WO2002086974A1

WO2002086974A1 - Semiconductor device

Info

Publication number: WO2002086974A1
Application number: PCT/JP2002/003616
Authority: WO
Inventors: Takeshi Ikeda; Hiroshi Miyagi
Original assignee: Niigata Seimitsu Co., Ltd.
Priority date: 2001-04-16
Filing date: 2002-04-11
Publication date: 2002-10-31
Also published as: JP2002313935A

Abstract

A quartz oscillation circuit (5) which generates a digital pulse signal for controlling e.g. a frequency conversion circuit (3) is disposed at a remotest position from a RF circuit (2) which handles a high-frequency signal in an IC chip (1), so that the harmonic from the quartz oscillation circuit (5) is attenuated at a proportion of the reciprocal of a squared distance to suppress the unfavorableness of superposing on an analog signal processed by the RF circuit (2) as a digital noise.

Description

Description Semiconductor device technology

The present invention relates to a semiconductor device, and is particularly suitable for use in a semiconductor device in which an analog circuit and an oscillation circuit are mounted in one semiconductor chip or one module. Background art

With the spread of wireless communication terminals such as radio receivers, mobile phone devices, and PDAs (Personal Digital Assistants), ICs have been highly integrated and semiconductor elements have been miniaturized to reduce the size and weight of these terminals. Is rapidly progressing. Under such circumstances, attempts have been made to integrate wireless circuits including passive components such as capacitors into ICs (single chip) or into one module.

Recently, there has been an increasing demand to mix analog circuits and digital circuits in one chip or one module. For example, radio circuits (analog circuits) for transmitting and receiving analog signals and radio PLLs for radio receivers, mobile phone devices, short-range wireless data communication technology such as Bluetooth and wireless LAN. (Phase Locked Loop) Attempts to integrate a frequency synthesizer circuit (digital circuit) and a baseband signal processing circuit (digital circuit) for digitally processing signals to be transmitted and received into one chip or one module have been actively conducted. Have been done.

A crystal oscillation circuit that generates a digital control signal according to the oscillation frequency of the crystal oscillator to control these analog or digital circuits However, they are often provided in the same chip or the same module as analog and digital circuits.

However, when the analog circuit and the crystal oscillation circuit are mounted on one chip or one module, the harmonic components of the digital control signal such as the system clock generated from the crystal oscillation circuit are converted into digital noise. A problem arises in that it jumps into the analog circuit and degrades the characteristics of the analog signal transmitted and received. For example, when transmitting and receiving audio signals, the sound quality is significantly degraded, making it very difficult to hear.

For example, as shown in Fig. 1, if the oscillation frequency of the crystal oscillator is 10 MHz, the second harmonic at 20 MHz, the third harmonic at 30 MHz, ... The n-th harmonic component is generated as shown. These harmonics have relatively little attenuation even at higher orders.

On the other hand, taking an FM radio receiver as an example, a Japanese FM broadcast signal uses a frequency band of 76 MHz to 90 MHz as a reception band. For this reason, the 8th and 9th harmonics of the system clock generated from the crystal oscillation circuit are superimposed on the RF (Radio Frequency) analog signal in the FM broadcast wave band. This is a factor that reduces the sensitivity of the signal that should be received.

In this way, when an analog circuit such as an RF circuit and a crystal oscillation circuit are integrated into one chip or one module, the frequency of the nth harmonic of the digital pulse signal generated from the crystal oscillation circuit and the RF circuit If the frequency of the analog signal to be handled is substantially the same, the n-th harmonic will result in interfering with the analog signal, and the quality of the analog signal will be degraded.

The present invention has been made to solve such a problem. When the analog circuit and the crystal oscillation circuit are integrated into one chip or one module, an object is to suppress the inconvenience of receiving digital noise from the crystal oscillation circuit and deteriorating the quality of analog signals. Disclosure of the invention

The semiconductor device of the present invention includes, in one semiconductor chip, an analog circuit that performs a process related to a signal in a desired frequency band and an oscillation circuit that generates a signal in which a harmonic of an oscillation frequency can exist in the desired frequency band. The oscillation circuit is arranged in the semiconductor chip at a position farthest from the analog circuit or the input circuit for the signal of the desired frequency band. According to another aspect of the present invention, there is provided a semiconductor device in which an analog circuit that performs a process related to a high-frequency signal in a desired frequency band and a digital circuit are mounted on a single semiconductor chip, wherein the semiconductor chip operates in accordance with a predetermined oscillation frequency. An oscillation circuit for generating a digital pulse signal is provided, and the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip.

