KR100699443B1 - Phase delay device for ultra-small-size cardioid condenser microphone assembly, the microphone assembly using the phase delay device and method for assembling the microphone - Google Patents

Abstract

The present invention relates to a phase delay unit of a unidirectional microcondenser microphone assembly, a microphone assembly using the same, and a method for assembling the same. In the present invention, a series of steps are newly added to the edge of the phase delay unit, and thus, the assembled phase is completed. By allowing the retarder to form a predetermined phase delay gap in the assembly, the phase delay function of the specific direction sound wave required by the phase delay member is made of a metallic material instead of a sintered body made of conductive powder. Function) can be induced to perform normally. In addition, in the present invention, by changing the shape of the phase delay body, the sound wave phase delay mechanism of the phase delay body is improved from the mechanism using the air permeability of the conductive powder sintered body to the mechanism using the phase delay gap, and thereby, the phase delay By normalizing the metallization of the sieve, various problems caused when the phase retarder takes the form of a sintered body on the producer side, for example, the production efficiency of the phase retarder is lowered, the unit cost of the microphone is increased, the phase retarder Easily solved the problem that the yield of the production is lowered.

Description

Phase delay device for ultra-small-size cardioid condenser microphone assembly, the microphone assembly using the phase delay device and method for assembling the microphone}

1 is an exploded perspective view of a unidirectional condenser microphone assembly according to the prior art;

2 is a cross-sectional view of FIG.

3 is an exploded perspective view of a unidirectional subminiature condenser microphone assembly according to the present invention;

4 is a cross-sectional view of FIG. 3.

The present invention relates to a unidirectional condenser microphone assembly, and more particularly to a unidirectional microminiature that can improve the part structure and assembly pattern of the component, which can greatly improve the mass production and quality of the final finished product. A condenser microphone assembly. The present invention also relates to a method for assembling such a single directional condenser microphone assembly and a phase delay device assembled thereto.

Recently, with the rapid development of technology in the field of information and communication devices such as mobile phones, telephones, and sound wave devices such as amplifiers, consumer demand for improving the call quality of microphones is gradually increasing.

In recent years, according to the consumer's demand for improving call quality, so-called unidirectional condenser microphones which improve the sensitivity of sound waves flowing in a certain direction and block sound waves flowing in other directions, thereby minimizing the reproduction of unnecessary noise. For example, as disclosed in Korean Utility Model Publication No. 1982-1044, "Small unidirectional electric microphone," it has been developed and widely distributed.

As shown in Figs. 1 and 2, the unidirectional condenser microphone assembly 10 according to the prior art previously filed by the applicant has a round cylindrical case 1 formed with a series of sound wave inlets 1a; And a diaphragm 3 mounted on the case 1 and vibrating by the spacer ring 4 in a state in which the diaphragm 3 is vibrated by sound waves input through the sound wave inlet 1a, and mounted on the case 1. ) And a dielectric plate 5 which maintains a gap of a predetermined size, and a cylindrical body in which one side is closed, while supporting the dielectric plate 5, sound waves in a predetermined direction, for example, a front sound ( A phase delay body 6 which selectively reproduces only S1, and attenuates sound waves in other directions, for example, the rear sound S2, and surrounds the phase delay body 6, A base ring 7 in contact with the side wall and mounted on the case 1, a series of electrical patterns, eg The PCB 9 includes a transistor 9a, a capacitor 9b, and the like, which is in electrical contact with the phase delay element 6, and has a back chamber 10a between the phase delay element 6. In combination.

In this case, the preceding phase delay member 6 forms a series of conductive powder sintered bodies in which conductive powders 6a such as nickel and copper are formed through a predetermined press process-sintering crystal, or the like. According to the air permeability (a time when a certain amount of air passes through the unit area of the conductive powder sintered body), it realizes a sound wave phase delay mechanism in which the resistance of sound waves is controlled.

At this time, the front diaphragm 3 is integrally bonded with the polar ring 2 to form the diaphragm assembly 8, and a series of sound wave inlets 9c are additionally disposed on the PCB 9.

Specific configuration, specific operation, and the like of the unidirectional condenser microphone assembly 10 according to the related art are disclosed in more detail in Korean Patent Laid-Open Publication No. 2000-95776 filed by the present applicant.

