WO2002025701A3 - Body-tied silicon on insulator semiconductor device structure and method therefor - Google Patents

Body-tied silicon on insulator semiconductor device structure and method therefor Download PDF

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Publication number
WO2002025701A3
WO2002025701A3 PCT/US2001/027704 US0127704W WO0225701A3 WO 2002025701 A3 WO2002025701 A3 WO 2002025701A3 US 0127704 W US0127704 W US 0127704W WO 0225701 A3 WO0225701 A3 WO 0225701A3
Authority
WO
WIPO (PCT)
Prior art keywords
region
trench isolation
silicon
device structure
soi
Prior art date
Application number
PCT/US2001/027704
Other languages
French (fr)
Other versions
WO2002025701A2 (en
Inventor
Byoung W Min
Michael A Mendicino
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to AU2001288845A priority Critical patent/AU2001288845A1/en
Publication of WO2002025701A2 publication Critical patent/WO2002025701A2/en
Publication of WO2002025701A3 publication Critical patent/WO2002025701A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7841—Field effect transistors with field effect produced by an insulated gate with floating body, e.g. programmable transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78612—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
    • H01L29/78615—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect with a body contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76283—Lateral isolation by refilling of trenches with dielectric material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Element Separation (AREA)

Abstract

A silicon on insulator (SOI) device structure and method therefore in which the SOI device structure utilizes a conductive body contact region (220) under a partial trench isolation region (250) to connect a doped region (320), which is a conductive area, with the body region (380) of the device such that the desired potential within the body region (380) can be achieved. This is accomplished by patterning the silicon on insulator (SOI) substrate and etching away the portion of the substrate within which the partial trench isolation is to be formed. Following the etching operation, an implant step dopes the remaining portion of the silicon film underlying the partial trench isolation region (250) to achieve the desired conductivity. Full trench isolation regions (240) are then patterned and formed. Subsequent formation of contacts (710, 720) and other layers of interconnect (750) complete formation of the SOI device.
PCT/US2001/027704 2000-09-19 2001-09-07 Body-tied silicon on insulator semiconductor device structure and method therefor WO2002025701A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001288845A AU2001288845A1 (en) 2000-09-19 2001-09-07 Body-tied silicon on insulator semiconductor device structure and method therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66555000A 2000-09-19 2000-09-19
US09/665,550 2000-09-19

Publications (2)

Publication Number Publication Date
WO2002025701A2 WO2002025701A2 (en) 2002-03-28
WO2002025701A3 true WO2002025701A3 (en) 2002-10-10

Family

ID=24670554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/027704 WO2002025701A2 (en) 2000-09-19 2001-09-07 Body-tied silicon on insulator semiconductor device structure and method therefor

Country Status (3)

Country Link
AU (1) AU2001288845A1 (en)
TW (1) TW506078B (en)
WO (1) WO2002025701A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7732287B2 (en) 2006-05-02 2010-06-08 Honeywell International Inc. Method of forming a body-tie
US7964897B2 (en) 2008-07-22 2011-06-21 Honeywell International Inc. Direct contact to area efficient body tie process flow
JP5736808B2 (en) * 2011-02-02 2015-06-17 富士通セミコンダクター株式会社 Semiconductor device and manufacturing method thereof
US8946819B2 (en) * 2013-05-08 2015-02-03 Globalfoundries Singapore Pte. Ltd. Silicon-on-insulator integrated circuits with local oxidation of silicon and methods for fabricating the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246562A (en) * 1996-03-14 1997-09-19 Nec Corp Semiconductor device of soi structure
JPH10242470A (en) * 1997-02-28 1998-09-11 Toshiba Corp Semiconductor device and fabrication thereof
EP0989613A1 (en) * 1998-08-29 2000-03-29 International Business Machines Corporation SOI transistor with body contact and method of forming same
DE10054098A1 (en) * 2000-03-24 2001-10-04 Mitsubishi Electric Corp Semiconductor device with element-insulating insulation films, has stacked structure comprising semiconductor substrate, insulating layer, and semiconductor layer in given sequence

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09246562A (en) * 1996-03-14 1997-09-19 Nec Corp Semiconductor device of soi structure
JPH10242470A (en) * 1997-02-28 1998-09-11 Toshiba Corp Semiconductor device and fabrication thereof
EP0989613A1 (en) * 1998-08-29 2000-03-29 International Business Machines Corporation SOI transistor with body contact and method of forming same
DE10054098A1 (en) * 2000-03-24 2001-10-04 Mitsubishi Electric Corp Semiconductor device with element-insulating insulation films, has stacked structure comprising semiconductor substrate, insulating layer, and semiconductor layer in given sequence

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) *

Also Published As

Publication number Publication date
WO2002025701A2 (en) 2002-03-28
TW506078B (en) 2002-10-11
AU2001288845A1 (en) 2002-04-02

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