WO2002011183A3 - Shape accuracy improvement using a novel calibration approach - Google Patents

Shape accuracy improvement using a novel calibration approach Download PDF

Info

Publication number
WO2002011183A3
WO2002011183A3 PCT/US2001/023998 US0123998W WO0211183A3 WO 2002011183 A3 WO2002011183 A3 WO 2002011183A3 US 0123998 W US0123998 W US 0123998W WO 0211183 A3 WO0211183 A3 WO 0211183A3
Authority
WO
WIPO (PCT)
Prior art keywords
shape accuracy
accuracy improvement
calibration approach
novel calibration
novel
Prior art date
Application number
PCT/US2001/023998
Other languages
French (fr)
Other versions
WO2002011183B1 (en
WO2002011183A2 (en
Inventor
William Drohan
William Goldfarb
Peter Harvey
Jaydeep Sinha
Original Assignee
Ade Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ade Corp filed Critical Ade Corp
Priority to JP2002516812A priority Critical patent/JP4080866B2/en
Priority to EP01959357A priority patent/EP1309987A2/en
Publication of WO2002011183A2 publication Critical patent/WO2002011183A2/en
Publication of WO2002011183A3 publication Critical patent/WO2002011183A3/en
Publication of WO2002011183B1 publication Critical patent/WO2002011183B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
PCT/US2001/023998 2000-07-31 2001-07-31 Shape accuracy improvement using a novel calibration approach WO2002011183A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002516812A JP4080866B2 (en) 2000-07-31 2001-07-31 Improvement of shape accuracy using new calibration method
EP01959357A EP1309987A2 (en) 2000-07-31 2001-07-31 Shape accuracy improvement using a novel calibration approach

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22213000P 2000-07-31 2000-07-31
US60/222,130 2000-07-31

Publications (3)

Publication Number Publication Date
WO2002011183A2 WO2002011183A2 (en) 2002-02-07
WO2002011183A3 true WO2002011183A3 (en) 2002-04-25
WO2002011183B1 WO2002011183B1 (en) 2002-07-11

Family

ID=22830972

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/023998 WO2002011183A2 (en) 2000-07-31 2001-07-31 Shape accuracy improvement using a novel calibration approach

Country Status (4)

Country Link
US (1) US6594002B2 (en)
EP (1) EP1309987A2 (en)
JP (2) JP4080866B2 (en)
WO (1) WO2002011183A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002011183A2 (en) * 2000-07-31 2002-02-07 Ade Corporation Shape accuracy improvement using a novel calibration approach
US7120514B1 (en) * 2001-03-22 2006-10-10 Advanced Micro Devices, Inc. Method and apparatus for performing field-to-field compensation
US6815958B2 (en) * 2003-02-07 2004-11-09 Multimetrixs, Llc Method and apparatus for measuring thickness of thin films with improved accuracy
US7519447B1 (en) * 2004-10-05 2009-04-14 Advanced Micro Devices, Inc. Method and apparatus for integrating multiple sample plans
JP4531685B2 (en) * 2005-11-24 2010-08-25 株式会社神戸製鋼所 Shape measuring device and shape measuring method
US7847954B2 (en) * 2008-05-15 2010-12-07 Kla-Tencor Corporation Measuring the shape and thickness variation of a wafer with high slopes
JP6513377B2 (en) * 2014-11-27 2019-05-15 Hoya株式会社 Method of measuring surface shape, method of manufacturing mask blank substrate, method of manufacturing mask blank, and method of manufacturing transfer mask
JP6186020B2 (en) * 2016-01-18 2017-08-23 神津精機株式会社 SORI value measurement method
US11435393B2 (en) 2017-11-03 2022-09-06 Tokyo Electron Limited Enhancement of yield of functional microelectronic devices
CN108828267B (en) * 2018-03-19 2021-05-25 长江存储科技有限责任公司 Method and device for measuring wafer warping degree
CN111146107B (en) * 2020-01-03 2022-11-29 浙江百盛光电股份有限公司 Wafer plane measuring instrument
CN112233995A (en) * 2020-12-15 2021-01-15 西安奕斯伟硅片技术有限公司 Auxiliary device for visual inspection of silicon wafer and visual inspection method of silicon wafer
CN115962735B (en) * 2022-12-26 2024-01-05 中国林业科学研究院林业研究所 Method for determining catalpa leaf shape based on geometric measurement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3748602A (en) * 1971-06-11 1973-07-24 It Telecommunicazioni Siemens Determination of equalizer setting in telecommunication system
US5048023A (en) * 1989-02-16 1991-09-10 The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration Asymmetric soft-error resistant memory
US5155633A (en) * 1991-07-30 1992-10-13 Applied Magnetics Corporation Anamorphic achromatic prism for optical disk heads

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750141A (en) * 1985-11-26 1988-06-07 Ade Corporation Method and apparatus for separating fixture-induced error from measured object characteristics and for compensating the measured object characteristic with the error, and a bow/warp station implementing same
JP2935603B2 (en) * 1992-01-14 1999-08-16 株式会社東京精密 Roundness measuring device with straightness measuring function
JP3532642B2 (en) * 1994-11-28 2004-05-31 黒田精工株式会社 Method and apparatus for measuring surface shape of wafer and other thin layers
GB9612383D0 (en) * 1995-12-07 1996-08-14 Rank Taylor Hobson Ltd Surface form measurement
JP3197001B2 (en) * 1996-02-26 2001-08-13 エーディーイー コーポレーション Wafer test and automatic calibration system
JP3392145B2 (en) * 1996-05-31 2003-03-31 トロペル コーポレーション Interferometer for thickness error measurement of semiconductor wafer
JPH10125755A (en) * 1996-10-22 1998-05-15 Hitachi Electron Eng Co Ltd Wafer flatness measuring mechanism
JPH11351857A (en) * 1998-06-08 1999-12-24 Kuroda Precision Ind Ltd Method and apparatus for measurement of surface shape of thin plate
US6275297B1 (en) * 1998-08-19 2001-08-14 Sc Technology Method of measuring depths of structures on a semiconductor substrate
JP2000234912A (en) * 1999-02-15 2000-08-29 Hitachi Electronics Eng Co Ltd Wafer thickness measuring equipment
JP3404318B2 (en) * 1999-04-02 2003-05-06 黒田精工株式会社 Surface shape measurement method
WO2002011183A2 (en) * 2000-07-31 2002-02-07 Ade Corporation Shape accuracy improvement using a novel calibration approach
JP2002243431A (en) * 2001-02-09 2002-08-28 Hitachi Electronics Eng Co Ltd Method for measuring warpage of wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3748602A (en) * 1971-06-11 1973-07-24 It Telecommunicazioni Siemens Determination of equalizer setting in telecommunication system
US5048023A (en) * 1989-02-16 1991-09-10 The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration Asymmetric soft-error resistant memory
US5155633A (en) * 1991-07-30 1992-10-13 Applied Magnetics Corporation Anamorphic achromatic prism for optical disk heads

Also Published As

Publication number Publication date
JP2008145439A (en) 2008-06-26
WO2002011183B1 (en) 2002-07-11
JP4486991B2 (en) 2010-06-23
US20020017911A1 (en) 2002-02-14
JP4080866B2 (en) 2008-04-23
JP2004505286A (en) 2004-02-19
EP1309987A2 (en) 2003-05-14
US6594002B2 (en) 2003-07-15
WO2002011183A2 (en) 2002-02-07

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