CN112233995A - Auxiliary device for visual inspection of silicon wafer and visual inspection method of silicon wafer - Google Patents
Auxiliary device for visual inspection of silicon wafer and visual inspection method of silicon wafer Download PDFInfo
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- CN112233995A CN112233995A CN202011471605.0A CN202011471605A CN112233995A CN 112233995 A CN112233995 A CN 112233995A CN 202011471605 A CN202011471605 A CN 202011471605A CN 112233995 A CN112233995 A CN 112233995A
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- silicon wafer
- visual inspection
- annular body
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- imaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
The invention relates to a visual inspection auxiliary device and a visual inspection method for a silicon wafer, wherein the visual inspection auxiliary device for the silicon wafer comprises a silicon wafer clamping structure, a reflecting structure and an imaging structure; the imaging structure comprises an imaging surface, wherein the imaging surface is provided with a first area and a second area which are arranged adjacently or at intervals; the reflection structure comprises a first reflection unit and a second reflection unit, wherein the first reflection unit and the second reflection unit are arranged on two opposite sides of the silicon wafer clamping structure, the first reflection unit is used for imaging a first surface of a silicon wafer in the first area, and the second reflection unit is used for imaging a second surface, back to the first surface, of the silicon wafer in the second area. The invention solves the problems of low efficiency and easy pollution of visual inspection of the silicon wafer.
Description
Technical Field
The invention relates to the technical field of silicon wafer detection, in particular to a silicon wafer visual inspection auxiliary device and a silicon wafer visual inspection method.
Background
In a silicon wafer processing line, there are currently two ways for visual inspection: the other is automatic inspection, which converts light signals into data and processes the data by a computer to judge whether the silicon chip is qualified.
The advantage of manual inspection is to slight defect, people's eye discernment is more clear, because people's eye is sensitive to slight content, to some defects that appear for the first time in addition, the effect of an early warning can be played in manual inspection, and not judge simply, but the silicon chip is positive to seeing earlier in the manual visual inspection process generally, overturns the silicon chip after the silicon chip openly inspects, then looks over the silicon chip back, and inefficiency, and personnel check time is longer, causes the contaminated probability of silicon chip bigger.
Disclosure of Invention
In order to solve the technical problems, the invention provides a visual inspection auxiliary device and a visual inspection method for a silicon wafer, which solve the problems of low visual inspection efficiency and easy pollution of the silicon wafer.
In order to achieve the purpose, the invention adopts the technical scheme that: a visual inspection auxiliary device for a silicon wafer comprises a silicon wafer clamping structure, a reflecting structure and an imaging structure;
the imaging structure comprises an imaging surface, wherein the imaging surface is provided with a first area and a second area which are arranged adjacently or at intervals;
the reflection structure comprises a first reflection unit and a second reflection unit, the first reflection unit and the second reflection unit are arranged on two opposite sides of the silicon wafer clamping structure, the first reflection unit is used for imaging a first surface of a silicon wafer in the first area, and the second reflection unit is used for imaging a second surface, back to back, of the silicon wafer in the second area.
Optionally, the silicon wafer clamping device further comprises a rotating structure for controlling the silicon wafer clamping structure to rotate, so that different regions to be inspected of the first surface of the silicon wafer are imaged in the first region, and different regions to be inspected of the second surface of the silicon wafer are imaged in the second region.
Optionally, the silicon wafer clamping structure comprises a fixing part, an annular body and at least two clamping pieces, the annular body is rotatably fixed on the fixing part, the clamping pieces are fixed on the annular body, each clamping piece comprises a connecting rod connected with the annular body, the first end of each connecting rod is connected onto the annular body, the second end of each connecting rod extends towards the center of the annular body, and the second end of each connecting rod is provided with a clamping part for clamping a silicon wafer.