Under such a conventional unidirectional condenser microphone assembly system, as mentioned above, the phase delay core 6, which is a phase delay core element, is made of a sintered body made of a predetermined conductive powder 6a, Under the conventional system, in order to realize the phase delay body 6 of the completed form, a procedure of blending conductive powders 6a such as nickel, copper, etc., of which the characteristics are extremely different, The procedure of press working 6a) and the process of sintering the pressed conductive powder 6a will inevitably proceed.

That is, under the conventional system, unless a separate action is taken, the phase delay unit 6 must be subjected to a very complicated processing procedure to be completed as a normal product, and, as a result, the phase delay unit 6 The overall production efficiency of is inevitably deteriorated.

Of course, in order to proceed with the above-described compounding procedure, press working procedure, sintering procedure, etc., the producer side may of course arrange various devices suitable for the same in the production line, for example, a mixing device, a press device, and a sintering device. In addition, since additional measures must be taken to additionally arrange a manpower dedicated to the process, the unit price of the finally completed microphone assembly 10 may be greatly increased unless a separate solution is devised under the conventional system. There will be no.

Furthermore, due to the characteristics of the compounding procedure in which various variables such as the size of the compounding particles, the amount of the compounding particles, the compounding time, and the like act, the distribution of the conductive powders (6a, nickel, copper, etc.) forming the phase retarder 6 is reduced. It is never easy to maintain uniformity at every completion of the process, and as a result, if no action is taken, producers will have a lot of difficulty in equalizing the characteristics of each phase-delays 6 mass-produced. Inevitably, the problem that the overall mass production yield of the phase delay body 6 falls significantly is inevitable.

Of course, if the material of the phase retarder 6 is replaced with a different material, for example, a metal material from the sintered body material by the conductive powder, various problems described above may be easily solved, but in this case, the phase retarder 6 Since the air permeability disappears and the phase retarder 6 cannot perform the sound wave phase delay function normally given to it, a serious problem must be raised, so that it is caused by conventionally sintering the phase retarder 6 by conductive powder. While deeply aware of the various problems to be solved, the situation is not prepared at all.

Accordingly, an object of the present invention is to newly form a series of steps on the edge of the phase delay unit, thereby allowing the assembled phase delay unit to form a predetermined phase delay gap in the assembly. It is to induce a phase delay function (attenuation function) of a specific directional sound wave, which is required of itself, while forming a metallic material, not a sintered body made of conductive powder.

Another object of the present invention is to improve the sound wave phase delay mechanism of the phase delay body from the mechanism using the air permeability of the conductive powder sintered body to the mechanism using the phase delay gap by changing the shape of the phase delay body, and thereby, the phase By realizing the metallization of the retarder normally, various problems caused when the phase retarder takes the form of sintered body on the producer side, for example, the production efficiency of the phase retarder decreases, the cost of the microphone increases, the phase delay It is to induce easy to solve the problem that the mass production yield of the sieve is reduced.

Still other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

In order to achieve the above object, in the present invention, a series of sound wave inlets are formed, and a vibration plate mounted on the case and vibrating by sound waves input through the sound wave inlet, and mounted on the case, the diaphragm and the gap are formed. A dielectric plate to be retained, a conductor supporting the dielectric plate with a predetermined back surface, a base ring mounted inside the case while surrounding the conductor, and a series of electrical patterns mounted on the case A unidirectional micro-condenser microphone assembly comprising a combination of PCBs having a profile and in electrical contact with a conductor and having a back chamber between the conductors is disclosed.

In this case, a step for supporting the dielectric plate protrudes from the conductor and the dielectric plate so that a phase delay gap for selectively attenuating sound waves in a predetermined direction is formed between the conductor and the dielectric plate.

In another aspect of the present invention, the method further comprises the steps of: placing a diaphragm on the bottom of the case; placing a spacer ring on an upper portion of the diaphragm, and then placing a base ring on an upper portion of the spacer ring; Placing a dielectric plate inside the base ring to maintain a gap of a predetermined size with the diaphragm via the spacer ring; Contacting the step of the phase delay member on the circumference of the dielectric plate to maintain a phase delay gap of a predetermined size between the dielectric plate and placing the phase delay member on top of the dielectric plate; Placing a PCB on top of the phase delay unit; Disclosed is a method for assembling a single directional micro-condenser microphone assembly consisting of a combination of sealing the inside of the case.