According to another aspect of the present invention, an analog circuit that performs processing related to a high-frequency signal in a desired frequency band, a digital circuit that performs predetermined digital signal processing, a crystal oscillator that oscillates at a predetermined frequency, and the crystal oscillator An oscillation circuit that generates a digital pulse signal in accordance with the oscillation frequency of the analog circuit, wherein the oscillation circuit is arranged at a position farthest from the analog circuit. It is characterized by being arranged near the oscillation circuit.

According to another aspect of the present invention, there is provided a semiconductor chip in which an analog circuit for performing processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted. A semiconductor device that oscillates at a predetermined frequency, and an oscillation circuit in the semiconductor chip that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator. The oscillator circuit is arranged at a position farthest from the analog circuit. According to another aspect of the present invention, there is provided a semiconductor device having a semiconductor chip in which an analog circuit for performing processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein the crystal oscillator oscillates at a predetermined frequency. An oscillation circuit in the semiconductor chip for generating a digital pulse signal according to the oscillation frequency of the crystal oscillator, wherein the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip, and It is characterized in that a crystal oscillator is arranged near the oscillation circuit.

In another aspect of the present invention, the analog circuit is a wireless circuit for transmitting and / or receiving an analog signal wirelessly.

According to another aspect of the present invention, there is provided an analog high-frequency circuit for wirelessly transmitting and receiving or receiving a high-frequency signal in a desired frequency band, and an oscillation circuit for generating a digital pulse signal according to the oscillation frequency of a crystal oscillator. The oscillation circuit is provided in one semiconductor chip, and the oscillation circuit is arranged at a position farthest from the high frequency circuit in the semiconductor chip.

According to another aspect of the present invention, there is provided a semiconductor device having a semiconductor chip in which an analog circuit for performing processing relating to a high-frequency signal in a desired frequency band and a digital circuit are mounted, wherein the high-frequency signal is transmitted wirelessly and / or Or an analog high-frequency circuit for reception, and an oscillation circuit for generating a digital pulse signal in accordance with the oscillation frequency of the crystal oscillator, wherein the oscillation circuit is located farthest from the high-frequency circuit in the semiconductor chip. It is characterized by being arranged. According to another aspect of the present invention, the oscillation circuit and the high-frequency circuit are arranged at diagonal positions of the semiconductor chip.

In another aspect of the present invention, an analog circuit that performs processing related to an S frequency signal in a desired frequency band, a crystal oscillator that oscillates at a predetermined frequency, and generates a digital pulse signal according to the oscillation frequency of the crystal oscillator An oscillation circuit is provided in one module, and the crystal oscillator and the oscillation circuit are arranged at a position farthest from the analog circuit in the module.

According to another aspect of the present invention, there is provided a semiconductor device in which an analog circuit for performing a process related to a high-frequency signal in a desired frequency band and a digital circuit are mounted in one module, wherein the module oscillates at a predetermined frequency. A crystal oscillator that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator, wherein the crystal oscillator and the oscillation circuit are located farthest from the analog circuit in the module. It is characterized by being arranged.

In another embodiment of the present invention, the module has one or more semiconductor chips, the analog circuit and the oscillation circuit are provided in the same semiconductor chip, and the oscillation circuit is included in the semiconductor chip in the semiconductor chip. It is characterized by being located at the farthest position from it.

In another aspect of the present invention, an analog circuit that performs processing related to a high-frequency signal in a desired frequency band, a crystal oscillator that oscillates at a predetermined frequency, and an oscillation that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator A circuit is provided on one module, and the analog circuit, the crystal oscillator, and the oscillation circuit are separately arranged on both sides of a module substrate.

According to another aspect of the present invention, a process related to a high-frequency signal in a desired frequency band is performed. A semiconductor device in which an analog circuit for performing processing and a digital circuit are mixed in one module, wherein the module includes a crystal oscillator that oscillates at a predetermined frequency and a digital pulse according to the oscillation frequency of the crystal oscillator. An oscillator circuit for generating a signal is provided, and the analog circuit, the crystal oscillator, and the oscillator circuit are separately arranged on both sides of a module substrate.

