WO2002052591A2 - Electric multilayer component and arrangement with this component - Google Patents
Electric multilayer component and arrangement with this component Download PDFInfo
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- WO2002052591A2 WO2002052591A2 PCT/DE2001/004818 DE0104818W WO02052591A2 WO 2002052591 A2 WO2002052591 A2 WO 2002052591A2 DE 0104818 W DE0104818 W DE 0104818W WO 02052591 A2 WO02052591 A2 WO 02052591A2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
Definitions
- the invention relates to an electrical multilayer component with at least two mutually different capacitors connected in parallel, each having at least two overlapping electrode layers with a dielectric layer arranged between them, in which the capacitors are spaced apart from one another in such a way that the component defines different capacitors Has resonance frequencies.
- the invention further relates to an arrangement with the component.
- multilayer components of the type mentioned are known, in which the electrode layers are designed in a U-shape.
- the electrode layers are alternately aligned opposite one another and arranged one above the other in a multi-layer stack. Legs of the U-shaped electrodes lying one above the other form the partial capacitances of a first, larger capacitance or the partial capacitances of a second, smaller capacitance.
- Such multilayer components are used as double resonance capacitors in dual-band mobile telephones to dampen the carrier frequencies of 900 MHz and 1.8 GHz that are coupled in via a data line.
- the known component Since, according to the structure described in the above-mentioned document, a dielectric layer, by means of which the electrode layers are separated from one another, belongs to different capacitances and these are thus coupled to one another, the known component has the disadvantage that for spatial separation and thus for realizing two different ones Capacities a large distance between the legs of the ⁇ ⁇ ! CD N p. tr ⁇ s ⁇
- Component for example the circuit board on which the component can be soldered or solder joints etc. determined.
- the multilayer component according to the invention has the advantage that the different capacitances no longer have a common dielectric layer. This is achieved by stacking the individual capacities on top of one another. The required spatial spacing of the capacitors can easily be achieved by a simple measure, namely by inserting an appropriately dimensioned intermediate layer. Because of the different levels in which the capacitances are arranged, a relatively small distance is sufficient to decouple the capacitances, as a result of which the volume of the multilayer component is reduced.
- ceramic materials for capacitor applications for example the ceramics known under the names "COG”, "X7R” etc., can be used for the component. But varistor materials are also possible.
- different ceramic materials can be used for different dielectric layers.
- Joint sintering also known to the person skilled in the art under the term “cofiring”, or by gluing the layers together.
- CD PJ tr d s d ⁇ 3 PJ ⁇ d ffi 3 D tr 3 Hi ⁇ P d d ⁇ P- CQ N
- levels of the electrode layers can be realized by superimposing several ceramic green foils.
- a component is particularly advantageous in which the outer contour of at least one electrode layer has at least one lateral incision.
- Such a component makes it possible to increase the inductance within the component.
- the inductance increases with the number of cuts if these are made alternately from opposite sides from the edge into the interior of the electrode layer and thus form a meandering structure of the electrode layer.
- An increased inductance of the component has the advantage that the LC constants that are important for the resonance frequencies of the component no longer depend so strongly on the external conditions, for example on the shape of the leads of the component on a printed circuit board.
- the electrical property of the component can be largely determined by the design and is only slightly influenced by the external factors, such as supply lines, etc.
- Electrode layers a further degree of freedom for the freely selectable design of the desired capacity.
- a marking which is suitable for distinguishing the top side of the layer stack from its underside can be attached to the outside of the component in a particularly advantageous manner.
- a marking has the advantage that it allows the component according to the invention to be attached to a printed circuit board in a very specific orientation.
- an orientation is preferably chosen in which the smaller of the capacitances is closer to the printed circuit board than the larger of the capacitances, since it is shown co rt CD Di in O ⁇ ⁇ rt P- CD CD D. O tr $, ö LQ r 1 D. tr 1 ⁇ ⁇ rt rt tr «rt 3 ⁇ er D. er
- CD 0 P- t ⁇ P- 3 ⁇ rt rt P- P 3 d P rt
- a component can be provided in which all dielectric layers consist of a varistor ceramic.
- dielectric layers that are produced from ZnO-Bi2 ⁇ 3-Sb2 ⁇ 3 come into consideration here.
- Such a varistor ceramic also has excellent properties with regard to its suitability as a dielectric layer for capacitors in certain applications.
- the component according to the invention can be produced particularly advantageously by sintering a stack of ceramic green foils lying one above the other.
- Such a production has the advantage that thin layers are connected to a monolithic component in a single sintering process. Due to the thin ceramic layers, a high capacitance can be achieved with a small footprint of the component.
- FIG. 1 shows an example of a component according to the invention in a schematic cross section.
- FIG. 2 shows the insertion loss of the component from FIG.
- FIG. 3 shows an example of another component according to the invention with varistor ceramic in schematic
- FIG. 4 shows the insertion loss of the component shown in FIG. 3 measured as a function of the frequency. to to P 1 P 1 o in o in O in
- the dimensions of the component shown in FIG. 3 are 1.44 mm in length, 0.72 mm in width and 0.85 mm in height.
- the thickness D of the intermediate layer 4 is 350 ⁇ m.
- the total capacitance C_ + C2 is 60.8 pF, measured at approx. 1 kHz.
- the resonance frequencies f] _ and f2 shown in FIG. 4 result, which can be read according to FIG. 2 from the curve S21 (f).
- the lower resonance frequency f ⁇ is 805 MHz, while the higher resonance frequency f2 is 1.76 MHz.
- FIGS. 5A, 5B and 5C show electrode layers 1 in different designs as can be used to increase the inductance of the component according to the invention.
- the electrode layers 1 according to FIGS. 5A and 5C have at least partially the shape of a meander with respect to their outer contour, which results from a plurality of lateral incisions 9.
- the electrode layer 1 according to FIG. 5B does not have the shape of a meander, but rather only has a lateral incision 9. It is crucial in all of the exemplary embodiments of the electrode layers 1 shown in FIG. 5A, FIG. 5B and FIG.
- FIG. 6 shows a multilayer component according to the invention with reference numerals that correspond to FIG. 1, which according to the invention
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention relates to an electric multilayer component comprising at least two capacitors (C1, C2), which differ from one another, are connected in parallel, and which each have at least two overlapping electrode layers (1) with a dielectric layer (2) arranged therebetween. According to the invention, the capacitors (C1, C2) are stacked to form a layer stack (3) and are separated from one another by at least one intermediate layer (4) as to provide the component with different resonance frequencies (f1, f2) that are defined by the capacitors (C1, C2) The invention also relates to the arrangement of an inventive component on a printed circuit board (6). A double resonance capacitor having a very small volume can be realized by stacking different capacitors (C1, C2) and separating the capacitors (C1, C2) from one another by an appropriate intermediate layer (4).
Description
Beschreibungdescription
ELEKTRISCHES VIELSCHICHTBAUELEMENT UND ANORDNUNG MIT DEM BAUELEMENTELECTRICAL MULTI-LAYER COMPONENT AND ARRANGEMENT WITH THE COMPONENT
Elektrisches Vielschichtbauelement und Anordnung mit dem BauelementElectrical multilayer component and arrangement with the component
Die Erfindung betrifft ein elektrisches Vielschichtbauelement mit wenigstens zwei voneinander verschiedenen, parallel geschalteten Kapazitäten, die jeweils wenigstens zwei einander überlappende Elektrodenschichten mit einer dazwischen ange- ordneten Dielektrikumschicht aufweisen, bei dem die Kapazitäten so voneinander beabstandet sind, daß das Bauelement unterschiedliche, durch die Kapazitäten definierte Resonanzfrequenzen aufweist. Ferner betrifft die Erfindung eine Anordnung mit dem Bauelement .The invention relates to an electrical multilayer component with at least two mutually different capacitors connected in parallel, each having at least two overlapping electrode layers with a dielectric layer arranged between them, in which the capacitors are spaced apart from one another in such a way that the component defines different capacitors Has resonance frequencies. The invention further relates to an arrangement with the component.
Aus der Druckschrift WO 98/50927 sind Vielschichtbauelemente der eingangs genannten Art bekannt, bei denen die Elektrodenschichten in U-Form ausgeführt sind. Dabei sind die Elektrodenschichten abwechselnd entgegengesetzt zueinander ausge- richtet und übereinander in einem Vielschichtstapel angeordnet. Jeweils übereinanderliegende Schenkel der U-förmigen Elektroden bilden die Teilkapazitäten einer ersten, größeren Kapazität beziehungsweise die Teilkapazitäten einer zweiten, kleineren Kapazität.From the publication WO 98/50927 multilayer components of the type mentioned are known, in which the electrode layers are designed in a U-shape. The electrode layers are alternately aligned opposite one another and arranged one above the other in a multi-layer stack. Legs of the U-shaped electrodes lying one above the other form the partial capacitances of a first, larger capacitance or the partial capacitances of a second, smaller capacitance.
Solche Vielschichtbauelemente werden als Doppelresonanzkondensatoren in Dual -Band-Mobiltelefonen verwendet zur Dämpfung der über eine Datenleitung eingekoppelten Trägerfrequenzen von 900 MHz und 1,8 GHz.Such multilayer components are used as double resonance capacitors in dual-band mobile telephones to dampen the carrier frequencies of 900 MHz and 1.8 GHz that are coupled in via a data line.
