WO2002052615A3 - Composant a semi-conducteur emettant un rayonnement et pourvu d'un element de conversion de luminescence - Google Patents

Composant a semi-conducteur emettant un rayonnement et pourvu d'un element de conversion de luminescence Download PDF

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Publication number
WO2002052615A3
WO2002052615A3 PCT/DE2001/004880 DE0104880W WO02052615A3 WO 2002052615 A3 WO2002052615 A3 WO 2002052615A3 DE 0104880 W DE0104880 W DE 0104880W WO 02052615 A3 WO02052615 A3 WO 02052615A3
Authority
WO
WIPO (PCT)
Prior art keywords
conversion element
luminescence conversion
radiation
semiconductor component
emitting semiconductor
Prior art date
Application number
PCT/DE2001/004880
Other languages
German (de)
English (en)
Other versions
WO2002052615A2 (fr
Inventor
Bert Braune
Stefan Gruber
Guenter Waitl
Ulrich Zehnder
Original Assignee
Osram Opto Semiconductors Gmbh
Bert Braune
Stefan Gruber
Guenter Waitl
Ulrich Zehnder
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Bert Braune, Stefan Gruber, Guenter Waitl, Ulrich Zehnder filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2002052615A2 publication Critical patent/WO2002052615A2/fr
Publication of WO2002052615A3 publication Critical patent/WO2002052615A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

L'invention concerne un composant à semi-conducteur émettant un rayonnement et pourvu d'un élément de conversion de luminescence (8). Selon l'invention, un corps semi-conducteur est suivi d'un réflecteur (7) enduit d'un élément de conversion de luminescence (8) ou contenant un élément de conversion de luminescence (8). L'élément de conversion de luminescence (8) transforme une partie du rayonnement (6) généré par le corps semi-conducteur (3) en fonctionnement dans une première gamme d'ondes en rayonnement (9) dans une deuxième gamme d'ondes. Le corps semi-conducteur (3) et l'élément de conversion de luminescence (8) sont de préférence accordés l'un à l'autre de sorte qu'une lumière blanche à teintes mixtes est émise.
PCT/DE2001/004880 2000-12-27 2001-12-21 Composant a semi-conducteur emettant un rayonnement et pourvu d'un element de conversion de luminescence WO2002052615A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2000165381 DE10065381B4 (de) 2000-12-27 2000-12-27 Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE10065381.2 2000-12-27

Publications (2)

Publication Number Publication Date
WO2002052615A2 WO2002052615A2 (fr) 2002-07-04
WO2002052615A3 true WO2002052615A3 (fr) 2002-12-19

Family

ID=7669239

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/004880 WO2002052615A2 (fr) 2000-12-27 2001-12-21 Composant a semi-conducteur emettant un rayonnement et pourvu d'un element de conversion de luminescence

Country Status (2)

