sont constitués par des éléments optiques actifs, tels que des puces lasers, des pompes et/ou des diodes photodétecteurs par exemple, qui sont assemblés et électriquement connectés sur des embases. Ces composants, constitués de la puce sur l'embase, sont ensuite assemblés sur des supports appropriés permettant des connexions électroniques adéquates puis éventuellement disposés dans des boîtiers,The present invention relates to the field of manufacturing optoelectronic components and more particularly the assembly of such components on supports. The optoelectronic components are constituted by active optical elements, such as laser chips, pumps and / or photodetector diodes for example, which are assembled and electrically connected on bases. These components, consisting of the chip on the base, are then assembled on appropriate supports allowing adequate electronic connections then possibly arranged in housings,
Les principales étapes de fabrication d'un composant optoélectronique, telles de connues de l'art antérieur, sont les suivantes :The main steps in manufacturing an optoelectronic component, as known from the prior art, are as follows:
La figure 1 illustre schématiquement une première étape qui consiste à assembler une puce 10 sur une embase 20 pour constituer un composant optique. Selon différentes techniques possibles, la puce 10 peut être collée ou brasée. Par exemple, sur la figure 1, un dépôt de couche mince 25 en or/étain (AuSn) à 80/20 wt% (qui indique les proportions en poids) est réalisé sur l'embase 20 par pulvérisation ou autre technique connue afin de permettre la brasure de la puce 10 sur ladite embase 20 par un cycle de température supérieure ou égale à 283°C,FIG. 1 schematically illustrates a first step which consists in assembling a chip 10 on a base 20 to constitute an optical component. According to different possible techniques, the chip 10 can be glued or soldered. For example, in FIG. 1, a deposit of a thin layer 25 of gold / tin (AuSn) at 80/20 wt% (which indicates the proportions by weight) is produced on the base 20 by spraying or other known technique in order to allow soldering of the chip 10 on said base 20 by a temperature cycle greater than or equal to 283 ° C.,
La figure 2 illustre schématiquement une deuxième étape qui consiste à disposer un ou plusieurs composants optiques 30, 30', c'est à dire une ou plusieurs puces 10, 10' avec leurs embases respectives 20, 20', sur un support 40. Il peut s'agir, par exemple, d'une puce laser 10 brasée sur une embase 20 et disposée en regard d'une puce de photodétecteur 10', elle-même disposée sur une embase 20'.FIG. 2 schematically illustrates a second step which consists in placing one or more optical components 30, 30 ′, that is to say one or more chips 10, 10 ′ with their respective bases 20, 20 ′, on a support 40. It may be, for example, a laser chip 10 soldered on a base 20 and arranged opposite a photodetector chip 10 ', itself arranged on a base 20'.
La figure 3 illustre plus en détail l'étape d'assemblage d'un composant 30 sur le support 40, Cette étape peut être réalisée par brasure au moyen d'une préforme 50 disposée entre le support 40 et l'embase 20 à braser. La préforme 50 est constituée d'une plaquette métallique, par exemple en étain et antimoine dans les proportions en poids suivantes SnSb 95/5 wt%. La brasure de l'embase 20 sur le support 40 est alors obtenue en exerçant une pression sur l'embase 20 posée sur la préforme 50 sur le support 40 et par un passage en température supérieure ou égale à 240°C.FIG. 3 illustrates in more detail the step of assembling a component 30 on the support 40. This step can be carried out by soldering by means of a preform 50 disposed between the support 40 and the base 20 to be brazed. The preform 50 consists of a metal plate, for example made of tin and antimony in the following weight proportions SnSb 95/5 wt%. The soldering of the base 20 on the support 40 is then obtained by exerting a pressure on the base 20 placed on the preform 50 on the support 40 and by passing through a temperature greater than or equal to 240 ° C.
Ces trois figures illustrent schématiquement les étapes d'assemblage d'une puce sur une embase et d'un composant optique sur un support telles qu'elles sont effectuées de manière connue. Le support peut ensuite être disposé dans un boîtier approprié ou incorporé dans un module optoélectronique selon une quelconque technique connue et adaptée, telle que par exemple une brasure ou un collage,These three figures schematically illustrate the steps of assembling a chip on a base and an optical component on a support as they are carried out in known manner. The support can then be placed in an appropriate box or incorporated in an optoelectronic module according to any known and suitable technique, such as for example soldering or gluing,
Généralement, l'étape d'assemblage du composant optique (puce sur l'embase) sur le support est réalisée manuellement par un opérateur qui saisit une préforme, la positionne sur le support puis saisit l'embase avec la puce et la positionne sur la préforme. Une pression est ensuite appliquée sur le dessus de l'embase pour la maintenir sur la préforme et le support, puis un cycle de température est appliqué à l'ensemble pour permettre une fusion de ladite preforme et une brasure de l'embase sur le support,Generally, the step of assembling the optical component (chip on the base) on the support is carried out manually by an operator who grasps a preform, positions it on the support and then grasps the base with the chip and positions it on the preform. Pressure is then applied to the top of the base to maintain it on the preform and the support, then a temperature cycle is applied to the assembly to allow fusion of said preform and soldering of the base on the support ,