Optionally, the fixing portion includes two bearings located on two opposite sides of the annular body, the bearings include an inner ring and an outer ring, a ball is disposed between the inner ring and the outer ring, the annular body is sleeved on the inner ring of the two bearings, when the annular body rotates, the inner ring rotates, and the outer ring is fixed.
Optionally, the rotating structure includes a driving motor, a transmission shaft and a belt, the transmission shaft is in transmission connection with the driving motor, and the belt is wound on the transmission shaft and the outer peripheral surface of the annular body.
Optionally, the annular body is fixed with three clamping pieces, and the three clamping pieces are uniformly arranged along the circumferential direction of the annular body.
Optionally, the silicon wafer clamping structure further comprises light sources respectively arranged on two opposite sides of the silicon wafer clamping structure.
Optionally, the imaging structure includes at least one lens, the imaging surface is provided on the lens, and the lens is located within the horizontal visual angle range of the visual inspection personnel, or the lens is located above the horizontal line of sight of human eyes.
The embodiment of the invention also provides a visual inspection method of a silicon wafer, which is applied to the auxiliary device for visual inspection of the silicon wafer and comprises the following steps:
clamping and fixing the silicon wafer, so that a to-be-detected area of a first surface of the silicon wafer is imaged in a first area of an imaging surface, a to-be-detected area of a second surface of the silicon wafer is imaged in a second area of the imaging surface, and the first area and the second area are arranged adjacently or at intervals;
and rotating the silicon wafer to enable different regions to be detected of the first surface of the silicon wafer to be imaged in the first region, and different regions to be detected of the second surface of the silicon wafer to be imaged in the second region.
The invention has the beneficial effects that: can wait to examine regional formation of image in the first region of imaging with the first face of silicon chip, wait to examine regional formation of image in the second region of imaging with the second face of silicon chip simultaneously, first region and second region are two regions of complete difference, like this, need not to overturn the silicon chip, visual inspection personnel can accomplish the inspection to the two sides of silicon chip, raise the efficiency, and reduced visual inspection personnel's check-up time, reduced the contaminated probability of silicon chip.
Drawings
FIG. 1 is a schematic structural diagram of an auxiliary device for visual inspection of a silicon wafer according to an embodiment of the present invention;
FIG. 2 shows a schematic view of a bearing coupled to an annular body in an embodiment of the invention;
FIG. 3 shows a schematic side view of an annular body in an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only for the purpose of facilitating description of the present invention and simplifying description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, the present embodiment provides an auxiliary device for visual inspection of a silicon wafer, which includes a silicon wafer clamping structure 1, a reflection structure and an imaging structure 5;
the imaging structure 5 comprises an imaging surface having a first region 51 and a second region 52 arranged adjacently or at an interval;
the reflection structure comprises a first reflection unit 3 and a second reflection unit 4 which are arranged on two opposite sides of the silicon wafer clamping structure 1, wherein the first reflection unit 3 is used for imaging a first surface of the silicon wafer 100 on a first area 51 of the imaging surface, and the second reflection unit 4 is used for imaging a second surface, opposite to the first surface, of the silicon wafer 100 on a second area 52 of the imaging surface.
In this embodiment, through reflection configuration's setting can wait to examine regional and the second facial waiting of first face of silicon chip 100 and wait to examine the regional two regions that form images simultaneously completely different on the imaging surface, need not the upset silicon chip, and visual inspection personnel can accomplish the inspection to the two sides of silicon chip 100, raises the efficiency, and has reduced visual inspection personnel's check-up time, has reduced the contaminated probability of silicon chip 100.
The region to be inspected may be a partial region or a whole region of a corresponding surface of the silicon wafer 100, and may be determined according to a relative position relationship between the silicon wafer clamping structure and the reflection structure.