In another aspect of the present invention, the analog circuit is a radio circuit for transmitting and / or receiving an analog signal wirelessly.

Since the present invention comprises the above technical means, for example, in a semiconductor device in which an analog circuit for handling a high-frequency signal and an oscillation circuit for generating a digital pulse signal are mounted in one chip or one module, By locating the oscillation circuit, which is the source of the harmonics of the pulse signal, as far as possible from the analog circuit, the harmonics from the oscillation circuit are attenuated at a rate of 1 square of the distance and processed by the analog circuit. This makes it possible to prevent the inconvenience of superimposing harmonics from the oscillation circuit as digital noise on the high-frequency analog signal that is generated.

According to another feature of the present invention, for example, in a semiconductor device in which an analog circuit for handling a high-frequency signal and an oscillation circuit for generating a digital pulse signal are mounted on one module, the analog circuit and the digital pulse signal By arranging the oscillation circuit that is the source of the waves on a different module substrate surface, it is possible to shield the harmonics from the module substrate surface so that the harmonics from the oscillation circuit do not enter the analog circuit. Becomes BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a diagram showing a frequency spectrum for explaining a conventional problem. It is.

FIG. 2 is a diagram showing an example of a circuit arrangement in an IC chip implementing the semiconductor device of the present invention.

FIG. 3 is a diagram showing another configuration example of an IC chip implementing the semiconductor device of the present invention.

FIG. 4 is a diagram showing an example of a circuit arrangement in an IC chip of a radio receiver implementing the semiconductor device of the present invention.

FIG. 5 is a diagram showing an example of a circuit arrangement in a module implementing the semiconductor device of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a diagram showing a configuration example of a semiconductor chip (IC chip) implementing the semiconductor device of the present invention.

In FIG. 2, an IC chip 1 according to the present embodiment includes an RF circuit 2 that performs processing related to transmission and / or reception of a high-frequency signal via an antenna 7, and converts a signal frequency to convert an intermediate frequency signal from a high-frequency signal. A frequency conversion circuit 3 to generate, an IF (Intermediate Frequency Frequency) circuit 4 for processing an intermediate frequency signal, and a crystal oscillation circuit 5 for generating a digital pulse signal for controlling the frequency conversion circuit 3 are provided. I have. A crystal oscillator 6 that oscillates at a predetermined oscillation frequency is connected to the crystal oscillation circuit 5.

In the IC chip 1 having such a configuration, the crystal oscillation circuit 5 and the crystal oscillator 6 are disposed farthest from the RF circuit 2, that is, on the opposite side of the RF conversion circuit 2 with respect to the frequency conversion circuit 3 and the IF circuit 4. are doing. By arranging the crystal oscillation circuit 5 and the crystal oscillator 6 at such positions, the crystal oscillation circuit 5 and the crystal oscillation circuit that generate harmonics of the digital pulse signal are provided. The pendulum 6 can be arranged as far away from the RF circuit 2 as possible.

In general, electromagnetic waves attenuate at a rate equal to one square of the distance from the source. Therefore, by arranging the crystal oscillation circuit 5 and the crystal oscillator 6 as far away from the RF circuit 2 as possible, sufficient harmonic components of the digital pulse signal generated from the crystal oscillation circuit 5 can reach the RF circuit 2. And the superimposition of the n-th harmonic on the analog signal handled by the RF circuit 2 can be suppressed. As a result, it is possible to suppress sound quality deterioration due to noise mixing in the analog signal.

Note that an antenna 7 is usually connected to the RF circuit 2. Since the position near the antenna 7 is particularly easy to pick up electromagnetic waves in the RF circuit 2, it is preferable to dispose the crystal oscillation circuit 5 and the crystal oscillator 6 farthest from the antenna 7. That is, for example, when the antenna 7 is provided near one corner of the IC chip 1, it is preferable to dispose the crystal oscillation circuit 5 and the crystal oscillator 6 at diagonal positions as shown in FIG. Is a diagram showing another configuration example of the IC chip 1, and here shows a mixed circuit of an analog circuit and a digital circuit. The IC chip 10 shown in FIG. 3 includes an analog circuit 11 for processing an analog signal, a digital circuit 12 for processing a digital signal, and a system clock (digital) for controlling the analog circuit 11 or the digital circuit 12. And a crystal oscillation circuit 13 for generating a pulse signal. A crystal oscillator 14 that oscillates at a predetermined frequency is connected to the crystal oscillation circuit 13.