Malgré l'utilisation d'un matériel précis, une telle opération manuelle peut difficilement garantir une précision meilleure que 150 à 200μm dans le positionnement relatif du composant sur le support, En outre, une telle opération manuelle ne peut permettre d'atteindre des cadences industrielles élevées et donc constitue une opération coûteuse,Despite the use of precise equipment, such a manual operation can hardly guarantee an accuracy better than 150 to 200 μm in the relative positioning of the component on the support. In addition, such a manual operation cannot make it possible to reach industrial rates. high and therefore constitutes an expensive operation,
Les problèmes cités ci-dessus sont encore accrus dans le cas de composants de petites tailles difficiles à manipuler et entraînant plus particulièrement la délicate manipulation de préformes également de petites tailles, Le but de la présente invention est de résoudre les problèmes de l'art antérieur et plus particulièrement de répondre au besoin d'un assemblage précis de composants optiques sur un support, en particulier lorsque les composants sont de petites tailles, En effet, parvenir à s'affranchir de la manipulation manuelle de préformes de petites tailles permettrait d'automatiser l'assemblage du composant sur l'embase et donc d'obtenir une meilleure précision de cette opération, A cet effet, l'invention propose de substituer à la préforme généralement utilisée, un film de soudure déposé directement sur l'embase du composant à positionner sur le support et apte à permettre la brasure dudit composant sur ledit support avec un point de fusion compris entre 200 et 250°C,The problems mentioned above are further increased in the case of components of small sizes which are difficult to handle and which more particularly entail the delicate manipulation of preforms which are also small. The object of the present invention is to solve the problems of the prior art and more particularly to meet the need for a precise assembly of optical components on a support, in particular when the components are small, Indeed, managing to get rid of the manual manipulation of small preforms would automate the assembly of the component on the base and therefore to obtain better precision of this operation, To this end, the invention proposes to replace the generally used preform, a solder film deposited directly on the base of the component to be positioned on the support and capable of allowing the soldering of said component on said support with a melting point included. between 200 and 250 ° C,
L'invention se rapporte plus particulièrement à un procédé d'assemblage d'au moins un composant optique sur un support, ledit composant optique étant constitué d'une embase comportant une puce sur une première de ses faces, caractérisé en ce que ledit assemblage est réalisé par brasure d'une deuxième face de l'embase sur le support au moyen d'un film de soudure déposé sur ladite deuxième face et présentant un point de fusion compris entre 200 et 250°C,The invention relates more particularly to a method of assembling at least one optical component on a support, said optical component consisting of a base comprising a chip on a first of its faces, characterized in that said assembly is produced by brazing a second face of the base on the support by means of a welding film deposited on said second face and having a melting point of between 200 and 250 ° C.,
Selon une caractéristique, le film de soudure est composé d'un alliage or/étain (AuSn) avec une proportion en poids d'or comprise entre 0 et 10 Wt%,According to one characteristic, the solder film is composed of a gold / tin alloy (AuSn) with a proportion by weight of gold of between 0 and 10 Wt%,
Selon un mode de réalisation, la brasure est réalisée par un faisceau laser focalisé sur le film de soudure,According to one embodiment, the solder is produced by a laser beam focused on the welding film,
L'invention concerne également un module optique comportant un composant optique brasé sur un support, ledit composant optique étant constitué d'une embase comportant une puce sur une première de ses faces, caractérisé en ce que l'embase comporte en outre un film de soudure sur une deuxième de ses faces distincte de la première,The invention also relates to an optical module comprising an optical component soldered on a support, said optical component consisting of a base comprising a chip on a first of its faces, characterized in that the base also comprises a solder film on a second of its faces distinct from the first,
Selon un premier mode de réalisation, les première et deuxième faces de l'embase sont disposées l'une par rapport à l'autre avec un angle de 90°, Selon un second mode de réalisation, les première et deuxième faces de l'embase sont disposées l'une par rapport à l'autre avec un angle de 180°,According to a first embodiment, the first and second faces of the base are arranged relative to each other at an angle of 90 °. According to a second embodiment, the first and second faces of the base are arranged relative to each other at an angle of 180 °,
Les particularités et avantages de l'invention apparaîtront clairement à la lecture de la description qui suit, faite à titre d'exemple illustratif et non limitatif et faite en référence aux figures annexées dans lesquelles : - la figure 1, déjà décrite, illustre schématiquement l'étape d'assemblage d'une puce optique sur une embase selon un procédé connu de l'art antérieur ;The features and advantages of the invention will appear clearly on reading the description which follows, given by way of illustrative and nonlimiting example and made with reference to the appended figures in which: - Figure 1, already described, schematically illustrates the step of assembling an optical chip on a base according to a method known from the prior art;
- la figure 2, déjà décrite, illustre schématiquement l'assemblage de deux composants optiques sur un support ;- Figure 2, already described, schematically illustrates the assembly of two optical components on a support;
