WO2002072915A1

WO2002072915A1 - Conditioning agent and use thereof

Info

Publication number: WO2002072915A1
Application number: PCT/JP2001/001936
Authority: WO
Inventors: Masami Ishikawa; Satoru Shimizu
Original assignee: Ebara-Udylite Co., Ltd.
Priority date: 2001-03-13
Filing date: 2001-03-13
Publication date: 2002-09-19
Also published as: JP4651266B2; JPWO2002072915A1

Abstract

A degreasing conditioning agent which comprises one or more of the following component (A); and a degreasing conditioning agent which further comprises one or more of the following component (B). The degreasing conditioning agents afford satisfactory catalyst deposition even when use is made of a catalyzer solution having a Pd concentration about 1/3 the concentration in the case of a conventional conditioning agent and also the electroplating of a surface thus catalyzed is almost free from roughness or occurrence of pits.

Description

Description Conditioning agent and its application Technical field

The present invention relates to a conditioning composition for promoting the adsorption of a palladium-tin tin colloid catalyst on a non-conductive material such as plastic, and more particularly, to the use of a palladium tin tin colloid catalyst at a low concentration. The present invention relates to a conditioning agent, a conditioning composition, and a method for precipitating a palladium-tin tin colloid catalyst on a nonconductive polymer material using the same. Background art

For a long time, a palladium-tin tin colloid catalyst (hereinafter referred to as “Pd—Sn catalyst”) was deposited on the surface of a polymer material to form a metal film on a nonconductive polymer material such as plastic. A so-called plastic plating method has been used in which a so-called catalyzing treatment is performed, and then, if necessary, electroless plating is performed, followed by metal electroplating. Also, in recent printed wiring boards, it is usual to combine a plurality of printed boards to form a multilayer, and to provide a through hole or a blind via hole between these boards, and to provide each through a metal deposited in these holes. The substrate has become conductive.

In any of the above methods, the Pd-Sn catalyst is sufficiently and uniformly adsorbed and deposited in the catalizing process in order to accurately form a metal film on the target portion in the subsequent process. Is needed. And in order to obtain such adsorption 'precipitation, use P It was supposed that the concentration of the d—Sn catalyst solution had to be above a certain level.

However, palladium itself is an extremely expensive metal, and the higher the concentration of the Pd—Sn catalyst solution, the greater the amount of catalyst lost by so-called “pumping”, which poses a major economic problem. Therefore, there is a strong demand for performing the catalizing treatment with a catalyst solution having a lower concentration.

Therefore, as a problem in this field, while reducing the concentration of P d-S _n catalyst solution, to provide a means capable of precipitating a uniform P d-S n catalyst layer was present.

There is also a need for a means that can provide an excellent conditioning effect to polyimide resins (particularly laser-drilled surfaces) and resins containing glass fibers, which were considered to have weak conditioning effects with conventional conditioning agents. Had been. Disclosure of the invention

The present inventor has conducted various studies on the conditions of the catalizing treatment, and the quality of the catalizing treatment is not limited to the Pd-Sn catalyst solution used, but also to the conditioning treatment in the preceding process. I knew it was affected. We have been studying compositions to further enhance the conditioning effect.Conditioning agents using specific polymer components and conditioning compositions prepared by combining these with other specific polymer components Can provide an excellent catalizing effect, and can deposit a Pd—Sn catalyst layer without any problem even if the concentration of the conventional Pd—Sn catalyst solution is about 1 to 3. Completed the present invention by finding that it can provide a conditioning effect did.

