WO2002045168A1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
WO2002045168A1
WO2002045168A1 PCT/JP2000/008437 JP0008437W WO0245168A1 WO 2002045168 A1 WO2002045168 A1 WO 2002045168A1 JP 0008437 W JP0008437 W JP 0008437W WO 0245168 A1 WO0245168 A1 WO 0245168A1
Authority
WO
WIPO (PCT)
Prior art keywords
pads
semiconductor device
section
terminals
semiconductor
Prior art date
Application number
PCT/JP2000/008437
Other languages
French (fr)
Japanese (ja)
Inventor
Ikuo Nishimoto
Shiro Kano
Shigeo Miyagawa
Original Assignee
Yamatake Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatake Corporation filed Critical Yamatake Corporation
Priority to AU2001216493A priority Critical patent/AU2001216493A1/en
Priority to PCT/JP2000/008437 priority patent/WO2002045168A1/en
Priority to JP2002547232A priority patent/JP4186186B2/en
Publication of WO2002045168A1 publication Critical patent/WO2002045168A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1017—Shape being a sphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A semiconductor device which has a pad section (2) and an electronic circuit (4) on the semiconductor, the pad section having a plurality of pads (3), the electronic circuit being connected to the plurality of pads of the pad section and to a plurality of terminals on the semiconductor, a switch section (41) for selectively electrically connecting the plurality of pads and the plurality of terminals, and a connection control section for controlling selective connection of the switch section on the basis of information about the plurality of connecting terminals of an external device respectively connected to the plurality of pads of the pad section. This semiconductor device is adapted to easily make a matched connection with such external device as another semiconductor device.
PCT/JP2000/008437 2000-11-29 2000-11-29 Semiconductor device WO2002045168A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001216493A AU2001216493A1 (en) 2000-11-29 2000-11-29 Semiconductor device
PCT/JP2000/008437 WO2002045168A1 (en) 2000-11-29 2000-11-29 Semiconductor device
JP2002547232A JP4186186B2 (en) 2000-11-29 2000-11-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/008437 WO2002045168A1 (en) 2000-11-29 2000-11-29 Semiconductor device

Publications (1)

Publication Number Publication Date
WO2002045168A1 true WO2002045168A1 (en) 2002-06-06

Family

ID=11736731

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/008437 WO2002045168A1 (en) 2000-11-29 2000-11-29 Semiconductor device

Country Status (3)

Country Link
JP (1) JP4186186B2 (en)
AU (1) AU2001216493A1 (en)
WO (1) WO2002045168A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006324648A (en) * 2005-04-21 2006-11-30 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit, method of controlling electronic apparatus and semiconductor integrated circuit using it
JP2007520851A (en) * 2004-02-05 2007-07-26 マイクロン テクノロジー，インコーポレイテッド Dynamic command and / or address mirroring system and method for memory modules
JP2021068806A (en) * 2019-10-23 2021-04-30 ルネサスエレクトロニクス株式会社 Semiconductor device, semiconductor device connection processing method, and electronic device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61180995A (en) * 1986-02-07 1986-08-13 Nec Corp Semiconductor integrated circuit device
JPS6240833A (en) * 1985-08-16 1987-02-21 Omron Tateisi Electronics Co Setting system for code of transponder
JPH04119652A (en) * 1990-09-11 1992-04-21 Toshiba Corp Semiconductor integrated circuit device
JPH11211794A (en) * 1998-01-29 1999-08-06 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit and its checking method
JP2000216329A (en) * 1999-01-25 2000-08-04 Seiko Epson Corp Spherical semiconductor and semiconductor device using it
EP1030266A2 (en) * 1999-02-19 2000-08-23 Nippon Telegraph and Telephone Corporation Noncontact type IC card and system therefor
JP2000243907A (en) * 1999-02-17 2000-09-08 Sony Corp Semiconductor chip and package

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240833A (en) * 1985-08-16 1987-02-21 Omron Tateisi Electronics Co Setting system for code of transponder
JPS61180995A (en) * 1986-02-07 1986-08-13 Nec Corp Semiconductor integrated circuit device
JPH04119652A (en) * 1990-09-11 1992-04-21 Toshiba Corp Semiconductor integrated circuit device
JPH11211794A (en) * 1998-01-29 1999-08-06 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit and its checking method
JP2000216329A (en) * 1999-01-25 2000-08-04 Seiko Epson Corp Spherical semiconductor and semiconductor device using it
JP2000243907A (en) * 1999-02-17 2000-09-08 Sony Corp Semiconductor chip and package
EP1030266A2 (en) * 1999-02-19 2000-08-23 Nippon Telegraph and Telephone Corporation Noncontact type IC card and system therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007520851A (en) * 2004-02-05 2007-07-26 マイクロン テクノロジー，インコーポレイテッド Dynamic command and / or address mirroring system and method for memory modules
JP2006324648A (en) * 2005-04-21 2006-11-30 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit, method of controlling electronic apparatus and semiconductor integrated circuit using it
JP2021068806A (en) * 2019-10-23 2021-04-30 ルネサスエレクトロニクス株式会社 Semiconductor device, semiconductor device connection processing method, and electronic device
JP7282654B2 (en) 2019-10-23 2023-05-29 ルネサスエレクトロニクス株式会社 Semiconductor device, connection processing method for semiconductor device, and electronic device

Also Published As

Publication number Publication date
JP4186186B2 (en) 2008-11-26
AU2001216493A1 (en) 2002-06-11
JPWO2002045168A1 (en) 2004-04-08

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