If the IC chip 10 implements a function such as a radio receiver, a mobile phone device, a wireless LAN, or a Bluetooth interface, the analog circuit 11 is connected to an analog circuit via the antenna 15. It consists of a radio circuit (RF circuit, IF circuit, etc.) for transmitting and / or receiving signals. You. The digital circuit 12 includes a baseband signal processing circuit for digitally processing signals transmitted and received by the analog circuit 11.

In the present embodiment, as shown in FIG. 3, the analog circuit 11 and the digital circuit 12 are physically divided in the IC chip 10 into two regions. In the example of Fig. 3 (a), the IC chip 10 is divided into regions in the vertical (or horizontal) direction, and the analog circuit 11 is arranged in one area and the digital circuit 12 is arranged in the other area. are doing. The difference in the layout area between the analog circuit 11 and the digital circuit 12 is due to the difference in the scale of the built-in circuits.

In such an arrangement of the analog circuit 11 and the digital circuit 12, the crystal oscillator 13 and the crystal oscillator 14 are located farthest from the analog circuit 11, that is, the analog circuit 11 is sandwiched by the digital circuit 12. Located on the opposite side of circuit 11. By arranging the crystal oscillator 13 and the crystal oscillator 14 in such a position, the crystal oscillator 13 and the crystal oscillator 14 that generate harmonics of the system clock can be moved from the analog circuit 11 as much as possible. They can be placed remotely.

Therefore, the harmonic components of the digital pulse signal generated from the crystal oscillation circuit 13 are sufficiently attenuated before reaching the analog circuit 11, and the n-th harmonic is superimposed on the analog signal handled by the analog circuit 11. Can be deterred. As a result, it is possible to suppress sound quality deterioration due to noise mixing in the analog signal.

When the analog circuit 11 is configured by a wireless circuit as described above, the antenna 15 is usually connected thereto. Since the position near antenna 15 is the most easily picked up electromagnetic wave in analog circuit 11, crystal oscillation circuit 13 and water are located farthest from antenna 15. It is preferable to dispose the crystal oscillator 14. That is, for example, when the antenna 15 is provided near one corner of the IC chip 10, the crystal oscillation circuit 13 and the crystal oscillator 14 are arranged at diagonal positions as shown in FIG. 3 (a). Is preferred.

FIG. 3B is a diagram showing another example of the arrangement of the analog circuit 11 and the digital circuit 12 in the IC chip 10. In the example of FIG. 3 (b), the analog circuit 11 is placed in a region near one corner of the IC chip 10 and the digital circuit 12 is placed in the remaining region (in this case, the analog circuit 11). (L-shaped area surrounding the area). Then, the crystal oscillation circuit 13 and the crystal oscillator 14 are arranged at a position farthest from the analog circuit 11, that is, at a position diagonally opposite to the area of the analog circuit 11.

With this arrangement, the crystal oscillator 13 and the crystal oscillator 14 can be arranged as far away from the analog circuit 11 as possible. As a result, it is possible to prevent harmonics of the digital pulse signal generated from the crystal oscillation circuit 13 from being superimposed on the analog signal handled by the analog circuit 11, thereby reducing digital noise. In particular, by arranging the antenna 15 and the crystal oscillation circuit 13 and the crystal oscillator 14 on the diagonal of the IC chip 10 so that the distance between them is maximized, interference with analog signals can be prevented. Can be suppressed efficiently.

FIG. 4 is a diagram showing a specific example of an IC chip in which an analog circuit and a digital circuit are mixed. Figure 4 shows an example where the functions of the radio receiver are integrated into one chip. The IC chip 20 shown in Fig. 4 has, as analog circuits, an RF amplifier 21, a mixer 22, a local oscillator (OSC) 23, an IF amplifier 24, a detection circuit 25, an audio amplifier 26,? A circuit 27 is provided.

The RF amplifier 21 is a radio signal (high frequency Signal) via the antenna 40 and the antenna filter 41, and amplifies the signal. The mixer 22 generates an intermediate frequency (IF) signal by mixing the high-frequency signal output from the RF amplifier 21 and the signal of the local oscillation frequency output from the local oscillator 23, and Output to amplifier 24.