That is, the first object of the present invention is to provide the following component (A)

(A) Equation (1), (I I) or (I I I)

(In the formula, R represents a saturated or unsaturated alkyl group having 12 to 20 carbon atoms, R and R _s each represent a lower alkyl group, or represents a lower alkylene group, and n and m each represent Indicate the number from 5 to 10)

(Wherein, R ₆ and R ₇ each represent a lower alkyl group, and I represents a number from 10 to 100)

PEG- -NH-Lr-NH-PEG- (III)

(Wherein, PEG represents a polyethylene glycol group having a molecular weight of 1,000 to 10,000, L ₂ represents a saturated or unsaturated alkylene group having 12 to 20 carbon atoms, and p represents 10 From 100)

One or more polymer compounds represented by By providing a degreasing conditioning agent containing as an active ingredient.

The second object of the present invention is to provide the above component (A) and the following component (B),

(B) The following formula (IV), (V) or (VI)

(In the formula, R 'represents hydrogen or a lower alkyl group, Y represents halogen, anion sulfate, anion nitrate or anion phosphate, and q represents a number from 100 to 10,000.)

(Wherein, R ₈ and R ₉ represent hydrogen or a lower alkyl group, and r represents a number from 100 to 100,000)

(Wherein, Z represents a halogen ion, anion sulfate, anion nitrate or anion phosphate, and R ₈ , R ₉ and r have the above-mentioned meanings) One or more polymer compounds represented by

Is to provide a conditioning composition containing as an active ingredient.

A further object of the present invention is to treat a non-conductive polymer material with the above-mentioned conditioning agent or conditioning composition, and then to immerse the material in a catalyst that contains a palladium-tin colloid catalyst. An object of the present invention is to provide a method for depositing a palladium-tin tin colloid catalyst on a polymer material. BEST MODE FOR CARRYING OUT THE INVENTION

The conditioning agent of the present invention is prepared using a component (A) (first polymer component) selected from high molecular compounds represented by formulas (I) to (III) as an active ingredient.

Among the components (A), the polymer compound represented by the formula (I) is composed of an acrylate monomer represented by the following formula (VII) and an acrylate monomer represented by the following formula (VI II). It has a structure in which an acid ester quaternary monomer is copolymerized.

(Wherein, R, R, ~ R ₅ and L have the above-mentioned meanings)

In this polymer compound (I), examples of the ester group R include an alkyl group or an alkenyl group having 12 to 20 carbon atoms, and specific examples thereof include a stearyl group, a palmityl group, and an oleyl group. Can be Also, group R, examples of the lower alkyl group ~ R _5, a methyl group, Echiru group, a propyl group, an alkyl group having 1 to 4 carbon atoms. Furthermore, examples of the lower alkenyl group include a methylene group and an ethylene group.

This polymer compound (I) can be obtained by copolymerizing acrylate ester monomer (VII) and acrylate quaternary monomer (VIII) according to a conventional method.

Further, among the high molecular compounds used as the component (A), those of the formula (II) have, for example, a structure in which a monomer represented by the following formula (IX) is polycondensed.

(In the formula, X represents a leaving group such as halogen, and R ₆ and R ₇ have the meaning described above.)

In the polymer compound (II), lower alkyls represented by the formulas R ₆ and R ₇ Examples of the alkyl group include an alkyl group having 1 to 4 carbon atoms, such as a methyl group, an ethyl group, and a propyl group.

This polymer compound (II) is also obtained by subjecting the monomer (IX) to polycondensation according to a conventional method.

Further, among the components (A), the polymer compound (III) has, for example, a structure in which a diamine represented by the formula (X) and polyoxyethylene are condensed, and the group represented by the formula (Ml) the L _2, stearyl group, palmityl group, Oreiru group and the like.

H ₂ N—— L ₂ — N ₂ H (X)

The production of the polymer compound (III) is obtained by reacting diamine (X) with polyoxyethylene according to a general method.

The polymer compounds of the above formulas (I) to (III) are all commercially available, for example, from Nippon Oil & Fats Co., Ltd.