Da gemäß dem in der oben genannten Druckschrift beschriebenen Aufbau jeweils eine Dielektrikumschicht, durch die die Elektrodenschichten voneinander getrennt sind, zu verschiedenen Kapazitäten gehört und diese somit miteinander gekoppelt sind, hat das bekannte Bauelement den Nachteil, daß zur räumlichen Trennung und damit zur Realisierung zweier verschiedener Kapazitäten ein großer Abstand zwischen den Schenkeln der
α <! CD N p. tr < s αSince, according to the structure described in the above-mentioned document, a dielectric layer, by means of which the electrode layers are separated from one another, belongs to different capacitances and these are thus coupled to one another, the known component has the disadvantage that for spatial separation and thus for realizing two different ones Capacities a large distance between the legs of the α <! CD N p. tr <s α
P- 0 Ω P- PJ= Φ O J φ 3 tr φ rt P- P1 Ω ω Φ P- Φ d tr 0= φ P- Ω 3 Di 3 rt PP- 0 Ω P- PJ = Φ OJ φ 3 tr φ rt P- P 1 Ω ω Φ P- Φ d tr 0 = φ P- Ω 3 Di 3 rt P
CD 3 tr φ φ Φ 3 J rt Φ d p. 3 P- P-CD 3 tr φ φ Φ 3 J rt Φ d p. 3 P- P-
I 3 tr p. 3 P1 CQI 3 tr p. 3 P 1 CQ
P- D PJ Φ < tr ~ Φ φ Φ d <! H Φ Φ 3 p> Φ 0 ≤ P, 3 D.P- D PJ Φ <tr ~ Φ φ Φ d <! H Φ Φ 3 p> Φ 0 ≤ P, 3 D.
P ' p. fr $. 0= PJ CdP 'p. for $. 0 = PJ Cd
≤ Φ φ 3 φ rt E ) ≤ Φ φ 3 φ rt E )
P- 3 3 P- CD 3 P- Φ p. rt φ φ Ω D CQ ?TP- 3 3 P- CD 3 P- Φ p. rt φ φ Ω D CQ? T
D. 3 CQ tr d rt J rtD. 3 CQ tr d rt J rt
O rt Φ rt 3 - co p. φ Ό 3 • CQ OLocation 3 - co p. φ Ό 3 • CQ O
Ό tr D. d trΌ tr D. d tr
Φ φ Φ D P- Φ ΦΦ φ Φ D P- Φ Φ
P- p. 3 Φ 3 ? 3P- p. 3 Φ 3? 3
3 rt φ p. PJ3 rt φ p. PJ
D Φ P- Cd co 3 3 d 3 rt < 0 3 OD Φ P- Cd co 3 3 d 3 rt <0 3 O
3 N P- rt rt3 N P rt rt
CQ ^ d P- φ Ω Φ ≤ O J CD 3 tr ΦCQ ^ d P- φ Ω Φ ≤ O J CD 3 tr Φ
CQ •0 rt D o Φ < 3 φ J Φ d Ω CQ P- αCQ • 0 rt D o Φ <3 φ J Φ d Ω CQ P- α
3 IM 3 tr φ p- t3 IM 3 tr φ p- t
P>= P- I—1 CQ P- CQ CQ 7Ö rt φ Ω P. CDP> = P- I - 1 CQ P- CQ CQ 7Ö rt φ Ω P. CD
PJ= 3 P- tr 0 Ω P-PJ = 3 P- tr 0 Ω P-
D. rt -» o rt tΛ tr co d Φ rt tr φ P- rt ii 3 tr J CD Ω •D. rt - »o rt tΛ tr co d Φ rt tr φ P- rt ii 3 tr J CD Ω •
Ω φ Φ d tr tr <! P- CD Φ < rt OΩ φ Φ d tr tr <! P-CD Φ <rt O
Φ o r JΦ o r J
Φ D. Di Φ P1 J p.Φ D. Di Φ P 1 J p.
P- ^ Φ PJ 3 d d PJP- ^ Φ PJ 3 d d PJ
3 P- 3 tr φ 3 Φ d3 P- 3 tr φ 3 Φ d
3 Φ 3 Φ CD3 Φ 3 Φ CD
Φ CQ D. p. rt 3 ΦΦ CQ D. p. rt 3 Φ
Φ Φ - Φ 3 P. φ p. p> P- Φ φ rt Φ P- CD 3 ω rt > P- 3 rt rt d p. P- tr 3Φ Φ - Φ 3 P. φ p. p> P- Φ φ rt Φ P- CD 3 ω rt> P- 3 rt rt d p. P- tr 3
P- co co S P- Φ rtP- co co S P- Φ rt
CD rt rt < 0 3 P- P-CD rt rt <0 3 P- P-
Ω . ) P- tr CD 3 Φ tr 3 φ P- tr p.Ω. ) P- tr CD 3 Φ tr 3 φ P- tr p.
Φ φ CQ rt co CQ pΦ φ CQ rt co CQ p
D d 0 OD d 0 O
< Φ 3 3 Λ Φ<Φ 3 3 Λ Φ
P- p. ?r D. Φ p. φ Q φ CDP- p. ? r D. Φ p. φ Q φ CD
Bauelements, beispielsweise die Platine, auf die das Bauelement aufgelötet werden kann oder auch Lötstellen etc. bestimmt .Component, for example the circuit board on which the component can be soldered or solder joints etc. determined.
Das erfindungsgemäße Vielschichtbauelement hat den Vorteil, daß die verschiedenen Kapazitäten keine gemeinsame Dielektrikumschicht mehr aufweisen. Dies gelingt durch das Ubereinanderstapeln der einzelnen Kapazitäten. Der erforderliche räumliche Abstand der Kapazitäten kann durch eine einfache Maß- nähme, nämlich durch Einlegen einer entsprechend dimensionierten Zwischenschicht leicht realisiert werden. Wegen der unterschiedlichen Ebenen, in denen die Kapazitäten angeordnet sind, genügt ein relativ kleiner Abstand zur Entkopplung der Kapazitäten, wodurch das Volumen des Vielschichtbauelements verringert wird.The multilayer component according to the invention has the advantage that the different capacitances no longer have a common dielectric layer. This is achieved by stacking the individual capacities on top of one another. The required spatial spacing of the capacitors can easily be achieved by a simple measure, namely by inserting an appropriately dimensioned intermediate layer. Because of the different levels in which the capacitances are arranged, a relatively small distance is sufficient to decouple the capacitances, as a result of which the volume of the multilayer component is reduced.
Für die Verwendung als Dielektrikumschicht in dem erfindungs- gemäßen Bauelement kommt eine Vielzahl verschiedener Keramikmaterialien in Betracht. Es können insbesondere Keramikmate- rialien für Kondensatoranwendungen, beispielsweise die unter den Namen "COG", "X7R" usw. bekannten Keramiken für das Bauelement verwendet werden. Es kommen aber auch Varistormaterialien in Betracht.A large number of different ceramic materials come into consideration for use as a dielectric layer in the component according to the invention. In particular, ceramic materials for capacitor applications, for example the ceramics known under the names "COG", "X7R" etc., can be used for the component. But varistor materials are also possible.
Es können je nach beabsichtigter Applikation des Bauelements verschiedene Keramikmaterialien für verschiedene Dielektrikumschichten verwendet werden.Depending on the intended application of the component, different ceramic materials can be used for different dielectric layers.
Bei der Verwendung verschiedener Materialien für die Dielek- trikumschichten kommt die Herstellung des Bauelements durchWhen using different materials for the dielectric layers, the production of the component comes through
Gemeinsamsinterung, dem Fachmann auch bekannt unter dem Begriff "cofiring", oder durch Übereinanderkleben der Schichten in Betracht .Joint sintering, also known to the person skilled in the art under the term "cofiring", or by gluing the layers together.
Die Verwendung der verschiedenen bekannten Kondensatormaterialien ermöglicht durch ein entsprechendes Design die Ein-
The use of the various known capacitor materials enables the inputs to be
N co D. CD Φ P- CD α o co D. Cd CQ X φ CD 3 d σ D CD co D. < Hl 3 D. Cd Cd CQN co D. CD Φ P- CD α o co D. Cd CQ X φ CD 3 d σ D CD co D. <Hl 3 D. Cd Cd CQ
Ω s: Ω d 0 P- 3 Ω SD P- Ω d φ Φ 0 P- rt Φ 3 Φ 0 Φ PJ= Ω d φ fr P- P- Φ Φ rt tr P- tr P 1— ' 3 tr P 3 tr 3 CD 3 3 3 Φ P D. CD 3 3 3 tr P P P Φ P- P ΦΩ s: Ω d 0 P- 3 Ω SD P- Ω d φ Φ 0 P- rt Φ 3 Φ 0 Φ PJ = Ω d φ for P- P- Φ Φ rt tr P- tr P 1— '3 tr P 3 tr 3 CD 3 3 3 Φ P D. CD 3 3 3 tr PPP Φ P- P Φ
P- CD P- Ω Ω Φ ^ P- J Di P- CQ 0 Hl Hi ≤ rt rt Φ Ω N 3 ΦP- CD P- Ω Ω Φ ^ P- J Di P- CQ 0 Hl Hi ≤ rt rt Φ Ω N 3 Φ
