CN111970616A

CN111970616A - Loudspeaker module and electronic equipment

Info

Publication number: CN111970616A
Application number: CN202011008109.1A
Authority: CN
Inventors: 李小波
Original assignee: Huaqin Technology Co Ltd
Current assignee: Huaqin Technology Co Ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2020-11-20

Abstract

The invention relates to the technical field of electronics, and discloses a loudspeaker module and electronic equipment. The loudspeaker module comprises a shell and a loudspeaker unit; the loudspeaker unit is arranged in the inner cavity of the shell and divides the inner cavity into a front sound cavity and a rear sound cavity which are isolated from each other; a sound outlet hole is formed in the corresponding area of the front sound cavity on the shell and is communicated with the front sound cavity; the shell is provided with a preset number of communicating holes in the corresponding area of the rear sound cavity, and the communicating holes are communicated with the rear sound cavity. According to the embodiment of the invention, when the loudspeaker unit makes a sound, the vibration of the vibrating membrane can push the air in the rear sound cavity to move, so that the air in the rear sound cavity expands and flows out to the external environment of the loudspeaker module through the communication hole of the rear sound cavity, or the air in the external environment enters the rear sound cavity through the communication hole due to contraction, the effect of expanding the rear sound cavity by using the external space is achieved, which is equivalent to increasing the volume of the rear sound cavity, further the Fo value and the SPL value are reduced, and the sound effect is effectively improved.

Description

Loudspeaker module and electronic equipment

Technical Field

The invention relates to the technical field of electronics, in particular to a loudspeaker module and electronic equipment.

Background

In recent years, the subjective experience requirements of users on sound effects are continuously improved, and the users have undergone a transition process from simple sound-sound big-sound good-sound effect experience. Because the big sound effect of the back sound chamber of speaker module is better, consequently the volume in back sound chamber is an effectual sound effect promotion method behind the increase.

However, with the trend of miniaturization, the overall thickness of electronic devices such as smart phones and flat panels is thinner and thinner, which results in smaller and smaller available space of speaker modules in the electronic devices such as mobile phones and flat panels. Therefore, it is difficult to increase the volume of the back sound cavity in the speaker module in the limited available space.

Currently, there are two conventional back volume augmentation approaches:

the utility model provides an add atom adsorption material for in the cavity of speaker module, utilize oxygen atom and nitrogen atom in this atom adsorption material absorption air in order to form the negative pressure to reach the effect of extension back sound chamber volume. However, the atomic adsorption material is expensive, requires special canning equipment, and has a complicated packing process.

The other is to stick sound absorption cotton in the back sound cavity, but the back sound cavity volume that this mode can increase is limited, and can sacrifice some sound loudness, makes the audio effect worsen.

Disclosure of Invention

The invention aims to provide a loudspeaker module and electronic equipment, which overcome the defects of high cost, complex process and small effect improvement degree in the prior art.

In order to achieve the purpose, the invention adopts the following technical scheme:

a speaker module, comprising: a housing and a speaker unit;

the loudspeaker unit is arranged in the inner cavity of the shell and divides the inner cavity into a front sound cavity and a rear sound cavity which are isolated from each other; a sound outlet hole is formed in the corresponding area of the front sound cavity on the shell, and the sound outlet hole is communicated with the front sound cavity; the shell is provided with a preset number of communicating holes which are arranged according to a preset mode in a corresponding area of the rear sound cavity, and the communicating holes are communicated with the rear sound cavity.

Optionally, a porous damping net is arranged on the shell in the opening area of the communicating hole, and the aperture of the through hole of the porous damping net is smaller than that of the communicating hole.

Optionally, the porous damping net is attached to the outer wall of the shell.

Optionally, the communication holes on the housing are arranged in a rectangular array.

Optionally, the number of the communication holes is 20 to 150.

Optionally, the number of the communication holes is 56, the diameter of the communication holes is 0.5mm, and the mesh number of the through holes of the porous damping net is 2000.

Optionally, the housing comprises an upper shell and a lower shell which are assembled and connected to form the inner cavity; the loudspeaker is characterized in that a step groove is formed in the lower shell, the loudspeaker unit is arranged on the step surface of the step groove, and the sound outlet surface of the loudspeaker unit faces the step groove, so that the sound outlet surface of the loudspeaker and the step groove form a sealed front sound cavity.

