WO2000072350A1 - Field emission display anode having a conductive matrix - Google Patents
Field emission display anode having a conductive matrix Download PDFInfo
- Publication number
- WO2000072350A1 WO2000072350A1 PCT/US2000/008067 US0008067W WO0072350A1 WO 2000072350 A1 WO2000072350 A1 WO 2000072350A1 US 0008067 W US0008067 W US 0008067W WO 0072350 A1 WO0072350 A1 WO 0072350A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- field emission
- phosphor
- conductive matrix
- emission display
- height
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
- H01J9/148—Manufacture of electrodes or electrode systems of non-emitting electrodes of electron emission flat panels, e.g. gate electrodes, focusing electrodes or anode electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/08—Electrodes intimately associated with a screen on or from which an image or pattern is formed, picked-up, converted or stored, e.g. backing-plates for storage tubes or collecting secondary electrons
- H01J29/085—Anode plates, e.g. for screens of flat panel displays
Definitions
- the present invention pertains to the area of field emission displays and, more particularly, to an anode plate for a field emission display.
- Phosphors for field emission displays are known in the art. They can be deposited onto a thin film of indium tin oxide (ITO) formed on a glass substrate. Phosphors can also be covered by a protective metal film, which is included to reflect light, dissipate electrical charge, and to provide mechanical stability to the phosphor material. Several metals may be used for the protective film, the most common being aluminum. To increase viewability, the phosphor is typically located within a non-transparent matrix material. Prior art configurations typically have the phosphor disposed at a depth less than that of the matrix material.
- This anode pbte configuration includes numerous hills and valleys, which makes it difficult to place a smooth protective metal film over the phosphors due to "tenting" of the metal film between features.
- the “tenting” of the metal film occurs when the metal film spans a gap and is not in contact with the phosphor.
- Two things generally happen under “tenting” conditions.
- the metal film adhesion is reduced, and can easily be pulled away from the anode plate by high electric fields developed within the field emission display.
- blistersxan form which are caused by the buildup- of organic material in the hills and valleys during processing.
- prior art phosphors disposed below the matrix material are required to use smaller, typically less efficient phosphor particle sizes to ensure no gaps exist between particles.
- FIG.l is a bottom plan view of a first embodiment of an anode plate for a field emission display in accordance with the invention
- FIG.2 is a cross-sectional view taken along the section line 2 - 2 of FIG.l of a field emission display in accordance with the invention.
- FIG.3 is another cross-sectional view taken along the section line 2 - 2 of FIG.l of a field emission display in accordance with the invention.
- An embodiment of the invention is for a field emission display having an anode structure that includes a conductive matrix, which contains cathodoluminescent phosphors.
- the phosphors are disposed within phosphor vias defined by the conductive matrix.
- the phosphors are disposed at a height equal to or greater than a surrounding conductive matrix material. This has the benefit of eliminating the "tenting" of a protective metal film associated with phosphors that are disposed below the matrix material. Yet another benefit is that a larger phosphor particle size may be used.
- Phosphors that are composed of larger phosphor particle sizes are typically more efficient than phosphors that are composed of smaller particle sizes.
- the conductive matrix provides a conduction path to prevent the accumulation of electrical charge on the phosphors, which would otherwise tend to repel approaching electrons.
- the conductive matrix can also define the anode electrode of the field emission display thereby obviating the need for a separate anode electrode, such as the ITO layer typically employed in the prior art.
- FIG.l is a bottom plan view of an anode plate 100 for a field emission display in accordance with the invention.
- Anode plate 100 includes a substrate 102 having a major surface, which is made from a hard, transparent material, such as glass, quartz, sapphire and the like.
- a conductive matrix 104 is affixed to the major surface of substiate 102.
- Conductive matrix 104 includes a thick film that is conductive.
- Conductive matrix 104 further defines a plurality of phosphor vias 105, which contain the cathodoluminescent phosphors.
- the embodiment of FIG.l includes a polychromatic display. So, the phosphor material includes a red phosphor 106, a green phosphor 108, and a blue phosphor 110, which define a plurality of pixels.