Ω Ω Ω tr tr P 0 Ω d Ω 3 ■£. Φ J 0 Φ P d tr P- N J ö CQ P- pj tr tr tr Hi Φ P tr CQ tr 3 P- X Ω rt α P- P- 0 PJ P- Ω s: rt P- Φ Ω d rt Φ rt d= Φ 3 rt et P- φ P rt tr Φ Φ rt 3 Ω Q co tr P- Φ φ Φ tr dΩ Ω Ω tr tr P 0 Ω d Ω 3 ■ £. Φ J 0 Φ P d tr P- NJ ö CQ P- p j tr tr tr Hi Φ P tr CQ tr 3 P- X Ω rt α P- P- 0 PJ P- Ω s: rt P- Φ Ω d rt Φ rt d = Φ 3 rt et P- φ P rt tr Φ Φ rt 3 Ω Q co tr P- Φ φ Φ tr d
D. 3 1 tα P- Φ P Φ rt P Di P- Φ CD P Φ P1 3 tr P P- rt CQ P P- Φ CQD. 3 1 tα P- Φ P Φ rt P Di P- Φ CD P Φ P 1 3 tr P P- rt CQ P P- Φ CQ
P- CD P- p. Φ 3 Φ 3 Φ 3 CD 0 P P- α P P- • Φ fr d Φ Ω P- Φ CQ •P- CD P- p. Φ 3 Φ 3 Φ 3 CD 0 P P- α P P- • Φ for d Φ Ω P- Φ CQ •
Ω Ω Ω tr P N P- ω D 3 Φ 3 3 P- Φ Φ d rt rt tr PJ tr d Di t tr tr J ω P- 3 d d PJ Φ <! P- 3 D. Φ φ 3 P α co Hi Φ - Φ rt Φ ΦΩ Ω Ω tr P N P- ω D 3 Φ 3 3 P- Φ Φ d rt rt tr PJ tr d Di t tr tr J ω P- 3 d d PJ Φ <! P- 3 D. Φ φ 3 P α co Hi Φ - Φ rt Φ Φ
Φ P- Φ P rt CQ φ 3 d 3 0 Φ tr φ J Ω 0 P d P rt PΦ P- Φ P rt CQ φ 3 d 3 0 Φ tr φ J Ω 0 P d P rt P
Ω 3 . φ φ P D- rt CD P P t P Φ P- d D. tr 3 ≤ co tr P- ΦΩ 3. φ φ P D- rt CD P P t P Φ P- d D. tr 3 ≤ co tr P- Φ
CD tr 3 P- 0 rt tr Φ Cd Φ tr CD D. d P- P- 0 Ω Φ ?r d JÖCD tr 3 P- 0 rt tr Φ Cd Φ tr CD D. d P- P- 0 Ω Φ? R d JÖ
P- rt D. •n o α Φ Φ tr Φ PJ P P- P rt rt Φ P Ω Φ Φ D tr CD d ΦP- rt D. • n o α Φ Φ tr Φ PJ P P- P rt rt Φ P Ω Φ Φ D tr CD d Φ
3 Φ Φ fr d CO Ω P- H P- Φ P- P CO 3 Φ P Ω tr 3 P- d P- rt 3 > CD3 Φ Φ for d CO Ω P- H P- Φ P- P CO 3 Φ P Ω tr 3 P- d P rt 3> CD
D 3 p P 3 Ω tr φ rt 3 3 1— ' Φ rt 3 P- Φ TJ tr rt d P Ω Φ CD Ό oD 3 p P 3 Ω tr φ rt 3 3 1— 'Φ rt 3 P- Φ TJ tr rt d P Ω Φ CD Ό o
CQ tr P- tr 3 Φ CD tr CD P Φ tr Φ Ω tr tr Ω Ό d ö D. P- Ω Φ P- d CQ PJ 0 O d 0 P- 3 Φ CQ tr rt Φ tr PJ co D P- PJ P- Ω tr tr 3 3 Φ Hl co Ω 3 <! N CQ P- Φ d P- P- 3CQ tr P- tr 3 Φ CD tr CD P Φ tr Φ Ω tr tr Ω Ό d ö D. P- Ω Φ P- d CQ PJ 0 O d 0 P- 3 Φ CQ tr rt Φ tr PJ co D P- PJ P- Ω tr tr 3 3 Φ Hl co Ω 3 <! N CQ P- Φ d P- P- 3
0 P- Φ CD CD tr rt rt CD Di 3 rt Ω d Ω tr CD 0 Φ rt Di CΛ Φ 3 • Ω tr N0 P- Φ CD CD tr rt rt CD Di 3 rt Ω d Ω tr CD 0 Φ rt Di CΛ Φ 3 • Ω tr N
3 Φ rt er ^ P CQ J tr 3 tr P- Ω 3 C > Φ φ rt P- tr J Hi3 Φ rt er ^ P CQ J tr 3 tr P- Ω 3 C> Φ φ rt P- tr J Hi
P- Φ ω P- Φ Di 3 P- P- CQ Φ Ω tr Hi Φ CQ P- PJ 3 tr α rt rt P rt CQ tT ) tr P- tr tr o Φ 3 CD Ω "• D tr P- < d= P- 3 O Φ PJ Φ P- φP- Φ ω P- Φ Di 3 P- P- CQ Φ Ω tr Hi Φ CQ P- PJ 3 tr α rt rt P rt CQ tT ) tr P- tr tr o Φ 3 CD Ω " • D tr P- < d = P- 3 O Φ PJ Φ P- φ
PJ rt d Φ Ω Φ d J 3 rt rt tr rt Ω O 3" 3 Cd tr Φ CQ N 3 o Λ tr 3 P Φ CD tr P- 3 3 co Φ rt D Cd Φ tr P P Φ PJ φ P1 0 P- d 3 dPJ rt d Φ Ω Φ d J 3 rt rt tr rt Ω O 3 "3 Cd tr Φ CQ N 3 o Λ tr 3 P Φ CD tr P- 3 3 co Φ rt D Cd Φ tr PP Φ PJ φ P 1 0 P- d 3 d
0= N P- o Φ CD CD rt φ d Φ α PJ J 3 rt rt d d P- CQ Φ P Di Φ Φ0 = N P- o Φ CD CD rt φ d Φ α PJ J 3 rt rt d d P- CQ Φ P Di Φ Φ
3 N ? Φ 3 O Ω P-1 P- P- d Φ Φ 3 tr Φ rt Ω tr Ω Φ 3 33 N? Φ 3 O Ω P- 1 P- P- d Φ Φ 3 tr Φ rt Ω tr Ω Φ 3 3
3 PJ d 3 D. tr P- tr Φ tr Cd 3 Ω <! Φ D. d P- CQ φ < tr d tr CD N3 PJ d 3 D. tr P- tr Φ tr Cd 3 Ω <! Φ D. d P- CQ φ <tr d tr CD N
Φ tr 3 Φ Φ Φ φ P- P- Φ PJ tr 0 Φ P-1 ω Φ P- 0 Φ d tr Φ *>Φ tr 3 Φ Φ Φ φ P- P- Φ PJ tr 0 Φ P- 1 ω Φ P- 0 Φ d tr Φ *>
3 co 3 P P P" Ω 3 3 d CQ Φ 3 Φ P Di - 3 0 3 Ω 3 co LQ Ξ öd 0= d3 co 3 P P P "Ω 3 3 d CQ Φ 3 Φ P Di - 3 0 3 Ω 3 co LQ Ξ öd 0 = d
P- Ω rt CD Q CD tr φ 0 3 CD Φ o= 3 φ tr CD P- J 3 tr LQ tr Φ €, rt ω t^ 1— ' tr Φ φ φ CD ≤ CQ α 3 Φ fr Cd ≤ P d 3 D. φ Φ P- Φ co Φ Φ PJ Φ φ Ω Φ P- 3 Φ Φ rt 3 tr PJ φ Di Φ Φ ΦP- Ω rt CD Q CD tr φ 0 3 CD Φ o = 3 φ tr CD P- J 3 tr LQ tr Φ €, rt ω t ^ 1— 'tr Φ φ φ CD ≤ CQ α 3 Φ for Cd ≤ P d 3 D. φ Φ P- Φ co Φ Φ PJ Φ φ Ω Φ P- 3 Φ Φ rt 3 tr PJ φ Di Φ Φ Φ
P- Ω P Φ rt P- 3 d P 3 tr P- 3 rt tr Cd 3 P- P CQ Φ d P- d CDP- Ω P Φ rt P- 3 d P 3 tr P- 3 rt tr Cd 3 P- P CQ Φ d P- d CD
CD < tr LQ P- φ co Φ PJ φ Φ Φ φ PJ 3 Ω CD co P φ CD PJ ΦCD <tr LQ P- φ co Φ PJ φ Φ Φ φ PJ 3 Ω CD co P φ CD PJ Φ
Ό P- rt Φ Ω φ PJ 1— ' 3 3 Q D P tr 3 d tr CQ P- Φ Φ d 3 Di tüΌ P- rt Φ Ω φ PJ 1— '3 3 Q D P tr 3 d tr CQ P- Φ Φ d 3 Di tü
P- Φ Φ tr tr 1— ' d Φ P- rt φ PJ Φ Di • Φ Φ 3 P- φ Hi φ P- JP- Φ Φ tr tr 1— 'd Φ P- rt φ PJ Φ Di • Φ Φ 3 P- φ Hi φ P- J
Φ 3 Φ et rt φ CQ 3 - to P Φ rt O h- ■ P- P- rt 3 3 α d φ dΦ 3 Φ et rt φ CQ 3 - to P Φ rt O h- ■ P- P- rt 3 3 α d φ d
Hi 3 P- Φ 3 J P- Ω Φ φ d rt Φ PJ φ P- Φ rt ΦHi 3 P- Φ 3 J P- Ω Φ φ d rt Φ PJ φ P- Φ rt Φ
CD PJ tr d s: d Φ 3 PJ σ d ffi 3 D tr 3 Hi Φ P d d Φ P- CQ NCD PJ tr d s: d Φ 3 PJ σ d ffi 3 D tr 3 Hi Φ P d d Φ P- CQ N
£ Ω Φ o 3 Φ φ P- rt rt Φ Φ φ N Φ P- Φ N PJ d tr D rt P-1 d € φ£ Ω Φ o 3 Φ φ P- rt rt Φ Φ φ N Φ P- Φ N PJ d tr D rt P- 1 d € φ
Φ 3" N P- P P 3 - Φ P- P P- 3 Ω 3 ≤ Ω φ Φ φ Φ J P- 3Φ 3 "N P- P P 3 - Φ P- P P- 3 Ω 3 ≤ Ω φ Φ φ Φ J P- 3
P- φ P- Ω D. Φ P Φ CD CQ tr rt P- tr D P tr X d CD ΦP- φ P- Ω D. Φ P Φ CD CQ tr rt P- tr D P tr X d CD Φ
CQ φ tr d Φ Ω 3 P- 3 rt Φ < et Q CD Φ tr P- Φ rt S CQ Ω dCQ φ tr d Φ Ω 3 P- 3 rt Φ <et Q CD Φ tr P- Φ rt S CQ Ω d
Φ φ tr 3 3 P Φ PJ Φ φ Φ d 0 D. Ω Φ 3 P- CD P J tr rtΦ φ tr 3 3 P Φ PJ Φ φ Φ d 0 D. Ω Φ 3 P- CD P J tr rt
P- d D tr fr CD 3 3 P P- J tr d P LQ φ 0 P- rt Di Φ coP- d D tr for CD 3 3 P P- J tr d P LQ φ 0 P- rt Di Φ co
CQ 3 3 PJ 0 tr 3 Φ CD rt rt Ω d φ d Q d CQ d f Φ Φ dCQ 3 3 PJ 0 tr 3 Φ CD rt rt Ω d φ d Q d CQ d f Φ Φ d
P Φ Q 3 PJ Hl P Φ tr co d Φ tr CQ 3 Φ 3 Φ D. d ^ 3 CQ fr o= P CD d Ό 3 O PJ 3 Φ PJ= P- 3 Φ P- Φ ω ω CQ 3 φ 3 P- CQ Ω tr tΛ ≤ P I—1 3 P-1 3 P 3 3 CQ P- I—1 1_1. Ω rt Φ D. P o J Φ tr φP Φ Q 3 PJ Hl P Φ tr co d Φ tr CQ 3 Φ 3 Φ D. d ^ 3 CQ fr o = P CD d Ό 3 O PJ 3 Φ PJ = P- 3 Φ P- Φ ω ω CQ 3 φ 3 P- CQ Ω tr tΛ ≤ PI— 1 3 P- 1 3 P 3 3 CQ P- I— 1 1_1. Ω rt Φ D. P o J Φ tr φ
Φ IT Φ Ω P- • P- P- ISI CQ rt Ω tr Φ tr Φ φ 3 Φ CQ Ω P- PΦ IT Φ Ω P- • P- P- ISI CQ rt Ω tr Φ tr Φ φ 3 Φ CQ Ω P- P
P P- tr N φ tr φ H-1 < J tr Φ φ ≤ P- P- d tr <! tr ΩP P- tr N φ tr φ H- 1 <J tr Φ φ ≤ P- P- d tr <! tr Ω
Φ Φ CD P- Cd - 3 P- CQ P- Φ d rt P- P Φ Ω Ω P- P- φ tr ≤Φ Φ CD P- Cd - 3 P- CQ P- Φ d rt P- P Φ Ω Ω P- P- φ tr ≤
P- Φ Φ P- PJ co rt Ω P CD 3 cQ P- tr tr rt D. X Φ Ω φ d rt φ ti P 3 3 rt Ω Φ tr <! Φ Φ rt rt r σ CQ P- Φ P- tr Φ P-P- Φ Φ P- PJ co rt Ω P CD 3 cQ P- tr tr rt D. X Φ Ω φ d rt φ ti P 3 3 rt Ω Φ tr <! Φ Φ rt rt r σ CQ P- Φ P- tr Φ P-
CD rt Φ d Φ tr Φ P- φ 0 P 1 CQ Φ ≤ Φ P Ω rt HiCD rt Φ d Φ tr Φ P- φ 0 P 1 CQ Φ ≤ Φ P Ω rt Hi
P- P Φ 3 CQ π d rtP- P Φ 3 CQ π d rt
1 rt Φ P d N Φ J tr Φ PJ Φ Φ1 rt Φ P d N Φ J tr Φ PJ Φ Φ
Φ p P- 3 rt 1 PJ 1 Φ d P Hi 3 rt d P dΦ p P- 3 rt 1 PJ 1 Φ d P Hi 3 rt d P d
3 PJ 1 3 P- 1 fr P- rt PJ d3 PJ 1 3 P- 1 for P- rt PJ d
1 1 P 1 1 D.
