WO2002063924A1 - System for assembling a ultra-thin type condenser microphone - Google Patents

System for assembling a ultra-thin type condenser microphone Download PDF

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Publication number
WO2002063924A1
WO2002063924A1 PCT/KR2001/002214 KR0102214W WO02063924A1 WO 2002063924 A1 WO2002063924 A1 WO 2002063924A1 KR 0102214 W KR0102214 W KR 0102214W WO 02063924 A1 WO02063924 A1 WO 02063924A1
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WO
WIPO (PCT)
Prior art keywords
rings
raw material
stage
rail
metal base
Prior art date
Application number
PCT/KR2001/002214
Other languages
French (fr)
Inventor
Gap Ryol Jung
Original Assignee
Cosmosound Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cosmosound Technology Co., Ltd. filed Critical Cosmosound Technology Co., Ltd.
Publication of WO2002063924A1 publication Critical patent/WO2002063924A1/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones

Definitions

  • the present invention relates to a system for assembling a microphone, for example, a condenser microphone. More specifically, the present invention relates to an ultra-thin type condenser microphone assembly through which mass productivity and quality may be highly enhanced because the assembling process of some elements (for example, dielectric plates and base rings) is greatly improved.
  • a condenser microphone in the related art generally comprises a printed circuit board ("PCB") on which a series of electrical patterns are formed, a diaphragm which is located on the PCB and vibrates by sound wave injected from outside, a dielectric plate which is located apart from the diaphragm by a predetermined gap, and a case which holds in its inside all the said elements, namely, the PCB, the diaphragm and the dielectric plate.
  • PCB printed circuit board
  • a dielectric plate is surrounded compactly by a base ring block including "a metal base ring and an insulation base ring", and is stably contained in a case.
  • a back chamber of a certain size is defined between the PCB and the dielectric plate.
  • the gap between the diaphragm and the dielectric plate” and “the back chamber between the PCB and the dielectric plate” are located in the main transmission path through which sound wave is inputted from outside, the "gap” and the “back chamber” greatly affect the overall performance of the microphone.
  • a large amount of efforts have been made in the research on the structure of the gap and the back chamber. For example, research has frequently been carried out to precisely adjust the parallelism.
  • a conventional microphone having the above-described structure is assembled through steps such as "a step of press fitting a dielectric plate and a base ring block into an assembly” and "a step of inserting the dielectric plate/base ring assembly between a PCB and a diaphragm, and assembling the PCB, the dielectric plate/base ring assembly and the diaphragm into a case sequentially”.
  • the gap formed between the diaphragm and the dielectric plate is located in the main passage of the sound wave that flows in from outside and thus greatly affects the overall performance of the microphone. Accordingly, if the dielectric plate and the base ring are deformed or damaged, and thus, for example, the parallelism of "the gap formed between the diaphragm and the dielectric plate” is destroyed due to the "pressure” applied during the press fit process or the "processing error", the performance and the productivity of the final microphone are resultantly degraded.
  • the dielectric plate and the base ring block form a single assembly through a series of the press fit processes
  • two base rings that form the base ring block i.e. "the metal base ring and the insulation base ring”
  • the unbalanced press fit between the dielectric plate and the base ring may occur and, accordingly, the dielectric plate of the final microphone assembly is not level on "the back chamber defined by the base ring block,” and is tilted to the left or the right. Consequently, the parallelism of the dielectric plate is broken and the performance and the productivity of the final microphone are inevitably degraded.
  • steps such as "a step of press fitting a dielectric plate and a base ring block into an assembly” and "a step of inserting the dielectric plate/base ring assembly between a PCB and a diaphragm, and assembling the PCB, the dielectric plate/base ring assembly and the diaphragm into a case sequentially" are individually conducted.
  • the assembly line is inevitably divided into two lines. Accordingly, the number of required processes increases and thus the productivity is lowered seriously.
  • the object of the present invention is to have some elements constituting a condenser microphone such as a dielectric plate and base rings be assembled with other structures to form one completed microphone assembly and, accordingly, to exclude the conventional press fit process for assembling "the dielectric plate and the base ring block" from the overall assembly line of a microphone, thereby preventing "the deformation of the dielectric plate” or “the damage to the dielectric plate and the base ring” that may occur during the press fit process.
  • Another object of the present invention is to make it possible to maintain high performance and productivity of the final ultra-thin type condenser microphone by preventing "the deformation of the dielectric plate” and “the damage to the dielectric plate and the base ring” that may occur during the press fit process in advance and by making "the gap formed between the diaphragm and the dielectric plate” be in parallelism.
  • Another object of the present invention is to highly improve the productivity of the final ultra-thin type condenser microphone by unifying the conventional two- step assembling processes comprised of "the press fit process” and “the loading process” into the one-step assembling process of mounting each part sequentially, thereby integrating the assembly lines of an ultra-thin type microphone into one line.
  • the present invention provides an ultra-thin type condenser microphone assembling system comprising the combination of a stage provided with a rail, a case loading block arranged from the entrance of said stage successively, a diaphragm assembly loading block, a spacer ring loading block, an insulation base ring loading block, a dielectric plate loading block, a metal base ring loading-block and a PCB loading block.
  • a case, a diaphragm assembly, a spacer ring, an insulation base ring, a dielectric plate, a metal base ring and a PCB are naturally loaded with the close cooperation of said case loading block, said diaphragm assembly loading block, said spacer ring loading block, said insulation base ring loading block, said dielectric plate loading block, said metal base ring loading-block and said PCB loading block, forming the ultra-thin type condenser microphone assembled body.
  • Fig. 1 is an exploded perspective view showing an ultra-thin type condenser microphone assembly according to the present invention.
  • Fig. 2 is a schematic diagram showing a system of assembling an ultra-thin type condenser microphone according to the present invention.
  • Fig. 3 is a flow chart showing the operation of a system for assembling an ultra-thin type condenser microphone according to the present invention.
  • an ultra-thin type condenser microphone assembly (200) of the present invention includes a cylindrical case (201) having a series of sound wave entrances and the combination of a diaphragm assembly (204), a spacer ring (205), an insulation base ring (206), a dielectric plate (207), a metal base ring (208) and a PCB (210), which are placed sequentially on said case (201) and loaded into the inner space of said case (201).
  • the diaphragm assembly (204) comprises the combination of a polar ring (202) and a diaphragm (203).
  • the PCB comprises a field effect transistor (FET: 209).
  • the system for assembling an ultra-thin type condenser microphone (100) includes the combination of a stage (101) having a straight and movable rail (104), a case loading-block (10) arranged from the entrance of said stage continuously in a row, a diaphragm assembly loading-block (20), a spacer ring loading-block (30), an insulation base ring loading-block (50), a dielectric plate loading-block (60), a metal base ring loading-block and a PCB loading-block (80).
  • the rail (104) provided in the stage (101) comprises the first rail (103) and the second rail (102) which cross each other at the joint and are connected to each other.
  • the first rail (103) and the second rail (102) are provided with rail grooves (105) for stabilizing the movement of the each element of the ultra-thin type condenser microphone, namely a case (201), a diaphragm assembly (204), a spacer ring (205), an insulation base ring (206), a dielectric plate (207), a metal base ring (208), a PCB (210).
  • the case loading-block (10) is located in the entrance of the stage (101), is fed with the arbitrarily provided plural cases (201), selects several cases (201), namely ten pieces of cases (201), and loads the selected cases into the rail groove (105) of the first rail (103).
  • the case loading-block (10) comprises the combination of a case feeding plate (11), a case align bridge (12) and a case pick-up tool (13).
  • the case feeding plate (11) loads plural cases (201) arbitrarily and is arranged in the outside of the stage (101).
  • the case feeding plate (11) feeds each case (201) to the stage (101) by force.
  • the case align bridge (12) aligns the cases (201), namely ten pieces of cases being fed by a series of section grooves.
  • the case pick-up tool (13) picks up the cases (201) aligned by the case align bridge (12) and loads the cases (201) on the rail groove (105) of the first rail (103) at one time.
  • the case pick-up tool (13) is provided with plural fingers, namely ten pieces of fingers, for picking up and placing ten pieces of cases (201) at one time. These fingers (14) can accomplish "the case handling process" stably using the vacuum pressure.
  • said diaphragm assembly loading-block (20) is arranged in one side of said case loading-block (10) forming one line.