Optionally, the sound outlet is provided in a side wall or a bottom wall of the step groove.

Optionally, the speaker module further includes a flexible circuit board disposed in the inner cavity; one end of the flexible circuit board is electrically connected with the loudspeaker unit, and the other end of the flexible circuit board extends out of the inner cavity and is electrically connected with a power supply.

An electronic device comprising a speaker module as described in any of the above.

Compared with the prior art, the embodiment of the invention has the following beneficial effects:

the embodiment of the invention is specially designed for the rear sound cavity: a plurality of communicating holes are formed in the corresponding area of the rear sound cavity on the shell, so that the rear sound cavity is communicated with the external environment of the loudspeaker module. When the speaker unit makes a sound, the vibration of the vibrating membrane of the speaker unit can promote the air motion in the back sound cavity, the air in the back sound cavity can expand like this and flow to the external environment of speaker module by the intercommunicating pore in back sound cavity, perhaps take place the shrink and let the air in the external environment get into the back sound cavity by the intercommunicating pore, consequently this special design has reached and has utilized the external space to carry out the effect that expands to the back sound cavity, the volume in back sound cavity has been increased in other words, and then can reduce Fo value and promote the SPL value, the audio has effectively been promoted.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is an assembled perspective view of a speaker module according to an embodiment of the present invention;

fig. 2 is an exploded view of a speaker module according to an embodiment of the present invention;

fig. 3 is a cross-sectional view of a speaker module according to an embodiment of the present invention;

fig. 4 is a comparison graph of SPL loudness curves provided by an embodiment of the present invention;

fig. 5 is a graph comparing Fo curves provided by the embodiments of the present invention.

Illustration of the drawings: the loudspeaker comprises a shell 10, a loudspeaker unit 20, a porous damping net 30, a flexible circuit board 40, a front sound cavity 11, a rear sound cavity 12, a sound outlet hole 13, a communication hole 14, an upper shell 15, a lower shell 16 and a step groove 17.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 is an assembled perspective view of a speaker module according to an embodiment of the present invention, fig. 2 is an exploded perspective view of the speaker module according to the embodiment of the present invention, and fig. 3 is a sectional view of the speaker module according to the embodiment of the present invention. Referring to fig. 1 to 3, a speaker module according to an embodiment of the present invention mainly includes: a housing 10 and a speaker unit 20.

The speaker unit 20 is disposed in an inner cavity of the housing 10, and divides the inner cavity into a front sound cavity 11 and a rear sound cavity 12 isolated from each other. The casing 10 has a sound outlet 13 formed in a corresponding area of the front sound cavity 11, and the sound outlet 13 is connected to the front sound cavity 11. The housing 10 is provided with a predetermined number of communication holes 14 arranged in a predetermined manner in a corresponding area of the rear sound chamber 12, and the communication holes 14 are communicated with the rear sound chamber 12.

It should be noted that there are many kinds of speaker units 20, but the basic operation principle is similar, and each is an element that converts an electric signal into a sound signal to reproduce the sound signal. At present, the most widely used is an electrodynamic loudspeaker which comprises a vibrating diaphragm, a voice coil, a permanent magnet, a bracket and the like, and the working principle is as follows: when the voice coil of the speaker unit 20 is energized with an audio current, the voice coil generates an alternating magnetic field under the action of the current, and the permanent magnet also generates a constant magnetic field with a constant magnitude and direction. The size and direction of the magnetic field generated by the voice coil are continuously changed along with the change of the audio current, so that the voice coil moves in a direction vertical to the current direction in the voice coil due to the interaction of the two magnetic fields, the voice coil is connected with the vibrating membrane, the vibrating membrane is driven to vibrate, and the vibration of air is caused by the vibration of the vibrating membrane to make sound.

The speaker frequency response curve key parameters include SPL (sensitivity) values and Fo (bass resonance frequency) values. Wherein, SPL: the electric power input to the speaker unit 201W is a sound pressure level measured at a position 1 m away from the axis of the speaker, and is substantially a reflection of the conversion efficiency. Fo reflects the low-frequency characteristics of the loudspeaker and is the second most important indicator of the frequency response curve.