1 1 P 1 1 D.
stände der Elektrodenschichten durch Übereinanderlegen mehrerer keramischer Grünfolien realisiert werden.levels of the electrode layers can be realized by superimposing several ceramic green foils.
Desweiteren ist ein Bauelement besonders vorteilhaft, bei dem die Außenkontur wenigstens einer Elektrodenschicht wenigstens einen seitlichen Einschnitt aufweist. Durch ein solches Bauelement ist es möglich, die Induktivität innerhalb des Bauelements zu erhöhen. Insbesondere erhöht sich die Induktivität mit der Zahl der Einschnitte, falls diese abwechselnd von entgegengesetzten Seiten her vom Rand in das Innere der Elektrodenschicht geführt werden und somit eine Mäanderstruktur der Elektrodenschicht bilden.Furthermore, a component is particularly advantageous in which the outer contour of at least one electrode layer has at least one lateral incision. Such a component makes it possible to increase the inductance within the component. In particular, the inductance increases with the number of cuts if these are made alternately from opposite sides from the edge into the interior of the electrode layer and thus form a meandering structure of the electrode layer.
Eine erhöhte Induktivität des Bauelements hat den Vorteil, daß die für die Resonanzfrequenzen des Bauelements wichtigen LC-Konstanten nicht mehr so stark von den äußeren Gegebenheiten, beispielsweise von der Form der Zuleitungen des Bauelements auf einer Leiterplatte, abhängen. Somit kann also die elektrische Eigenschaft des Bauelements durch das Design weitgehend festgelegt werden und wird nur noch geringfügig durch die äußeren Faktoren, wie Zuleitungen etc., beeinflußt.An increased inductance of the component has the advantage that the LC constants that are important for the resonance frequencies of the component no longer depend so strongly on the external conditions, for example on the shape of the leads of the component on a printed circuit board. Thus, the electrical property of the component can be largely determined by the design and is only slightly influenced by the external factors, such as supply lines, etc.
Desweiteren ist die Anzahl und Größe der Einschnitte der Elektrodenschichten neben dem Abstand der Elektrodenschichten voneinander und dem Überlapp der eine Kapazität bildendenFurthermore, the number and size of the incisions of the electrode layers, in addition to the spacing of the electrode layers from one another and the overlap of those forming a capacitance
Elektrodenschichten ein weiterer Freiheitsgrad für die frei wählbare Gestaltung der gewünschten Kapazität.Electrode layers a further degree of freedom for the freely selectable design of the desired capacity.
Desweiteren kann besonders vorteilhaft an der Außenseite des Bauelements eine Markierung angebracht sein, die dazu geeignet ist, die Oberseite des Schichtstapels von dessen Unterseite zu unterscheiden. Eine solche Markierung hat den Vorteil, daß sie erlaubt, das erfindungsgemäße Bauelement in einer ganz bestimmten Orientierung auf einer Leiterplatte anzu- bringen. Vorzugsweise wird dabei eine Orientierung gewählt, bei der die kleinere der Kapazitäten näher an der Leiterplatte liegt als die größere der Kapazitäten, da es sich gezeigt
co rt CD Di in O φ σ rt P- CD CD D. O tr $, ö LQ r1 D. tr1 α Φ rt rt tr« rt 3 α er D. erFurthermore, a marking which is suitable for distinguishing the top side of the layer stack from its underside can be attached to the outside of the component in a particularly advantageous manner. Such a marking has the advantage that it allows the component according to the invention to be attached to a printed circuit board in a very specific orientation. In this case, an orientation is preferably chosen in which the smaller of the capacitances is closer to the printed circuit board than the larger of the capacitances, since it is shown co rt CD Di in O φ σ rt P- CD CD D. O tr $, ö LQ r 1 D. tr 1 α Φ rt rt tr «rt 3 α er D. er
Ό P Φ J J Ω J Φ CQ l-1 Ω Φ J J Φ Φ Φ H φ J Φ PJ= PJ= PJ: φ Φ φ Φ PJ: φ PJΌ P Φ JJ Ω J Φ CQ l- 1 Ω Φ JJ Φ Φ Φ H φ J Φ PJ = PJ = PJ: φ Φ φ Φ PJ: φ PJ
PJ 0 3 ω d tr φ co P rt CD tr CQ Di CD 3 CD 0= P- tΛ P- 3 Φ rt rt P- P 3 d P rtPJ 0 3 ω d tr φ co P rt CD tr CQ Di CD 3 CD 0 = P- tΛ P- 3 Φ rt rt P- P 3 d P rt
3 3 rt Φ PJ 3 P- ^ d tr d rt P- ≤ CΛ rt rt TJ rt J > φ LQ ^ d P- Cd φ 3 PJ S rt 0= Φ P Φ LQ Φ Φ Φ Φ Φ Hl rt 3 Φ 3 d Φ o d CQ P- PJ Φ rt 3 P- P" tr PJ N 3 P Ω er CD P- P P P- P d P Cd PJ= PJ 0 rt 3 P D.3 3 rt Φ PJ 3 P- ^ d tr d rt P- ≤ CΛ rt rt TJ rt J> φ LQ ^ d P- Cd φ 3 PJ S rt 0 = Φ P Φ LQ Φ Φ Φ Φ Φ Hl rt 3 Φ 3 d Φ od CQ P- PJ Φ rt 3 P- P "tr PJ N 3 P Ω er CD P- PP P- P d P Cd PJ = PJ 0 rt 3 P D.