In order to effectively ensure that the region to be inspected on the first surface and the region to be inspected on the second surface of the silicon wafer 100 are imaged in two completely different regions on the imaging surface, in this embodiment, an adjusting structure may be further included for adjusting the positions of one or more of the silicon wafer holding structure 1, the first reflection unit 3, and the second reflection unit 4. The specific structural form of the adjusting structure can be various, for example, the adjusting structure can include a rotating unit for controlling the horizontal rotation of the silicon wafer clamping structure 1 and a lifting unit for controlling the lifting of the silicon wafer clamping structure 1, the rotating unit can include a rotating table, the silicon wafer clamping structure 1 is fixed on the rotating table, and the lifting unit can include a lifting cylinder capable of controlling the lifting of the rotating table.
Of course, the position of at least one of the silicon wafer holding structure 1, the first reflection unit 3 and the second reflection unit 4 may be manually adjusted to reduce the cost.
In this embodiment, for convenience of imaging, the imaging structure 5 may include two lenses pivotally connected to each other, one lens having the first area 51 and one lens having the second area 52, and the angles of the two lenses may be adjusted to facilitate imaging on the basis that the imaging surface faces the inspector.
It should be noted that, in the embodiment, when the silicon wafer 100 is inspected, the silicon wafer 100 is disposed perpendicular to the horizontal plane, which is beneficial to the position of the first reflection unit 3 and the second reflection unit 4, and is beneficial to the first reflection unit 3 to image the region to be inspected of the first surface of the silicon wafer 100 on the first region 51, and simultaneously, the second reflection unit 4 to image the region to be inspected of the second surface of the silicon wafer 100 on the second region 52.
In the embodiment, the wafer clamping device further comprises a rotating structure 2 for controlling the wafer clamping structure 1 to rotate, so that different regions to be inspected on the first surface of the wafer 100 are imaged on the first region 51, and different regions to be inspected on the second surface of the wafer 100 are imaged on the second region 52.
Exemplarily in this embodiment, the silicon wafer clamping structure 1 includes a fixing portion, an annular body 11 and at least two clamping members, the annular body 11 is rotatably fixed on the fixing portion, at least two the clamping members are fixed on the annular body 11, each the clamping member includes a connecting rod 10 connected to the annular body, a first end of the connecting rod 10 is connected to the annular body, a second end of the connecting rod 10 extends to the center of the annular body, and a clamping portion for clamping the silicon wafer 100 is provided at a second end of the connecting rod 10.
As shown in fig. 2, in this embodiment, the fixing portion includes two bearings 7 located on two opposite sides of the annular body 11, the bearings 7 include an inner ring and an outer ring, balls are disposed between the inner ring and the outer ring, the annular body 11 is sleeved on the inner ring of the two bearings 7, when the annular body 11 rotates, the inner ring rotates, and the outer ring is fixed.
In this embodiment, for example, the rotating structure 2 includes a driving motor, a transmission shaft and a belt 21, the transmission shaft is in transmission connection with the driving motor, and the belt 21 is wound around the transmission shaft and the outer peripheral surface of the annular body.
As shown in fig. 3, the annular body 11 includes a middle region 101 and edge regions 102 located at two sides of the middle region 101 along the axial direction, the edge regions 102 are connected to the inner rings of the corresponding bearings 7, the belt 21 is wound around the middle region 101, and the belt 21 drives the annular body 11 to rotate under the driving of the driving motor.
In this embodiment, the auxiliary device for visual inspection of the silicon wafer 100 further includes a base (not shown) for fixing the bearing 7.
In this embodiment, the connection between the silicon wafer clamping structure 1 and the silicon wafer 100 is a point contact, which reduces the contact area with the silicon wafer 100 and avoids damage or contamination to the silicon wafer 100.
In this embodiment, the clamping portion includes a U-shaped clamping plate, and two inner sides of the U-shaped clamping plate are respectively provided with a protrusion for contacting with the silicon wafer 100 to realize point contact.
In this embodiment, three clamping pieces are fixed on the annular body, and the three clamping pieces are uniformly arranged along the circumferential direction of the annular body.
The angle between two adjacent clamping pieces is 120 degrees, so that the force is uniformly applied to the silicon wafer 100, and the clamping stability of the silicon wafer 100 is improved.