The conditioning agent of the present invention is prepared by combining one or more of the above-mentioned polymer compounds (I) to (III) with an appropriate carrier or another component as required. The above-mentioned component (A) may be blended with the conditioning agent so that the concentration in the bath at the time of use is about 0.1 to 20 and preferably "! To about 5 L. The composition comprises, as the first polymer component (A), a component (B) (the second polymer component) selected from the polymer compounds represented by the formulas (IV) to (VI). It is prepared by mixing and formulating in a conventional manner. Of the second polymer component (B), the lower alkyl group R ′ of the polymer compound (IV) is an alkyl group having 1 to 4 carbon atoms such as a methyl group, an ethyl group, and a propyl group. No. This polymer compound (IV) is commercially available, for example, as PVAD, Diamond Clear (all manufactured by Mitsubishi Chemical Corporation), etc., and can be used.

Further, among the component (B), the lower alkyl group of R ₈ and R ₉ in the polymer compounds (V) and (VI) is also an alkyl group having 1 to 4 carbon atoms such as a methyl group, an ethyl group, and a propyl group. Groups.

These polymer compounds can be obtained by polymerizing an alkyl vinylamine represented by the following formula (XI), or by further converting the amino group of the polymer to a halogen acid such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid or the like. It can be obtained by quaternizing with.

H. R ₉

> Niku (XI)

R ₈ NH ₂

This is also commercially available, for example, under the trade name of P VAM (manufactured by Mitsubishi Chemical Corporation), and can be used.

Component (A) in the conditioning composition of the present invention should be incorporated into the conditioning composition in such an amount that the concentration in the bath at the time of use is about 0.1 to 20 _g ZL, particularly about 1 to 5 _g ZL. The component (B) is preferably incorporated into the conditioning composition in such an amount that the concentration in the bath at the time of use is about 0.1 to 10 _g , particularly about 1 to 5 _g ZL. preferable. Conditioning agent or conditioning composition of the present invention, As described above, component (A) is used alone, or is prepared by combining component (B) with component (A). If necessary, a suitable carrier or other components may be added. can do.

Carriers or other components that can be added to the conditioning agent of the present invention ゃ conditioning composition (hereinafter referred to as “conditioning agent etc.”) include organic amine compounds such as monoethanolamine and triethanolamine, and the like. Examples thereof include inorganic alkali compounds such as sodium hydroxide, sodium carbonate and sodium gay acid, and nonionic surfactants such as nonylphenol ethoxylate and secondary alcohol-ruethoxylate.

Of these components, conditioning agents containing surfactants and surfactants, such as organic amine compounds and inorganic surfactants, improve the degreasing power. Therefore, not only as a dedicated conditioner, but also as a degreasing agent. It can also be used as a conditioner.

Preferred components for preparing this defatting conditioner and their ranges of amounts are as follows.

Component (A) 0.1 to 20 gZL (1 to 5 g / L) [Component (B) 0.1 to 10 g / L (1 to 5 gZL)] Monoethanolamine 2 to 30 g L (5 to 20 gZ L_) Triethanolamine 1 to 20 g / L (2 to 10 gZ) Sodium hydroxide 0 to 50 gZ (0 to 20 gZ) Sodium carbonate 0 to 50 gZ L (0 to 20 gZ) Nonionic surfactant 0 to 30 g / L (2 to "! O gZ L)

(Note) The inside of the box is in a preferable range. The conditioning agent of the present invention thus obtained is, like the conventional conditioner, used for electroless plating and directing without electroless plating. As a pretreatment for the plating method (DPS method), Pd—Sn catalyst is deposited on various nonconductive polymer materials, such as substrates of plastic materials, glass epoxy resin, polyimide resin, etc. It can be used to enhance performance.

The conditions for using the conditioning agent and the like of the present invention are not particularly limited, and may be almost the same as those of known ones. However, the amount of the Pd-Sn catalyst contained in the catalyst may be reduced as compared with the conventional one. It is possible.