- the dimensions of phosphor vias 105 are about 50 x 180 micrometers.
- the present invention is not limited to polychromatic displays and can be embodied by a monochromatic field emission display.
- the particular phosphor configuration depicted in FIG.1 is exemplary and in no way intended to be limiting.
- FIG.2 is a cross-sectional view taken along the section line 2 - 2 of FIG.l of a field emission display 200 in accordance with an embodiment of the invention.
- Field emission display 200 includes anode plate 100 and further includes a cathode plate 202, which opposes anode plate 100.
- Cathode plate 202 is spaced apart from anode plate 100 by spacers (not shown) to define an interspace region 205 therebetween.
- Cathode plate 202 includes a substrate 203, upon which are formed a cathode electrode 208 and a plurality of electron emitters 206. Electron emitters 206 oppose phosphor vias 105.
- Conductive matrix 104 has a plurality of via walls 103, which define phosphor vias 105.
- the phosphor material is disposed within phosphor vias 105.
- the depth of each of phosphor vias 105 has the same depth as the phosphor 106, 108, 110 disposed therein.
- the depth of phosphor vias 105 and phosphor 106, 108, 110 are equal to the thickness of conductive matrix 104, which is about 10 - 12 micrometers.
- This configuration provides many advantages. For example, larger more efficient phosphor particle sizes can be used since the additional phosphor material ensures that gaps between phosphor particles are filled thereby preventing electrons from missing the phosphor particle and impinging on the substrate directly. This creates a more efficient phosphor layer and a correspondingly more efficient field emission display.
- no protective metal film is formed on the phosphor material.
- the omissio-i in die present invention of the prior art metal film precludes the attenuation of the energy of the incident electrons, which would otherwise occur upon their traversal of the prior art metal film. This retention of electron energy also improves the efficiency of field emission display 200.
- Phosphors 106, 108, 110 are disposed within phosphor vias 105 and are affixed to the surface of substrate 102.
- Conductive matrix 104 further includes a contrast layer 107 as shown in FIG.2.
- Contrast layer 107 is disposed on the surface of substrate 102 and is light-absorbing, so that it enhances the contrast of the display image.
- contrast layer 107 is made from the glass/metal mixture comprising conductive matrix 104 and further includes a contrast enhancement material, which imparts a dark, light-absorbing color to the film.
- This contrast enhancement constituent preferably includes an inorganic oxide, and most preferably, ruthenium oxide, which imparts a black color to contrast layer 107.
- conductive matrix 104 does not include the inorganic oxide.
- conductive matrix 104 does not include a distinct contrast layer 107.
- a contrast enhancement material such as ruthenium oxide, nickel oxide, and the like, is distributed throughout conductive matrix 104.
- contrast layer 107 includes black chrome or other "black" metallic like material.
- Conductive matrix 104 is made from a mixture of a glass and a conductive material, such as a metal, metal alloy or metallic oxide. Examples of metals include but are not limited to silver, copper, gold, palladium, platinum, combinations thereof, and the like.
- the conductive material composition of this mixture is within a range of about 5 - 100 per cent by volume.
- the metallic constituent imparts conductivity to conductive matrix 104.
- the composition of the conductive material is predetermined to impart to conductive matrix 104 a resistivity that is less than 100 ohm-cm, preferably less than 10 ohm-cm.
- the glass constituent of conductive matrix 104 includes a glass having a bonding (e.g., melting, sintering) temperature that is less than the strain point temperature of substrate 102.
- FIG.3 is the same field emission display 200 as shown in FIG.2, with the addition of protective metal film 220.
- Protective metal film 220 is preferably but not limited to aluminum and has thickness within a range of about 300 - 1000 angstroms.
- protective metal film 220 is disposed over conductive matrix 104 and phosphors 106, 108, 110. This configuration provides many advantages. For example, when phosphors 106, 108, 110 are the same height as surrounding conductive matrix, a smooth surface is created for the application of protective metal film 220.
- a defect free protective metal film 220 is created which avoids the "tenting" of prior art anode plate configurations.