3 Ω Ω d 3 d rt rt Φ o rt Hi 3 Hi er rt rt rt Φ *Ö 3 •o d P- P- tr Ό rt P CQ P- PJ3 Ω Ω d 3 d rt rt Φ o rt Hi 3 Hi er rt rt rt Φ * Ö 3 • od P- P- tr Ό rt P CQ P- PJ
CQ tr tr Φ Φ d 3 3 Φ d Φ P- - Φ Φ 1— ■ Φ I—1 LQ CD d φ I— ■ rt Di O φ tΛCQ tr tr Φ Φ d 3 3 Φ d Φ P- - Φ Φ 1— ■ Φ I— 1 LQ CD d φ I— ■ rt Di O φ tΛ
Φ φ Φ -~ d LQ tT Φ 3 P d d d s: d P PJ J CQ Ω Φ P PJ Φ 3 P 3Φ φ Φ - ~ d LQ tT Φ 3 P d d d s: d P PJ J CQ Ω Φ P PJ Φ 3 P 3
3 3 Φ rt PJ P- Φ rt P- tr P- D. CD Φ PJ rt > rt Φ tr rt ^ d Φ rt D. co 3 LQ d 3 P- PJ rt α d P Φ d Ό rt d rt P- Φ D PJ rt d Ω P- P-3 3 Φ rt PJ P- Φ rt P- tr P- D. CD Φ PJ rt> rt Φ tr rt ^ d Φ rt D. co 3 LQ d 3 P- PJ rt α d P Φ d Ό rt d rt P - Φ D PJ rt d Ω P- P-
CQ Ω J φ er φ d Φ 3 tr P- o d D. CD Φ J Φ 0 Φ LQ d 0 d Φ tr CQ er Φ ΦCQ Ω J φ er φ d Φ 3 tr P- o d D. CD Φ J Φ 0 Φ LQ d 0 d Φ tr CQ er Φ Φ
Φ tr d d 0 CD p Φ Φ 0 T3 LQ CD P- P- N P Φ P1 Φ Φ PΦ tr dd 0 CD p Φ Φ 0 T3 LQ CD P- P- NP Φ P 1 Φ Φ P
CQ PJ rt Ω Ω *Ö P- d •σ O Φ Φ 3 CQ P- LQ D. PJ d Cd Ω D. J P- Di d d ΦCQ PJ rt Ω Ω * Ö P- d • σ O Φ Φ 3 CQ P- LQ D. PJ d Cd Ω D. J P- Di dd Φ
Ω 1— ' D- er er PJ α= N co D. Φ IQ CD d Φ rt rt d= d tr co P- tr Φ 3 Φ Di d tr rt Φ d 0 J P tr d •Ö Φ P Φ PJ= d d er Ω LQ Φ P LQ CD LQ Φ fr d P P- er PJ Φ O P- CQ φ P 3 3 M α Φ rt CD d PJ= er φ Φ φ P- tr rt 3 φ 3 rt P φ CQ PJ Φ p)= 0= CD Φ P- rt LQ 3 PJ d f 0 P Φ co D. rtΩ 1— 'D- er er PJ α = N co D. Φ IQ CD d Φ rt rt d = d tr co P- tr Φ 3 Φ Di d tr rt Φ d 0 JP tr d • Ö Φ P Φ PJ = dd er Ω LQ Φ P LQ CD LQ Φ fr d P P- er PJ Φ O P- CQ φ P 3 3 M α Φ rt CD d PJ = er φ Φ φ P- tr rt 3 φ 3 rt P φ CQ PJ Φ p ) = 0 = CD Φ P- rt LQ 3 PJ df 0 P Φ co D. rt
N IQ co P- Φ o tr Φ CD CΛ CQ 0 P d d P- LQ Hl CD 3 Φ P P rt Φ P rt Ό Φ LQ rt φ J PJ CD d P- 0 Φ PJ= CQ 3 P- rt Ω 0 P- D. Di Hi CQ P-N IQ co P- Φ o tr Φ CD CΛ CQ 0 P dd P- LQ Hl CD 3 Φ PP rt Φ P rt Ό Φ LQ rt φ J PJ CD d P- 0 Φ PJ = CQ 3 P- rt Ω 0 P - D. Di Hi CQ P-
• < PJ P J CD ≤ CO 3 P- J α Cd er Φ P- LQ φ tr P rt 3 P- P- φ co• <PJ P J CD ≤ CO 3 P- J α Cd er Φ P- LQ φ tr P rt 3 P- P- φ co
0 3 0 ≤ 3 P- Φ P- PJ CO Ω rt P- P Φ P rt 3 PJ Di Φ Φ Φ d P- d Ω0 3 0 ≤ 3 P- Φ P- PJ CO Ω rt P- P Φ P rt 3 PJ Di Φ Φ Φ d P- d Ω
P 3 tr Cd Φ N 3 Φ P- CD Φ 3 PJ er P- φ d P CD - Hi 3 P rt D. d PJ tr d 3 Φ P d d P CD 0 P N d -» 0 Φ P- Di P- rt d Ό co d d φ ω d P- P- D d rt Φ rt X Φ d Φ PJ CD Φ d <! Φ 3 CD Ω d ≤ Φ dP 3 tr Cd Φ N 3 Φ P- CD Φ 3 PJ er P- φ d P CD - Hi 3 P rt D. d PJ tr d 3 Φ P dd P CD 0 PN d - »0 Φ P- Di P- rt d Ό co dd φ ω d P- P- D d rt Φ rt X Φ d Φ PJ CD Φ d <! Φ 3 CD Ω d ≤ Φ d
Φ LQ LQ Φ Φ LQ Φ J 0 Φ CQ X Φ d rt P i 0 3 LQ PJ P- tr CQ φ D CD > d P- CQ PJ rt s: d φ P- $. rt 3 ~ • d rt 3 P- CD P- Φ CdΦ LQ LQ Φ Φ LQ Φ J 0 Φ CQ X Φ d rt P i 0 3 LQ PJ P- tr CQ φ D CD> d P- CQ PJ rt s: d φ P- $. rt 3 ~ • d rt 3 P- CD P- Φ Cd
Ω KQ d d d CQ < t— ' P- Φ Di 3 3 P- P φ D. Di P- rt Ω LQ rt 3 P- - d d Hi Φ Ω J CD O P Φ Φ Φ D. P- d φ J I—1 α D Φ CD Φ tr Φ Φ φ LQΩ KQ ddd CQ <t— 'P- Φ Di 3 3 P- P φ D. Di P- rt Ω LQ rt 3 P- - dd Hi Φ Ω J CD OP Φ Φ Φ D. P- d φ JI— 1 α D Φ CD Φ tr Φ Φ φ LQ
PJ= φ D rt Cd P tr P d d 3 Φ tr rt P φ J Φ CD rt d rt 3 P 3 Φ CTiPJ = φ D rt Cd P tr P d d 3 Φ tr rt P φ J Φ CD rt d rt 3 P 3 Φ CTi
D P" P Φ d P- s: CD Φ CD rt Ξ P d CQ P- tr 3 3 Φ PJ= φ rt 3D P "P Φ d P- s: CD Φ CD rt Ξ P d CQ P- tr 3 3 Φ PJ = φ rt 3
P- D Φ P- N rt CQ P- 3 PJ Φ CQ 3 tr tr1 d Φ Cd tr P- D. d L ) P CQ CQP- D Φ P- N rt CQ P- 3 PJ Φ CQ 3 tr tr 1 d Φ Cd tr P- D. d L) P CQ CQ
CQ Φ P- rt d N rt Ω P- . rt N P- rt CD Φ φ Di φ P- > PJ Φ Φ Φ Ω d Φ Φ tr Hl O er α 0 d rt J Ω co P- φ P tr d CD IQ tr D. d Ω PJ trCQ Φ P- rt d N rt Ω P-. rt N P- rt CD Φ φ Di φ P-> PJ Φ Φ Φ Ω d Φ Φ tr Hl O er α 0 d rt J Ω co P- φ P tr d CD IQ tr D. d Ω PJ tr
3 J d CD d P rt Φ P Φ 3 er 0 rt P φ er D Φ 0 rt Φ Φ Φ d PJ3 J d CD d P rt Φ P Φ 3 er 0 rt P φ er D Φ 0 rt Φ Φ Φ d PJ
LQ tr α= φ Ω d X P- P Φ P- P P- d Φ d J rt 3 P- CD Cd LQ Hl HlLQ tr α = φ Ω d X P- P Φ P- P P- d Φ d J rt 3 P- CD Cd LQ Hl Hl
Φ • tr Φ P- tr tr Φ LQ CD d d Φ Ω Di P d rt PJ φ PJ J Φ rt d Φ P- d fr rt P Φ rt rt CD r Φ •υ 3 ϊ d 3 Φ α td d 3 Φ Φ α P d φ rt P- PJ PJ 3 Φ Φ O rt P LQ PJ CD D. Φ P CD Φ PJ Φ CD P- d J J CD Φ d N 0 3 d P- LQ h- ' J φ CQ PJ φ Ό P- d CQ P d 1— ' rt d d Di Ό P Φ 3 P- D rt P Φ 3 d rt tr PJ Ω D. rt Di Φ φ P) ΦΦ • tr Φ P- tr tr Φ LQ CD dd Φ Ω Di P d rt PJ φ PJ J Φ rt d Φ P- d fr rt P Φ rt rt CD r Φ • υ 3 ϊ d 3 Φ α td d 3 Φ Φ α P d φ rt P- PJ PJ 3 Φ Φ O rt P LQ PJ CD D. Φ P CD Φ PJ Φ CD P- d JJ CD Φ d N 0 3 d P- LQ h- 'J φ CQ PJ φ Ό P- d CQ P d 1— 'rt dd Di Ό P Φ 3 P- D rt P Φ 3 d rt tr PJ Ω D. rt Di Φ φ P ) Φ
Hi d J co 3 x PJ P- 3 < rt Φ tsi er Φ co <! P- D. 3 3 P ΦHi d J co 3 x PJ P- 3 <rt Φ tsi er Φ co <! P- D. 3 3 P Φ
P d C= Ό D. J CD co = Φ rt d PJ 0 Φ r P- P o φ P- φ φ D CQP d C = Ό D. J CD co = Φ rt d PJ 0 Φ r P- P o φ P- φ φ D CQ
Ω Ω d tr J Φ d P- CD *Ü tr P P d d P P rt er P φ 3 d r1 Ω Ω d tr J Φ d P- CD * Ü tr PP dd PP rt er P φ 3 dr 1
P tr d Φ d d CQ d Φ PJ Φ Φ P- LQ CD rt rt PJ= Φ n P- rt LQ φ rt D φ Cd d d P d LQ d P d CD CD Φ P- Φ rt P PJ d Φ P X d Q Φ P- PJ d ≤ LQ CD d Φ φ Cd < d D • Ω J Φ P- Φ PJ Ό CD P- 0= rt P rt dP tr d Φ dd CQ d Φ PJ Φ Φ P- LQ CD rt rt PJ = Φ n P- rt LQ φ rt D φ Cd dd P d LQ d P d CD CD Φ P- Φ rt P PJ d Φ PX d Q Φ P- PJ d ≤ LQ CD d Φ φ Cd <d D • Ω J Φ P- Φ PJ Ό CD P- 0 = rt P rt d
Di P- Ό 3 P Φ 0 d •σ tr tr P- LQ ^ 3 d J tr EΛ φ CD J φ ΦDi P- Ό 3 P Φ 0 d • σ tr tr P- LQ ^ 3 d J tr EΛ φ CD J φ Φ
P Hi PJ CQ Φ fr rt d d PJ Cd Φ er d er rt J PJ= CD N φ er Φ P- d Cd PP Hi PJ CQ Φ fr rt d d PJ Cd Φ er d er rt J PJ = CD N φ er Φ P- d Cd P