That is, as will be described in Examples below, the conditioning agent of the present invention has a concentration of 13 which has been required so far, especially for polyimide resins in which Pd-Sn catalyst is difficult to precipitate. Even if a catalyst with a Pd—Sn catalyst concentration is used, complete precipitation can be obtained. Therefore, by performing conditioning using the conditioning agent of the present invention, the concentration of the catalyst in the subsequent process can be reduced, and as a result, the amount of the Pd—Sn catalyst extracted can be reduced. This is extremely advantageous.

In addition, when the conditioning agent of the present invention is used, the Pd—Sn catalyst is uniformly deposited on the non-conductive polymer material. Another characteristic is that pits and roughness are difficult to see.

Furthermore, when the conditioning agent of the present invention is used, precipitation of the Pd—Sn catalyst can be obtained in a wide range of catalyst concentrations, and thus there is an advantage in bath management. Example

Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. Example 1

Through holes of various hole diameters were made on the FPC substrate (polyimide resin; plate thickness: 50 m, double-sided copper foil: 18 m) with a laser, and electroless copper plating was performed in the following processing steps. After the electroless copper plating, the cross section of the through hole was cut open and observed with a microscope to examine the copper coverage on the resin surface in the through hole. The degreasing conditioner used had the following composition. Table 1 shows the results. Test degreasing conditioner composition:

(Invention product 1)

Polymer of formula _{(I) (R = C 18} H 37, [^ ~ ^ methyl, teeth = E Ji

Ren, n = 8, m = 8 ) 5 g / L formula (IV) polymer of _{_{(R '= C 3 H 7}} , Y = - S 0 3 H, q = 5000)

2 gZ then monoethanolamine 10 gZL triethanolamine 5 gL nonylphenol ethoxylate 5 gZL

(Invention product 2)

Polymer of formula _{(I) (R = C 18} H 37,! ^ ~ ^ Nimechiru, teeth = E Ji Ren, n = 8, m = 8 ) 5 g / L monoethanolamine § Min 1 0 GZL Bok Rietano one Ruamin 5 L Nonylphenol ethoxylate 5 gZ L

(Comparative product 1)

Trimethyl stearyl ammonium 5 gZ Conclusion

Chloride

Mono-Ethano Lily "V 10 £ /

, /)

Trietano I J 5a- / I Non I J 1

Treatment process ·

r-Month resin binder (Table 1) 60 ° C for 5 minutes Soft etch * ¹ 25 ° C for 1 minute Pre-dip * ² 25 ° C for 1 minute Catalyzer * ³ 30 ° C for 5 minutes Accelerator * ⁴ 30 ° C 5 minutes Electroless copper plating * ⁵ 25 ° C 15 minutes

* 1 Ρ Β 2 2 8 (manufactured by Ebara Uji Light Co., Ltd.) 100 g L

* 2: Ρ Β 2 3 2 (manufactured by Ebara Uji Light Co., Ltd.) 200 g / L

* 3: Ρ Β 3 1 8 (manufactured by Ebara Uji Light) m

(30 mg / L as Pd)

* 4: 100 g of sulfuric acid

P B—44 5 (manufactured by EBARA Yuji Light Co., Ltd.) 5 ml /

* 5: PB503AF (manufactured by Ebara Uji Light Co., Ltd.) 100 ml /

PB 503 BF (manufactured by Ebara Uji Light Co., Ltd.) 100 ml /

Through-hole coverage (%) Hole diameter

(mm) Inventive product 1 Inventive product 2 Comparative product 1

0.2 1 00 80 30

0.3 1 00 1 00 40

0.4 1 00 1 00 60

1.0 1 00 1 00 60

As shown in the results of Table 1, when the present invention 1 containing the component (Α) and the component (Β) is used in the degreasing conditioner, the electroless copper plating is hardly deposited and the 0.2 mm of polyimide resin is hardly deposited. It was clarified that even for a through hole of 0, the entire surface inside the hole was completely covered even with a standard Pd concentration of 1 to 3 or less. Also, in the case of the product 2 of the present invention containing the component (A), although the through hole of 0.2 mm ø was slightly inferior, the coverage was overwhelmingly improved as compared with the comparative product 1 conventionally used. Was admitted.