- la figure 3, déjà décrite, illustre schématiquement l'étape de brasure d'un composant optique sur un support selon un procédé connu de l'art antérieur,FIG. 3, already described, schematically illustrates the step of soldering an optical component on a support according to a method known from the prior art,
- la figure 4 illustre schématiquement une embase munie d'un film de soudure selon la présente invention ;- Figure 4 schematically illustrates a base provided with a welding film according to the present invention;
-les figures 5 et 6 illustrent respectivement deux modes de réalisation du procédé d'assemblage selon la présente invention.FIGS. 5 and 6 respectively illustrate two embodiments of the assembly method according to the present invention.
L'invention concerne un procédé d'assemblage d'au moins un composant optique 30 sur un support 40. L'invention trouve une application particulièrement avantageuse dans le cas de composants de petites tailles à assembler sur un support commun comme par exemple des photodiodes d'environ 1 mm2, contre 16mm2 classiquement. Dans un tel cas, la manipulation de préformes de si petite taille devient complexe. Le procédé selon l'invention s'applique néanmoins de la même manière à tout type de composant de toute taille.The invention relates to a method of assembling at least one optical component 30 on a support 40. The invention finds a particularly advantageous application in the case of components of small sizes to be assembled on a common support such as for example photodiodes of '' about 1 mm 2 , against 16mm 2 conventionally. In such a case, handling such small preforms becomes complex. The method according to the invention nevertheless applies in the same way to any type of component of any size.
Comme illustré sur la figure 4, le composant optique 30 est constitué d'une embase 20 comportant une puce 10 sur une première A de ses faces.As illustrated in FIG. 4, the optical component 30 consists of a base 20 comprising a chip 10 on a first A of its faces.
Par exemple, cette puce 10 peut avoir été brasée sur l'embase 20 comme décrit en référence à la figure 1 de l'art antérieur. L'embase 20 peut être en céramique (AIN) ou en matériau semi-conducteur (du silicium par exemple) selon différentes applications possibles.For example, this chip 10 may have been soldered on the base 20 as described with reference to FIG. 1 of the prior art. The base 20 can be made of ceramic (AIN) or of a semiconductor material (silicon for example) according to different possible applications.
Selon l'invention, l'embase 20 comporte en outre, sur une deuxième B de ses faces, un film de soudure 60 présentant un point de fusion compris entre 200 et 250°C, Ce film de soudure 60 est préférentiellement composé d'un alliage or/étain (AuSn) avec une proportion en poids d'or comprise entre 0 et 10 Wt%, c'est à dire un alliage AuSn à 10/90Wt%, ou de l'étain à 100Wt%.According to the invention, the base 20 further comprises, on a second B of its faces, a welding film 60 having a melting point between 200 and 250 ° C. This welding film 60 is preferably composed of a gold / tin alloy (AuSn) with a proportion by weight of gold included between 0 and 10 Wt%, ie an AuSn alloy at 10 / 90Wt%, or tin at 100Wt%.
Le film de soudure 60 a été déposé sur la deuxième face B de l'embase 20 selon une quelconque technique connue et bien maîtrisée telle que la pulvérisation cathodique ou l'évaporation sous vide par exemple. Ces techniques permettent chacune d'obtenir un film de soudure 60 présentant une épaisseur et une rugosité bien contrôlées.The welding film 60 has been deposited on the second face B of the base 20 according to any known and well-controlled technique such as sputtering or vacuum evaporation for example. These techniques each make it possible to obtain a welding film 60 having a well controlled thickness and roughness.
En référence aux figures 5 et 6, le composant 30 est assemblé sur un support 40 qui peut être une palette, par exemple constituée d'un matériau métallique tel que du Fer, Nickel, Cobalt (FeNiCo) doré, Le support 40 peut également être directement un fond de boîtier, métallique ou en céramique métallisée ou en plastique avec une ossature métallique (connue sous le terme anglais de leadframe).With reference to FIGS. 5 and 6, the component 30 is assembled on a support 40 which can be a pallet, for example made of a metallic material such as iron, nickel, cobalt (FeNiCo), the support 40 can also be directly a case back, metallic or metallized ceramic or plastic with a metallic framework (known under the English term of leadframe).
Selon les applications, le film de soudure 60 est déposé sur une deuxième face B de l'embase disposée avec un angle de 90° ou de 180° par rapport à la première face A sur laquelle est disposée la puce 10,Depending on the applications, the welding film 60 is deposited on a second face B of the base arranged at an angle of 90 ° or 180 ° relative to the first face A on which the chip 10 is placed,
Le composant optique 30 est avantageusement positionné sur le support 40, selon une technique de positionnement automatique dite de "pick and place". L'automatisation permet à terme d'atteindre une précision meilleure de positionnement.The optical component 30 is advantageously positioned on the support 40, according to an automatic positioning technique called "pick and place". Automation ultimately achieves better positioning accuracy.
La brasure est ensuite réalisée par un cycle de température chauffant le film de soudure 60 jusqu'au point de fusion avant de le refroidir pour assurer la fixation de l'embase 20 sur le support 40. Selon les modes de réalisation, ce cycle de température est assuré, par exemple, par un chauffage au four ou par un faisceau laser focalisé sur le film de soudure 60. The brazing is then carried out by a temperature cycle heating the welding film 60 to the melting point before cooling it to ensure the fixing of the base 20 on the support 40. According to the embodiments, this temperature cycle is provided, for example, by heating in an oven or by a laser beam focused on the welding film 60.

