KR200235900Y1 - Ultra-thin type condenser microphone assembly - Google Patents

Abstract

The present invention relates to an ultra-thin condenser microphone assembly. In the present invention, the assembly process of the microphone is 'a process of stacking a vibration plate assembly, a spacer ring, a second base ring, a dielectric plate, a first base ring, and a PCB in an independent individual state.' Unify with When the present invention is achieved, the dielectric plate and the base ring are not subjected to any damages such as deformation and damage caused by the indentation process, and thus, the diaphragm, the dielectric plate, etc. disposed in the structure ensure the exact balance. Finally, the final ultra-thin condenser microphone can be provided with the effect that its mass productivity and quality are improved by a certain level or more.

In addition, in the present invention, the dielectric plate and the base rings are naturally combined with other structures in individual independent states without the 'assembly through the indentation process' to form the final ultra-thin microphone assembly. When the present invention is achieved, a series of gaps may be naturally formed between the first base ring and the second base ring to allow the air inside the bag chamber to flow out, so that the pressure inside the bag chamber is the pressure of the outside air. And a series of equilibrium can be maintained continuously, and as a result, the final microphone assembly can maintain a certain level or more of quality.

Description

Ultra-thin type condenser microphone assembly

The present invention relates to a microphone, for example, a condenser microphone, and more particularly, the mass production and quality of the product by greatly improving the assembly method of some components, such as dielectric plates, base rings It relates to an ultra-thin condenser microphone assembly that can greatly improve the.

Recently, with the rapid development of technology in the field of information and communication devices such as mobile phones and telephones, and in the field of acoustic devices such as amplifiers, the demand for microphones for converting acoustic energy into electrical energy is also increasing. It shows a sharp increase.

For example, U.S. Patent No. 5490220 'Solid state condenser and microphone devices', U.S. Patent No. 5870482 'Miniature silicon condenser microphone', U.S. Patent No. 6088463 'Solid state silicon-based condenser microphone', Japanese Patent No. 1999-266499 'Electret condenser microphone', Japanese Patent No. 1999-88989 'Electret Electret condenser microphone ', Korean Patent Publication No. 2000-19963' Condenser microphone for mobile communication terminal ', Korean Patent Publication No. 1999-55502' Condenser microphone ', etc. An example is disclosed in detail.

Such a conventional condenser microphone is usually a printed circuit board (hereinafter referred to as a 'PCB') having a series of electrical patterns (Pattern), which is disposed on the upper part of the PCB, by the sound waves flowing from the outside Vibrating diaphragm plate, dielectric plate arranged with a gap between the diaphragm and a certain gap, casing for mounting each component, namely PCB, diaphragm, dielectric plate, etc. Is made up of a combination.

In this case, for example, as disclosed in Korean Patent Publication No. 2000-12516, "Insulation ring of capacitor microphone and its fixing method", the dielectric plate is, for example, a base ring block made of a combination of 'metal base ring, insulating base ring'. It is compactly wrapped so that it can be stably mounted inside the casing. According to the mounting of the basering block, a back chamber of a predetermined size is defined between the PCB and the dielectric plate.

At this time, since the 'gap formed between the vibration plate and the dielectric plate' and the 'back chamber formed between the PCB and the dielectric plate' are located in the main transmission path of sound waves flowing from the outside, the 'gap, the back chamber', etc. Inevitably have a significant effect on the overall performance of, and accordingly, in the prior art, a lot of efforts have been made to precisely control the structure of the gap, the back chamber, and the like, for example, the balance.

In general, the conventional microphone having such a structure is a 'process of pressing the dielectric plate and the base ring block and assembling them into one assembly', and then inserting the assembled dielectric plate / base ring assembly between the PCB and the vibration plate. , A process of assembling the PCB, the dielectric plate / base ring assembly, the diaphragm, etc. sequentially into the casing to form a single independent assembly.

However, in this case, when the dielectric plate and the base ring block are combined into one assembly through a series of press-fit processes, a pressing force of a certain size is inevitably applied to the press-fit portions of the dielectric plate and the base ring block. In this case, the dielectric plate and the base ring block have no choice but to cause a series of deformation due to the pushing force transmitted, and the joint parts of each other are shaved by this pushing force, resulting in a series of damages. There is no choice but to wear.