N D. PJ= 3 φ tr CD P LQ d φ PJ= Φ J • H1 er LQ P- CD PJ P d Ό Hi P Ό Φ d 3 3 rt rt PJ CD 3 P- •n 3 3 Hi Φ Φ rt 0 Hi Φ Φ PJ Hi 1— ' 3N D. PJ = 3 φ tr CD P LQ d φ PJ = Φ J • H 1 er LQ P- CD PJ P d Ό Hi P Ό Φ d 3 3 rt rt PJ CD 3 P- • n 3 3 Hi Φ Φ rt 0 Hi Φ Φ PJ Hi 1— '3
D. d P Φ Ω φ PJ d co d LQ rt - P CD PJ= 3 rt P P Φ P- J φ tr P- rt d P- 0 rt er P tr 3 Ό d P- 3 - rt rt D. « Φ PJ P- d rt d o φ CQ co 3 Φ rt J er CQ P- tr LQ PJ ≤ PJ φ Φ φ PJ h-1 d rt rt er P- rt P- • 3 PJ= CD φ rt rt tr 0 3 1— ■ d P D *Ü ^ h- ' Φ d Φ coD. d P Φ Ω φ PJ d co d LQ rt - P CD PJ = 3 rt PP Φ P- J φ tr P- rt d P- 0 rt er P tr 3 Ό d P- 3 - rt rt D. « Φ PJ P- d rt do φ CQ co 3 Φ rt J er CQ P- tr LQ PJ ≤ PJ φ Φ φ PJ h- 1 d rt rt er P- rt P- • 3 PJ = CD φ rt rt tr 0 3 1— ■ d PD * Ü ^ h- 'Φ d Φ co
Φ φ 3 C CQ Cd P- 3 I—1 P- P- Φ Φ Φ PJ PJ PJ φ P dΦ φ 3 C CQ Cd P- 3 I— 1 P- P- Φ Φ Φ PJ PJ PJ φ P d
P i— ■ P- D Ω P x LQ co 0 CD P P- Di D- rt N N T3 - ' LQ PJ <P i— ■ P- D Ω P x LQ co 0 CD P P- Di D- rt NN T3 - 'LQ PJ <
Φ $. P PJ tr d 3 P- d rt P- P- Φ ^ d D D P- J d1 tr 0 tr φ D. co Φ PJ CQ Φ • PJ D. Φ P P P- P- N N φ φ d d P- P- I—1 Φ φ Φ P- d P- P- d 3 P
Φ $. P PJ tr d 3 P- d rt P- P- Φ ^ d DD P- J d 1 tr 0 tr φ D. co Φ PJ CQ Φ • PJ D. Φ PP P- P- NN φ φ dd P- P - I— 1 Φ φ Φ P- d P- P- d 3 P
Desweiteren kann zur Vereinfachung der Herstellung und zur Reduktion der Materialvielfalt ein Bauelement vorgesehen sein, bei dem sämtliche Dielektrikumschichten aus einer Varistorkeramik bestehen. Insbesondere kommen hier Dielektrikumschichten in Betracht, die aus ZnO-Bi2θ3-Sb2θ3 hergestellt sind. Eine solche Varistorkeramik hat gleichzeitig hervorragende Eigenschaften bezüglich ihrer Eignung als Dielektrikumschicht für Kondensatoren bei bestimmten Anwendungen.Furthermore, to simplify production and to reduce the variety of materials, a component can be provided in which all dielectric layers consist of a varistor ceramic. In particular, dielectric layers that are produced from ZnO-Bi2θ3-Sb2θ3 come into consideration here. Such a varistor ceramic also has excellent properties with regard to its suitability as a dielectric layer for capacitors in certain applications.
Das erfindungsgemäße Bauelement kann besonders vorteilhaft durch Sintern eines Stapels von übereinanderliegenden keramischen Grünfolien hergestellt sein. Eine solche Herstellung hat den Vorteil, daß dünne Schichten in einem einzigen Sin- terprozeß zu einem monolithischen Bauteil verbunden werden. Aufgrund der dünnen Keramikschichten kann schon mit einer kleinen Grundfläche des Bauelements eine hohe Kapazität erreicht werden.The component according to the invention can be produced particularly advantageously by sintering a stack of ceramic green foils lying one above the other. Such a production has the advantage that thin layers are connected to a monolithic component in a single sintering process. Due to the thin ceramic layers, a high capacitance can be achieved with a small footprint of the component.
Im folgenden wird die Erfindung anhand von Ausführungsbei- spielen und den dazu gehörigen Figuren näher erläutert .The invention is explained in more detail below with the aid of exemplary embodiments and the associated figures.
Figur 1 zeigt beispielhaft ein erfindungsgemäßes Bauelement im schematischen Querschnitt.FIG. 1 shows an example of a component according to the invention in a schematic cross section.
Figur 2 zeigt die Einfügedämpfung des Bauelements aus FigurFIG. 2 shows the insertion loss of the component from FIG
1 gemessen in Abhängigkeit von der Frequenz .1 measured depending on the frequency.
Figur 3 zeigt beispielhaft ein weiteres erfindungsgemäßes Bauelement mit Varistorkeramik im schematischenFigure 3 shows an example of another component according to the invention with varistor ceramic in schematic
Querschnitt .Cross-section .
Figur 4 zeigt die Einfügedämpfung des in Figur 3 dargestellten Bauelements gemessen in Abhängigkeit von der Frequenz.
to to P1 P1 o in o in O inFIG. 4 shows the insertion loss of the component shown in FIG. 3 measured as a function of the frequency. to to P 1 P 1 o in o in O in
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> > to t in o in o in o in rt α Di D. fr d o Ω tr CD CD < Hl rt tr ^ tr P s d Di LQ d > α Ξ Φ U 3 Cd α>> to t in o in o in o in rt α Di D. fr do Ω tr CD CD <Hl rt tr ^ tr P sd Di LQ d > α Ξ Φ U 3 Cd α
PJ= Φ Φ Φ tr Φ P Φ rt et Φ fr Φ Φ Φ t PJ PJ= P- d P- Φ Φ P- P- 3 PJ rt P d P Φ P 3 fr rt PJ O P P P LQ Φ 3 N d 3 tr t X Φ 3 tr d Φ d φPJ = Φ Φ Φ tr Φ P Φ rt et Φ fr Φ Φ Φ t PJ PJ = P- d P- Φ Φ P- P- 3 PJ rt P d P Φ P 3 fr rt PJ OPPP LQ Φ 3 N d 3 tr t X Φ 3 tr d Φ d φ
CD P Φ rt d P d P £, CD d . O rt CD e D. rt φ d ΦCD P Φ rt d P d P £, CD d. O rt CD e D. rt φ d Φ
Ω = Ω Ω Φ d Φ Hi PJ= X Φ D Ω Di P d Hi Hl <τj N Ω Φ P P α d P" CQ o tr tr P P- P 0 LQ φ d P- er P- Φ J o P d CQ P Φ rt P- P- Di φ ΦΩ = Ω Ω Φ d Φ Hi PJ = X Φ D Ω Di P d Hi Hl <τj N Ω Φ PP α d P "CQ o tr tr P P- P 0 LQ φ d P- er P- Φ J o P d CQ P Φ rt P- P- Di φ Φ
Φ fr d ^ 3 h-1 rt D. P D. φ Φ ω P O PJ φ d P- Φ CD X α φ 3 0 o P Ω d PJ J * — P- J Φ φ φ J tr Λ LQ Ω Ω J d P- φ 3Φ fr d ^ 3 h- 1 rt D. P D. φ Φ ω PO PJ φ d P- Φ CD X α φ 3 0 o P Ω d PJ J * - P- J Φ φ φ J tr Λ LQ Ω Ω J d P- φ 3
~ er Hi d O • Φ 3 rt LSI D. cd N d N Φ d er er 3 i 3 Ω Φ d d Φ t J t 0 D. J 3 n Di P- s: φ Φ P- Φ CO Φ rt CD X tr rt rt ts Φ Φ N ö φ tr ≤ P- N N (t 3 to D. d X Φ Ω φ rt D. CD P~ er Hi d O • Φ 3 rt LSI D. cd N d N Φ er er 3 i 3 Ω Φ dd Φ t J t 0 D. J 3 n Di P- s: φ Φ P- Φ CO Φ rt CD X tr rt rt ts Φ Φ N ö φ tr ≤ P- NN (t 3 to D. d X Φ Ω φ rt D. CD P
Ό d P P- Φ 0 "ϊ= P - 0 CΩ d d LQ PJ PJ= LQ N Φ α PJ er P Φ P-Ό d P P- Φ 0 " ϊ = P - 0 CΩ dd LQ PJ PJ = LQ N Φ α PJ er P Φ P-