Example 2

The same FPC substrate as in Example 1 was drilled with through holes (0.3 mm in hole diameter) as a sample, and the concentration of the catalyst (Pd concentration of the catalyst) was changed in each case of Example 1. The performance of the degreasing conditioner was compared. The processing steps other than the concentration of the catalyst and the measurement of the coverage were performed in the same manner as in Example 1. Table 2 shows the results.

(Result) Table 2

As is evident from the results in Table 2, in the conventional degreasing conditioner (comparative product 1), Pd in the catalyst was 10 Om to completely cover the inside of the hole with copper. Although it was necessary to be not less than gZL, in the present invention products 1 and 2, the inside of the hole could be completely covered with copper with 3 O mg gZL. Example 3

Laser holes were used to drill throughholes of various hole diameters on an RPC board (glass epoxy resin; board thickness 1.6 mm, copper on both sides ¾18¾m). Conclusion

In the same manner, electroless copper plating was performed, and the copper coverage on the resin surface in the through hole was examined. The degreasing conditioner is shown below.

\)

The one having the composition was used. Table 3 shows the results. Test degreasing conditioner composition:

(Invention product 3)

Polymer of formula (II) (R _e = R ₇ = methyl, 20)

5 g L Polymer of formula (VI) (R ₈ = methyl, R ₉ = HZ = CI, r = 2000) 5 g L

Monoethanolamine 10 g / L Triethanolamine 5 g X L Secondary alcohol ethoxylate 10 g L (Comparative product 1)

Trimethylstearylammonium chloride 5 g Monoethanolamine 0 g XL Triethanolamine 5 g / L Secondary alcohol ethoxylate 5 g / L

Three

As shown in the above results, when the degreasing conditioner of the present invention product 3 is used, even if the Pd concentration is 30 mg L and the standard concentration of 1 to 3, the RPC substrate commonly used is used. It became clear that the entire surface of the small through hole of O.3 mm 0 can be covered with copper.

In particular, the deposition of copper on glass fibers, which is usually difficult to coat even at low palladium concentrations, indicates that the performance of the degreasing conditioner of the present invention is extremely excellent. . Example 4

Rough pit generation test:

In the test of Example 2, the condition of the minimum Pd concentration at which 100% coating was obtained (Pd concentration of 3 Omg gL for the present invention, and 10 Omg gL for the comparative product 1) ), And then electroless copper The substrate that had been subjected to the plating process was subsequently subjected to copper sulfate plating under the following conditions. The finished surface of the obtained substrate was observed with a stereoscopic microscope, and the roughness was compared. Table 4 shows the number of rough pits per cm ² . Note that roughness and pits with a diameter of 10 m or less are difficult to distinguish, so they are indicated as the number of roughness pits.

(Copper sulfate plating bath composition)

Copper sulfate 75 g / L Sulfuric acid 180 g / L Chloride ion 60 mg Z L Cube light T H M I 5 m I / L

(Manufactured by EBARA Yuji Light Co., Ltd.)

(Copper sulfate plating conditions)

Current density 3.0 A / dm ² Plating time 50 min Plating temperature 25 ° C Stirring air rate (result)

Four

As shown in the above results, when the conditioning treatment was performed using the product of the present invention having a Pd concentration of 3 Omg gL, the roughness after final copper sulfate plating was much smaller than that of the standard. There were few. This can be interpreted as the fact that the tin and palladium adsorbed on the surface of the copper foil of the material were uniformly dispersed, and that there were few large lumps. Example 5

A degreased conditioner (Product 4 of the present invention) was produced according to the following composition. Since this degreasing conditioner has extremely excellent wettability and permeability, it was particularly suitable for a high-ascent substrate such as a multilayer plate (a substrate having a small through-hole diameter and a large plate thickness).