In addition, in another aspect of the present invention, in accordance with the change in the gap between the dielectric plate electrically connected to the PCB and the diaphragm mounted on the top of the dielectric plate, a single directional microcapacitor for converting external sound waves into a series of electrical signals It is disposed on a part of the microphone assembly, forms a single cylindrical body with one side closed, and supports the dielectric plate in a state where it is mounted on the PCB, so that the conductor that electrically connects the dielectric plate with the PCB, and the front dielectric plate is supported. Disclosed is a phase delay body which is formed integrally with the edge of the conductor and is formed of a combination of steps defining a predetermined phase delay gap between the conductor and the dielectric plate.

Hereinafter, with reference to the accompanying drawings, the unidirectional micro-capacitor microphone assembly according to the present invention, an assembly method thereof, and a phase delay assembly assembled thereto will be described in more detail.

As shown in Figs. 3 and 4, the unidirectional ultra-small condenser microphone assembly 20 according to the present invention comprises a round cylindrical case 21 in which a series of sound inlets 21a are formed, and in this case 21. A disk-shaped diaphragm 23 that is mounted and vibrates by a sound wave input through the sound wave inlet 21a, and a disk-shaped dielectric that maintains a predetermined size gap with the diaphragm 23 in a state in which it is mounted on the case 21. A plate 25, a base ring 27 in contact with the inner wall of the case 21, wrapped around the dielectric plate 25, mounted on the case 21, a series of electrical patterns, For example, a combination of a PCB 29 having a transistor 29a and a capacitor 29b and having a series of back chambers 20a on its top in electrical contact with the front dielectric plate 25. Is done. In this case, the front diaphragm 23 is integrally bonded with the polar ring 22 to form the diaphragm assembly 28, and a series of sound wave inlets 29c are disposed on the PCB 29.

In this case, the front case 21 is made of, for example, aluminum (Al) or copper (Cu), the polar ring 22 is, for example, nickel (Ni) Plating (Prass plate) The spacer ring 24 is made of, for example, a PET film having a thickness of about 35 μm to about 46 μm, and the diaphragm 23 is about 2.5 μm to 3.5 μm coated with gold or nickel. It consists of a PET film having a thickness.

Here, as shown in the figure, the phase retarder 30 forming the gist of the present invention forms a single cylindrical shape in which one side is closed by the rear surface 31a, and the dielectric plate 25 is placed on the PCB 29. ), The conductor 31 electrically connecting the dielectric plate 25 to the PCB 29, and from the edge of the rear surface 31a side of the conductor 31 so that the front dielectric plate 25 is supported. The protrusion 32 is integrally formed, and a step 32 is formed between the rear surface 31a of the conductor 31 and the dielectric plate 25 to define a predetermined phase delay gap DG.

In this case, the phase delay gap DG is formed of a predetermined fluid resistance layer (for example, an air resistance layer), and the sound wave in a specific direction, for example, the back sound flowing through the sound wave inlet 29c of the PCB 29 ( Serves to selectively attenuate S4).

Of course, since the phase delay gap DG is an element formed when the conductor 31 having the step 32 is placed on the top of the dielectric plate 25, it is formed without any further action. Under the present invention, the producer side can effectively eliminate the necessity of further processing for the formation of the phase delay gap DG, and thus can easily enjoy the effect of improving the production efficiency.

In other words, the phase retarder 30 of the present invention has a configuration in which the conductor 31 and the step 32 are integrally combined, so that their acoustic wave retardation mechanism is not a mechanism using the air permeability of the conductive powder sintered body, By implementing the mechanism using the phase delay gap DG, for example, the dielectric plate 25 may be electrically connected to the PCB 29, and the back sound S4 may be attenuated at the same time. Will be.

Here, the protruding height of the step 32 is a very important factor in determining the phase delay characteristics of the phase delay unit 30. In the present invention, the protruding height of the step 32 is determined in consideration of these problems. Preferably, by selecting and holding at about 5 µm to 100 µm, the final delayed phase delayer 30 is induced to maintain the optimum magnitude and phase delay characteristics simultaneously.

At this time, the base ring 27 mentioned above is not only the dielectric plate 25, but also takes the structure that surrounds the periphery of the phase delay unit 30, in this case, the inner diameter of the base ring 27 is preferably For example, by maintaining a size larger than the diameter of the phase delay unit 30, a gap G having a predetermined size is defined between the phase delay unit 30 and itself. In this case, the base ring 27 is made of, for example, a material containing glass in plastic. Of course, the material of the base ring 27 may form a variety of deformation, depending on the situation.

