WO2002011172A1 - Field emission display and method of manufacture - Google Patents
Field emission display and method of manufacture Download PDFInfo
- Publication number
- WO2002011172A1 WO2002011172A1 PCT/US2001/018977 US0118977W WO0211172A1 WO 2002011172 A1 WO2002011172 A1 WO 2002011172A1 US 0118977 W US0118977 W US 0118977W WO 0211172 A1 WO0211172 A1 WO 0211172A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- phosphor
- photosensitive
- photosensitive layer
- pair
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
- H01J9/22—Applying luminescent coatings
- H01J9/227—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines
- H01J9/2271—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines by photographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/08—Electrodes intimately associated with a screen on or from which an image or pattern is formed, picked-up, converted or stored, e.g. backing-plates for storage tubes or collecting secondary electrons
- H01J29/085—Anode plates, e.g. for screens of flat panel displays
Definitions
- the present invention relates, in general, to field emission displays and, more particularly, to an anode plate for a field emission display and methods of manufacturing the anode plate.
- Anode plates of field emission displays are comprised of a thick film system with individual "via-like" subpixels which hold phosphor.
- Phosphor is typically screen printed as a phosphor paste directly into each subpixel and subsequently fired.
- screen printing a phosphor paste is difficult and usually results in pinholes and poor phosphor uniformity. Pinholes occur due to the small feature size of the subpixel with respect to the silk screens. Poor phosphor uniformity occurs due to the nature of screen printing over a small well structure. More particularly, the phosphor paste at the beginning of the well structure will be thin and the phosphor paste at the end of the well structure will be thick.
- FIG. 1 is a bottom plan view of an anode plate for a field emission display in accordance with an embodiment of the present invention
- FIG. 2 is a cross-sectional view of the field emission display taken along section line 2-2 of FIG. 1;
- FIG. 3 is a cross-sectional view of the field emission display taken along section line 3-3 of FIG. 1;
- FIG. 4 is an isometric view of an anode plate at an early stage of manufacture in accordance with an embodiment of the present invention
- FIG. 5 is an isometric view of the anode plate of FIG. 4 further along in manufacture
- FIG. 6 is an isometric view of the anode plate of FIG. 5 further along in manufacture.
- the present invention provides a field emission display and a method for manufacturing the field emission display such that it has an anode structure that includes channels into which a phosphor paste is disposed.
- the channels containing the phosphor material may be referred to as phosphor channels.
- the channels allow formation of pinhole free phosphor films of uniform thickness in a cost efficient manner.
- FIG. 1 is a bottom plan view of an anode plate 10 for a field emission display 30 in accordance with an embodiment of the present invention.
- Anode plate 10 includes a substrate 11, which is made of a hard, transparent material, such as glass, quartz, or the like.
- a channel structure 12 is formed on substrate 11 from a plurality of photosensitive layers.
- Channel structure 12 defines a plurality of phosphor channels 13, 14, and 15, which contain the cathodoluminescent phosphors.
- the embodiment of FIG. 1 is described as a polychromatic display; however, this is not intended as a limitation of the present invention. That is, the present invention may be a monochromatic display.
- the phosphor material includes a red phosphor 23, a green phosphor 24, and a blue phosphor 25, which define a plurality of pixels.
- the dimensions of phosphor channels 13, 14, and 15 are about 75 micrometers wide dependent on the size of the display and about 10 micrometers deep.
- FIG. 2 is a cross-sectional view of field emission display 30 taken along section line 2-2 of FIG. 1.
- Field emission display 30 includes anode plate 10 and a cathode plate 31, which opposes anode plate 10.
- Cathode plate 31 is spaced apart from anode plate 10 by spacers 32 to define an interspace region 33 therebetween.
- One of the opposing edges of spacer 32 contacts one of the spacer regions of channel structure 12, and the other opposing edge of spacer 32 contacts cathode plate 31.
- Cathode plate 31 includes a substrate 34, upon which are formed a cathode electrode 35 and a plurality of electron emitters 36. Electron emitters 36 oppose phosphor channels 13, 14, and 15. It should be noted that only phosphor channel 13 is shown in
- Channel structure 12 has a plurality of channel walls 16, which define phosphor channels 13, 14, and 15.