- the absence of “tenting” creates a protective metal film 220 with improved adhesion characteristics and better reflectivity when applied to conductive matrix 104 and phosphors 106, 108, 110.
- the height of phosphor 106, 108, 110 can be greater than the height of conductive matrix 104 and not include the protective metal film 220. In still another embodiment of the invention, the height of phosphor 106, 108, 110 can be greater than the height of conductive matrix 104 and include the protective metal film 220.
- the field emission display 200 shown in FIG.2 and FIG.3 may include a conductive film disposed between substrate 102 and conductive matrix 104 and phosphor 106, 108, 110.
- Conductive film is made from a conductive, transparent material, such as ITO.
- the conductive matrix is formed by first forming on the anode substrate a film containing the glass/metal mixture.
- the film is further patterned to realize the phosphor vias.
- the patterning may be realized during the deposition step, such as by screen printing using a screen that defines the pattern of the phosphor vias.
- the patterning may be realized subsequent to the deposition step, such as by phcto-patterning of a film that is deposited by silk-screening.
- the film further includes a photo-sensitive material in an amount sufficient to make the film photo-patternable.
- Conductive matrix 104 is made using a conductive photo-printable material, which is available from E.I. du Pont de Nemours and Company of Wilmington, Delaware, and sold under the trademark FODEL.
- Contrast enhancement layer 107 includes FODEL and a contrast enhancement material, which includes an inorganic oxide such as ruthenium oxide and the like. The remainder of conductive matrix 104 can be standard white FODEL without the addition of a contrast enhancement material.
- the FODEL is a mixture including a glass and a silver metal. A photo-sensitive polymer is added to both FODEL mixtures in a concentration sufficient to impart photo-sensitivity to the dried FODEL film, so that it may be photo-patterned.
- FODEL with and without the contrast enhancement material is available from E.I. du Pont de Nemours and Company.
- Conductive matrix 104 is made by first forming contrast layer 107 on substrate 102.
- contrast layer 107 FODEL with a contrast enhancement material, which comes in the form of a black paste, is silk screened onto the dry surface of substrate 102 to form a black film.
- the black film has a thickness within a range of about 3 - 5 micrometers.
- Substrate 102 is then placed in a low temperature oven, and the black film is dried by heating at about 80°C for about 20 minutes.
- the white FODEL paste is silk screened onto the black film.
- Substrate 102 is then placed in a low temperature oven to dry the white film at a temperature of about 80°C for about 20 minutes.
- the dried films are then exposed to collimated ultra-violet light through a mask.
- the regions of the films that are to be removed are not exposed to the UN light.
- the films are developed using a sodium bicarbonate solution having a pH of 11.
- the developing step causes the unexposed regions to be removed, thereby forming phosphor vias 105.
- the resulting structure is then fired in air in the temperature range of 500°C and 550°C to dacciiipose the photo-sensitive polymer and bond the glass constituent, thereby forming a cohesive ctructure that is affixed to substrate 102.
- phosphor 106, 108, 110 is deposited into phosphor vias 105 by one of several phosphor deposition methods, which are known to one skilled in the art.
- An exemplary screen printing process for the deposition of phosphor 106, 108, 110 includes using a patterned screen to deposit the phosphor material directly into phosphor vias 105. If a fine pixel pitch is desired, a photosensitive polymer binder can be added to the phosphor materials. Then, the different color phosphor materials are sequentially silk screened, photo-imaged, and developed.
- a useful photo-sensitive polymer binder is a mixture of polyvinyl alcohol and ammonium dichromate.
- Another useful photo-sensitive polymer binder is polymethylene-p-diazodiphenylamine, which is obtainable from Fairmont Chemical
- Phosphor 106, 108, 110 is affixed within phosphor vias 105 by one of several methods, such as by van der Waals forces, the addition of a cement, the addition of a glue, and the like.
- a "glue" material can be incorporated into the phosphor paste prior to its deposition into phosphor vias 105.
- the glue material may include Tetraethyl orthosilicate (TEOS) or potassium silicate.
- the electrodes of field emission display 200 include cathode electrode 208, a gate extraction electrode 210, and conductive matrix 104.