In this situation, as shown in the figure, the rear surface 31a of the conductor 31 has, for example, a phase delay gap DG having the rear sound S4 introduced through the sound wave inlet 29c of the PCB 29. A predetermined sound wave passing hole 33 for passing to the side is further formed.

Of course, the size of the sound wave passing hole 33 also acts as a very important factor in determining the phase delay characteristics of the phase delay unit 30, as well as the protrusion height of the step 32. In the present invention, such a problem In consideration of the above, the diameter of the sound wave passing hole 33 is preferably selected and maintained at about 350 μm to 450 μm, so that the final phase delay unit 30 is precisely optimized for the optimum attenuation characteristic of the back sound S4. Encourage them to stay.

On the other hand, the former conductor 31 and the step 32 are preferably made of a metal body such as aluminum (Al) or copper (Cu). Of course, the type of the metal constituting the conductor 31 and the step 32 may be variously modified according to circumstances, and in this case, the surfaces of the conductor 31 and the step 32 may be A metal coating layer, preferably a nickel coating layer, for preventing these corrosions may be further disposed.

As described above, in the framework of the present invention, when the conductor 31 and the step 32 forming the phase retarder 30 are both made of a predetermined metal body, the producer side has completed a simple mold process even though only a series of mold processes are performed. It is possible to easily produce the phase retarder 30 in the form, and as a result, it is possible to effectively solve various problems caused when the phase retarder takes the form of a predetermined sintered body as in the prior art.

For example, under the system of the present invention, the producer side does not need to complicated the procedure of compounding the conductive powder of nickel, copper, etc., the process of pressing the compounded conductive powder, the process of sintering the pressed conductive powder, etc. However, only a simple process of collectively taking the conductor 31 and the step 32 through the mold can be easily produced, the phase retarder 30 of the completed form, after all, compared to the conventional In this case, the overall production efficiency of the phase delay unit 30 can be easily enjoyed.

In addition, under the system of the present invention, the producer side measures to arrange a compounding device, a press device, a sintering device, etc. in the production line, and an additional arrangement of a manpower dedicated to the compounding process, the press process, the sintering process, etc. in the production line. It is not necessary to take complicated steps and the like, but simply take a step of arranging a predetermined mold apparatus in the production line alone and a small amount of manpower dedicated to the mold apparatus in the production line. 30) can be easily produced, and as a result, it is possible to easily enjoy the effect that the unit cost of the finished microphone assembly 20 is greatly reduced compared to the conventional.

Of course, under the framework of the present invention, the phase delay unit 30 implements its sound wave phase delay mechanism as a mechanism using a phase delay gap, rather than a mechanism using the air permeability of the conductive powder sintered body, unlike conventional, Since it can be effectively metallized regardless of disappearance, when the present invention is implemented, a large amount of the phase retarder 30 of the completed form is normally used on the producer side by using a mold process whose process deviation is significantly smaller than that of the sintering process. As a result, it is possible to easily enjoy the effect that the characteristics of each of the phase delay units 30 to be finally produced are substantially uniform (that is, the mass production yield is greatly improved) as compared with the related art.

At this time, the step 32 of the present invention is preferably manufactured in the same mold as the conductor 31, and forms the same body as the conductor 31.

Of course, when the step 32 is collectively manufactured in the same mold as the conductor 32, the producer side can effectively eliminate the need to proceed with individual processes for the formation of the conductor 31 and the step 32. As a result, the production efficiency improvement effect can be easily enjoyed.

Moreover, when the conductor 31 and the step 32 of the present invention form one same body without separate unnatural coupling action (for example, indentation action), the back 31a of the conductor 31 and the dielectric The phase delay gap DG defined between the plates 25 can naturally maintain a rigid balance of more than a certain level, and thus, the phase delay body 30 composed of the conductor 31 and the step 32 is excellent. The phase delay characteristic can be easily retained.

On the other hand, when mounting the above-described components in the inner space of the case 21, in the present invention, first, the process of placing the diaphragm assembly 28 on the bottom surface of the case 21.