  • said diaphragm assembly loading-block (20) pushes the supplied diaphragm assembly raw material (300) and at the same time picks up said number of, namely ten pieces of, diaphragm assemblies (204) from said diaphragm assembly raw material (300).
  • said diaphragm assembly loading-block (20) loads said picked-up diaphragm assemblies (204) on the cases (201) of the rail groove (105) at one time.
  • Said diaphragm assembly loading-block (20) comprises the combination of a push-magazine (22), a diaphragm assembly guide chain (21) and a diaphragm assembly pick-up tool (23).
  • the diaphragm assembly push-magazine (22) is arranged in the outside of the stage (101) vertically by the elevator support (106), takes on sheet-shaped plural diaphragm assembly raw material (300) in order, and pushes said diaphragm assembly raw material (300) to the stage (101) by force.
  • the diaphragm assembly guide chain (21) is arranged across the first rail (103), and guides the movement of the diaphragm assembly raw material (300) that is pushed by the diaphragm assembly push-magazine (22).
  • the diaphragm assembly pick-up tool (23) is arranged above the first rail (103). If said diaphragm assembly raw material (300) is guided by said diaphragm assembly guide chain (21), the diaphragm assembly pick-up tool (23) picks up the diaphragm assemblies (204), namely ten pieces of diaphragm assemblies (204), from the appropriate diaphragm assembly raw material (300). Thereafter, the diaphragm assembly pick-up tool (23) collectively loads these diaphragm assemblies (204) on the cases (201) laid on the rail groove (105).
  • the diaphragm assembly pick-up tool (23) is provided at front and back sides with the plural fingers, namely ten pieces of fingers (24, 25) that can pick up/place namely ten pieces of diaphragm assemblies (204) at one time.
  • These fingers (24, 25) can accomplish the stable "diaphragm assembly loading process" similarly with said case pick-up tool (13) by using vacuum pressure.
  • the spacer ring loading-block (30) is located next to the diaphragm assembly loading-block (20).
  • the spacer ring loading-block (30) rolls the spacer ring raw material (301) supplied from the outside. Then, the spacer ring loading- block (30) picks up the spacer rings (205), namely ten pieces of spacer rings from the spacer ring raw material (301) at one time. Thereafter, the spacer ring loading- block (30) loads the picked-up spacer rings (205) on the diaphragm assemblies (204) loaded on the cases (201) collectively.
  • the spacer ring loading-block (30) comprises the combination of spacer ring rollers (31 , 32) and a spacer ring pick-up tool.
  • the spacer ring rollers (31 , 32) roll up spacer ring raw material (103), and simultaneously are arranged in the left side and right side of the first rail (103) vertically.
  • the spacer ring rollers (31, 32) roll the spacer ring raw material (301) to said stage by force.
  • the spacer ring pick- up tool (33) is arranged on said first rail (103) individually.
  • the spacer ring pick-up tool (33) picks up ten pieces of spacer rings (205) from the spacer ring raw material (301) at one time. Thereafter, the spacer ring pick-up tool (33) loads these spacer rings (205) on the diaphragm assemblies that are loaded on the cases (201) at one time.
  • the spacer ring pick-up tool (33) is provided at front and back sides with the plural fingers, namely ten pieces of fingers (34, 35) that can pick up/place namely ten pieces of diaphragm assemblies (205) at one time.
  • These fingers (34, 35) can accomplish the stable "spacer ring loading process" similarly to said case pick-up tool (10) and said diaphragm assembly pick-up tool (20), by using vacuum pressure.
  • the rail-pushing tool (40) is arranged in the joint portion of the first rail (103) and the second rail (102).
  • This rail pushing tool (40) is, for example, located in the first rail (103) fixedly, and pushes the condenser microphone semi-assembly, that is assembled with, namely, a case (201)/a diaphragm assembly (204)/a spacer ring (205) and is carried along the first rail (103), to the second rail
  • the condenser microphone semi-assembly that is carried along the first rail (103) can move to the second rail (104) quickly.
  • the insulation base ring loading-block (50) is arranged at the one side of the rail-pushing tool (40).
  • the insulation base ring loading-block (50) is fed with arbitrarily supplied plural insulation base rings (206), and selects 10 insulation base rings. After that, the insulation base ring loading-block (50) loads the selected insulation base rings on the spacer ring (205) located inside of the case (201) transferred along the second rail (102).
  • Said insulation base ring loading-block (50) comprises the combination of an insulation base ring feeding plate (51), an insulation base ring align bridge (52) and an insulation base ring pick-up tool (53).
  • the insulation base ring feeding plate (51) is arranged at the outside of stage (101) horizontally, and feeds the individual insulation base rings (206) to the stage (101) by force.
  • the insulation base ring align bridge (52) Connecting said insulation base ring feeding plate (51) and said stage (101), the insulation base ring align bridge (52), to which said insulation base ring feeding plate (51) and said stage (101) are connected, aligns insulation base rings (206) fed by the insulation base ring feeding plate (51), namely ten pieces of insulation base rings (206), according to the movement of a series of dividing grooves.
  • the insulation base ring pick-up tool (53) on the stage (101) picks up the insulation base rings (206) that are aligned by the insulation base ring align bridge (52) at one time, and loads collectively these insulation base rings (206) on the spacer rings (205) inside of the case (201) on which the diaphragm assemblies (204)/the spacer rings (205) are loaded.
  • the insulation base ring pick-up tool (53) is provided with the plural fingers, namely ten pieces of fingers (54) that can pick up/place namely ten pieces of insulation base rings (206) at one time. These fingers (54) can accomplish the stable "insulation base rings loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23) and the spacer ring pick-up tool (33), by using vacuum pressure.
  • the dielectric plate loading-block (60) is arranged at the one side of the insulation base ring pick-up tool (50) forming one line.
  • the dielectric plate loading- block (60) pushes the dielectric plate raw material (302) supplied from the outside, picks up ten dielectric plates (207) from the dielectric plate raw material (302), and loads said picked up ten dielectric plates (207) into the insulation base rings (206) in the cases (201).
  • Said dielectric plate loading-block (60) comprises the combination of a dielectric plate push-magazine (62), a dielectric plate guide chain (61) and a dielectric plate pick-up tool (63).
  • the dielectric plate push-magazine (62) is arranged at the outside of stage (101) vertically, loads sheet-shaped plural dielectric plate raw material (302) in order, and pushes the dielectric plate raw material (302) to the. stage (101) by force.
  • the dielectric plate guide chain (61) is arranged across the second rail (102), and guides the movement of the dielectric plate raw material (302) that is pushed from the dielectric plate push-magazine (62).
  • the dielectric plate pick-up tool (63) is arranged above the second rail (102).
  • the dielectric plate pick-up tool (63) picks up ten dielectric plates (207) from the corresponding dielectric plate raw material (302) at one time. Thereafter, the dielectric plate pick-up tool (63) loads collectively said dielectric plates (207) within the insulation base rings (206) loaded on the cases (201).
  • the dielectric plate pick-up tool (63) is provided with the plural fingers, namely ten pieces of fingers (64, 65) that can pick up/place namely ten pieces of dielectric plates (207) at one time. These fingers (64, 65) can accomplish the stable "dielectric plates loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23), the spacer ring pick-up tool (33) and the insulation base ring pick-up tool (53), by using vacuum pressure.
  • the metal base ring loading-block (70) is arranged at the one side of the dielectric plate loading-block (60).
  • the metal base ring loading- block (70) is fed with arbitrarily supplied plural metal base rings (208) and selects ten metal base rings (208). Thereafter, the metal base ring loading-block (70) loads the selected metal base rings (208) into the dielectric plate (207) in the case (201) which is transferred along the second rail (102).
  • the metal base ring loading-block (70) comprises the combination of a metal base ring feeding plate (71), a metal base ring align bridge (72) and a metal base ring pick-up tool (73). While plural metal base rings (208) have been loaded arbitrarily, the metal base ring feeding plate (71) is arranged at the outside of the stage (101) horizontally, and feeds the individual metal base rings (208) to the stage (101) by force.
  • the metal base ring align bridge (72) that is connected with said metal base ring feeding plate (71) and said stage (101) aligns the metal base rings (208) fed from the metal base ring feeding plate (71) by a series of the division grooves.
