WO2002069404A3 - Schaltungsanordnung - Google Patents

Schaltungsanordnung Download PDF

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Publication number
WO2002069404A3
WO2002069404A3 PCT/DE2002/000601 DE0200601W WO02069404A3 WO 2002069404 A3 WO2002069404 A3 WO 2002069404A3 DE 0200601 W DE0200601 W DE 0200601W WO 02069404 A3 WO02069404 A3 WO 02069404A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
circuit arrangement
generating components
region
components
Prior art date
Application number
PCT/DE2002/000601
Other languages
English (en)
French (fr)
Other versions
WO2002069404A2 (de
Inventor
Gerd Auerswald
Hans Rappl
Kurt Gross
Stefan Kulig
Michael Kirchberger
Original Assignee
Siemens Ag
Gerd Auerswald
Hans Rappl
Kurt Gross
Stefan Kulig
Michael Kirchberger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Gerd Auerswald, Hans Rappl, Kurt Gross, Stefan Kulig, Michael Kirchberger filed Critical Siemens Ag
Priority to EP02712790A priority Critical patent/EP1364406A2/de
Publication of WO2002069404A2 publication Critical patent/WO2002069404A2/de
Publication of WO2002069404A3 publication Critical patent/WO2002069404A3/de
Priority to US10/649,839 priority patent/US6930373B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01005—Boron [B]
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    • H01L2924/0101—Neon [Ne]
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    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01031—Gallium [Ga]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
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    • H01L2924/01065—Terbium [Tb]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Abstract

Die Schaltungsanordnung weist ein Leistungsteil (LE) auf, das wärmeerzeugende Bauelemente und mindestens ein weniger wärmeerzeugendes Bauelement umfasst. Das weniger wärmeerzeugende Bauelement ist in einem inneren Bereich der Schaltungsanordnung angeordnet. Die wärmeerzeugenden Bauelemente sind um den inneren Bereich herum angeordnet und an mindestens einem als elektrische Leitung wirkenden metallischen Körper (K1) befestigt, mit dem sie elektrisch verbunden sind. Zur Kühlung der wärmeerzeugenden Bauelemente ist der Körper (K1) elektrisch isoliert zumindest im Bereich der wärmeerzeugenden Bauelemente auf einem Kühlkörper (KK) angeordnet. Der Kühlkörper (KK) ist um den inneren Bereich umlaufend ausgestaltet.
PCT/DE2002/000601 2001-02-27 2002-02-20 Schaltungsanordnung WO2002069404A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP02712790A EP1364406A2 (de) 2001-02-27 2002-02-20 Schaltungsanordnung
US10/649,839 US6930373B2 (en) 2001-02-27 2003-08-27 Circuit arrangement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10109329A DE10109329C1 (de) 2001-02-27 2001-02-27 Schaltungsanordnung
DE10109329.2 2001-02-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/649,839 Continuation US6930373B2 (en) 2001-02-27 2003-08-27 Circuit arrangement

Publications (2)

Publication Number Publication Date
WO2002069404A2 WO2002069404A2 (de) 2002-09-06
WO2002069404A3 true WO2002069404A3 (de) 2003-05-22

Family

ID=7675601

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/000601 WO2002069404A2 (de) 2001-02-27 2002-02-20 Schaltungsanordnung

Country Status (4)

Country Link
US (1) US6930373B2 (de)
EP (1) EP1364406A2 (de)
DE (1) DE10109329C1 (de)
WO (1) WO2002069404A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7393236B2 (en) 2005-09-02 2008-07-01 Gm Global Technology Operations, Inc. Integrated thermal and electrical connection system for power devices
CN101326853B (zh) * 2005-12-13 2011-11-23 Nxp股份有限公司 处理音频数据流的装置和方法
US9559590B2 (en) * 2008-03-06 2017-01-31 Infineon Technologies Austria Ag Methods and apparatus for a power supply

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0886368A2 (de) * 1997-06-18 1998-12-23 Mitsubishi Denki Kabushiki Kaisha Leistungshalbleiter-Schaltvorrichtung
DE19727548A1 (de) * 1997-06-28 1999-01-07 Bosch Gmbh Robert Elektronisches Steuergerät
US6160326A (en) * 1991-04-16 2000-12-12 Iversen; Arthur H. Power semiconductor packaging
US6166937A (en) * 1998-06-02 2000-12-26 Hitachi Ltd. Inverter device with cooling arrangement therefor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3420535C2 (de) * 1984-06-01 1986-04-30 Anton Piller GmbH & Co KG, 3360 Osterode Halbleiter-Modul für eine schnelle Schaltanordnung
JP2692765B2 (ja) * 1989-12-22 1997-12-17 株式会社日立製作所 ダイオード及びｉｇｂｔとの並列回路とそのモジュール及びそれを用いた電力変換装置
DE29510335U1 (de) * 1995-06-26 1995-08-24 Siemens Ag Elektronisches kombiniertes Logik-Leistungsmodul
US6201701B1 (en) * 1998-03-11 2001-03-13 Kimball International, Inc. Integrated substrate with enhanced thermal characteristics
DE19924994A1 (de) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Intelligentes Leistungsmodul

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6160326A (en) * 1991-04-16 2000-12-12 Iversen; Arthur H. Power semiconductor packaging
EP0886368A2 (de) * 1997-06-18 1998-12-23 Mitsubishi Denki Kabushiki Kaisha Leistungshalbleiter-Schaltvorrichtung
DE19727548A1 (de) * 1997-06-28 1999-01-07 Bosch Gmbh Robert Elektronisches Steuergerät
US6166937A (en) * 1998-06-02 2000-12-26 Hitachi Ltd. Inverter device with cooling arrangement therefor

Also Published As

Publication number Publication date
DE10109329C1 (de) 2002-05-02
US6930373B2 (en) 2005-08-16
EP1364406A2 (de) 2003-11-26
WO2002069404A2 (de) 2002-09-06
US20040169268A1 (en) 2004-09-02

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