(Composition)

Polymer of formula (III) (L ₂ = C ₁₆ H ₃₂ , PEG = polyethylene glycol with molecular weight 4000, p = 20) 5 g / L Polymer of formula (V) (R ₈ = H, R ₉ = H, r = 500)

2 g / L monoethanolamine 15 g X L

Secondary alcohol ethoxylate 10 g L Nonylphenyl ethoxylate 5 g / L Example 6

A defatting conditioner (Product 5 of the present invention) was produced according to the following composition. This degreasing conditioner was particularly suitable for direct plating because of its high alkalinity and extremely strong conditioning action.

(Composition)

Polymer of formula (I) (R = CBH: R 1 ~R 5 = methyl, Echire emissions, n = 8 m = 8) polymer 1 o kappa L formula _{(VI) (R 8 = C} Ha R 9 = H, z = c

r = 5000) 2 g κL monoethanolamine 10 g / L sodium hydroxide 5 g L nonylphenol ethoxylate 10 g / L Example 7

The amount of palladium adsorbed on the sample substrate when the following degreased conditioner was used was compared. The treatment process was the same as in Example 1, and the amount of palladium adsorbed was calculated by dissolving the catalyst adsorbed on the substrate surface after activator with aqua regia and measuring the palladium concentration by atomic absorption. . What As the sample substrate, a sample in which the copper foil of a glass epoxy substrate (Matsushita, FR4) was dissolved and removed with nitric acid to expose the epoxy resin surface, and a polyimide film (Toray, Kapton) were used. Table 5 shows the results.

(Conditioner composition)

Invention 6:

Polymer of formula (I) (R = C, 8 H 37, R 1 ~ R S = methyl, Echire emissions, n = 8, m = 8 ) 2 gZ L monoethanolamine § Min 1 0 gZ L triethanolamine § Min 3 g ZL

Secondary alcohol ethoxylate 5 gZ L Invention product 7:

Polymer of formula (II) (R ₆ = R ₇ = methyl, 1 = 20) 2 g / L monoethanolamine 10 gZ L Triethanolamine 3 g L

Secondary alcohol ethoxylate 5 g L Invention product 8:

Polymer of formula (111) (L ₂ = C ₂ H ₄ , p = 30, average molecular weight of PEG is 600) 2 g / L monoethanolamine 10 gZL Triethanolamine 3 gL

Secondary alcohol ethoxylate 5 gZ L Comparative product 2:

Trimethyl stearyl ammonium chloride 2 gZL

Monoethanolamine 10 gZL

Triethanolamine 3 g L

Secondary alcohol ethoxylate 5 g / L (Result)

Five

Comparative product 2 has a composition generally used at present.Compared to this, it can be seen that inventive products 6 to 8 have a large amount of palladium adsorbed and have excellent palladium adsorption properties. .

In particular, it was clarified that the products 6 and 7 of the present invention exhibited an extremely excellent effect even on polyimides, which conventional degreasing conditioners are not good at. The invention's effect

The co-conditioning agent and the conditioning composition of the present invention have an excellent conditioning effect, and even when a conventional catalyst having a Pd concentration of about 1 to 3 is used, sufficient catalyst precipitation can be obtained. In addition, even after electric plating, the roughness is extremely low and the performance is excellent. Therefore, it can be used advantageously as a pretreatment for plating various plastic materials and substrates as a high-performance and economical alternative to the conventionally used conditioning agents.

In particular, the conditioning agent of the present invention has an excellent effect on polyimide resins (particularly laser-drilled surfaces) and resins containing glass fibers, which have been considered to be ineffective with conventional conditioning agents. It is extremely useful as a conditioning composition capable of adsorbing a Pd-Sn catalyst even into micropores called through holes and blind via holes provided in a substrate.