  • the metal base ring pick-up tool (73) is arranged on the stage (101), picks up the metal base rings (208) that are aligned by the metal base ring align bridge (72) at one time, and loads collectively these metal base rings (208) on the dielectric plates (207) in the cases (201) on which the diaphragm assemblies (204)/the spacer rings (205)/the insulation base rings (206)/the dielectric plates (207) are loaded in order.
  • the metal base ring pick-up tool (73) is provided with the plural fingers, namely ten pieces of fingers (74) that can pick up/place namely ten pieces of metal base rings (208) at one time. These fingers (74) can accomplish the stable "metal base ring loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23), the spacer ring pick-up tool (33), the insulation base ring pick-up tool (53) and the dielectric plate pick-up tool (63), by using vacuum pressure.
  • the PCB loading-block (80) is arranged at the one side of the metal base ring loading-module (70).
  • the PCB loading- block (80) pushes the PCB raw material (303) supplied from the outside, and picks up ten pieces of PCBs (210) from the PCB raw material (303). Thereafter, the PCB loading-block (80) loads ten pieces of picked up PCBs (210) on the metal base ring (208) collectively.
  • the PCB loading-block (80) comprises the combination of a PCB push- magazine (82), a PCB guide chain (81) and a PCB pick-up tool (83).
  • the PCB push-magazine (82) is arranged in the outside of stage (101) vertically, loads sheet- shaped PCB raw material (303) in order, and pushes the PCB raw material (303) to the stage (101) by force.
  • the PCB guide chain (81) is arranged across the second rail (102), and guides the movement of the PCB raw material (303) that is pushed by the PCB push-magazine (82).
  • the PCB pick-up tool (83) is arranged above the second rail (102).
  • the PCB pick-up tool (83) picks up ten pieces of PCBs (210) from the corresponding PCB raw material (303) at one time. After that, the PCB pick-up tool (83) loads collectively said PCBs (210) on the metal base rings (208) loaded in the cases (201).
  • the PCB pick-up tool (83) is provided at the front and back sides with the plural fingers, namely ten pieces of fingers (84, 85) that can pick up/place namely ten pieces of PCBs (210) at one time.
  • These fingers (84, 85) can accomplish the stable "PCB loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23), said spacer ring pick-up toll (33), said insulation base ring pick-up tool (53), said dielectric plate pick-up tool (63) and said metal base ring pick-up tool (73), by using vacuum pressure.
  • a reception area (90) is arranged at the terminal of the stage (101), namely, the one side of the PCB loading-block (80).
  • said reception area (90) collects final ultra-thin type condenser microphone assemblies (200).
  • the assembling process starts with a start signal, and as shown in Fig. 3, the case feeding plate (11) of the case loading-block (10) feeds arbitrarily loaded individual cases (201) into the stage (101) by force (step SI).
  • the case align bridge (12) aligns the cases (201) fed by the case feeding plate (11) using the division grooves, namely ten pieces of the cases (201).
  • the case pick-up tool (13) picks up individual cases (201), and loads the cases (201) on the rail groove (105) of the first rail (103) collectively (step S2).
  • the first rail (103) loaded with ten pieces of cases (201) enables the diaphragm assembly loading-module (20) to accomplish a series of diaphragm assembly loading processes through the first leftward movement (step S3).
  • the diaphragm assembly push-magazine (22) of the diaphragm assembly loading-module (20) pushes the diaphragm assembly raw material (300) to the stage
  • the diaphragm assembly guide chain (21) guides the movement of the diaphragm assembly raw material (300) that is pushed by the diaphragm assembly push-magazine (22).
  • the diaphragm assembly pick-up tool (23) picks up ten pieces of diaphragm assemblies (204) from the diaphragm assembly raw material (300). After that, the diaphragm assembly pick-up tool (23) collectively loads these diaphragm assemblies (204) on the cases (201) (step S5).
  • the case loading-block (10) keeps loading the cases (201).
  • the first rail (103) with ten pieces of cases (201) that are loaded with the diaphragm assemblies (204) enables the spacer ring loading-module (30) to accomplish a series of spacer ring loading processes through the second leftward movement (step S6).
  • the spacer ring rollers (31, 32) of the spacer ring loading-module (30) roll the spacer ring raw material (301) that is rolled up around the spacer ring rollers (31, 32) to the stage (101) by force (step S7).
  • the spacer ring pick-up tool (33) picks up ten pieces of spacer rings (205) from the spacer ring raw material (301) at one time. After that, the spacer ring pick-up tool (33) loads these ten pieces of spacer rings (305) on the diaphragm assemblies (204) in the cases (201) collectively (step S8).
  • the first rail (103) with ten pieces of cases (201) that are loaded with the diaphragm assemblies/the spacer rings takes the third leftward movement.
  • the rail pushing tool (40) pushes to the second rail (102) the condenser microphone semi-assembly that is assembled with, namely, a case (201)/a diaphragm assembly (204)/a spacer ring (205) and that is carried along the first rail (103).
  • the second rail (102) loaded with the appropriate condenser microphone semi-assembly takes the first leftward movement, thus enabling the insulation base ring loading-module (50) to accomplish a series of the insulation base ring loading processes (steps S9, S10,
  • the insulation base ring feeding plate (51) of the insulation base ring loading-block (50) feeds the individual insulation base rings (206), that have been arbitrarily loaded, into the stage (101) (step SI 2).
  • the insulation base ring align bridge (52) aligns ten pieces of insulation base rings (206) fed by the insulation base ring feeding plate (51) by using the series of dividing grooves. After that, the insulation base ring pick-up tool (53) picks up ten pieces of insulation base rings (206) at one time, and loads collectively these insulation base rings (206) on the spacer rings (205) in the cases (201) (step SI 3).
  • said case loading-block (10), said diaphragm assembly loading-block (20) and said spacer ring loading-block (30) keep loading the cases (201), the diaphragm assemblies (204) and the spacer rings (205) without stopping.
  • the dielectric plate loading-module (60) can accomplish a series of dielectric plate loading processes (step SI 4).
  • the dielectric plate push magazine (62) of the dielectric plate loading-block (60) pushes to the stage the dielectric plate raw material (302) loaded into its reception area (step SI 5).
  • the dielectric plate guide chain (61) elaborately guides the movement of the dielectric plate raw material (302) pushed by the dielectric plate push magazine (62).
  • the dielectric plate pick-up tool (53) picks up ten pieces of dielectric plates (207) from the dielectric plate raw material (302) at one time. After that, the dielectric plate pick-up tool (53) loads these ten pieces of dielectric plates (207) into the insulation base rings (206) collectively (step S16).
  • the metal base ring loading-module (70) can accomplish a series of metal base ring loading processes (step SI 7).
  • step SI 8 feeds to the stage the individual metal base rings (208) that are arbitrarily loaded on the metal base ring feeding plate ( 1) by force (step SI 8).
  • the metal base ring align bridge (72) aligns ten pieces of metal base rings (208) that are fed by the metal base ring feeding plate (71) by using its division grooves.
  • the metal base ring pick-up tool (73) picks up the individual ten metal base rings at one time, and loads these metal base rings (208) on the dielectric plated (207) loaded in the cases collectively.
  • said case loading-block (10), said diaphragm assembly loading-block (20), said spacer ring loading-block (30), said insulation base ring loading-block (50) and said dielectric plate loading-block (60) keep loading the cases (201), the diaphragm assemblies (204), the spacer rings (205), the insulation base rings (206) and the dielectric plates (207) without stopping.
  • the PCB loading-module (80) can accomplish a series of PCB loading processes (step S20).
  • the PCB push magazine (82) of the PCB loading-block (80) pushes to the stage (101) the PCB raw material (303) loaded into its reception area (step S21).
  • the PCB guide chain (81) elaborately guides the movement of the PCB raw material (303) pushed by the dielectric plate push magazine (82).
  • said case loading- block (10), said diaphragm assembly loading-block (20), said spacer ring loading- block (30), said insulation base ring loading-block (50), said dielectric plate loading- block (60) and said metal base ring loading-block (70) keep loading the cases (201), the diaphragm assemblies (204), the spacer rings (205), the insulation base rings (206), the dielectric plates (207) and the metal base rings (208) without stopping.
  • the second rail (102) with these ten pieces of ultra-thin type condenser microphone assemblies loaded takes the fifth leftward movement. Then, the second rail (102) with ten pieces of ultra-thin type condenser microphone assemblies (200) puts out the ultra-thin type condenser microphone assemblies (200), and enables the ultra-thin type condenser microphone assemblies (200) to be collected stably (step S23, S24).