Claims

REVENDICATIONS
1. Procédé d'assemblage d'au moins un composant optique (30) sur un support (40), ledit composant optique (30) étant constitué d'une embase (20) comportant une puce (10) sur une première (A) de ses faces, caractérisé en ce que ledit assemblage est réalisé par brasure d'une deuxième (B) face de l'embase (20) sur le support (40) au moyen d'un film de soudure (60) déposé sur ladite deuxième face (B) et présentant un point de fusion compris entre 200 et 250°C.1. Method for assembling at least one optical component (30) on a support (40), said optical component (30) consisting of a base (20) comprising a chip (10) on a first (A) of its faces, characterized in that said assembly is produced by brazing a second (B) face of the base (20) on the support (40) by means of a welding film (60) deposited on said second face (B) and having a melting point of between 200 and 250 ° C.
2. Procédé d'assemblage selon la revendication 1, caractérisé en ce que le film de soudure (60) est composé d'un alliage or/étaln (AuSn) avec une proportion en poids d'or comprise entre 0 et 10 Wt%.2. The assembly method according to claim 1, characterized in that the welding film (60) is composed of a gold / standard alloy (AuSn) with a proportion by weight of gold of between 0 and 10 Wt%.
3. Procédé d'assemblage selon l'une des revendications 1 à 2, caractérisé en ce que le film de soudure (60) est déposé sur la deuxième face (B) de l'embase (20) par pulvérisation cathodique, 3. Assembly method according to one of claims 1 to 2, characterized in that the welding film (60) is deposited on the second face (B) of the base (20) by sputtering,
4. Procédé d'assemblage selon l'une des revendications 1 à 2, caractérisé en ce que le film de soudure (60) est déposé sur la deuxième face (B) de l'embase (20) par évaporation sous vide.4. An assembly method according to one of claims 1 to 2, characterized in that the welding film (60) is deposited on the second face (B) of the base (20) by vacuum evaporation.
5. Procédé d'assemblage selon l'une des revendications 1 à 4, caractérisé en ce que la brasure est réalisée par un faisceau laser focalisé sur le film de soudure (60).5. An assembly method according to one of claims 1 to 4, characterized in that the soldering is carried out by a laser beam focused on the welding film (60).
6. Module optique comportant un composant optique (30) brasé sur un support (40), ledit composant optique (30) étant constitué d'une embase (20) comportant une puce (10) sur une première (A) de ses faces, caractérisé en ce que l'embase (20) comporte en outre un film de soudure (60) sur une deuxième de ses faces (B) distincte de la première (A).6. Optical module comprising an optical component (30) soldered on a support (40), said optical component (30) consisting of a base (20) comprising a chip (10) on a first (A) of its faces, characterized in that the base (20) further comprises a welding film (60) on a second of its faces (B) distinct from the first (A).
7. Module optique selon la revendication 6, caractérisé en ce que les première (A) et deuxième (B) faces de l'embase (20) sont disposées l'une par rapport à l'autre avec un angle de 90°, 7. Optical module according to claim 6, characterized in that the first (A) and second (B) faces of the base (20) are arranged relative to each other at an angle of 90 °,
8. Module optique selon la revendication 6, caractérisé en ce que les première (A) et deuxième (B) faces de l'embase (20) sont disposées l'une par rapport à l'autre avec un angle de 180°, 8. Optical module according to claim 6, characterized in that the first (A) and second (B) faces of the base (20) are arranged relative to each other at an angle of 180 °,
9. Module optique selon la revendication 6, caractérisé en ce que le support (40) est une palette en métal, 9. Optical module according to claim 6, characterized in that the support (40) is a metal pallet,
10. Module optique selon la revendication à, caractérisé en ce que le support (40) est un fond de boîtier en plastique muni d'une ossature en métal.10. Optical module according to claim a, characterized in that the support (40) is a plastic case bottom provided with a metal frame.
11. Module optique selon la revendication 6, caractérisé en ce que le support (40) est un fond de boîtier en céramique métallisée,11. Optical module according to claim 6, characterized in that the support (40) is a metallized ceramic case bottom,
12. Module optique selon la revendication 6, caractérisé en ce que le support (40) est un fond de boîtier en métal,12. Optical module according to claim 6, characterized in that the support (40) is a metal case bottom,
13. Module optique selon la revendication 6, caractérisé en ce que l'embase (20) est en céramique, 13. Optical module according to claim 6, characterized in that the base (20) is made of ceramic,
14. Module optique selon la revendication 6, caractérisé en ce que l'embase (20) est en matériau semi-conducteur, 14. Optical module according to claim 6, characterized in that the base (20) is made of semiconductor material,
PCT/FR2002/001977 2001-06-11 2002-06-10 Method for assembling an optical component on a support WO2002101420A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0107583 2001-06-11
FR0107583 2001-06-11