Subsequently, in the present invention, the process of placing the spacer ring 24 on the circumference of the aforementioned diaphragm assembly 28 is performed, and the base ring on the circumference of the spacer ring 24 is brought into contact with the inner wall of the case 21. Proceed with placing (27).

Subsequently, in the present invention, the process of placing the disk-shaped dielectric plate 25 on the circumference of the spacer ring 24 corresponding to the inside of the base ring 27 described above is performed. In this case, the dielectric plate 25 Through the spacer ring 24, the gap between the front diaphragm 23 and the predetermined size can be maintained.

Through the above process, if the diaphragm assembly 111, the spacer ring 24, the base ring 27, the dielectric plate 25, etc. are all mounted in the case 21, the base ring 27 in the present invention The process of placing the phase delay unit 30 on the circumference of the dielectric plate 25 corresponding to the inside of the process is performed.

At this time, as mentioned above, since the base ring 27 maintains a larger diameter than the phase delay body 30, the phase delay body 30 is placed on the circumference of the dielectric plate 25, so that the base ring In the case of the inner side of (27), a gap G having a predetermined size can be naturally defined between the phase delay unit 30 and the base ring 27.

In addition, since the stepped portion 32 is formed at the edge of the conductor 31 constituting the phase delay member 30, the protrusion height of about 5 to 100 µm is formed. In the state where the step 32 is in contact with the circumference of 25, and is placed inside the base ring 27, a phase delay gap of a predetermined size is provided between the phase delay member 30 and the dielectric plate 25. (DG) can be defined naturally.

Subsequently, in the present invention, a procedure of placing the PCB 29 on the rear surface 31a of the phase delay unit 30 and bending the edge of the case 21 toward the PCB 29 to seal the internal space of the case 21 is performed. By proceeding to complete the final single directional ultra-small condenser microphone assembly 20 to be implemented in the present invention.

Thus, in the present invention, each individual component constituting the unidirectional micro condenser microphone 20, namely, the diaphragm assembly 28, the spacer ring 24, the base ring 27, the dielectric plate 25, the phase delay member (30, conductor + step), PCB 29, etc. are assembled in order in each of the independent individual state, so that when the present invention is achieved, for example, the phase delay unit 30 is an excessive assembly process (for example, Deformation and damage due to the progress of the indentation process) can be avoided in advance, and as a result, the balance of the phase delay gap (DG) can be maintained strictly, and ultimately, the optimum phase delay characteristics can be effectively exhibited. do.

Of course, in this case, the phase delay unit 30 of the present invention can maintain an even level even on the back chamber 20a, thereby naturally maintaining a single directivity of a certain level or more, and as a result, the final microphone assembly (20) can also effectively exhibit the optimum frequency characteristic.

On the other hand, under the unidirectional micro condenser microphone assembly 20 according to the present invention having the above-described structure, first, when the front sound (S3) is introduced through the sound wave inlet (21a) of the case 21, the diaphragm 23 By virtue of this sound wave S3, the mechanism vibrates at a constant speed.

Of course, when the vibration of the diaphragm 23 proceeds, the gap between the diaphragm 23 and the dielectric plate 25 is changed at a constant speed by the vibration, and the diaphragm 23 and the dielectric are changed according to the change of the gap. The electrostatic field between the plates 25 also changes in response to sound waves. As a result, according to a general law of electrostatic induction, the potential of the dielectric plate 25 also changes rapidly in response to sound waves.

In this state, when the potential variable value of the dielectric plate 25 is transferred to the gate electrode of the transistor 29a disposed on the PCB 29 via the conductor 31, the transistor 29a is changed to this potential variable value. Amplifying the current value according to the output to the outside, and finally, the single directional micro-capacitor microphone assembly 20 of the present invention "electric signal to the front sound (S3) flowing through the sound wave inlet (21a) Converting to amplification "effectively accomplishes the original mission.

Of course, under the arrangement of the unidirectional ultra-small condenser microphone assembly 20 according to the present invention, the inside of the case 21 is provided with a series of sound waves through the sound wave inlets 29c of the PCB 29 as well as the front front sound S3. The rear sound (S3) is also introduced at the same time, in this case, the rear sound (S3) to vibrate the diaphragm 23 via the back chamber 20a, the sound wave passage hole 33 and the dielectric plate 25. It takes a mechanism.