In this embodiment, the auxiliary device for visual inspection of the silicon wafer 100 further includes light sources 6 respectively disposed on two opposite sides of the silicon wafer holding structure 1.
The light source 6 is arranged to enable the silicon wafer 100 to be imaged on an imaging surface more clearly, and it should be noted that, since the irradiation range of the light source 6 is limited and cannot be irradiated on the whole surface of the silicon wafer 100, the rotation of the silicon wafer 100 needs to be controlled by the rotation structure to realize the detection of different areas of each surface of the silicon wafer 100.
In the related art, visual inspection personnel are detecting silicon chip 100, and silicon chip 100 is located people's eye below, and silicon chip 100 detects and detects in the clean room, is provided with the clean air system in the clean room, blows off the particle pollution of people's head to silicon chip 100 easily, causes the pollution of silicon chip 100, to this problem, exemplarily in this embodiment, the imaging structure includes at least a lens, have on the lens the image plane, the lens is located visual inspection personnel's horizontal visual angle scope, perhaps the lens is located the top of people's eye horizontal sight.
By adopting the scheme, when the silicon wafer 100 is inspected, visual inspection personnel observe the imaging surface, and visually inspect the imaging surface or look up the imaging surface, so that the pollution of the personnel to the silicon wafer 100 is avoided.
The number of the lenses can be set according to actual requirements, and in one embodiment, the imaging structure may include two lenses pivotally connected to each other, one lens having the first area 51 and one lens having the second area 52.
In this embodiment, during detection, the annular body is vertically disposed (disposed in a direction perpendicular to a horizontal plane), so that the silicon wafer 100 is vertically disposed, in fig. 1, a side surface of the silicon wafer 100 faces a visual inspection person (but not limited thereto), an area (to-be-detected area) of the first surface of the silicon wafer 100 irradiated by the light source is reflected by the first reflecting unit to the first area 51 of the imaging surface, an area of the second surface of the silicon wafer 100 irradiated by the light source is reflected by the second reflecting unit to the second area 52 of the imaging surface, and after detection by the visual inspection person, the silicon wafer 100 rotates around its own central point through rotation of the rotating structure, so that the visual inspection person can detect other areas of the first surface of the silicon wafer 100 and detect other areas of the second surface of the silicon wafer 100.
The number of rotations and the rotation angle of the silicon wafer 100 are determined according to the area of the region of the silicon wafer 100 irradiated by the light source, for example, the region of the silicon wafer 100 irradiated by the light source occupies half of the silicon wafer 100, and the silicon wafer 100 can be detected only by one rotation.
The embodiment of the invention also provides a visual inspection method of a silicon wafer, which is applied to the auxiliary device for visual inspection of the silicon wafer and comprises the following steps:
clamping and fixing the silicon wafer, so that a to-be-detected area of a first surface of the silicon wafer is imaged in a first area of an imaging surface, a to-be-detected area of a second surface of the silicon wafer is imaged in a second area of the imaging surface, and the first area and the second area are arranged adjacently or at intervals;
and rotating the silicon wafer to enable different regions to be detected of the first surface of the silicon wafer to be imaged in the first region, and different regions to be detected of the second surface of the silicon wafer to be imaged in the second region.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A visual inspection auxiliary device for a silicon wafer is characterized by comprising a silicon wafer clamping structure, a reflecting structure and an imaging structure;
the imaging structure comprises an imaging surface, wherein the imaging surface is provided with a first area and a second area which are arranged adjacently or at intervals;
the reflection configuration including set up in the first reflection unit and the second reflection unit of the relative both sides of silicon chip clamping structure, first reflection unit be used for with the first face of silicon chip wait to examine regional imaging in first region, the second reflection unit be used for with the silicon chip with the second face that the first face was carried on the back mutually wait to examine regional imaging in the second region.