  • the system for assembling ultra-thin type condenser microphones unifies the overall microphone assembling processes into one process of mounting a diaphragm assembly, a spacer ring, an insulation base ring, a dielectric plate, a metal base ring and a PCB as independent individual bodies by interconnecting a case loading- module, a diaphragm assembly loading-module, a spacer ring loading-module, an insulation base ring loading-module, a metal base ring loading-module and a PCB loading-module closely.
  • the dielectric plate and the base ring will not be subject to any deformation or damage that can be caused by the press fit process.
  • the diaphragm, the dielectric plate and so on are guaranteed to maintain the strict parallelism. Consequently, the ultra-thin type condenser microphone assembly according to the present invention may achieve accordingly improved quality above a certain level.
  • the assembling line of an ultra-thin type condenser microphone can be unified into one line and, therefore, the productivity of the ultra-thin type condenser microphone can be improved highly and easily.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The present invention relates to a system for assembling ultra-thin type condenser microphones. The present invention unifies the whole microphone assembling processes into a process of accumulating independent and individual components such as a diaphragm assembly, a spacer ring, the insulation base ring, a dielectric plate, a metal base ring, a PCB and so forth by closely interconnecting a case loading module, a diaphragm assembly loading module, a spacer ring loading module, an insulation base ring loading module, a dielectric plate loading module, a metal base ring loading module, a PCB loading-module and so forth arranged consecutively in a row on the stage. According to the present invention, dielectric plates and base rings are not subject to any deformation or other damage. Accordingly, diaphragms and dielectric plates are guaranteed the exact balance degree, and thus the final ultra-thin type condenser microphone may have significantly improved quality.

Description

SYSTEM FOR ASSEMBLING A ULTRA-THIN TYPE CONDENSER MICROPHONE
TECHNICAL FIELD
The present invention relates to a system for assembling a microphone, for example, a condenser microphone. More specifically, the present invention relates to an ultra-thin type condenser microphone assembly through which mass productivity and quality may be highly enhanced because the assembling process of some elements (for example, dielectric plates and base rings) is greatly improved.
BACKGROUND ART
Recently, as the technologies related to the communications apparatus such as telephone or cellular phone, and the sound equipment such as amplifier develops greatly, the demand for microphones that convert acoustic energy to electric energy also has been increased.
The microphone for such purpose in the related art, such as a condenser microphone, is disclosed in detail in US patent No. 5,490,220, "Solid state condenser and microphone devices", US patent No. 5,870,482, "Miniature silicon condenser microphone", US patent No. 6,088,463, "Solid state silicon-based condenser microphone", Japanese patent application publication 1999-266,499, "Electret condenser microphone", Japanese patent application publication 1999-88989, "Electret condenser microphone", Korean patent application publication 2000-19963. "Condenser microphone for mobile radio communication terminal", Korean patent application publication 1999-55502, "condenser microphone", etc. A condenser microphone in the related art generally comprises a printed circuit board ("PCB") on which a series of electrical patterns are formed, a diaphragm which is located on the PCB and vibrates by sound wave injected from outside, a dielectric plate which is located apart from the diaphragm by a predetermined gap, and a case which holds in its inside all the said elements, namely, the PCB, the diaphragm and the dielectric plate.
As shown in Korean patent publication 2000-12516, "The insulation ring and fixing method for a condenser microphone" for example, a dielectric plate is surrounded compactly by a base ring block including "a metal base ring and an insulation base ring", and is stably contained in a case. As the base ring block is contained, a back chamber of a certain size is defined between the PCB and the dielectric plate.
Here, because "the gap between the diaphragm and the dielectric plate" and "the back chamber between the PCB and the dielectric plate" are located in the main transmission path through which sound wave is inputted from outside, the "gap" and the "back chamber" greatly affect the overall performance of the microphone. Thus, a large amount of efforts have been made in the research on the structure of the gap and the back chamber. For example, research has frequently been carried out to precisely adjust the parallelism.
Ordinarily, a conventional microphone having the above-described structure is assembled through steps such as "a step of press fitting a dielectric plate and a base ring block into an assembly" and "a step of inserting the dielectric plate/base ring assembly between a PCB and a diaphragm, and assembling the PCB, the dielectric plate/base ring assembly and the diaphragm into a case sequentially".
However, in case of the combination of the dielectric plate and the base ring block through a series of the press fit processes, the pressing force of a certain magnitude is inevitably applied to the joint of the dielectric plate and the base ring block, and the dielectric plate and the base ring block are inevitably deformed by the transmitted pressing force. Also, the respective joint part of the dielectric plate and the base ring block is worn and damaged by the pressing force.
In addition, because dielectric plates and base ring blocks are very small generally, even a minute processing error during the press fit process can cause serious problems of damaging these parts.
As mentioned above, "the gap formed between the diaphragm and the dielectric plate" is located in the main passage of the sound wave that flows in from outside and thus greatly affects the overall performance of the microphone. Accordingly, if the dielectric plate and the base ring are deformed or damaged, and thus, for example, the parallelism of "the gap formed between the diaphragm and the dielectric plate" is destroyed due to the "pressure" applied during the press fit process or the "processing error", the performance and the productivity of the final microphone are resultantly degraded.
Also, as explained above, if "the dielectric plate and the base ring block" form a single assembly through a series of the press fit processes, two base rings that form the base ring block, i.e. "the metal base ring and the insulation base ring," inevitably adhere closely to each other. In this case, the unbalanced press fit between the dielectric plate and the base ring may occur and, accordingly, the dielectric plate of the final microphone assembly is not level on "the back chamber defined by the base ring block," and is tilted to the left or the right. Consequently, the parallelism of the dielectric plate is broken and the performance and the productivity of the final microphone are inevitably degraded.
To complete a microphone as an independent assembled unit, as mentioned above, steps such as "a step of press fitting a dielectric plate and a base ring block into an assembly" and "a step of inserting the dielectric plate/base ring assembly between a PCB and a diaphragm, and assembling the PCB, the dielectric plate/base ring assembly and the diaphragm into a case sequentially" are individually conducted. In this case, the assembly line is inevitably divided into two lines. Accordingly, the number of required processes increases and thus the productivity is lowered seriously.
DISCLOSURE OF THE INVENTION
The object of the present invention is to have some elements constituting a condenser microphone such as a dielectric plate and base rings be assembled with other structures to form one completed microphone assembly and, accordingly, to exclude the conventional press fit process for assembling "the dielectric plate and the base ring block" from the overall assembly line of a microphone, thereby preventing "the deformation of the dielectric plate" or "the damage to the dielectric plate and the base ring" that may occur during the press fit process.
Another object of the present invention is to make it possible to maintain high performance and productivity of the final ultra-thin type condenser microphone by preventing "the deformation of the dielectric plate" and "the damage to the dielectric plate and the base ring" that may occur during the press fit process in advance and by making "the gap formed between the diaphragm and the dielectric plate" be in parallelism.
Another object of the present invention is to highly improve the productivity of the final ultra-thin type condenser microphone by unifying the conventional two- step assembling processes comprised of "the press fit process" and "the loading process" into the one-step assembling process of mounting each part sequentially, thereby integrating the assembly lines of an ultra-thin type microphone into one line. The objects and characteristic of the present invention will be more apparent by describing preferred embodiments of the present invention with references to the accompanied drawings.
To accomplish the above-mentioned objects, the present invention provides an ultra-thin type condenser microphone assembling system comprising the combination of a stage provided with a rail, a case loading block arranged from the entrance of said stage successively, a diaphragm assembly loading block, a spacer ring loading block, an insulation base ring loading block, a dielectric plate loading block, a metal base ring loading-block and a PCB loading block.
According to the present invention, a case, a diaphragm assembly, a spacer ring, an insulation base ring, a dielectric plate, a metal base ring and a PCB are naturally loaded with the close cooperation of said case loading block, said diaphragm assembly loading block, said spacer ring loading block, said insulation base ring loading block, said dielectric plate loading block, said metal base ring loading-block and said PCB loading block, forming the ultra-thin type condenser microphone assembled body.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is an exploded perspective view showing an ultra-thin type condenser microphone assembly according to the present invention. Fig. 2 is a schematic diagram showing a system of assembling an ultra-thin type condenser microphone according to the present invention.