Claims

1. The following components (A)

(A) Formula (1), (II) or (III)

Enclosure

(Wherein, R represents a saturated or unsaturated alkyl group having 12 to 20 carbon atoms, to R ₅ each represents a lower alkyl group, or R ₅ represents a lower alkylene group, and n and m each represent 5 to 1 Indicates the number of 0)

(Wherein, R ₆ and R ₇ each represent a lower alkyl group, and represents a number from 10 to 100)

PEG- -NH-Lr-NH-PEG- (III)

(Wherein, PEG represents a polyethylene glycol group having a molecular weight of 1,000 to 10,000, a saturated or unsaturated alkylene group having 12 to 20 carbon atoms, and p represents (Indicates the number of 100) One or more polymer compounds represented by

A conditioning agent containing as an active ingredient.

2. The conditioning composition according to claim 1, further comprising an alkanolamine, which is used as a degreasing conditioner.

3. The degreasing conditioning agent according to claim 1, further comprising an inorganic alkali substance and / or a nonionic surfactant, which is used as a degreasing conditioner.

4. Non-conductive polymer material is composed of the following components (A)

(A) Formula (l), (I I) or (I II)

(Wherein, R, R, to R ₅ , un and m have the above-mentioned meanings, respectively)

(Wherein, R ₆ , R ₇ and I have the meanings described above, respectively) PEG- -NH-Lr-NH-PEG- (III)

(Wherein PEG, L ₂ and p have the same meanings as described above), respectively.

After treating with a conditioning agent containing palladium-tin as an active ingredient, this is immersed in a catalyst containing a palladium-tin-colloid catalyst. Deposition method.

5. The non-conductive polymer material according to claim 4, wherein the concentration of the palladium-tin colloid catalyst in the catalyst in terms of metal palladium is from 100 mg / mL to 30 mg / mL. Method for depositing palladium-tin colloid catalyst on top.

6. The following components (A) and (B),

(A) The following formula (l), (I I) or (I I I)

(Wherein, R to R ₅ , L n and m each have the meaning described above)

(Wherein, R ₆ , R ₇ and I have the meanings described above, respectively)

PEG—f— NH-L-Factory NH-PEG- (III)

(Wherein, P EG, p and p have the above-mentioned meanings, respectively)

(B) The following formula (IV), (V) or (VI)

(Wherein, R ₈ and R _s represent hydrogen or a lower alkyl group, and r is 10 0 to 10 0, indicating the number of O 00)

(In the formula, Z represents a halogen ion, anion sulfate, anion nitrate or anion phosphate, and R ₈ , R ₉ and r have the same meanings as described above.) that's all

A conditioning composition containing as an active ingredient.

7. The conditioning composition according to claim 6, further comprising an alkanolamine, which is used as a degreasing conditioner.

8. The degreasing conditioning composition according to claim 6, further comprising an inorganic alkali substance and / or a nonionic surfactant, and used as a degreasing conditioner.

9. The non-conductive polymer material is composed of the following components (A) and (B),

(A) The following equation (1), (I I) or (111)

(Wherein, R, R, to R ₅ , Lu n and m have the above-mentioned meanings, respectively)

(Wherein, R ₆ , R ₇ and I have the meanings described above, respectively)

PEG—H NH-Lr-NH-PEG- (III)

(Wherein PEG, L ₂ and p have the above-mentioned meanings, respectively)

(B) The following formula (IV), (V) or (VI)

(Wherein, R ′, Y and q have the meanings described above, respectively)

(Wherein, R ₈ , R ₉ and r each have the meaning described above)

(Wherein, Z, R ₈ , R ₉ and r have the above-mentioned meanings, respectively)

After treating with a conditioning composition containing as an active ingredient, this is immersed in a catalyzer containing a palladium-tin colloid catalyst, wherein the palladium-tin colloid is coated on a nonconductive polymer material. Method of depositing catalyst.

10. The non-conductive polymer according to claim 9, wherein the concentration of the palladium-tin tin colloid catalyst in the catalyst in terms of metal palladium is from 100 mg / mL to 30 mg / mL. Method for depositing palladium-tin colloid catalyst on materials.