- the phosphor material is disposed within phosphor channels 13, 14, and 15.
- FIG. 3 is a cross-sectional view of field emission display 30 taken along section line 3-3 of FIG. 1.
- FIG. 3 illustrates spacers 32 and photosensitive films 58 and 59 as further described hereinbelow.
- Anode plate 10 includes substrate 11, which can be made from a hard transparent material such as, for example, glass, quartz, or the like.
- a photosensitive film 58 is disposed on the surface of substrate 11.
- photosensitive film 58 is made using a conductive photo-printable material, which is available from E.I. du Pont de Nemours and Company of Wilmington Delaware, and sold under the trademark FODEL.
- the FODEL is a mixture including glass, silver metal, and a photosensitive polymer.
- the glass constituent has a bonding (e.g., melting, sintering) temperature less than about 600 degrees Celsius (°C).
- the silver composition of the FODEL ranges up to about 95 per cent by weight.
- the concentration of the photosensitive polymer is sufficient to impart photo-sensitivity to the dried FODEL film, so that it may be photo-patterned.
- Photosensitive film 58 further includes a contrast enhancement material, such as ruthenium oxide, nickel oxide, or the like which is admixed to the FODEL paste in an amount sufficient to form a black paste.
- the photosensitive film 58 is then light absorbing, so that it enhances the contrast of the display image.
- the black paste is then silk screened onto the dry surface of substrate 11 to form a black film.
- the black film has a thickness within a range of about 1.5 to 5 micrometers.
- Substrate 11 is then placed in a low temperature oven, and the black film is dried by heating at about 80 °C for about 20 minutes.
- the dried film is then exposed to radiation such as, for example, collimated ultra-violet (UV) light, through a mask.
- UV collimated ultra-violet
- a plurality of rectangularly shaped regions or stripes 26, 27, and 28 are exposed to the UV light. Rectangularly shaped regions 26, 27, and 28 are parallel to and spaced apart from one another. Regions 26, 27, and 28 are indicated in FIG. 4 by cross-hatches in photosensitive film 58.
- photosensitive film 59 is disposed on the photosensitive film 58.
- photosensitive film 59 is made using a conductive photo-printable material such as, for example, FODEL.
- the silver composition of the FODEL ranges up to 95 percent by weight.
- the concentration of the photo-sensitive polymer is sufficient to impart photo-sensitivity to the dried FODEL film, so that it may be photo-patterned.
- the thickness of photosensitive film 59 ranges from about 3 to about 8 micrometers.
- Substrate 11 is then placed in a low temperature oven, and the photosensitive film 59 is dried by heating at about 80 °C for about 20 minutes.
- the dried film is then exposed to radiation such as, for example, collimated UV light through a mask.
- radiation such as, for example, collimated UV light through a mask.
- the regions of the film that are to be removed are not exposed to the UV light.
- a plurality of rectangularly shaped regions or stripes 61, 62, 63, and 64 are exposed to the UV light. Rectangularly shaped regions 61, 62, 63, and 64 are spaced apart from one another. Regions 61, 62, 63, and 64 are indicated in FIG. 2 by cross- hatches in photosensitive film 59. It should be noted that the unexposed portions of photosensitive film 58 that are between substrate 11 and exposed regions 61, 62, 63, and 64 also become exposed during the exposure of photosensitive film 59.
- photosensitive films 58 and 59 are developed using a sodium bicarbonate solution having a pH of about 11.
- the developing step causes the unexposed regions of photosensitive films 58 and 59 to be removed, thereby forming channels 13, 14, and 15.
- developing photosensitive layers 58 and 59 results in the formation of a pair of light absorbing strips disposed on the substrate, wherein the pair of light absorbing strips are spaced apart from each other and substantially parallel to each other.
- the developing step further forms a pair of conductive ribs disposed over the pair of light absorbing strips, wherein the pair of conductive ribs are spaced apart from each other, substantially parallel to each other, and substantially pe ⁇ endicular to the pair of light absorbing strips, and wherein the pair of light absorbing strips and the pair of conductive ribs cooperate to form a channel.