The local oscillator 23 generates a signal of the frequency according to the local oscillation frequency controlled by the PLL circuit 27 according to the set desired reception frequency, and supplies the signal to the mixer 22. The reference frequency from which the local oscillation frequency is generated by the PLL circuit 27 is determined by the oscillation frequency of the crystal oscillator 31.

The IF amplifier 24 performs predetermined processing such as amplification on the IF signal output from the mixer 22 and outputs the result to the detection circuit 25 at the next stage. The detection circuit 25 detects the IF signal output from the IF amplifier 24 and outputs the result to the audio amplifier 26. The audio amplifier 26 amplifies and outputs the detection output from the detection circuit 25.

The IC chip 20 shown in FIG. 4 is a digital circuit such as a crystal oscillator circuit 32, a digital counter 33, a digital controller 34, and a DARC (Data Radio Channel: FM data broadcast). It has a decoder 35 and so on. The crystal oscillation circuit 32 generates a system clock (digital pulse signal) for controlling the entire analog circuit and digital circuit using the crystal oscillator 31 oscillating at a predetermined frequency.

The digital counter 33 counts a system clock generated by the crystal oscillation circuit 32, and the count value is supplied to, for example, a digital controller 34, which is used to control the digital circuit. . The digital controller 34 controls the entire digital circuit including the 0-81 decoder 35.

0 1 ^ 〇 Decoder 35 is used for FM broadcasting (mobile FM multiplex broadcasting) It performs processing of receiving and decoding data transmitted by the communication. Here, processing such as error correction of the received data based on the error correction code included in the transmission data is also performed.

Note that the configuration inside the IC chip 20 shown here is merely an example, and it is not always necessary to provide all of these configurations. In addition to the configuration shown in Fig. 4, it is also necessary to process radio broadcast signals received by the antenna 40, such as a synthesizer for tuning (selecting the reception frequency) and a volume circuit for adjusting the volume. Other circuits may be provided.

As described above, in the IC chip 20 of the radio receiver, in which the analog circuit and the digital circuit are mounted together, the crystal oscillator 31 and the crystal oscillation circuit 32 are the RF amplifiers that are particularly easy to pick up electromagnetic waves among analog circuits. The IC chip 20 is located at a position farthest from the IC chip 21, that is, a diagonal position of the IC chip 20 when viewed from the RF amplifier 21.

By arranging the crystal oscillator 31 and the crystal oscillation circuit 32 in such a position, the source of the harmonic that causes noise can be arranged as far away from the RF amplifier 21 as possible. As a result, it is possible to suppress the inconvenience that the harmonic of the digital pulse signal generated from the crystal oscillation circuit 32 is superimposed on the high-frequency signal transmitted and received by the RF amplifier 21, thereby reducing noise and suppressing sound quality deterioration. be able to.

In the example of FIG. 4, the RF amplifier 21 and the crystal oscillator 31 and the crystal oscillation circuit 32 are arranged at diagonal positions of the IC chip 20, respectively. However, the present invention is limited to this example. It is not something to be done. For example, when the RF amplifier 21 is arranged along one side of the IC chip 20, if the crystal oscillator 31 and the crystal oscillation circuit 32 are arranged along the opposite side (opposite side), good. The point is that the present invention is included in the present invention as long as the crystal oscillation circuit 32 is arranged as far as possible from the RF amplifier 21 in the IC chip 20. In addition, in the examples of FIGS. 2 to 4, the crystal oscillator is shown as an external component of the IC chip, but the crystal oscillator may be built in the IC chip. Further, the oscillator and the oscillation circuit do not necessarily have to be made of crystal.

FIG. 5 is a diagram showing a configuration example of a module implementing the semiconductor device of the present invention.

The modules shown in Fig. 5 (functional modules such as radio receivers, mobile phones, wireless LANs, and bluetooth interfaces mounted on a single printed circuit board) 50 transmit and / or receive high-frequency signals Analog radio circuit (including an RF amplifier and IF amplifier) 51 that performs digital signal processing on signals transmitted and received by the radio circuit 51 (for example, a baseband signal processing circuit). 52), a crystal oscillator 53, and a crystal oscillation circuit 54.