In addition, since the dielectric plate and the base ring block are generally very small in size, the dielectric plate and the base ring block have serious problems that are greatly damaged even if only a slight process error occurs during the above-described indentation process. .

As mentioned above, the 'gap formed between the vibration plate and the dielectric plate' is located in the main transmission path of sound waves coming in from the outside, which greatly affects the overall performance of the microphone. ',' Process error ', etc. cause a series of deformation or damage to the dielectric plate and the base ring, for example, if the balance of the' gap formed between the vibration plate and the dielectric plate 'is destroyed, the final microphone is uniform It has no choice but to have sub-level performance, and inevitably leads to yield dispersion.

In addition, as described in the foregoing description, when the 'dielectric plate and base ring block' constitutes a single assembly through a series of indentation processes, the two base rings forming the base ring block, that is, the metal base ring, 'Insulation base ring' and the like have a compact structure that closely adheres to each other. In this case, the dielectric plate and the base ring have an indentation imbalance, and the dielectric plate forming the final microphone assembly is formed by the base ring block. It does not form a horizontal state on the defined 'back chamber' and is inclined to the left and right sides, and eventually, the balance of the dielectric plate is destroyed, so that the finished microphone may cause a serious problem in that its frequency characteristic and yield are greatly degraded. There is no choice but to.

Furthermore, as described above, when the two base rings that form the base ring block form a compact contact structure with each other, the back chamber defined by the base ring block suffers from the damage that the internal space is sealed. As a result of the pressure inside the chamber not being balanced with the outside air, a serious problem is inevitably caused that the frequency characteristics of the final microphone are greatly reduced.

Meanwhile, in order to complete the microphone as one independent assembly, as described above, the process of assembling the dielectric plate and the base ring block into one assembly and the assembled dielectric plate / base ring assembly on the PCB And inserting between the diaphragms, and then sequentially assembling the PCB, the dielectric plate / base ring assembly, and the diaphragm into the casing. 'In this case, the entire assembly line can only be divided into two. As a result, the number of process steps is increased more than necessary, which in turn leads to a serious problem that the overall mass productivity of the product is greatly reduced.

Accordingly, an object of the present invention is to allow dielectric plates and base rings, unlike the prior art, to be combined with other structures in each separate individual state to form one completed microphone assembly, based on which the 'dielectric plate and As the conventional 'indentation process' for assembling the base ring block can be easily excluded in the entire assembly flow of the microphone, the 'deformation of the dielectric plate', 'dielectric plate and base ring' according to the progress of the indentation process To prevent damage in advance.

Another object of the present invention is to block in advance the 'deformation of the dielectric plate', 'damage of the dielectric plate and the base ring', etc. in accordance with the progress of the indentation process, through which, for example, 'gap formed between the vibration plate and the dielectric plate' By maintaining an even balance, the final finished ultra-thin microphone is able to maintain a certain level of performance and yield.

Another object of the present invention is to provide a gap of a certain size between two base rings, for example, 'metal base ring and insulated base ring', when the dielectric plate and base rings are combined with other structures in each separate individual state. This allows the dielectric plate to maintain a level above a certain level on the 'back chamber defined by the base block', thereby preventing the lowering of the equilibrium of the dielectric plate due to the close contact between the base rings. In addition, the inner space of the back chamber is used to guide the outside air to form a stable airflow path.

Another object of the present invention is to allow the dielectric plate to maintain a level or more above a certain level on the back chamber, and to allow the inner space of the back chamber to form a stable air flow path with the outside air, thereby achieving the final ultra thin microphone. The frequency characteristic and yield are intended to be improved to a certain level or more.

Another object of the present invention is to unify the conventional ultra-thin microphone assembly method, which has been dualized into the 'pressing process', 'loading process', etc. into 'a series of mounting methods in which each component is stacked in sequence' By integrating the assembly line of the ultra-thin microphone into a single line, the mass production of the ultra-finished microphone is finally improved.