Country Link
DE (1) DE10065381B4 (fr)
WO (1) WO2002052615A2 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047748A (ja) 2002-07-12 2004-02-12 Stanley Electric Co Ltd 発光ダイオード
JP2004128273A (ja) * 2002-10-03 2004-04-22 Sharp Corp 発光素子
US7806541B2 (en) 2004-08-06 2010-10-05 Koninklijke Philips Electronics N.V. High performance LED lamp system
US7256057B2 (en) * 2004-09-11 2007-08-14 3M Innovative Properties Company Methods for producing phosphor based light sources
DE102004045950A1 (de) * 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102004047640A1 (de) 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement
JP4264109B2 (ja) * 2007-01-16 2009-05-13 株式会社東芝 発光装置
DE102007059548A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Auskoppellinse für ein optoelektronisches Bauelement
KR101488448B1 (ko) * 2007-12-06 2015-02-02 서울반도체 주식회사 Ｌｅｄ 패키지 및 그 제조방법
DE102010054591B4 (de) * 2010-12-15 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse und Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Bauelement
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
US9062198B2 (en) 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US8480254B2 (en) 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US9187621B2 (en) 2011-12-30 2015-11-17 Ticona Llc Reflector for light-emitting devices
DE102012109650A1 (de) 2012-10-10 2014-04-10 Osram Opto Semiconductors Gmbh Keramisches Konversionselement, optoelektronisches Halbleiterelement und Verfahren zur Herstellung eines keramischen Konversionselements
CN104903399B (zh) 2012-12-18 2017-05-31 提克纳有限责任公司 用于发光二极管组件的模制反射器
DE102017111426A1 (de) 2017-05-24 2018-11-29 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements
DE102018204163A1 (de) 2018-03-19 2019-09-19 Osram Opto Semiconductors Gmbh Konversionselement für LED-Anwendungen mit hoher Leistung und hoher Farbwiedergabe
CN109786517B (zh) 2019-01-25 2020-05-15 京东方科技集团股份有限公司 发光结构、发光二极管及其制备方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344774A1 (de) * 1972-09-05 1974-04-04 Matsushita Electronics Corp Festkoerper-anzeigevorrichtung
JPH07176794A (ja) * 1993-12-17 1995-07-14 Nichia Chem Ind Ltd 面状光源
DE29804149U1 (de) * 1998-03-09 1998-06-18 Chen Hsing Leuchtdiode (LED) mit verbesserter Struktur
WO1998054930A2 (fr) * 1997-05-27 1998-12-03 Koninklijke Philips Electronics N.V. Dispositif a del uv/bleu-phosphore a rendement lumineux accru
JPH1168166A (ja) * 1997-08-19 1999-03-09 Sanken Electric Co Ltd 発光ダイオード装置
JP2000022220A (ja) * 1998-07-03 2000-01-21 Stanley Electric Co Ltd 反射型ｌｅｄランプ
JP2000082849A (ja) * 1999-09-27 2000-03-21 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
WO2000019546A1 (fr) * 1998-09-28 2000-04-06 Koninklijke Philips Electronics N.V. Systeme d'eclairage
JP2000347601A (ja) * 1999-06-02 2000-12-15 Toshiba Electronic Engineering Corp 発光装置
WO2001059851A1 (fr) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Source lumineuse

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2267801B1 (fr) * 1996-06-26 2015-05-27 OSRAM Opto Semiconductors GmbH Puce à semi-conducteur luminescente et composant à semi-conducteur luminescent

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344774A1 (de) * 1972-09-05 1974-04-04 Matsushita Electronics Corp Festkoerper-anzeigevorrichtung
JPH07176794A (ja) * 1993-12-17 1995-07-14 Nichia Chem Ind Ltd 面状光源
WO1998054930A2 (fr) * 1997-05-27 1998-12-03 Koninklijke Philips Electronics N.V. Dispositif a del uv/bleu-phosphore a rendement lumineux accru
JPH1168166A (ja) * 1997-08-19 1999-03-09 Sanken Electric Co Ltd 発光ダイオード装置
DE29804149U1 (de) * 1998-03-09 1998-06-18 Chen Hsing Leuchtdiode (LED) mit verbesserter Struktur
JP2000022220A (ja) * 1998-07-03 2000-01-21 Stanley Electric Co Ltd 反射型ｌｅｄランプ
WO2000019546A1 (fr) * 1998-09-28 2000-04-06 Koninklijke Philips Electronics N.V. Systeme d'eclairage
JP2000347601A (ja) * 1999-06-02 2000-12-15 Toshiba Electronic Engineering Corp 発光装置
JP2000082849A (ja) * 1999-09-27 2000-03-21 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
WO2001059851A1 (fr) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Source lumineuse
EP1187228A1 (fr) * 2000-02-09 2002-03-13 Nippon Leiz Corporation Source lumineuse

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Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 10 30 November 1995 (1995-11-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 15 6 April 2001 (2001-04-06) *

Also Published As

Publication number Publication date
DE10065381A1 (de) 2002-07-11
WO2002052615A2 (fr) 2002-07-04
DE10065381B4 (de) 2010-08-26

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