The sound cavity mainly comprises a front sound cavity 11 and a rear sound cavity 12 which are isolated from each other. The front sound cavity 11 mainly affects the high-frequency part of the sound, and has little influence on the low-frequency part of the sound; as the volume of the front cavity 11 increases, the high-frequency resonance point becomes lower, and the area of the sound hole 13 needs to be considered when designing the front cavity 11, and generally, the larger the front cavity 11, the larger the area of the sound hole should be. The rear sound cavity 12 mainly affects the low frequency part of the sound and has little effect on the high frequency part; for example, in the case of a ring tone, the lower frequency part of the ring tone greatly affects the sound quality, and the more prominent the low frequency part is, the more pleasant the ring tone is subjectively perceived.

In the embodiment of the invention, the back sound cavity 12 is specially designed: a plurality of communication holes 14 are formed in the housing 10 in the area corresponding to the rear sound cavity 12, so that the rear sound cavity 12 communicates with the external environment of the speaker module. When the speaker unit 20 makes a sound, the vibration of the diaphragm of the speaker unit 20 pushes the air in the back sound cavity 12 to move, so that the air in the back sound cavity 12 expands and flows out to the external environment of the speaker module through the communication hole 14 of the back sound cavity 12, or contracts to allow the air in the external environment to enter the back sound cavity 12 through the communication hole 14, therefore, the special design achieves the effect of expanding the back sound cavity 12 by using the external space, which is equivalent to increasing the volume of the back sound cavity 12, and further can reduce the Fo value and improve the SPL value, and the sound effect is effectively improved.

Unlike the method of forming one opening having a large diameter, the present embodiment employs a method of forming a plurality of communication holes 14 having a small diameter, thereby effectively preventing noise from being mixed.

Meanwhile, since the machining precision of the communication holes 14 on the housing 10 is limited, the machining precision can only reach 0.5mm in diameter according to the current machining level, and theoretically, the smaller the diameter of the communication holes 14 is, the better the sound effect is, therefore, in order to further improve the sound effect, in the embodiment of the present invention, the porous damping net 30 is further provided in the opening area of the communication holes 14, and the pore diameter of the through holes of the porous damping net 30 is smaller than that of the communication holes 14.

Specifically, the porous damping net 30 is formed by die cutting a mesh cloth with a large acoustic resistance and a double-sided adhesive tape, and the number of the through holes on the porous damping net 30 can be selected according to actual sound effect requirements.

Illustratively, the number of the communication holes 14 is 20 to 150, and the communication holes are arranged in a rectangular array in a designated area on the housing 10. The design of different numbers of the communication holes 14 can realize the back sound cavities 12 with different volumes, thereby obtaining different sound effects. In practical application, the adjustment can be flexibly carried out according to actual requirements.

Preferably, the number of the communication holes 14 is 56, the diameter of each communication hole 14 is 0.5mm, and the mesh number of the through holes of the porous damping mesh 30 is 2000. In order to embody the technical effect of the embodiment, the following speaker module adopting the design is compared with a conventional speaker module for testing, and the comparison result is as follows:

please refer to fig. 4, which shows a comparison graph of the SPL loudness curve, wherein the SPL loudness curve a is an objective test value of the conventional speaker module, and the SPL loudness curve B is an objective test value of the speaker module after the back sound cavity 12 is enlarged in the present embodiment; from the test results, the SPL value of the speaker module of the present embodiment is significantly improved;

please refer to the Fo curve comparison chart shown in fig. 5, wherein the impedance curve C is an objective test value of the conventional speaker module, and the impedance curve D is an objective test value of the speaker module after the rear sound cavity 12 is enlarged in the present embodiment; from the test results, the Fo value of the speaker module of this embodiment is significantly reduced.

To facilitate processing, the housing 10 may specifically include an upper shell 15 and a lower shell 16 that are assembled to form an internal cavity. Wherein, a step groove 17 is arranged in the lower shell 16, the speaker unit 20 is arranged on the step surface of the step groove 17, and the sound outlet surface of the speaker unit 20 faces the step groove 17, so that the sound outlet surface of the speaker and the step groove 17 form a sealed front sound cavity 11. The sound outlet hole 13 is formed in the side wall of the step groove 17 to form a side sound outlet mode; in other embodiments, the sound outlet 13 may also be opened on the bottom wall of the step groove 17 to form a positive sound outlet mode.