The wireless circuit 51 is disposed near the antenna 55. Further, the digital signal processing circuit 52 is arranged in a region adjacent to the wireless circuit 51. Further, the crystal oscillator 53 and the crystal oscillation circuit 54 are located farthest from the analog radio circuit 51 (especially the RF amplifier) in the module 50, that is, the radio signal is sandwiched by the digital signal processing circuit 52. Located on the opposite side of circuit 51. As described above, since the antenna 55 is arranged near the radio circuit 51, the crystal oscillator 53 and the crystal oscillation circuit 54 are arranged at the farthest position from the antenna 55. Become.

As a result, the crystal oscillator 53 and the crystal oscillation circuit 54, which are sources of harmonics that cause interference with the analog signal, can be arranged as far away from the radio circuit 51 as is easy to pick up electromagnetic waves. By arranging the crystal oscillator 53 and the crystal oscillation circuit 54 as far as possible from the radio circuit 51 in this manner, the digital pulse generated from the crystal oscillation circuit 54 can be reduced. Signal harmonics can be prevented from being superimposed on analog signals transmitted and received by the wireless circuit 51, and noise can be reduced.

In the example of FIG. 5 described above, the crystal oscillator 53 and the crystal oscillation circuit 54 are arranged at the position farthest from the analog radio circuit 51 in the module 50. The circuit may be arranged using both sides of the printed circuit board, and the radio circuit 51 and the crystal oscillator 53 and the crystal oscillation circuit 54 may be arranged on different surfaces. By doing so, the harmonics (electromagnetic waves) generated from the crystal oscillation circuit 54 can be shielded by the arrangement pattern (PCB pattern) of the printed circuit board, and can be prevented from reaching the radio circuit 51.

Even when the radio circuit 51 and the crystal oscillator 53 and the crystal oscillation circuit 54 are arranged on different surfaces, the radio circuit 51 and the crystal oscillator 53 and the crystal oscillation circuit 54 are as far as possible from each other. It is preferable to arrange them at positions. By doing so, it is possible to more reliably prevent the harmonics of the digital pulse signal generated from the crystal oscillation circuit 54 from being superimposed on the analog signal transmitted and received by the wireless circuit 51.

Although FIG. 5 illustrates an example in which an analog circuit (wireless circuit 51) and a digital circuit (digital signal processing circuit 52) are mixed on one module 50, the IC chip shown in FIG. Similarly to 1, on a module on which only an analog circuit is mounted, a crystal oscillator and a crystal oscillation circuit may be arranged at a position farthest from the analog circuit. In the above embodiment, the IC chips 1, 10, and Although the case where the analog circuit in the module 20 or the analog circuit in the module 50 is a wireless circuit has been described, the present invention is not particularly limited to this example. In other words, any analog circuit that includes a circuit that can easily pick up electromagnetic waves Lighting can be applied.

Further, in the above embodiment, an example in which the analog circuit and the digital circuit are physically divided into regions has been described. However, at least a circuit that can easily pick up an electromagnetic wave is located as far as possible from the crystal oscillator and the crystal oscillation circuit. Analog circuits and digital circuits may be mixed as long as they are arranged.

In addition, the above-described embodiments are merely examples of embodying the present invention, and the technical scope of the present invention should not be interpreted in a limited manner. It is. That is, the present invention can be embodied in various forms without departing from its spirit or its main features.

As described above, according to the present invention, in a semiconductor device in which an analog circuit and an oscillating circuit are mounted in one chip or one module, an oscillation circuit serving as a generation source of a harmonic of a digital pulse signal is provided. The circuit can be placed as far as possible from the analog circuit. Thus, it is possible to suppress the inconvenience that harmonics from the oscillation circuit are superimposed as digital noise on an analog signal processed by the analog circuit without providing a special member for preventing noise. For example, when a voice signal is handled as an analog signal, the sound quality can be improved. According to another feature of the present invention, in a semiconductor device in which an analog circuit and an oscillation circuit are mounted in one module, the analog circuit is different from the oscillation circuit that is a source of generating a harmonic of a digital pulse signal. By arranging them on the module substrate surface, it is possible to shield the harmonics by the module substrate surface so that harmonics from the oscillation circuit do not enter the analog circuit. As a result, it is possible to suppress the inconvenience that harmonics from the oscillation circuit are superimposed as digital noise on the analog signal processed by the analog circuit without providing a special member for preventing noise. This In the case of, by arranging the oscillation circuit on the back surface as far as possible from the analog circuit, it is possible to more reliably prevent the harmonics generated from the oscillation circuit from being superimposed on the analog signal processed by the analog circuit. Will be able to do it.