3 Φ I—1 rt P 3 P Ω LQ et Ό rt φ Φ P •α PJ < P tr CD3 Φ I— 1 rt P 3 P Ω LQ et Ό rt φ Φ P • α PJ <P tr CD
3 D. 3 P- PJ= LQ Cd D- tr ^ CD PJ tr 3 D. PJ d Ω 0 X φ Ω to Φ Φ rt s ^-^ P- Φ Φ P- N Φ tsi Ω o= d P- Φ N CD tr d d eα et er3 D. 3 P- PJ = LQ Cd D- tr ^ CD PJ tr 3 D. PJ d Ω 0 X φ Ω to Φ Φ rt s ^ - ^ P- Φ Φ P- N Φ tsi Ω o = d P- Φ N CD tr dd eα et er
P tr LQ P φ φ 3 d CQ Φ P- P- P Hl d d P- rt 3 0= P ΦP tr LQ P φ φ 3 d CQ Φ P- P- P Hl d d P- rt 3 0 = P Φ
Φ Φ Φ Ω CQ ö Φ X CD d P- d rt et rt ≥; Φ ω CD tr dΦ Φ Φ Ω CQ ö Φ X CD d P- d rt et rt ≥; Φ ω CD tr d
3 Cd P d to rt P- CQ rt N Ω P Ω PJ= d tr D. d OJ: α d
Ω Φ LQ3 Cd P d to rt P- CQ rt N Ω P Ω PJ = d tr D. d OJ: α d Ω Φ LQ
P1 3 D PJ Ω d P • σ tr er s: rt d α d tr Φ d rt tr Φ >P 1 3 D PJ Ω d P • σ tr er s: rt d α d tr Φ d rt tr Φ>
LQ φ LQ Φ tr d tr 0 td P- Φ Φ D. 3 PJ= P et i t P- o d tr φ X P co d Φ D. Φ rt D. • φ Ω d Ω φ D. d Φ Ω 3 Ω - 3 rt 0= rt P- Φ CD tr co et t LQ ^ P rt ≤ tr co φLQ φ LQ Φ tr d tr 0 td P- Φ Φ D. 3 PJ = P et it P- or tr φ XP co d Φ D. Φ rt D. • φ Ω d Ω φ D. d Φ Ω 3 Ω - 3 rt 0 = rt P- Φ CD tr co et t LQ ^ P rt ≤ tr co φ
P tΛ 3 Ω P i d Φ d φ Φ rt P- D Φ • P- X Hi CD + J d tr rt d CDP tΛ 3 Ω P i d Φ d φ Φ rt P- D Φ • P- X Hi CD + J d tr rt d CD
3 0 Φ rt P PJ= to d P CD d Φ P Φ to LQ LQ Ω Ω 3 P Φ Φ 3 CD rt D. P Φ fr LQ D. Φ Ω 3 Ω ι > D 3 Φ Φ - X d tr to J D P 3 3 D d3 0 Φ rt P PJ = to d P CD d Φ P Φ to LQ LQ Ω Ω 3 P Φ Φ 3 CD rt D. P Φ for LQ D. Φ Ω 3 Ω ι> D 3 Φ Φ - X d tr to JDP 3 3 D d
Φ Φ Φ P d rt D. d tr P φ CD LQ P- Φ P rt Φ LQ Φ dΦ Φ Φ P d rt D. d tr P φ CD LQ P- Φ P rt Φ LQ Φ d
P d d _ Hi Φ D. D tsi fr Ω Hi 3 P 3 ≤ φ tr Φ to P LQ et CQ 0 P Φ Ω 3 d P d= Φ 0= φ 0 rt to D. Φ tr Φ CQ φP d d _ Hi Φ D. D tsi fr Ω Hi 3 P 3 ≤ φ tr Φ to P LQ et CQ 0 P Φ Ω 3 d P d = Φ 0 = φ 0 rt to D. Φ tr Φ CQ φ
Φ Ω t o 3 PJ tr Hl fr P P CΛ P tr 1— ' rt Φ et CD tr1 dΦ Ω to 3 PJ tr Hl for PP CΛ P tr 1— 'rt Φ et CD tr 1 d
3 er J P- o Cd d rt Cd 0 3 Φ Hl Φ Φ Φ <: Di P- P D d Φ P- PJ=3 er J P- o Cd d rt Cd 0 3 Φ Hl Φ Φ Φ <: Di P- P D d Φ P- PJ =
Ό α Φ Cß co Φ Hl Di P P P- o PJ Ω PJ= rt Φ 3 d Di tsi Ω PJ P- d "ϊ: φ Ω d P- 0 P- 3 Φ tϋ d P er LQ Φ Di LQ Φ d tr N φ 3 X tr co Φ I—1 φ ^ D Φ Hi LQ Φ rt er Ω et Φ CO co rt P- o rt s- tr 3 P- P- d # CD D Φ d rt o J et Φ et α= • ,-^ P d Φ φ o CQ d Φ 0 φ CD • Ω d P- ) 3 P)= tr LQ P O d P- D. Λ tr d d LQ CO d II P et in > CD d d rt Φ • φ D. D. Φ ^ Φ φ P CD 0 PJ Φ PJ *• K *>Ό α Φ Cß co Φ Hl Di PP P- o PJ Ω PJ = rt Φ 3 d Di tsi Ω PJ P- d " ϊ: φ Ω d P- 0 P- 3 Φ tϋ d P er LQ Φ Di LQ Φ d tr N φ 3 X tr co Φ I— 1 φ ^ D Φ Hi LQ Φ rt er Ω et Φ CO co rt P- o rt s- tr 3 P- P- d # CD D Φ d rt o J et Φ et α = •, - ^ P d Φ φ o CQ d Φ 0 φ CD • Ω d P- ) 3 P ) = tr LQ PO d P- D. Λ tr dd LQ CO d II P et in> CD dd rt Φ • φ DD Φ ^ Φ φ P CD 0 PJ Φ PJ * • K *>
Di P co Φ d= P CO CD φ LQ d d ^ P ' Ό 0 X *> ^Di P co Φ d = P CO CD φ LQ d d ^ P 'Ό 0 X *> ^
Ω α d d Di tr et rt φ Φ J N σi P J in 3 φΩ α d d Di tr et rt φ Φ J N σi P J in 3 φ
D. J P- P1 CQ Φ Φ LQ Φ Φ d X 3 d Hl o φ et N K, P 3 LQD. J P- P 1 CQ Φ Φ LQ Φ Φ d X 3 d Hl o φ et N K , P 3 LQ
Φ Φ •Ö Ω rt Ω P P P 3 tr φ t φ PJ= N P Λ P- O Φ Φ PJ 3 dΦ Φ • Ö Ω rt Ω P P P 3 tr φ t φ PJ = N P Λ P- O Φ Φ PJ 3 d
P P tr Ό X tr Φ o= Φ P P d t > Hi Φ S d < rt ^ d P 3 PP P tr Ό X tr Φ o = Φ P P d t> Hi Φ S d <rt ^ d P 3 P
Φ HI Φ Φ P- Ω P- CTO CD d P- et Φ P KQ tα Φ Φ PJ= - co PJ P-Φ HI Φ Φ P- Ω P- CTO CD d P- et Φ P KQ tα Φ Φ PJ = - co PJ P-
^ X rt P Ω P d φ Φ σ X D CD Φ d tsi d P rt PJ 3 CQ P- 1 ^ X rt P Ω P d φ Φ σ XD CD Φ d tsi d P rt PJ 3 CQ P- 1
Φ P PJ= d Φ tr fr J P P- PJ P- d W £! Φ N Φ LQ rt P- Ω dΦ P PJ = d Φ tr for J P P- PJ P- d W £! Φ N Φ LQ rt P- Ω d
P Φ P)= Ω d 3 rt d d φ 3 d Ω 3 P ω d d d J d φ 0 X tr Di J P- LQ er Di Di Φ Hi D. d CD X co Φ PJ φ N d Hi d 3 P Φ Di JP Φ P ) = Ω d 3 rt dd φ 3 d Ω 3 P ω ddd J d φ 0 X tr Di J P- LQ er Di Di Φ Hi D. d CD X co Φ PJ φ N d Hi d 3 P Φ Di J
3 d rt Φ d 0 Φ X φ Ω Ω d d i Hl Ω Φ tr Hi d Φ H3 d rt Φ d 0 Φ X φ Ω Ω d d i Hl Ω Φ tr Hi d Φ H
Φ Di PJ - ' P ^ PJ Φ er er Φ N Hi 3 CD Φ fr P LQΦ Di PJ - 'P ^ PJ Φ er er Φ N Hi 3 CD Φ for P LQ
X P IQ Di Φ d P- - ' PJ 3 <: Φ Hi P- D CD P P Ω ΦX P IQ Di Φ d P- - 'PJ 3 <: Φ Hi P- D CD P P Ω Φ
. φ Φ Φ 3 co φ P- T3 3 d o Ω d Φ Hl to rt Φ d Φ J P Cd CO d d P D. d Φ PJ • Φ d er • 3 to N P d 3 3 D fr P rt, φ Φ Φ 3 co φ P- T3 3 d o Ω d Φ Hl to rt Φ d Φ J P Cd CO d d P D. d Φ PJ • Φ d er • 3 to N P d 3 3 D fr P rt
PJ co D. Φ LQ (Sl P et φ d II D. D P- P- d Φ ΦPJ co D. Φ LQ (Sl P et φ d II D. D P- P- d Φ Φ
: d d Ω P P tr φ P- O en Φ d N P Φ d tr tr φ Hl P- 1— ' J CQ er Φ Φ d rt Φ < o d 3 rt d P1 d P- Ω Φ 0 rt J 0 Φ £ P- tr P- Di PJ= P PJ ~ P LQ » d to P- <! ü Φ rt J tr d 3 Φ rt P T= to P rx> ?d Hi φ P- P- Φ: dd Ω PP tr φ P- O en Φ d NP Φ d tr tr φ Hl P- 1— 'J CQ er Φ Φ d rt Φ <od 3 rt d P 1 d P- Ω Φ 0 rt J 0 Φ £ P- tr P- Di PJ = P PJ ~ P LQ »d to P- <! Φ Φ rt J tr d 3 Φ rt PT = to P rx>? d Hi φ P- P- Φ
N ≤ rt d Φ d P- 3 d ≤ 0= Φ fr φ Ω P φ Φ o dN ≤ rt d Φ d P- 3 d ≤ 0 = Φ fr φ Ω P φ Φ o d
P- P α P- Ω tr d 0 C > o CD LQ P PJ d φ 0 d φ 0 Φ -jP- P α P- Ω tr d 0 C> o CD LQ P PJ d φ 0 d φ 0 Φ -j
D. 1 o
D. 1 o
Die Abmessungen des in Figur 3 dargestellten Bauelements sind in der Länge 1,44 mm, in der Breite 0,72 mm und in der Höhe 0,85 mm.The dimensions of the component shown in FIG. 3 are 1.44 mm in length, 0.72 mm in width and 0.85 mm in height.
Die Dicke D der Zwischenschicht 4 beträgt 350 μm. Die Gesamtkapazität C_+C2 beträgt 60,8 pF, gemessen bei ca. 1 kHz.The thickness D of the intermediate layer 4 is 350 μm. The total capacitance C_ + C2 is 60.8 pF, measured at approx. 1 kHz.