Fig. 3 is a flow chart showing the operation of a system for assembling an ultra-thin type condenser microphone according to the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
Reference will now be made in detail to the preferred embodiment of the present invention's system for assembling an ultra-thin type condenser microphone as illustrated in the accompanying drawings. As shown in Fig. 1 , an ultra-thin type condenser microphone assembly (200) of the present invention includes a cylindrical case (201) having a series of sound wave entrances and the combination of a diaphragm assembly (204), a spacer ring (205), an insulation base ring (206), a dielectric plate (207), a metal base ring (208) and a PCB (210), which are placed sequentially on said case (201) and loaded into the inner space of said case (201).
In this case, the diaphragm assembly (204) comprises the combination of a polar ring (202) and a diaphragm (203). The PCB comprises a field effect transistor (FET: 209).
In the present applicant's Korean patent application 2000-75671, "ultra-thin type condenser microphone assembly and method for assembling the same", these assembling structures and functions of an ultra-thin type condenser microphone assembly are illustrated in detail.
As shown in Fig. 2, the system for assembling an ultra-thin type condenser microphone (100) according to the present invention includes the combination of a stage (101) having a straight and movable rail (104), a case loading-block (10) arranged from the entrance of said stage continuously in a row, a diaphragm assembly loading-block (20), a spacer ring loading-block (30), an insulation base ring loading-block (50), a dielectric plate loading-block (60), a metal base ring loading-block and a PCB loading-block (80).
Preferably, as shown in Fig. 2, the rail (104) provided in the stage (101) comprises the first rail (103) and the second rail (102) which cross each other at the joint and are connected to each other. The first rail (103) and the second rail (102) are provided with rail grooves (105) for stabilizing the movement of the each element of the ultra-thin type condenser microphone, namely a case (201), a diaphragm assembly (204), a spacer ring (205), an insulation base ring (206), a dielectric plate (207), a metal base ring (208), a PCB (210).
When, as mentioned above, a rail (104) is separated into the first rail (103) and the second rail (102), the load that can affect the rail-actuating belt in the production line can be easily appeased.
As shown in Fig. 2, the case loading-block (10) is located in the entrance of the stage (101), is fed with the arbitrarily provided plural cases (201), selects several cases (201), namely ten pieces of cases (201), and loads the selected cases into the rail groove (105) of the first rail (103). Here, the case loading-block (10) comprises the combination of a case feeding plate (11), a case align bridge (12) and a case pick-up tool (13). The case feeding plate (11) loads plural cases (201) arbitrarily and is arranged in the outside of the stage (101). The case feeding plate (11) feeds each case (201) to the stage (101) by force. With the case feeding plate (11) connected to the stage (104), the case align bridge (12) aligns the cases (201), namely ten pieces of cases being fed by a series of section grooves. While mounted on the stage (101), the case pick-up tool (13) picks up the cases (201) aligned by the case align bridge (12) and loads the cases (201) on the rail groove (105) of the first rail (103) at one time. Preferably, the case pick-up tool (13) is provided with plural fingers, namely ten pieces of fingers, for picking up and placing ten pieces of cases (201) at one time. These fingers (14) can accomplish "the case handling process" stably using the vacuum pressure.
In the meantime, said diaphragm assembly loading-block (20) is arranged in one side of said case loading-block (10) forming one line. When ten pieces of cases (201) loaded in the rail groove (105) are arranged in their suitable positions by the movement of the first rail (103), said diaphragm assembly loading-block (20) pushes the supplied diaphragm assembly raw material (300) and at the same time picks up said number of, namely ten pieces of, diaphragm assemblies (204) from said diaphragm assembly raw material (300). Thereafter that, said diaphragm assembly loading-block (20) loads said picked-up diaphragm assemblies (204) on the cases (201) of the rail groove (105) at one time.
Said diaphragm assembly loading-block (20) comprises the combination of a push-magazine (22), a diaphragm assembly guide chain (21) and a diaphragm assembly pick-up tool (23). Preferably, the diaphragm assembly push-magazine (22) is arranged in the outside of the stage (101) vertically by the elevator support (106), takes on sheet-shaped plural diaphragm assembly raw material (300) in order, and pushes said diaphragm assembly raw material (300) to the stage (101) by force. The diaphragm assembly guide chain (21) is arranged across the first rail (103), and guides the movement of the diaphragm assembly raw material (300) that is pushed by the diaphragm assembly push-magazine (22). The diaphragm assembly pick-up tool (23) is arranged above the first rail (103). If said diaphragm assembly raw material (300) is guided by said diaphragm assembly guide chain (21), the diaphragm assembly pick-up tool (23) picks up the diaphragm assemblies (204), namely ten pieces of diaphragm assemblies (204), from the appropriate diaphragm assembly raw material (300). Thereafter, the diaphragm assembly pick-up tool (23) collectively loads these diaphragm assemblies (204) on the cases (201) laid on the rail groove (105). Preferably, the diaphragm assembly pick-up tool (23) is provided at front and back sides with the plural fingers, namely ten pieces of fingers (24, 25) that can pick up/place namely ten pieces of diaphragm assemblies (204) at one time. These fingers (24, 25) can accomplish the stable "diaphragm assembly loading process" similarly with said case pick-up tool (13) by using vacuum pressure. As shown in Fig. 2, the spacer ring loading-block (30) is located next to the diaphragm assembly loading-block (20). When the cases (201) that are loaded with the diaphragm assemblies (201) are located in the appropriate position by the movement of the first rail (103), the spacer ring loading-block (30) rolls the spacer ring raw material (301) supplied from the outside. Then, the spacer ring loading- block (30) picks up the spacer rings (205), namely ten pieces of spacer rings from the spacer ring raw material (301) at one time. Thereafter, the spacer ring loading- block (30) loads the picked-up spacer rings (205) on the diaphragm assemblies (204) loaded on the cases (201) collectively.
The spacer ring loading-block (30) comprises the combination of spacer ring rollers (31 , 32) and a spacer ring pick-up tool. Here, the spacer ring rollers (31 , 32) roll up spacer ring raw material (103), and simultaneously are arranged in the left side and right side of the first rail (103) vertically. The spacer ring rollers (31, 32) roll the spacer ring raw material (301) to said stage by force. The spacer ring pick- up tool (33) is arranged on said first rail (103) individually. When the spacer ring raw material (301) is rolled up by the spacer ring rollers (31, 32) by force, the spacer ring pick-up tool (33) picks up ten pieces of spacer rings (205) from the spacer ring raw material (301) at one time. Thereafter, the spacer ring pick-up tool (33) loads these spacer rings (205) on the diaphragm assemblies that are loaded on the cases (201) at one time.
The spacer ring pick-up tool (33) is provided at front and back sides with the plural fingers, namely ten pieces of fingers (34, 35) that can pick up/place namely ten pieces of diaphragm assemblies (205) at one time. These fingers (34, 35) can accomplish the stable "spacer ring loading process" similarly to said case pick-up tool (10) and said diaphragm assembly pick-up tool (20), by using vacuum pressure.
As shown in Fig. 2, the rail-pushing tool (40) is arranged in the joint portion of the first rail (103) and the second rail (102). This rail pushing tool (40) is, for example, located in the first rail (103) fixedly, and pushes the condenser microphone semi-assembly, that is assembled with, namely, a case (201)/a diaphragm assembly (204)/a spacer ring (205) and is carried along the first rail (103), to the second rail
(102).
By the rail pushing tool (40), the condenser microphone semi-assembly that is carried along the first rail (103) can move to the second rail (104) quickly.
Here, the insulation base ring loading-block (50) is arranged at the one side of the rail-pushing tool (40). The insulation base ring loading-block (50) is fed with arbitrarily supplied plural insulation base rings (206), and selects 10 insulation base rings. After that, the insulation base ring loading-block (50) loads the selected insulation base rings on the spacer ring (205) located inside of the case (201) transferred along the second rail (102).
Said insulation base ring loading-block (50) comprises the combination of an insulation base ring feeding plate (51), an insulation base ring align bridge (52) and an insulation base ring pick-up tool (53). With plural insulation base rings loaded arbitrarily, the insulation base ring feeding plate (51) is arranged at the outside of stage (101) horizontally, and feeds the individual insulation base rings (206) to the stage (101) by force. Connecting said insulation base ring feeding plate (51) and said stage (101), the insulation base ring align bridge (52), to which said insulation base ring feeding plate (51) and said stage (101) are connected, aligns insulation base rings (206) fed by the insulation base ring feeding plate (51), namely ten pieces of insulation base rings (206), according to the movement of a series of dividing grooves. The insulation base ring pick-up tool (53) on the stage (101) picks up the insulation base rings (206) that are aligned by the insulation base ring align bridge (52) at one time, and loads collectively these insulation base rings (206) on the spacer rings (205) inside of the case (201) on which the diaphragm assemblies (204)/the spacer rings (205) are loaded.