- the resulting structure is then baked in an appropriate atmosphere to decompose the photo-sensitive polymer and bond the glass constituent, thereby forming a cohesive structure that is affixed to substrate 11.
- the resulting structure is baked in air at a temperature of about 520 °C for about 55 minutes.
- the times, temperatures, and atmosphere in which the resulting structure is baked is not a limitation of the present invention.
- Photosensitive films 58 and 59 have been described as negative photosensitive films, however, it should be understood this is not a limitation of the present invention. In other words, photosensitive films 58 and 59 can be positive photosensitive films or a combination of positive and negative photosensitive films.
- fiducials are typically formed at the develop step.
- the fiducials serve as alignment features when aligning two photomasks. Since two photomask steps are performed but there is only a single develop step, mechanical fiducials or alignment features (not shown) are formed on substrate 11.
- the alignment feature or fiducial is a rectangular shaped glass or ceramic material bonded to substrate 11.
- phosphors 23, 24, and 25 are deposited into phosphor channels 13, 14, and 15, respectively, by one of several phosphor deposition methods, which are known to one skilled in the art.
- An exemplary screen printing process for the deposition of phosphors 23, 24, and 25 includes using a patterned screen to deposit the phosphor material directly into phosphor channels 13, 14, and 15. If a fine pixel pitch is desired, a photo-sensitive polymer binder can be added to the phosphor materials. Then the different color phosphor materials are sequentially silk screened, photo- imaged, and developed. Thereafter, substrate 11 is heated at about 450 °C for about one hour to burn off the photo-sensitive binder.
- an aluminum overlayer (not shown) is formed on the phosphor material.
- Methods for forming the aluminum overlayer are known to those skilled in the art. It should be understood that formation of an aluminum overlayer is optional. Omission of the aluminum overlayer precludes the attenuation of the energy of the incident electrons, which otherwise would occur upon their traversal of the aluminum overlayer.
- the electrodes of field emission display 30 include cathode electrode 31 a gate extraction electrode 38, and phosphor channels 61, 62, 63, and 64.
- Gate extraction electrode 35 is spaced apart from cathode electrode 31 by a dielectric layer 39.
- Each electrode is designed to receive a potential from a potential source (not shown).
- potentials are applied to effect electron emission from selected ones of electron emitters 36, in a manner known to one skilled in the art.
- the emitted electrons traverse interspace region 33 to be received by the opposing phosphors 23, 24, or 25, thereby illuminating the corresponding pixel.
- the anode structure is patterned with a thin black surround matrix that is coupled with "ribs" of conductive material running parallel to the long edge of the phosphor sub-pixels, i.e., the phosphor channels.
- the phosphor channels can be filled with a phosphor material along the entire length of the anode structure, thus negating any sub-pixel printing and the drawbacks associated with this type of printing. For example, pinholes will not be formed in the phosphor material and it will have improved uniformity. Further, the anode structure of the present invention will be more cost efficient to manufacture.
- a white paste containing a gas-absorption material may be formed on photosensitive film 59.