Publications (1)

Publication Number Publication Date
WO2002101420A2 true WO2002101420A2 (en) 2002-12-19

Family

ID=8864151

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2002/001977 WO2002101420A2 (en) 2001-06-11 2002-06-10 Method for assembling an optical component on a support

Country Status (1)

Country Link
WO (1) WO2002101420A2 (en)

Similar Documents

Publication Publication Date Title
US7298049B2 (en) Submount for mounting semiconductor device
WO2004015756A1 (en) Submount and semiconductor device
FR2525815A1 (en) HIGH THERMAL CONDUCTION COMPOSITE SUBSTRATE AND APPLICATION TO HOUSINGS OF SEMICONDUCTOR DEVICES
CN101971442A (en) Optical module
EP0321340A1 (en) Electronic-component support, especially for a memory card, and product so obtained
EP2175485A2 (en) Connection between two soldered inserts and method of manufacturing the same
EP0593330B1 (en) 3D-interconnection method for electronic component housings and resulting 3D component
EP3154082A1 (en) Improved dbc structure provided with a mounting including a phase-change material
JP3794987B2 (en) Semiconductor light emitting device
FR2769100A1 (en) Casing for photosemiconductor device
WO2002101420A2 (en) Method for assembling an optical component on a support
EP0114760B1 (en) Highly thermal dissipation housing, especially for microelectronics
EP1427008B1 (en) Process of manufacturing an electronic module comprising an active component on a substrate
WO2020021197A1 (en) Method for producing a power electronics module
WO2002078088A1 (en) Method for assembling components of different thicknesses
FR2747005A1 (en) MICROELECTRONIC PACKAGE WITH COOLING SYSTEM
EP1192592A1 (en) Device and method for making devices comprising at least a chip fixed on a support
JP2007134744A (en) Submount and semiconductor device
US8031319B1 (en) Hermetic liquid crystal cell and sealing technique
WO2000077731A1 (en) Device and method for making devices comprising at least a chip mounted on a support
EP1278240A2 (en) Transfering method of a component onto a connection support by welding without supplying material
EP1697990B1 (en) Assembly of a component mounted on a transfer surface
WO2018020189A2 (en) Power electronics module for an aircraft and associated production method
KR102263552B1 (en) Manufacturing method of cover material for package and manufacturing method of package
JP3898521B2 (en) Optical semiconductor element storage package

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
WA Withdrawal of international application