The insulation base ring pick-up tool (53) is provided with the plural fingers, namely ten pieces of fingers (54) that can pick up/place namely ten pieces of insulation base rings (206) at one time. These fingers (54) can accomplish the stable "insulation base rings loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23) and the spacer ring pick-up tool (33), by using vacuum pressure.
As shown in Fig. 2, the dielectric plate loading-block (60) is arranged at the one side of the insulation base ring pick-up tool (50) forming one line. When ten pieces of cases (101) that have "diaphragm assemblies (204)/spacer rings (205)/insulation base rings (206)" loaded sequentially by the movement of the second rail (102) are arranged in the appropriate position, the dielectric plate loading- block (60) pushes the dielectric plate raw material (302) supplied from the outside, picks up ten dielectric plates (207) from the dielectric plate raw material (302), and loads said picked up ten dielectric plates (207) into the insulation base rings (206) in the cases (201).
Said dielectric plate loading-block (60) comprises the combination of a dielectric plate push-magazine (62), a dielectric plate guide chain (61) and a dielectric plate pick-up tool (63). The dielectric plate push-magazine (62) is arranged at the outside of stage (101) vertically, loads sheet-shaped plural dielectric plate raw material (302) in order, and pushes the dielectric plate raw material (302) to the. stage (101) by force. The dielectric plate guide chain (61) is arranged across the second rail (102), and guides the movement of the dielectric plate raw material (302) that is pushed from the dielectric plate push-magazine (62). The dielectric plate pick-up tool (63) is arranged above the second rail (102). If the dielectric plate raw material (302) is guided by said dielectric plate guide chain (61), the dielectric plate pick-up tool (63) picks up ten dielectric plates (207) from the corresponding dielectric plate raw material (302) at one time. Thereafter, the dielectric plate pick-up tool (63) loads collectively said dielectric plates (207) within the insulation base rings (206) loaded on the cases (201).
The dielectric plate pick-up tool (63) is provided with the plural fingers, namely ten pieces of fingers (64, 65) that can pick up/place namely ten pieces of dielectric plates (207) at one time. These fingers (64, 65) can accomplish the stable "dielectric plates loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23), the spacer ring pick-up tool (33) and the insulation base ring pick-up tool (53), by using vacuum pressure.
As shown in Fig. 2, the metal base ring loading-block (70) is arranged at the one side of the dielectric plate loading-block (60). The metal base ring loading- block (70) is fed with arbitrarily supplied plural metal base rings (208) and selects ten metal base rings (208). Thereafter, the metal base ring loading-block (70) loads the selected metal base rings (208) into the dielectric plate (207) in the case (201) which is transferred along the second rail (102).
The metal base ring loading-block (70) comprises the combination of a metal base ring feeding plate (71), a metal base ring align bridge (72) and a metal base ring pick-up tool (73). While plural metal base rings (208) have been loaded arbitrarily, the metal base ring feeding plate (71) is arranged at the outside of the stage (101) horizontally, and feeds the individual metal base rings (208) to the stage (101) by force. The metal base ring align bridge (72) that is connected with said metal base ring feeding plate (71) and said stage (101) aligns the metal base rings (208) fed from the metal base ring feeding plate (71) by a series of the division grooves. The metal base ring pick-up tool (73) is arranged on the stage (101), picks up the metal base rings (208) that are aligned by the metal base ring align bridge (72) at one time, and loads collectively these metal base rings (208) on the dielectric plates (207) in the cases (201) on which the diaphragm assemblies (204)/the spacer rings (205)/the insulation base rings (206)/the dielectric plates (207) are loaded in order.
The metal base ring pick-up tool (73) is provided with the plural fingers, namely ten pieces of fingers (74) that can pick up/place namely ten pieces of metal base rings (208) at one time. These fingers (74) can accomplish the stable "metal base ring loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23), the spacer ring pick-up tool (33), the insulation base ring pick-up tool (53) and the dielectric plate pick-up tool (63), by using vacuum pressure. The PCB loading-block (80) is arranged at the one side of the metal base ring loading-module (70). When ten pieces of cases (201) on which "the diaphragm assemblies (204)/the spacer rings (205)/the insulation base rings (206)/the dielectric plates (207)/the metal base rings (208)" are loaded in order are aligned in the appropriate position by the movement of the second rail (102), the PCB loading- block (80) pushes the PCB raw material (303) supplied from the outside, and picks up ten pieces of PCBs (210) from the PCB raw material (303). Thereafter, the PCB loading-block (80) loads ten pieces of picked up PCBs (210) on the metal base ring (208) collectively.
The PCB loading-block (80) comprises the combination of a PCB push- magazine (82), a PCB guide chain (81) and a PCB pick-up tool (83). The PCB push-magazine (82) is arranged in the outside of stage (101) vertically, loads sheet- shaped PCB raw material (303) in order, and pushes the PCB raw material (303) to the stage (101) by force. The PCB guide chain (81) is arranged across the second rail (102), and guides the movement of the PCB raw material (303) that is pushed by the PCB push-magazine (82). The PCB pick-up tool (83) is arranged above the second rail (102). If the PCB raw material (303) is guided by the PCB guide chain (81), the PCB pick-up tool (83) picks up ten pieces of PCBs (210) from the corresponding PCB raw material (303) at one time. After that, the PCB pick-up tool (83) loads collectively said PCBs (210) on the metal base rings (208) loaded in the cases (201).
The PCB pick-up tool (83) is provided at the front and back sides with the plural fingers, namely ten pieces of fingers (84, 85) that can pick up/place namely ten pieces of PCBs (210) at one time. These fingers (84, 85) can accomplish the stable "PCB loading process" similarly to said case pick-up tool (13), said diaphragm assembly pick-up tool (23), said spacer ring pick-up toll (33), said insulation base ring pick-up tool (53), said dielectric plate pick-up tool (63) and said metal base ring pick-up tool (73), by using vacuum pressure.
Here, a reception area (90) is arranged at the terminal of the stage (101), namely, the one side of the PCB loading-block (80). When the assembling process of the ultra-thin type condenser microphone assembly (200) is conducted by the cooperation of "said case loading module, said diaphragm assembly loading module, said spacer ring loading module, said insulation base ring loading module, said dielectric plate loading module, said metal base ring loading-module and said PCB loading module", said reception area (90) collects final ultra-thin type condenser microphone assemblies (200).
The operations of the system of assembling an ultra-thin type condenser microphone according to the present invention having the above-mentioned construction will be explained in detail in the following. At first, the assembling process starts with a start signal, and as shown in Fig. 3, the case feeding plate (11) of the case loading-block (10) feeds arbitrarily loaded individual cases (201) into the stage (101) by force (step SI).
The case align bridge (12) aligns the cases (201) fed by the case feeding plate (11) using the division grooves, namely ten pieces of the cases (201). As soon as completing the aligning process, the case pick-up tool (13) picks up individual cases (201), and loads the cases (201) on the rail groove (105) of the first rail (103) collectively (step S2).
After that, the first rail (103) loaded with ten pieces of cases (201) enables the diaphragm assembly loading-module (20) to accomplish a series of diaphragm assembly loading processes through the first leftward movement (step S3).
The diaphragm assembly push-magazine (22) of the diaphragm assembly loading-module (20) pushes the diaphragm assembly raw material (300) to the stage
(101) (step S4). The diaphragm assembly guide chain (21) guides the movement of the diaphragm assembly raw material (300) that is pushed by the diaphragm assembly push-magazine (22).
When said diaphragm assembly raw material (300) is guided by said diaphragm assembly guide chain (21) and ten pieces of cases (201) are aligned beneath the diaphragm assembly pick-up tool (23), the diaphragm assembly pick-up tool (23) picks up ten pieces of diaphragm assemblies (204) from the diaphragm assembly raw material (300). After that, the diaphragm assembly pick-up tool (23) collectively loads these diaphragm assemblies (204) on the cases (201) (step S5).