- Gate extraction electrode 210 is spaced apart from cathode electrode 208 by a dielectric layer 212.
- Each electrode is designed to receive a potential from a potential source (not shown).
- potentials are applied to effect electron emission from selected ones of electron emitters 206, in a manner known to one skilled in the art.
- the emitted elect-ons traverse interspace region 205, to be received by the opposing phosphors 106, 108, 110.
- the accumulated charge is conducted away from phosphors 106, 108, 110 by conductive matrix 104.
- This operation of the invention obviates the need for an ITO sublayer, such as is employed in the prior art for the purposes of providing the anode potential and conducting charge away from the phosphors.
- the invention is embodied by a triode display. It is desired to be understood that the present invention can also be embodied by a diode display and by displays having greater than three electrodes, including, for example, focusing electrodes.
- protective metal film 220 is formed thereon.
- Protective metal film 220 preferably includes a thin layer of aluminum, having a thickness within a range of about 300 - 1000 angstroms.
- a standard aluminization process may be employed, as is known to one skilled in the art.
- a field emission display includes an anode plate that has a conductive matrix, which contains the phosphor disposed at a height equal to or greater than the height of the conductive matrix This has the benefit of eliminating the
- the anode plate of the invention obviates the need for the ITO conductive film and the protective metal film of the prior art. Methods for forming the conductive matrix of the invention do not require the use of a photo-resist.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000620654A JP2003500818A (en) | 1999-05-21 | 2000-03-27 | Anode of field emission display having conductive matrix |
EP00918431A EP1185999A1 (en) | 1999-05-21 | 2000-03-27 | Field emission display anode having a conductive matrix |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31621999A | 1999-05-21 | 1999-05-21 | |
US09/316,219 | 1999-05-21 |
Publications (1)
Publication Number | Publication Date |
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WO2000072350A1 true WO2000072350A1 (en) | 2000-11-30 |
Family
ID=23228071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/008067 WO2000072350A1 (en) | 1999-05-21 | 2000-03-27 | Field emission display anode having a conductive matrix |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1185999A1 (en) |
JP (1) | JP2003500818A (en) |
TW (1) | TW475341B (en) |
WO (1) | WO2000072350A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002011172A1 (en) * | 2000-07-27 | 2002-02-07 | Motorola, Inc. | Field emission display and method of manufacture |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003109487A (en) * | 2001-09-28 | 2003-04-11 | Canon Inc | Electronic excitation light emitting body and image display device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5463273A (en) * | 1994-05-04 | 1995-10-31 | Motorola | Dimpled image display faceplate for receiving multiple discrete phosphor droplets and having conformal metallization disposed thereon |
WO1999000822A1 (en) * | 1997-06-30 | 1999-01-07 | Motorola Inc. | Field emission display |
-
2000
- 2000-03-27 WO PCT/US2000/008067 patent/WO2000072350A1/en not_active Application Discontinuation
- 2000-03-27 JP JP2000620654A patent/JP2003500818A/en active Pending
- 2000-03-27 EP EP00918431A patent/EP1185999A1/en not_active Withdrawn
- 2000-04-11 TW TW89106735A patent/TW475341B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5463273A (en) * | 1994-05-04 | 1995-10-31 | Motorola | Dimpled image display faceplate for receiving multiple discrete phosphor droplets and having conformal metallization disposed thereon |
WO1999000822A1 (en) * | 1997-06-30 | 1999-01-07 | Motorola Inc. | Field emission display |
Non-Patent Citations (1)
Title |
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PATENT ABSTRACTS OF JAPAN * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002011172A1 (en) * | 2000-07-27 | 2002-02-07 | Motorola, Inc. | Field emission display and method of manufacture |
US6716078B1 (en) | 2000-07-27 | 2004-04-06 | Motorola Inc. | Field emission display and method of manufacture |
Also Published As
Publication number | Publication date |
---|---|
EP1185999A1 (en) | 2002-03-13 |
TW475341B (en) | 2002-02-01 |
JP2003500818A (en) | 2003-01-07 |
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