Still other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

1 is an exploded perspective view for explaining the assembly process of the ultra-thin condenser microphone assembly according to the present invention.

2 is a cross-sectional view of the ultra-thin condenser microphone assembly according to the present invention.

Figure 3 is an enlarged perspective view of the second base ring of the ultra-thin condenser microphone assembly according to the present invention.

In order to achieve the above object, the present invention discloses an ultra-thin condenser microphone assembly made of a combination of a casing, a diaphragm, a dielectric plate, a first and second base rings, a PCB, and the like. In this case, a gap of a predetermined size is formed between the first and second base rings unlike the prior art.

Hereinafter, with reference to the accompanying drawings, the ultra-thin condenser microphone assembly according to the present invention in more detail as follows.

As shown in FIG. 1, the ultra-thin condenser microphone assembly 10 according to the present invention is placed on a casing 1 having a round cylindrical shape in which a series of sound inlets are formed, and sequentially placed on top of the casing 1. Diaphragm assembly 11, spacer ring (4), second base ring (7), dielectric plate (5), first base ring (6) and PCB (9) sequentially mounted in the inner space of ) Is a combination. In this case, the diaphragm assembly 11 consists of a combination of a polar ring 2 and a diaphragm 3 which are integrally bonded.

When mounting each of these components in the inner space of the casing (1), in the present invention, first, the process of placing the diaphragm assembly 11 on the bottom surface of the case (1).

Subsequently, in the present invention, the process of placing the spacer ring 4 on the circumference of the aforementioned diaphragm assembly 11 is performed, and the second circumference on the circumference of the spacer ring 4 is brought into contact with the inner wall of the casing 1. The process of placing the base ring 7 is performed.

Subsequently, in the present invention, a process of placing a disk-shaped dielectric plate 5 on the circumference of the spacer ring 4 corresponding to the inside of the second base ring 7 described above is performed. 5) through the spacer ring 4, it is possible to maintain a gap of a predetermined size with the front diaphragm (3).

Through the above process, when the diaphragm assembly 11, the spacer ring 4, the second base ring 7, the dielectric plate 5, etc. are all mounted in the case 1, in the present invention, the second base The first base ring 6 is mounted on the circumference of the dielectric plate 5 corresponding to the inner side of the ring 7. At this time, as shown in the figure, since the second base ring 7 maintains a larger diameter than the first base ring 6, the first base ring 6 is formed on the circumference of the dielectric plate 5. When placed on the inner side of the second base ring 7, a gap of a certain size is naturally defined between the first base ring 6 and the second base ring 7.

Thereafter, the PCB 9 is placed on the circumference of the first base ring 6, the edge of the casing 1 is bent toward the PCB 9, and the inner space of the casing 1 is sealed. The final ultra-thin condenser microphone assembly 10 is completed.

As such, in the present invention, each individual component of the ultra-thin condenser microphone, that is, the diaphragm assembly 11, the spacer ring 4, the second base ring 7, the dielectric plate 5, and the first base ring 6 is described. By sequentially assembling the PCB 9 and the like in a separate individual state, the final ultra-thin microphone assembly 10 is formed. Of course, in the conventional case, such an assembly method is not taken at all.

In the conventional case, as mentioned above, the assembling process of the ultra-thin condenser microphone includes the process of assembling the dielectric plate and the base ring block into one assembly and the assembled dielectric plate / base ring assembly to the PCB. And the process of assembling the PCB, the dielectric plate / base ring assembly, the diaphragm, and the like sequentially into the casing, after being inserted between the diaphragms.

In this conventional case, due to a series of indentation processes for assembling the 'dielectric plate and base ring block', the 'dielectric plate' and 'joint portion of the base ring combined with the dielectric plate' are deformed or damaged, and thus, The inability of the diaphragm and dielectric to remain strictly guaranteed has led to a serious problem, for example, that the 'gap between the vibrating plate and the dielectric plate' did not maintain an even balance. And by dualizing the 'mounting process', a serious problem that the mass production and quality of the ultra-thin condenser microphone is finally completed is greatly reduced.