Of course, while this diaphragm assembly (204) loading process goes on, said case loading-block (10) keeps loading the cases (201). After the diaphragm assembly loading process is completed, the first rail (103) with ten pieces of cases (201) that are loaded with the diaphragm assemblies (204) enables the spacer ring loading-module (30) to accomplish a series of spacer ring loading processes through the second leftward movement (step S6). The spacer ring rollers (31, 32) of the spacer ring loading-module (30) roll the spacer ring raw material (301) that is rolled up around the spacer ring rollers (31, 32) to the stage (101) by force (step S7).
When the spacer ring raw material (301) is rolled to the stage (101) by force and ten pieces of cases (201) are aligned beneath the spacer ring pick-up tool (33), the spacer ring pick-up tool (33) picks up ten pieces of spacer rings (205) from the spacer ring raw material (301) at one time. After that, the spacer ring pick-up tool (33) loads these ten pieces of spacer rings (305) on the diaphragm assemblies (204) in the cases (201) collectively (step S8).
Of course, while this spacer ring (205) loading process goes on, said case loading-block (10) and said diaphragm assembly loading-block (20) keep loading the cases (201) and the diaphragm assemblies (204) without stopping.
After the diaphragm assembly loading process is completed, the first rail (103) with ten pieces of cases (201) that are loaded with the diaphragm assemblies/the spacer rings takes the third leftward movement. The rail pushing tool (40) pushes to the second rail (102) the condenser microphone semi-assembly that is assembled with, namely, a case (201)/a diaphragm assembly (204)/a spacer ring (205) and that is carried along the first rail (103). As soon as the condenser microphone semi-assembly has been pushed along the first rail (103), the second rail (102) loaded with the appropriate condenser microphone semi-assembly takes the first leftward movement, thus enabling the insulation base ring loading-module (50) to accomplish a series of the insulation base ring loading processes (steps S9, S10,
Sll).
Here, the insulation base ring feeding plate (51) of the insulation base ring loading-block (50) feeds the individual insulation base rings (206), that have been arbitrarily loaded, into the stage (101) (step SI 2).
Similarly with the case align bridge, the insulation base ring align bridge (52) aligns ten pieces of insulation base rings (206) fed by the insulation base ring feeding plate (51) by using the series of dividing grooves. After that, the insulation base ring pick-up tool (53) picks up ten pieces of insulation base rings (206) at one time, and loads collectively these insulation base rings (206) on the spacer rings (205) in the cases (201) (step SI 3).
Of course, while this insulation base ring (206) loading process goes on, said case loading-block (10), said diaphragm assembly loading-block (20) and said spacer ring loading-block (30) keep loading the cases (201), the diaphragm assemblies (204) and the spacer rings (205) without stopping.
After the insulation base ring loading process is completed, the second rail
(102) with ten pieces of cases (201) that are loaded with the diaphragm assemblies/the spacer rings/the insulation base rings takes the second leftward movement. Thus, the dielectric plate loading-module (60) can accomplish a series of dielectric plate loading processes (step SI 4).
The dielectric plate push magazine (62) of the dielectric plate loading-block (60) pushes to the stage the dielectric plate raw material (302) loaded into its reception area (step SI 5). The dielectric plate guide chain (61) elaborately guides the movement of the dielectric plate raw material (302) pushed by the dielectric plate push magazine (62).
When this guide process goes on and ten pieces of cases (201) on which the diaphragm assemblies/ spacer ring/ insulation base rings are loaded are aligned beneath the dielectric plate pick-up tool (53), the dielectric plate pick-up tool (53) picks up ten pieces of dielectric plates (207) from the dielectric plate raw material (302) at one time. After that, the dielectric plate pick-up tool (53) loads these ten pieces of dielectric plates (207) into the insulation base rings (206) collectively (step S16). Of course, while this dielectric plate (207) loading process goes on, said case loading-block (10), said diaphragm assembly loading-block (20), said spacer ring loading-block (30) and said insulation base ring loading-block (50) keep loading the cases (201), the diaphragm assemblies (204), the spacer rings (205) and the insulation base rings (206) without stopping. After the dielectric plate loading process is completed, the second rail (102) with ten pieces of cases (201) that are loaded with the diaphragm assemblies/the spacer rings/the insulation base rings/the dielectric plates takes the third leftward movement. Thus, the metal base ring loading-module (70) can accomplish a series of metal base ring loading processes (step SI 7). The metal base ring feeding plate (71) of the metal base ring loading-block
(70) feeds to the stage the individual metal base rings (208) that are arbitrarily loaded on the metal base ring feeding plate ( 1) by force (step SI 8).
Here, similarly with the case align bridge and the insulation base ring align bridge, the metal base ring align bridge (72) aligns ten pieces of metal base rings (208) that are fed by the metal base ring feeding plate (71) by using its division grooves. As soon as this align process has been conducted, the metal base ring pick-up tool (73) picks up the individual ten metal base rings at one time, and loads these metal base rings (208) on the dielectric plated (207) loaded in the cases collectively.
Of course, while this metal base ring (208) loading process goes on, said case loading-block (10), said diaphragm assembly loading-block (20), said spacer ring loading-block (30), said insulation base ring loading-block (50) and said dielectric plate loading-block (60) keep loading the cases (201), the diaphragm assemblies (204), the spacer rings (205), the insulation base rings (206) and the dielectric plates (207) without stopping.
After the metal base ring loading process is completed, the second rail (102) with ten pieces of cases (201) that are loaded with the diaphragm assemblies/the spacer rings/the insulation base rings/the dielectric plates/the metal base rings takes the fourth leftward movement. Thus, the PCB loading-module (80) can accomplish a series of PCB loading processes (step S20).
The PCB push magazine (82) of the PCB loading-block (80) pushes to the stage (101) the PCB raw material (303) loaded into its reception area (step S21). Here, the PCB guide chain (81) elaborately guides the movement of the PCB raw material (303) pushed by the dielectric plate push magazine (82).
When this guide process goes on and ten pieces of cases (201) on which diaphragm assemblies/spacer rings/insulation base rings/dielectric plates/metal base rings are loaded are aligned beneath the PCB pick-up tool (83), the PCB pick-up tool (83) picks up ten pieces of PCBs (210) from the PCB raw material (303) at one time. After that, the PCB pick-up tool (83) loads these ten pieces of PCBs (210) into the metal base rings (208) collectively and completes the process of assembling the ultra-thin type condenser microphone assemblies (step S22).
Of course, while this PCB (210) loading process goes on, said case loading- block (10), said diaphragm assembly loading-block (20), said spacer ring loading- block (30), said insulation base ring loading-block (50), said dielectric plate loading- block (60) and said metal base ring loading-block (70) keep loading the cases (201), the diaphragm assemblies (204), the spacer rings (205), the insulation base rings (206), the dielectric plates (207) and the metal base rings (208) without stopping. After that, when said PCB loading process is completed and ten pieces of ultra-thin type condenser microphone assemblies (200) that respectively are composed of the case/the diaphragm assembly/the spacer ring/the insulation base ring/the dielectric plate/the metal base ring/the PCB are made, the second rail (102) with these ten pieces of ultra-thin type condenser microphone assemblies loaded takes the fifth leftward movement. Then, the second rail (102) with ten pieces of ultra-thin type condenser microphone assemblies (200) puts out the ultra-thin type condenser microphone assemblies (200), and enables the ultra-thin type condenser microphone assemblies (200) to be collected stably (step S23, S24).
INDUSTRIAL APPLICABILITY
As explained in detail in the foregoing, the system for assembling ultra-thin type condenser microphones according to the present invention unifies the overall microphone assembling processes into one process of mounting a diaphragm assembly, a spacer ring, an insulation base ring, a dielectric plate, a metal base ring and a PCB as independent individual bodies by interconnecting a case loading- module, a diaphragm assembly loading-module, a spacer ring loading-module, an insulation base ring loading-module, a metal base ring loading-module and a PCB loading-module closely. According to the present invention, the dielectric plate and the base ring will not be subject to any deformation or damage that can be caused by the press fit process. Thus, the diaphragm, the dielectric plate and so on are guaranteed to maintain the strict parallelism. Consequently, the ultra-thin type condenser microphone assembly according to the present invention may achieve accordingly improved quality above a certain level.
