WO2002052615A3 - Radiation-emitting semiconductor component with a luminescence conversion element - Google Patents
Radiation-emitting semiconductor component with a luminescence conversion element Download PDFInfo
- Publication number
- WO2002052615A3 WO2002052615A3 PCT/DE2001/004880 DE0104880W WO02052615A3 WO 2002052615 A3 WO2002052615 A3 WO 2002052615A3 DE 0104880 W DE0104880 W DE 0104880W WO 02052615 A3 WO02052615 A3 WO 02052615A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conversion element
- luminescence conversion
- radiation
- semiconductor component
- emitting semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Abstract
The invention relates to a radiation-emitting semiconductor component with a luminescence conversion element (8). A reflector (7) is connected downstream of a semiconductor body (3), this reflector being coated with a luminescence conversion element (8) or containing a luminescence conversion element (8). Said luminescence conversion element (8) converts part of the radiation (6) that is emitted by the semiconductor body during operation in a first wavelength range into radiation (9) in a second wavelength range. The semiconductor body (3) and the luminescence conversion element (8) are preferably tuned to each other in such a way that mixed-colour white light is emitted.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2000165381 DE10065381B4 (en) | 2000-12-27 | 2000-12-27 | Radiation-emitting semiconductor component with luminescence conversion element |
DE10065381.2 | 2000-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002052615A2 WO2002052615A2 (en) | 2002-07-04 |
WO2002052615A3 true WO2002052615A3 (en) | 2002-12-19 |
Family
ID=7669239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/004880 WO2002052615A2 (en) | 2000-12-27 | 2001-12-21 | Radiation-emitting semiconductor component with a luminescence conversion element |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10065381B4 (en) |
WO (1) | WO2002052615A2 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004047748A (en) | 2002-07-12 | 2004-02-12 | Stanley Electric Co Ltd | Light-emitting diode |
JP2004128273A (en) * | 2002-10-03 | 2004-04-22 | Sharp Corp | Light emitting element |
DE602005004297T2 (en) | 2004-08-06 | 2008-12-24 | Philips Intellectual Property & Standards Gmbh | HIGH PERFORMANCE LED LAMP SYSTEM |
US7256057B2 (en) | 2004-09-11 | 2007-08-14 | 3M Innovative Properties Company | Methods for producing phosphor based light sources |
DE102004045950A1 (en) | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for producing an optoelectronic component |
DE102004047640A1 (en) * | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelectronic component and housing for an optoelectronic component |
JP4264109B2 (en) * | 2007-01-16 | 2009-05-13 | 株式会社東芝 | Light emitting device |
DE102007059548A1 (en) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelectronic component and coupling-out lens for an optoelectronic component |
KR101488448B1 (en) | 2007-12-06 | 2015-02-02 | 서울반도체 주식회사 | Led package and method for fabricating the same |
DE102010054591B4 (en) * | 2010-12-15 | 2023-03-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Housing and method for producing a housing for an optoelectronic component |
US9062198B2 (en) | 2011-04-14 | 2015-06-23 | Ticona Llc | Reflectors for light-emitting diode assemblies containing a white pigment |
US9284448B2 (en) | 2011-04-14 | 2016-03-15 | Ticona Llc | Molded reflectors for light-emitting diode assemblies |
US9453119B2 (en) | 2011-04-14 | 2016-09-27 | Ticona Llc | Polymer composition for producing articles with light reflective properties |
US8480254B2 (en) * | 2011-04-14 | 2013-07-09 | Ticona, Llc | Molded reflective structures for light-emitting diodes |
JP5923183B2 (en) | 2011-12-30 | 2016-05-24 | ティコナ・エルエルシー | Reflector for light emitting device |