However, in the present invention, the assembly process of the ultra-thin condenser microphone is referred to as 'vibration plate assembly 11, spacer ring 4, second base ring 7, dielectric plate 5, first base ring 6, PCB' (9) unitizes the light into an independent individual state, so that when the present invention is achieved, the dielectric plate 5 is not subjected to any damage such as deformation or damage caused by the indentation process. As a result, the final ultra-thin condenser microphone 10 can have a 'gap' that maintains a certain level or more of balance, and, in turn, can be provided with the effect that its mass productivity and quality are improved to a certain level or more. do.

On the other hand, as shown in Figure 2, through the above-described process, the assembly of the ultra-thin condenser microphone assembly 10 of the present invention is completed inside the round cylindrical metal casing (1) having a series of sound inlet (1a) The diaphragm assembly 11, the spacer ring 4, the second base ring 7, the dielectric plate 5, the first base ring 6, and the PCB 9 are sequentially mounted.

In this case, a gap G1 having a predetermined size is formed between the diaphragm 3 and the dielectric plate 5 by the spacer ring 4 in the front, and the gap G1 is formed through the sound wave inlet 1a of the casing 1. Located in the main transmission path of the incoming sound waves, it affects the overall performance of the ultra-thin condenser microphone (10). Of course, since the gap G1 is not affected by the indentation process at all, unlike the prior art, the balance G1 maintains much better balance than the conventional art. At this time, the diaphragm 3 and the dielectric plate 5 are spaced apart with the gap G1 interposed therebetween to form a series of condenser structures.

Here, the front casing 1 is made of, for example, aluminum (Al), the polar ring 2 is made of, for example, a brass plate flattened with nickel (Ni), and the spacer ring ( 4) is made of, for example, a PET (polyethylene terephtalate) film having a thickness of about 35 ~ 45㎛.

In addition, as shown in the figure, the diaphragm 3 has a structure in which a coating layer 3b of gold (Au) or nickel (Ni) is disposed on a PET film 3a having a thickness of about 2.5 μm to 3.5 μm. The dielectric plate 5 disposed between the diaphragm 3 and the gap G1 has a FEP film layer 5a and a gold or nickel coating layer 5b disposed on the surface of the copper plate 5c. Another coating layer 5d of gold or nickel is disposed on the rear surface of the moving plate 5c.

On the other hand, the first base ring 6 supports the dielectric plate 5 and forms a structure in electrical contact with the PCB 9, and the second base ring 7 is surrounded by the first base ring 6. While wrapping, it forms a structure in contact with the inner wall of the casing (1). In this case, the first base ring 6 is made of, for example, a gold-plated material in brass, and the second base ring 7 is made of, for example, a material in which glass is contained in plastic.

Here, the PCB 9 which is in electrical contact with the first base ring 6 has, for example, a field effect transistor 8 (FET), a capacitor 8a, etc. The back chamber 9a defined by the arrangement of the first base ring 6 is provided. This back chamber 9a is also located in the main transmission path of the sound wave flowing through the sound wave inlet 1a of the casing 1, which greatly affects the overall performance of the ultra-thin microphone 10.

At this time, as described above, the present invention avoids a series of complicated indentation processes as in the prior art, simply, 'the process of placing the second base ring 7 on the circumference of the spacer ring 4', 'the second base' The process of placing the dielectric plate 5 on the circumference of the spacer ring 4 corresponding to the inside of the ring 7 ', on the circumference of the dielectric plate 5 corresponding to the inside of the second base ring 7. Since the process of placing the first base ring 6 having a smaller diameter than the second base ring 7 is sequentially performed to complete the assembly of the ultra-thin condenser microphone 10, the assembly process of the present invention is completed. In this case, as shown in the drawing, the first base ring 6 and the second base ring 7 form a structure in which a gap G2 of a predetermined size is formed therebetween.