Industrial applicability

INDUSTRIAL APPLICABILITY The present invention is useful for an analog-digital mixed circuit that can suppress inconvenience of receiving digital noise from a crystal oscillation circuit and deteriorating analog signal quality.

Claims

The scope of the claims

1. An analog circuit that performs processing related to a signal in a desired frequency band, and an oscillation circuit that generates a signal in which a harmonic of an oscillation frequency may exist in the desired frequency band are provided in one semiconductor chip.

A semiconductor device, wherein the oscillation circuit is arranged in the semiconductor chip at a position farthest from the analog circuit or the input circuit for a signal in a desired frequency band.

2. A semiconductor device in which an analog circuit for performing processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted on one semiconductor chip, and the semiconductor chip generates a digital pulse signal according to a predetermined oscillation frequency. Equipped with an oscillation circuit,

A semiconductor device, wherein the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip.

3. An analog circuit that performs processing related to a high-frequency signal in a desired frequency band, a digital circuit that performs predetermined digital signal processing,

A crystal oscillator that oscillates at a predetermined frequency,

An oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator,

A semiconductor device, wherein the oscillation circuit is arranged at a position farthest from the analog circuit.

4. The semiconductor device according to claim 3, wherein the crystal oscillator is arranged near the oscillation circuit.

5. A semiconductor device having a semiconductor chip in which an analog circuit for performing processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted, and An oscillation circuit in the semiconductor chip that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator,

6. A semiconductor device having a semiconductor chip on which an analog circuit for performing processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted, and a crystal oscillator that oscillates at a predetermined frequency;

An oscillation circuit in the semiconductor chip that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator,

A semiconductor device, wherein the oscillation circuit is arranged at a position farthest from the analog circuit in the semiconductor chip, and the crystal oscillator is arranged near the oscillation circuit.

7. The semiconductor device according to claim 1, wherein the analog circuit is a wireless circuit for transmitting and / or receiving an analog signal wirelessly.

8. An analog high-frequency circuit for wirelessly transmitting and receiving or receiving a high-frequency signal in a desired frequency band;

An oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator is provided in one semiconductor chip.

A semiconductor device, wherein the oscillation circuit is arranged farthest from the high-frequency circuit in the semiconductor chip.

9. A semiconductor device having a semiconductor chip in which an analog circuit for performing processing related to a high-frequency signal in a desired frequency band and a digital circuit are mixed, and an analog high-frequency signal for wirelessly transmitting and / or receiving the high-frequency signal. Circuit and

Oscillation that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator And a circuit,

10. The semiconductor device according to claim 8, wherein the oscillation circuit and the high-frequency circuit are arranged at diagonal positions of the semiconductor chip.

1 1. An analog circuit that processes high-frequency signals in a desired frequency band, a crystal oscillator that oscillates at a predetermined frequency,

An oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator is provided in one module.

A semiconductor device, wherein the crystal oscillator and the oscillation circuit are arranged at a position farthest from the analog circuit in the module.

12. A semiconductor device in which an analog circuit that performs processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted in one module, wherein the module includes a crystal oscillator that oscillates at a predetermined frequency; An oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator,

13. The module has one or more semiconductor chips, the analog circuit and the oscillation circuit are provided in the same semiconductor chip, and the oscillation circuit is located farthest from the analog circuit in the semiconductor chip. 12. The semiconductor device according to claim 11, wherein the semiconductor device is arranged in a semiconductor device.

1 4. An analog circuit that processes high-frequency signals in the desired frequency band A crystal oscillator that oscillates at a predetermined frequency,

An oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator is provided on one module,

A semiconductor device, wherein the analog circuit, the crystal oscillator, and the oscillation circuit are separately arranged on both sides of a module substrate.

15. A semiconductor device in which an analog circuit that performs processing related to a high-frequency signal in a desired frequency band and a digital circuit are mounted in one module, wherein the module includes a crystal oscillator that oscillates at a predetermined frequency; An oscillation circuit that generates a digital pulse signal according to the oscillation frequency of the crystal oscillator,

16. The semiconductor device according to claim 11, wherein the analog circuit is a wireless surface for transmitting and / or receiving an analog signal wirelessly.