2. The visual inspection auxiliary device for silicon wafers as set forth in claim 1, further comprising a rotation structure for controlling the rotation of the silicon wafer holding structure so that different areas to be inspected on the first surface of the silicon wafer are imaged on the first area and different areas to be inspected on the second surface of the silicon wafer are imaged on the second area.
3. The visual inspection auxiliary device for the silicon wafer as claimed in claim 2, wherein the silicon wafer clamping structure comprises a fixing portion, an annular body and at least two clamping members, the annular body is rotatably fixed on the fixing portion, the at least two clamping members are fixed on the annular body, each clamping member comprises a connecting rod connected with the annular body, a first end of the connecting rod is connected on the annular body, a second end of the connecting rod extends towards the center of the annular body, and a clamping portion for clamping the silicon wafer is arranged at the second end of the connecting rod.
4. The visual inspection auxiliary device for the silicon wafer as claimed in claim 3, wherein the fixing portion comprises two bearings located at two opposite sides of the annular body in the axial direction, each bearing comprises an inner ring and an outer ring, a ball is disposed between the inner ring and the outer ring, the annular body is sleeved on the inner rings of the two bearings, when the annular body rotates, the inner rings rotate, and the outer rings are fixed.
5. The visual inspection auxiliary device for the silicon wafers as claimed in claim 4, wherein the rotating structure comprises a driving motor, a transmission shaft and a belt, the transmission shaft is in transmission connection with the driving motor, and the belt is wound on the outer peripheral surfaces of the transmission shaft and the annular body.
6. The visual inspection auxiliary device for the silicon wafers as claimed in claim 3, wherein three clamping members are fixed on the annular body, and the three clamping members are uniformly arranged along the circumferential direction of the annular body.
7. The visual inspection auxiliary device for the silicon wafer as claimed in claim 1, further comprising light sources respectively disposed at two opposite sides of the silicon wafer holding structure.
8. The visual inspection auxiliary device for silicon wafers as claimed in claim 1, wherein the imaging structure comprises at least one lens, the lens is provided with the imaging surface, the lens is positioned in the horizontal visual angle range of the visual inspection personnel, or the lens is positioned above the horizontal visual line of human eyes.
9. A visual inspection method for silicon wafers, which is applied to the auxiliary device for visual inspection of silicon wafers as claimed in any one of claims 1 to 8, and is characterized by comprising the following steps:
clamping and fixing the silicon wafer, so that a to-be-detected area of a first surface of the silicon wafer is imaged in a first area of an imaging surface, a to-be-detected area of a second surface of the silicon wafer is imaged in a second area of the imaging surface, and the first area and the second area are arranged adjacently or at intervals;
and rotating the silicon wafer to enable different regions to be detected of the first surface of the silicon wafer to be imaged in the first region, and different regions to be detected of the second surface of the silicon wafer to be imaged in the second region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011471605.0A CN112233995A (en) | 2020-12-15 | 2020-12-15 | Auxiliary device for visual inspection of silicon wafer and visual inspection method of silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011471605.0A CN112233995A (en) | 2020-12-15 | 2020-12-15 | Auxiliary device for visual inspection of silicon wafer and visual inspection method of silicon wafer |
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| CN112233995A true CN112233995A (en) | 2021-01-15 |
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| CN202011471605.0A Pending CN112233995A (en) | 2020-12-15 | 2020-12-15 | Auxiliary device for visual inspection of silicon wafer and visual inspection method of silicon wafer |
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| US6606154B1 (en) * | 1998-07-10 | 2003-08-12 | Nidek Co., Ltd. | Sample inspecting apparatus |
| US6156580A (en) * | 1998-11-18 | 2000-12-05 | Advanced Micro Devices, Inc. | Semiconductor wafer analysis system and method |
| US20020017911A1 (en) * | 2000-07-31 | 2002-02-14 | William Drohan | Shape accuracy improvement using a novel calibration approach |
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Application publication date: 20210115 |