DE102012109650A1 (en) | 2012-10-10 | 2014-04-10 | Osram Opto Semiconductors Gmbh | Ceramic conversion element, optoelectronic semiconductor element and method for producing a ceramic conversion element |
WO2014099745A1 (en) | 2012-12-18 | 2014-06-26 | Ticona Llc | Molded reflectors for light-emitting diode assemblies |
DE102017111426A1 (en) | 2017-05-24 | 2018-11-29 | Osram Opto Semiconductors Gmbh | Radiation-emitting component and method for producing a radiation-emitting component |
DE102018204163A1 (en) | 2018-03-19 | 2019-09-19 | Osram Opto Semiconductors Gmbh | Conversion element for LED applications with high performance and high color rendering |
CN109786517B (en) * | 2019-01-25 | 2020-05-15 | 京东方科技集团股份有限公司 | Light-emitting structure, light-emitting diode and preparation method thereof |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2344774A1 (en) * | 1972-09-05 | 1974-04-04 | Matsushita Electronics Corp | SOLID DISPLAY DEVICE |
JPH07176794A (en) * | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | Planar light source |
DE29804149U1 (en) * | 1998-03-09 | 1998-06-18 | Chen Hsing | Light emitting diode (LED) with an improved structure |
WO1998054930A2 (en) * | 1997-05-27 | 1998-12-03 | Koninklijke Philips Electronics N.V. | Uv/blue led-phosphor device with enhanced light output |
JPH1168166A (en) * | 1997-08-19 | 1999-03-09 | Sanken Electric Co Ltd | Light-emitting diode |
JP2000022220A (en) * | 1998-07-03 | 2000-01-21 | Stanley Electric Co Ltd | Reflective led lamp |
JP2000082849A (en) * | 1999-09-27 | 2000-03-21 | Toshiba Corp | Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof |
WO2000019546A1 (en) * | 1998-09-28 | 2000-04-06 | Koninklijke Philips Electronics N.V. | Lighting system |
JP2000347601A (en) * | 1999-06-02 | 2000-12-15 | Toshiba Electronic Engineering Corp | Light emitting device |
WO2001059851A1 (en) * | 2000-02-09 | 2001-08-16 | Nippon Leiz Corporation | Light source |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1439586B1 (en) * | 1996-06-26 | 2014-03-12 | OSRAM Opto Semiconductors GmbH | Light-emitting semiconductor component with luminescence conversion element |
-
2000
- 2000-12-27 DE DE2000165381 patent/DE10065381B4/en not_active Expired - Fee Related
-
2001
- 2001-12-21 WO PCT/DE2001/004880 patent/WO2002052615A2/en active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2344774A1 (en) * | 1972-09-05 | 1974-04-04 | Matsushita Electronics Corp | SOLID DISPLAY DEVICE |
JPH07176794A (en) * | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | Planar light source |
WO1998054930A2 (en) * | 1997-05-27 | 1998-12-03 | Koninklijke Philips Electronics N.V. | Uv/blue led-phosphor device with enhanced light output |
JPH1168166A (en) * | 1997-08-19 | 1999-03-09 | Sanken Electric Co Ltd | Light-emitting diode |
DE29804149U1 (en) * | 1998-03-09 | 1998-06-18 | Chen Hsing | Light emitting diode (LED) with an improved structure |
JP2000022220A (en) * | 1998-07-03 | 2000-01-21 | Stanley Electric Co Ltd | Reflective led lamp |
WO2000019546A1 (en) * | 1998-09-28 | 2000-04-06 | Koninklijke Philips Electronics N.V. | Lighting system |
JP2000347601A (en) * | 1999-06-02 | 2000-12-15 | Toshiba Electronic Engineering Corp | Light emitting device |
JP2000082849A (en) * | 1999-09-27 | 2000-03-21 | Toshiba Corp | Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof |
WO2001059851A1 (en) * | 2000-02-09 | 2001-08-16 | Nippon Leiz Corporation | Light source |
EP1187228A1 (en) * | 2000-02-09 | 2002-03-13 | Nippon Leiz Corporation | Light source |
Non-Patent Citations (5)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 10 30 November 1995 (1995-11-30) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 15 6 April 2001 (2001-04-06) * |
Also Published As
Publication number | Publication date |
---|---|
WO2002052615A2 (en) | 2002-07-04 |
DE10065381B4 (en) | 2010-08-26 |
DE10065381A1 (en) | 2002-07-11 |
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