Entsprechend den unterschiedlichen Kapazitäten C]_ und C2 ergeben sich die in Figur 4 dargestellten Resonanzfrequenzen f]_ und f2 die entsprechend Figur 2 aus dem Kurvenverlauf S21(f) abgelesen werden können. Die kleinere Resonanzfrequenz f^ beträgt 805 MHz, während die größere Resonanzfrequenz f2 1,76 MHz beträgt .Corresponding to the different capacitances C] _ and C2, the resonance frequencies f] _ and f2 shown in FIG. 4 result, which can be read according to FIG. 2 from the curve S21 (f). The lower resonance frequency f ^ is 805 MHz, while the higher resonance frequency f2 is 1.76 MHz.
Die Figuren 5A, 5B und 5C zeigen Elektrodenschichten 1 in unterschiedlicher Ausführung, wie sie zur Erhöhung der Induktivität des Bauelements gemäß der Erfindung verwendet werden können. Die Elektrodenschichten 1 gemäß Figur 5A und 5C weisen bezüglich ihrer Außenkontur wenigstens teilweise die Form eines Mäanders auf, der aus mehreren seitlichen Einschnitten 9 resultiert. Die Elektrodenschicht 1 gemäß Figur 5B weist nicht die Form eines Mäanders auf, sondern sie weist nur einen seitlichen Einschnitt 9 auf. Entscheidend ist bei allen in Figur 5A, Figur 5B und Figur 5C dargestellten Ausführungs- beispielen der Elektrodenschichten 1, daß die Elektrodenschichten 1 von einer geradlinigen Struktur abweichen und so einen die entsprechende Kapazität aufladenden elektrischen Strom zwingen, einen nicht geradlinigen Weg zu beschreiben, wodurch die Induktivität einer solchen Elektrodenschicht 1 erhöht ist. Mit zunehmender Anzahl von einzelnen Krümmungen, wie sie in der Reihenfolge Figur 5B, 5A und 5C dargestellt sind, nimmt auch die Induktivität der Elektrodenschicht 1 und damit die Induktivität des erfindungsgemäßen Vielschichtbau- elements zu.FIGS. 5A, 5B and 5C show electrode layers 1 in different designs as can be used to increase the inductance of the component according to the invention. The electrode layers 1 according to FIGS. 5A and 5C have at least partially the shape of a meander with respect to their outer contour, which results from a plurality of lateral incisions 9. The electrode layer 1 according to FIG. 5B does not have the shape of a meander, but rather only has a lateral incision 9. It is crucial in all of the exemplary embodiments of the electrode layers 1 shown in FIG. 5A, FIG. 5B and FIG. 5C that the electrode layers 1 deviate from a rectilinear structure and thus force an electric current charging the corresponding capacitance to describe a non-rectilinear path, as a result of which the Inductance of such an electrode layer 1 is increased. As the number of individual curvatures increases, as shown in the sequence in FIGS. 5B, 5A and 5C, the inductance of the electrode layer 1 and thus the inductance of the multilayer component according to the invention also increases.
Figur 6 zeigt ein erfindungsgemäßes Vielschichtbauelement mit Bezugszeichen, die Figur 1 entsprechen, das gemäß der erfin-
FIG. 6 shows a multilayer component according to the invention with reference numerals that correspond to FIG. 1, which according to the invention
Claims
1. Elektrisches Vielschichtbauelement1. Electrical multilayer component
- mit wenigstens zwei voneinander verschiedenen, parallel geschalteten Kapazitäten (C]_, C2), die jeweils wenigstens zwei einander überlappende Elektrodenschichten (1) mit einer dazwischen angeordneten Dielektrikumschicht (2) aufweisen,with at least two mutually different capacitors (C) _, C2 connected in parallel, each having at least two overlapping electrode layers (1) with a dielectric layer (2) arranged between them,
- bei dem die Kapazitäten (C]_, C2) zu einem Schichtstapel (3) übereinander gestapelt und durch jeweils wenigstens eine Zwischenschicht (4) so voneinander beabstandet sind, daß das Bauelement unterschiedliche, durch die Kapazitäten (C_, C2) definierte Resonanzfrequenzen (f]_, f2) aufweist .- in which the capacitances (C] _, C2) are stacked to form a layer stack (3) and are spaced apart from one another by at least one intermediate layer (4) in such a way that the component has different resonance frequencies (C_, C2) defined by the capacitances (C_, C2) f ] _, f2).
2. Bauelement nach Anspruch 1, bei dem die Zwischenschichten (4) und die Dielektrikumschichten (2) aus demselben Keramikmaterial bestehen.2. The component according to claim 1, wherein the intermediate layers (4) and the dielectric layers (2) consist of the same ceramic material.
3. Bauelement nach Anspruch 1 bis 2, bei dem die Zwischenschichten (4) und die Dielektrikum- schichten (2) aus einer oder mehreren Schichten derselben Schichtdicke hergestellt sind.3. Component according to claim 1 to 2, wherein the intermediate layers (4) and the dielectric layers (2) are made from one or more layers of the same layer thickness.
4. Bauelement nach Anspruch 1 bis 3, bei dem die Außenkontur wenigstens einer Elektrodenschicht (1) wenigstens einen seitlichen Einschnitt (9) aufweist.4. The component according to claim 1 to 3, wherein the outer contour of at least one electrode layer (1) has at least one lateral incision (9).
5. Bauelement nach Anspruch 1 bis 4, an dessen Außenseite eine Markierung (5) angebracht ist, die dazu geeignet ist, die Oberseite des Schichtstapels (3) von dessen Unterseite zu unterscheiden.5. The component according to claim 1 to 4, on the outside of which a mark (5) is attached which is suitable for distinguishing the top of the layer stack (3) from the underside thereof.
6. Bauelement nach Anspruch 1 bis 5, bei dem wenigstens eine der Dielektrikumschichten (2) aus einem Material besteht, dessen Isolationswiderstand Spannungsabhängig ist .6. The component according to claim 1 to 5, in which at least one of the dielectric layers (2) a material whose insulation resistance is voltage-dependent.
7. Bauelement nach Anspruch 6, bei dem wenigstens eine der Dielektrikumschichten (2) aus einer Varistorkeramik besteht.7. The component according to claim 6, wherein at least one of the dielectric layers (2) consists of a varistor ceramic.
8. Bauelement nach Anspruch 6, bei dem sämtliche Dielektrikumschichten (2) aus einer Varistorkeramik bestehen.8. The component according to claim 6, in which all dielectric layers (2) consist of a varistor ceramic.
9. Bauelement nach Anspruch 1 bis 8, das durch Sintern eines Stapels von übereinanderliegenden keramischen Grünfolien hergestellt ist.9. The component according to claim 1 to 8, which is produced by sintering a stack of superimposed ceramic green foils.
10. Anordnung eines Bauelements gemäß Anspruch 1 bis 9 auf einer Leiterplatte (6), bei der die Schichten (1, 2, 4) des Bauelements parallel zur Leiterplatte (6) angeordnet sind und bei der die kleinere Kapazität (C2) näher an der Leiterplatte (6) liegt als die größere Kapazität (C]_) . 10. Arrangement of a component according to claims 1 to 9 on a circuit board (6), in which the layers (1, 2, 4) of the component are arranged parallel to the circuit board (6) and in which the smaller capacitance (C2) closer to the Printed circuit board (6) lies as the larger capacity (C ] _).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE2000164445 DE10064445A1 (en) | 2000-12-22 | 2000-12-22 | Electrical multilayer component and arrangement with the component |
DE10064445.7 | 2000-12-22 |
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WO2002052591A2 true WO2002052591A2 (en) | 2002-07-04 |
WO2002052591A3 WO2002052591A3 (en) | 2007-11-15 |
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PCT/DE2001/004818 WO2002052591A2 (en) | 2000-12-22 | 2001-12-20 | Electric multilayer component and arrangement with this component |
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DE (1) | DE10064445A1 (en) |
TW (1) | TW548669B (en) |
WO (1) | WO2002052591A2 (en) |
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US20150279569A1 (en) * | 2012-11-09 | 2015-10-01 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US20190198252A1 (en) * | 2017-12-21 | 2019-06-27 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
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DE10235011A1 (en) * | 2002-07-31 | 2004-02-26 | Epcos Ag | Electrical multilayer component |
DE102007020783A1 (en) | 2007-05-03 | 2008-11-06 | Epcos Ag | Electrical multilayer component |
DE102007031510A1 (en) | 2007-07-06 | 2009-01-08 | Epcos Ag | Electrical multilayer component |
WO2020132011A1 (en) | 2018-12-20 | 2020-06-25 | Avx Corporation | High frequency multilayer filter |
US11336249B2 (en) | 2018-12-20 | 2022-05-17 | KYOCERA AVX Components Corporation | Multilayer filter including a capacitor connected with at least two vias |
DE112019006334T5 (en) | 2018-12-20 | 2021-09-02 | Avx Corporation | MULTI-LAYER ELECTRONIC DEVICE WITH A CAPACITOR WITH A PRECISELY CONTROLLED CAPACITIVE AREA |
US11595013B2 (en) | 2018-12-20 | 2023-02-28 | KYOCERA AVX Components Corporation | Multilayer electronic device including a high precision inductor |
JP2022513526A (en) | 2018-12-20 | 2022-02-08 | エイブイエックス コーポレイション | Multilayer filter with protrusions to reduce return signal |
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US20150279569A1 (en) * | 2012-11-09 | 2015-10-01 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US9793053B2 (en) * | 2012-11-09 | 2017-10-17 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US9984828B2 (en) | 2012-11-09 | 2018-05-29 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US10236126B2 (en) | 2012-11-09 | 2019-03-19 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US20190157008A1 (en) * | 2012-11-09 | 2019-05-23 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US10622154B2 (en) | 2012-11-09 | 2020-04-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US20200211777A1 (en) * | 2012-11-09 | 2020-07-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US10847320B2 (en) | 2012-11-09 | 2020-11-24 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US11342124B2 (en) | 2012-11-09 | 2022-05-24 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US11694848B2 (en) | 2012-11-09 | 2023-07-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor |
US20190198252A1 (en) * | 2017-12-21 | 2019-06-27 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
US10770237B2 (en) * | 2017-12-21 | 2020-09-08 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
Also Published As
Publication number | Publication date |
---|---|
DE10064445A1 (en) | 2002-07-11 |
TW548669B (en) | 2003-08-21 |
WO2002052591A3 (en) | 2007-11-15 |
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