Also, in the present invention, the assembling line of an ultra-thin type condenser microphone can be unified into one line and, therefore, the productivity of the ultra-thin type condenser microphone can be improved highly and easily.

Claims

WHAT IS CLAIMED IS:
1. A system for assembling ultra-thin type condenser microphones comprising: a stage having a straight and movable rail; a case loading block located at the entrance of said stage, which is fed with the arbitrarily provided plural cases, selects a predetermined number of cases, and loads the selected cases into the rail groove of the first rail; a diaphragm assembly loading block arranged at one side of said case loading block forming one line, which, when said cases are arranged in the suitable position, pushes the supplied diaphragm assembly raw material, picks up said number of diaphragm assemblies from said diaphragm assembly raw material, and loads said picked-up diaphragm assemblies on said cases at one time; a spacer ring loading block located at one side of the diaphragm assembly loading block forming one line, which, when the cases that are loaded with the diaphragm assemblies are located in the appropriate position by the movement of said first rail, rolls the spacer ring raw material supplied from the outside, picks up said number of spacer rings from the spacer ring raw material, and loads the picked- up spacer rings on the diaphragm assemblies loaded on the cases collectively; an insulation base ring loading block arranged at the one side of the spacer ring loading block forming one line, which, when the cases that are loaded with the diaphragm assemblies/the spacer rings are located in the appropriate position by the movement of said first rail, us fed with arbitrarily supplied plural insulation base rings, selects said number of insulation base rings, and loads the selected insulation base rings on said spacer rings collectively; a dielectric plate loading block arranged at the one side of the insulation base ring loading block forming one line, which, when the cases with "diaphragm assemblies/spacer rings/insulation base rings" loaded in order are arranged in the appropriate position by the movement of said rail, pushes the dielectric plate raw material supplied from the outside, picks up said number of dielectric plates from the dielectric plate raw material, and loads said picked up dielectric plates into the insulation base rings collectively; a metal base ring loading block arranged at the one side of the dielectric plate loading block forming one line, which, when the cases with "diaphragm assemblies/spacer rings/insulation base rings/dielectric plates" loaded in order are arranged in the appropriate position by the movement of said rail, is fed with arbitrarily supplied plural metal base rings, selects said number of metal base rings, and loads the selected metal base rings into the dielectric plate collectively; a PCB (printed circuit board) loading block arranged at the one side of said metal base ring loading block, which, when said number of cases on which "the diaphragm assemblies/the spacer rings/the insulation base rings/the dielectric plates/the metal base rings" are loaded in order are aligned in the appropriate position by the movement of said rail, pushes the PCB raw material supplied from the outside, picks up said number of PCBs from the PCB raw material, and loads said number of picked up PCBs on the metal base rings collectively.
2. The system for assembling ultra-thin type condenser microphones according to claim 1, wherein said case loading block comprises: a case feeding plate that, while having plural cases arbitrarily loaded thereon, is arranged at the outside of the stage and feeds each case to the stage by force; a case align bridge connecting the case feeding plate to the stage, that aligns the cases fed from the case feeding plate in the said number unit using the series of division grooves; and a case pick-up tool mounted on the stage, that picks up the cases aligned by the case align bridge at one time and loads the cases on the rail groove of the first rail at one time.
3. The system for assembling ultra-thin type condenser microphones according to claim 1, wherein said diaphragm assembly loading block comprises: a diaphragm assembly push -magazine, that, while sheet-shaped plural diaphragm assembly raw material is loaded thereon in order, is arranged at the outside of said stage vertically and pushes said diaphragm assembly raw material to the stage by force; a diaphragm assembly guide chain that is arranged across the first rail, guides the movement of the diaphragm assembly raw material that is pushed by the diaphragm assembly push-magazine; and a diaphragm assembly pick-up tool that is arranged above the first rail, picks up said number of diaphragm assemblies from the diaphragm assembly raw material at one time, and loads these diaphragm assemblies on the cases collectively.
4. The system for assembling ultra-thin type condenser microphones according to claim 1, wherein said spacer ring loading block comprises: spacer ring rollers that, while rolling up the spacer ring raw material, are arranged in the left side and right side of said rail vertically, and roll the spacer ring raw material to said stage by force; and a spacer ring pick-up tool that is arranged apart on said rail individually, picks up said unit number of spacer rings at one time from the spacer ring raw material rolled up by the spacer ring roller, and loads said spacer rings on said diaphragm assemblies collectively.
5. The system for assembling ultra-thin type condenser microphones according to claim 1, wherein said insulation base ring loading block comprises: an insulation base ring feeding plate, which, while having plural insulation base rings loaded arbitrarily thereon, is arranged at the outside of stage horizontally, and feeds said individual insulation base rings to said stage by force; an insulation base ring align bridge that connects said insulation base ring feeding plate and said stage and aligns said number of insulation base rings fed by the insulation base ring feeding plate according to a series of dividing grooves; and an insulation base ring pick-up tool that is arranged on the stage, picks up at one time the insulation base rings that are aligned by the insulation base ring align bridge, and loads these insulation base rings on the spacer rings collectively.
6. The system for assembling ultra-thin type condenser microphone according to claim 1, wherein said dielectric plate loading block comprises: a dielectric plate push magazine which, while having sheet-shaped plural dielectric plate raw material loaded thereon in order, is arranged at the outside of the stage vertically, and pushes the dielectric plate raw material to the stage by force; a dielectric plate guide chain that is arranged across the second rail and guides the movement of the dielectric plate raw material pushed from the dielectric plate push magazine; and a dielectric plate pick-up tool that is arranged above the second rail, picks up ten dielectric plates from the dielectric plate raw material guided by said dielectric plate guide chain at one time, and loads said dielectric plates in the insulation base rings collectively.
7. The system for assembling ultra-thin type condenser microphones according to claim 1, wherein said metal base ring loading block comprises: a metal base ring feeding plate which, while having plural metal base rings loaded arbitrarily loaded thereon, is arranged at the outside of the stage horizontally, and feeds the individual metal base rings to the stage by force; a metal base ring align bridge that connects said metal base ring feeding plate and said stage, and aligns the metal base rings fed from the metal base ring feeding plate by a series of the division grooves; and a metal base ring pick-up tool that is arranged on the stage, picks up the metal base rings that are aligned by the metal base ring align bridge at one time, and loads these metal base rings on the dielectric plates collectively.
8. The system for assembling ultra-thin type condenser microphones according to claim 1, wherein said PCB loading-block comprises: a PCB push magazine that, while having sheet-shaped plural PCB raw material loaded thereon in order, is arranged at the outside of stage vertically, and pushes the PCB raw material to the stage by force; a PCB guide chain that is arranged across said rail, and guides the movement of the PCB raw material pushed by the PCB push magazine; and a PCB pick-up tool that is arranged above the second rail, picks up said number of PCBs from PCB raw material guided by the PCB guide chain at one time, and loads said PCBs in the metal base rings collectively.
PCT/KR2001/002214 2001-02-07 2001-12-19 System for assembling a ultra-thin type condenser microphone WO2002063924A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020010005805A KR100362843B1 (en) 2001-02-07 2001-02-07 System for assembling a ultra-thin type condenser microphone
KR2001/5805 2001-02-07

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WO2002063924A1 true WO2002063924A1 (en) 2002-08-15

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100544284B1 (en) * 2002-10-12 2006-01-23 주식회사 비에스이 Apparatus for assembling condenser microphone

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5733900A (en) * 1980-08-07 1982-02-24 Matsushita Electric Ind Co Ltd Manufacture of pickup cartridge
JPS61123400A (en) * 1984-11-20 1986-06-11 Matsushita Electric Ind Co Ltd Manufacture device of microphone
JPS6295832U (en) * 1985-12-03 1987-06-18
US5961762A (en) * 1998-04-29 1999-10-05 Sonigistix Corporation Method and assembly for manufacturing acoustic transducers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5733900A (en) * 1980-08-07 1982-02-24 Matsushita Electric Ind Co Ltd Manufacture of pickup cartridge
JPS61123400A (en) * 1984-11-20 1986-06-11 Matsushita Electric Ind Co Ltd Manufacture device of microphone
JPS6295832U (en) * 1985-12-03 1987-06-18
US5961762A (en) * 1998-04-29 1999-10-05 Sonigistix Corporation Method and assembly for manufacturing acoustic transducers

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KR100362843B1 (en) 2002-12-05
KR20020065672A (en) 2002-08-14

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