As such, when the gap G2 is formed in a state in which the process of injecting the respective base rings 6 and 7 is excluded, for example, the diaphragm 3 supported by the respective base rings 6 and 7, dielectric Since the plate 5 and the like are not affected by the indentation process at all, a certain level or more of degree of balance can be ensured. In this case, as shown in the drawing, the dielectric plate 5 forming the final microphone assembly 10 is shown. ) Can maintain an even horizontal state on the 'back chamber (9a), after all, the final ultra-thin condenser microphone 10 of the present invention is provided with the effect that the frequency characteristics and yield is greatly improved.

In addition, when such a gap G2 is formed, since the internal air of the bag chamber 9a can achieve rapid discharge along a series of flow paths, such as in the direction of the arrow, the bag chamber 9a has its own internal pressure. The base environment that can achieve a stable equilibrium with the pressure of the outside air can be provided, after all, when the present invention is achieved, the final ultra-thin condenser microphone 10 is able to maintain a certain level or more frequency characteristics.

In this case, as shown in FIG. 3, a plurality of air outlet grooves 7a are further formed at the edge of the casing 1 side of the second base ring 7. These air outlet grooves 7a, together with the above-described gap G2, further form a series of air outlet paths leading to the 'back chamber 9a inner-gap-air outlet groove 7a-sound wave inlet 1a'. Therefore, when the air outlet groove 7a is further formed, the air inside the back chamber 9a can more easily flow out.

In the ultra-thin condenser microphone assembly 10 according to the present invention having such a structure, first, if any sound wave, for example, a user's voice is introduced through the sound wave inlet 1a of the casing 1, the diaphragm 3 is This sound wave vibrates at a constant speed.

When the vibration of the diaphragm 3 progresses, the gap G1 is changed at a constant speed between the diaphragm 3 and the dielectric plate 5 by this vibration, and the diaphragm 3 and the dielectric are changed according to the change of the gap G1. The capacitance between the plates 5 also changes, and as a result, the electric potential of the dielectric plate 5 corresponds to the sound waves, thereby rapidly changing.

Subsequently, when the above-described potential variable value of the dielectric plate 5 is transferred to the field effect transistor 8 of the PCB 9 via the first base ring 6, the field effect transistor 8 becomes this potential. The amplified current value according to the variable value is outputted to the outside, and eventually, the ultra-thin condenser microphone assembly 10 of the present invention accomplishes the original task of 'converting and converting the sound wave introduced through the sound wave inlet into an electric signal.' Done.

As described in detail above, in the present invention, the assembly process of the ultra-thin microphone is integrated into a process of stacking a vibration plate assembly, a spacer ring, a second base ring, a dielectric plate, a first base ring, and a PCB in an independent individual state. .

When the present invention is achieved, the dielectric plate and the base ring are not subjected to any damages such as deformation and damage caused by the indentation process, and thus, the diaphragm, the dielectric plate, etc. disposed in the structure ensure the exact balance. Finally, the final ultra-thin condenser microphone can be provided with the effect that its mass productivity and quality are improved by a certain level or more.

In addition, in the present invention, the dielectric plate and the base rings are naturally combined with other structures in individual independent states without the 'assembly through the indentation process' to form the final ultra-thin microphone assembly.

When the present invention is achieved, a series of gaps may be naturally formed between the first base ring and the second base ring to allow the air inside the bag chamber to flow out, so that the pressure inside the bag chamber is the pressure of the outside air. And a series of equilibrium can be maintained continuously, and as a result, the final ultra-thin microphone assembly can maintain a certain level or more of quality.

Claims (2)

A round cylindrical casing in which a series of sound wave inlets are formed; A disk-shaped diaphragm mounted on the casing and vibrating by sound waves input through the sound wave inlet; A disk-shaped dielectric plate which maintains a gap of a predetermined size with the diaphragm in a state mounted on the casing; A first base ring supporting the dielectric plate; A second base ring wrapped around the first base ring and in contact with an inner wall of the casing; A PCB mounted on the casing, having a series of electrical patterns, in electrical contact with the first base ring, and having a back chamber defined by the first base ring between the dielectric plates; and, Ultra-thin condenser microphone assembly, characterized in that a gap of a predetermined size is formed between the first base ring and the second base ring. The ultra-thin condenser microphone assembly of claim 1, wherein a plurality of air outlet grooves are further formed at the casing side edge of the second base ring.