At this time, since the phase delay gap DG defined by the formation of the step 32 is formed in advance between the back surface 31a of the conductor 31 and the dielectric plate 25, the sound wave passage hole 33 is formed. Unlike the front sound S3, the passed back sound S4 inevitably undergoes a series of phase delay processes (attenuation processes) due to the phase delay gap DG. Compared to the front sound (S3) it is bound to be significantly less.

Of course, in the situation where the level of the rear sound S4 is greatly reduced, even if the rear sound S4 vibrates the diaphragm 23, the vibration of the diaphragm 23 is compared with that of the front sound S3. As a result, the variation in the distance between the diaphragm 23 and the dielectric plate 25 also becomes insignificant, and as a result, the unidirectional microcondenser microphone assembly 20 of the present invention is a series of singles. Directivity, for example, omni-directional, can be expressed naturally.

As described in detail above, in the present invention, a series of steps are newly added to the edge of the phase delay unit, and thus, the assembled phase delay unit can form a predetermined phase delay gap in the assembly. The phase retarder may be induced to perform a phase retardation function (attenuation function) of a specific directional sound wave required by itself while forming a metallic material instead of a sintered body made of conductive powder.

In addition, in the present invention, by changing the shape of the phase retarder, the sound wave phase delay mechanism of the phase retarder is improved from the mechanism using the air permeability of the conductive powder sintered body to the mechanism using the phase delay gap. By realizing the metallization of the phase normally, various problems caused when the phase retarder takes the form of a sintered body on the producer side, for example, the production efficiency of the phase retarder is lowered, the unit cost of the microphone is increased, It can be induced to easily solve problems such as a decrease in mass production yield.

The present invention described above has an overall useful effect in various types of information communication devices, sound wave devices, etc. requiring a microphone.

And, in the foregoing, specific embodiments of the present invention have been described and illustrated, but it is obvious that the present invention may be variously modified and implemented by those skilled in the art.

Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

Claims (10)

A case in which a series of sound wave inlets are formed; A vibration plate mounted in the case and vibrating by sound waves input through the sound wave inlet; A dielectric plate holding a gap with the diaphragm in a state mounted on the case; A conductor supporting the dielectric plate; A base ring mounted inside the case while surrounding the conductor; A PCB mounted in the case, having a series of electrical patterns, in electrical contact with the conductor, and having a back chamber between the conductors; In the edge of the conductor, between the conductor and the dielectric plate, a step supporting the dielectric plate is formed so as to form a phase delay gap for selectively attenuating sound waves in a predetermined direction. A unidirectional ultra small condenser microphone assembly. delete 2. The unidirectional micro-condenser microphone assembly of claim 1, wherein the step has a protruding height of 5 µm to 100 µm. 2. The unidirectional micro-condenser microphone assembly of claim 1, wherein a predetermined sound wave passing hole is further formed in the conductor. 5. The unidirectional micro-condenser microphone assembly according to claim 4, wherein the sonic pass-through hole has a diameter of 350 µm to 450 µm. 2. The unidirectional micro-condenser microphone assembly of claim 1, wherein the conductor is made of aluminum (Al) or copper (Cu). 7. The unidirectional microcondenser microphone assembly of claim 6, wherein the surface of the conductor is further coated with nickel. Placing a diaphragm on the bottom of the case; Placing a spacer ring on an upper portion of the diaphragm, and then placing a base ring on an upper portion of the spacer ring; Placing a dielectric plate inside the base ring to maintain a gap of a predetermined size with the diaphragm via the spacer ring; Contacting the step of the phase delay member on the circumference of the dielectric plate to maintain a phase delay gap of a predetermined size between the dielectric plate and placing the phase delay member on top of the dielectric plate; Placing a PCB on top of the phase delay unit; And sealing the inside of said case. As the gap between the dielectric plate electrically connected to the PCB and the diaphragm mounted on top of the dielectric plate is disposed, it is disposed on a part of a single directional microcondenser microphone assembly that converts external sound waves into a series of electrical signals. A conductor which forms a closed single-cylindrical shape, supports the dielectric plate in a state where it is mounted on the PCB, and electrically connects the dielectric plate to the PCB; And a stepped portion formed integrally with the edge of the conductor so that the dielectric plate is supported to define a predetermined phase delay gap between the conductor and the dielectric plate. 10. The phase retarder of claim 9, wherein the step is formed in the same mold as the conductor.

Images