In addition, the sound cavity module further comprises a flexible circuit board 40 arranged in the inner cavity; one end of the flexible circuit board 40 is electrically connected to the speaker unit 20, and the other end thereof extends out of the internal cavity to be electrically connected to a power supply.

It is understood that, in the embodiment of the present invention, the communication hole 14 may be specifically opened in the upper case 15 and/or the lower case 16. Accordingly, the porous damping net 30 is attached to the outer wall of the corresponding upper case 15/lower case 16 to reduce the difficulty of operation.

Referring to fig. 1 and 2, the method for assembling the speaker module of the present embodiment includes: firstly, the loudspeaker unit 20 is arranged at the corresponding position of the lower shell 16, and then dispensing and sealing are carried out; then, the flexible circuit board 40 is attached and hot-pressed and welded, so that the flexible circuit board 40 and the bonding pad of the speaker unit 20 are welded together; then covering the upper shell 15, and carrying out ultrasonic welding; and finally, attaching the porous damping net 30 to the corresponding position of the communication hole 14 on the outer surface of the shell 10 to finish the assembling process.

Compared with the conventional assembly method, the assembly method of the embodiment only adds a step of sticking the porous damping net 30 at the end. Therefore, the present embodiment also has the advantages of convenient assembly and low cost.

Based on this, the embodiment further provides an electronic device including the speaker module as described above. Specifically, the electronic device in this embodiment may include, but is not limited to, a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), a Point of Sales (POS), a vehicle-mounted computer, and the like.

It is understood that the electronic device of the present embodiment may include other components and structures besides the speaker module, and is not limited in particular.

Owing to adopted above-mentioned speaker module, the intercommunicating pore 14 on the electronic equipment accessible casing 10 of this embodiment makes the complete machine inner space intercommunication in back sound chamber 12 and electronic equipment to regard the complete machine inner space as the extension part in back sound chamber 12, the very big degree increased the volume in back sound chamber 12, finally make the Fo of module lower, the SPL loudness is higher, has promoted the audio greatly.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A speaker module, comprising: a housing and a speaker unit;

the loudspeaker unit (20) is arranged in an inner cavity of the shell (10) and divides the inner cavity into a front sound cavity (11) and a rear sound cavity (12) which are isolated from each other; a sound outlet hole (13) is formed in the corresponding area of the front sound cavity (11) on the shell (10), and the sound outlet hole (13) is communicated with the front sound cavity (11); the shell (10) is provided with a preset number of communicating holes (14) which are distributed according to a preset mode in a corresponding area of the rear sound cavity (12), and the communicating holes (14) are communicated with the rear sound cavity (12).

2. The speaker module as claimed in claim 1, wherein a porous damping mesh (30) is disposed on the housing (10) in the opening region of the communication hole (14), and the aperture of the through hole of the porous damping mesh (30) is smaller than the aperture of the communication hole (14).

3. A loudspeaker module according to claim 2, wherein the porous damping mesh (30) is attached to an outer wall of the housing (10).

4. A loudspeaker module according to claim 2, wherein the communication holes (14) in the housing (10) are arranged in a rectangular array.

5. A loudspeaker module according to claim 1, wherein the number of communication holes (14) is 20-150.

6. A loudspeaker module according to claim 5, wherein the number of the communication holes (14) is 56, the diameter of the communication holes (14) is 0.5mm, and the mesh number of the through holes of the porous damping mesh (30) is 2000.

7. A loudspeaker module according to claim 1, wherein the housing (10) comprises an upper shell (15) and a lower shell (16) which are fittingly connected to form the internal cavity; a step groove (17) is formed in the lower shell (16), the loudspeaker unit (20) is installed on the step surface of the step groove (17), and the sound outlet surface of the loudspeaker unit (20) faces the step groove (17), so that the sound outlet surface of the loudspeaker and the step groove (17) form a sealed front sound cavity (11).

8. The speaker module as claimed in claim 6, wherein the sound outlet hole (13) is opened in a side wall or a bottom wall of the stepped groove (17).

9. The speaker module as recited in claim 1, further comprising a flexible circuit board (40) disposed within the interior cavity; one end of the flexible circuit board (40) is electrically connected with the loudspeaker unit (20), and the other end of the flexible circuit board extends out of the inner cavity and is electrically connected with a power supply.

10. An electronic device comprising a speaker module according to any one of claims 1 to 9.