- different types of alignment features may be formed on substrate 11.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01948341A EP1307895A1 (en) | 2000-07-27 | 2001-06-13 | Field emission display and method of manufacture |
KR10-2003-7001216A KR20030016431A (en) | 2000-07-27 | 2001-06-13 | Field emission display and method of manufacture |
AU6980401A AU6980401A (en) | 2000-07-27 | 2001-06-13 | Field emission display and method of manufacture |
JP2002516805A JP2004522253A (en) | 2000-07-27 | 2001-06-13 | Field emission display and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/626,979 | 2000-07-27 | ||
US09/626,979 US6716078B1 (en) | 2000-07-27 | 2000-07-27 | Field emission display and method of manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002011172A1 true WO2002011172A1 (en) | 2002-02-07 |
Family
ID=24512656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/018977 WO2002011172A1 (en) | 2000-07-27 | 2001-06-13 | Field emission display and method of manufacture |
Country Status (8)
Country | Link |
---|---|
US (1) | US6716078B1 (en) |
EP (1) | EP1307895A1 (en) |
JP (1) | JP2004522253A (en) |
KR (1) | KR20030016431A (en) |
CN (1) | CN1261964C (en) |
AU (1) | AU6980401A (en) |
TW (1) | TW523775B (en) |
WO (1) | WO2002011172A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101891999B (en) * | 2010-06-28 | 2013-01-02 | 彩虹集团公司 | Water soluble photosensitive fluorescent powder coating and method for making anode fluorescent powder layer by same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5670296A (en) * | 1995-07-03 | 1997-09-23 | Industrial Technology Research Institute | Method of manufacturing a high efficiency field emission display |
US5945780A (en) * | 1997-06-30 | 1999-08-31 | Motorola, Inc. | Node plate for field emission display |
WO2000072350A1 (en) * | 1999-05-21 | 2000-11-30 | Motorola Inc. | Field emission display anode having a conductive matrix |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424605A (en) | 1992-04-10 | 1995-06-13 | Silicon Video Corporation | Self supporting flat video display |
US5477105A (en) | 1992-04-10 | 1995-12-19 | Silicon Video Corporation | Structure of light-emitting device with raised black matrix for use in optical devices such as flat-panel cathode-ray tubes |
US5543683A (en) * | 1994-11-21 | 1996-08-06 | Silicon Video Corporation | Faceplate for field emission display including wall gripper structures |
JP3163563B2 (en) * | 1995-08-25 | 2001-05-08 | 富士通株式会社 | Surface discharge type plasma display panel and manufacturing method thereof |
US5818162A (en) | 1997-03-31 | 1998-10-06 | Candescent Technologies Corporation | Multi-level conductive black matrix |
US5858619A (en) | 1997-09-30 | 1999-01-12 | Candescent Technologies Corporation | Multi-level conductive matrix formation method |
JP3705914B2 (en) * | 1998-01-27 | 2005-10-12 | 三菱電機株式会社 | Surface discharge type plasma display panel and manufacturing method thereof |
JPH11246638A (en) * | 1998-03-02 | 1999-09-14 | Taiyo Ink Mfg Ltd | Photosensitive composition and backed material pattern obtained by using same |
JP2002033058A (en) * | 2000-07-14 | 2002-01-31 | Sony Corp | Front plate for field emission type display device |
JP2002117756A (en) * | 2000-10-05 | 2002-04-19 | Fujitsu Ltd | Method for manufacturing original die for barrier rib transfer and barrier rib forming method |
-
2000
- 2000-07-27 US US09/626,979 patent/US6716078B1/en not_active Expired - Fee Related
-
2001
- 2001-06-13 AU AU6980401A patent/AU6980401A/en active Pending
- 2001-06-13 JP JP2002516805A patent/JP2004522253A/en active Pending
- 2001-06-13 KR KR10-2003-7001216A patent/KR20030016431A/en not_active Application Discontinuation
- 2001-06-13 EP EP01948341A patent/EP1307895A1/en not_active Withdrawn
- 2001-06-13 CN CNB018133932A patent/CN1261964C/en not_active Expired - Fee Related
- 2001-06-13 WO PCT/US2001/018977 patent/WO2002011172A1/en not_active Application Discontinuation
- 2001-06-28 TW TW090115771A patent/TW523775B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5670296A (en) * | 1995-07-03 | 1997-09-23 | Industrial Technology Research Institute | Method of manufacturing a high efficiency field emission display |
US5945780A (en) * | 1997-06-30 | 1999-08-31 | Motorola, Inc. | Node plate for field emission display |
WO2000072350A1 (en) * | 1999-05-21 | 2000-11-30 | Motorola Inc. | Field emission display anode having a conductive matrix |
Non-Patent Citations (1)
Title |
---|
See also references of EP1307895A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2004522253A (en) | 2004-07-22 |
AU6980401A (en) | 2002-02-13 |
KR20030016431A (en) | 2003-02-26 |
CN1451170A (en) | 2003-10-22 |
EP1307895A1 (en) | 2003-05-07 |
CN1261964C (en) | 2006-06-28 |
US6716078B1 (en) | 2004-04-06 |
TW523775B (en) | 2003-03-11 |
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