WO2002009904A1 - Laser beam machining method - Google Patents

Laser beam machining method Download PDF

Info

Publication number
WO2002009904A1
WO2002009904A1 PCT/JP2001/006131 JP0106131W WO0209904A1 WO 2002009904 A1 WO2002009904 A1 WO 2002009904A1 JP 0106131 W JP0106131 W JP 0106131W WO 0209904 A1 WO0209904 A1 WO 0209904A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beams
machined
width
laser
machining method
Prior art date
Application number
PCT/JP2001/006131
Other languages
English (en)
French (fr)
Inventor
Akio Satou
Kazuhisa Mikame
Original Assignee
Toyota Jidosha Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Jidosha Kabushiki Kaisha filed Critical Toyota Jidosha Kabushiki Kaisha
Priority to EP01949990A priority Critical patent/EP1310321B1/en
Priority to DE60139698T priority patent/DE60139698D1/de
Priority to US10/089,443 priority patent/US6838638B2/en
Publication of WO2002009904A1 publication Critical patent/WO2002009904A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/228—Selection of materials for cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2001/006131 2000-07-31 2001-07-16 Laser beam machining method WO2002009904A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP01949990A EP1310321B1 (en) 2000-07-31 2001-07-16 Laser beam machining method
DE60139698T DE60139698D1 (de) 2000-07-31 2001-07-16 Laserstrahlbearbeitungsverfahren
US10/089,443 US6838638B2 (en) 2000-07-31 2001-07-16 Laser beam machining method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000231182 2000-07-31
JP2000-231182 2000-07-31

Publications (1)

Publication Number Publication Date
WO2002009904A1 true WO2002009904A1 (en) 2002-02-07

Family

ID=18724051

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/006131 WO2002009904A1 (en) 2000-07-31 2001-07-16 Laser beam machining method

Country Status (4)

Country Link
US (1) US6838638B2 (ja)
EP (1) EP1310321B1 (ja)
DE (1) DE60139698D1 (ja)
WO (1) WO2002009904A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1500484A1 (en) * 2002-03-12 2005-01-26 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
JP2013248659A (ja) * 2012-06-04 2013-12-12 Micronics Japan Co Ltd 照射装置及び照射方法
WO2016059893A1 (ja) * 2014-10-15 2016-04-21 株式会社アマダホールディングス 半導体レーザ発振器
JP2016082219A (ja) * 2014-10-15 2016-05-16 株式会社アマダホールディングス 半導体レーザ発振器
WO2017026596A1 (ko) * 2015-08-12 2017-02-16 주식회사 포스코 강판 채색장치 및 채색방법

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100387488B1 (ko) * 2001-04-25 2003-06-18 현대자동차주식회사 레이저 클래딩 공법을 이용한 밸브 시트 제조방법
ATE282526T1 (de) * 2001-05-25 2004-12-15 Stork Prints Austria Gmbh Verfahren und vorrichtung zur herstellung einer druckform
ES2233523T3 (es) * 2001-05-25 2005-06-16 Stork Prints Austria Gmbh Procedimiento y dispositivo para la fabricacion de un molde de imprenta.
KR20030095313A (ko) * 2002-06-07 2003-12-18 후지 샤신 필름 가부시기가이샤 레이저 어닐링장치 및 레이저 박막형성장치
JP2004259153A (ja) * 2003-02-27 2004-09-16 Canon Inc 情報処理装置とその制御方法及び制御プログラム
DE20308097U1 (de) * 2003-05-23 2004-09-23 Kuka Schweissanlagen Gmbh Lasereinrichtung
JP4038724B2 (ja) * 2003-06-30 2008-01-30 トヨタ自動車株式会社 レーザクラッド加工装置およびレーザクラッド加工方法
DE102004001276A1 (de) * 2004-01-08 2005-08-04 Mtu Aero Engines Gmbh Verfahren zur Erwärmung von Bauteilen
US7199330B2 (en) * 2004-01-20 2007-04-03 Coherent, Inc. Systems and methods for forming a laser beam having a flat top
US7820936B2 (en) * 2004-07-02 2010-10-26 Boston Scientific Scimed, Inc. Method and apparatus for controlling and adjusting the intensity profile of a laser beam employed in a laser welder for welding polymeric and metallic components
US7897891B2 (en) * 2005-04-21 2011-03-01 Hewlett-Packard Development Company, L.P. Laser welding system
JPWO2007007766A1 (ja) * 2005-07-13 2009-01-29 古河電気工業株式会社 光照射装置および溶着方法
WO2007041460A2 (en) * 2005-10-03 2007-04-12 Aradigm Corporation Method and system for laser machining
EP1945400A4 (en) * 2005-11-10 2009-07-01 Quintessence Photonics Corp DEVICE FOR THE DYNAMIC CONTROL OF LASER BEAM PROFILES
US20070215575A1 (en) * 2006-03-15 2007-09-20 Bo Gu Method and system for high-speed, precise, laser-based modification of one or more electrical elements
US7545838B2 (en) * 2006-06-12 2009-06-09 Coherent, Inc. Incoherent combination of laser beams
DE102007006330A1 (de) * 2007-02-08 2008-08-14 Robert Bosch Gmbh Verfahren und Vorrichtung zum Laserschweißen
US20110278767A1 (en) * 2010-05-17 2011-11-17 David Aviel Direct engraving of flexographic printing plates
US10201877B2 (en) 2011-10-26 2019-02-12 Titanova Inc Puddle forming and shaping with primary and secondary lasers
US11141815B2 (en) 2013-09-24 2021-10-12 Ipg Photonics Corporation Laser processing systems capable of dithering
US10583530B2 (en) * 2017-01-09 2020-03-10 General Electric Company System and methods for fabricating a component with laser array
DE102021130289A1 (de) * 2021-11-19 2023-05-25 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Laserauftragschweißen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04327391A (ja) * 1991-04-25 1992-11-16 Nec Corp レーザ加工機
JPH1158665A (ja) * 1997-08-27 1999-03-02 Asahi Chem Ind Co Ltd レーザ製版装置

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US5319393A (en) * 1992-04-02 1994-06-07 Xerox Corporation Multiple-spot beam control for a raster output scanner an electrophotographic printer
ATE156739T1 (de) * 1993-05-19 1997-08-15 Fraunhofer Ges Forschung Verfahren zur materialbearbeitung mit diodenstrahlung
DE4339661C2 (de) * 1993-11-22 1996-09-26 Fraunhofer Ges Forschung Verfahren zum Herstellen von röhrenförmigen Rohlingen aus Fein- oder Feinstblech
DE4429913C1 (de) * 1994-08-23 1996-03-21 Fraunhofer Ges Forschung Vorrichtung und Verfahren zum Plattieren
EP0836905B1 (de) * 1996-10-20 2002-04-10 INPRO Innovationsgesellschaft für fortgeschrittene Produktionssysteme in der Fahrzeugindustrie mbH Verfahren und Anordnung zur temperaturgeregelten Oberflächenbehandlung, insbesondere zum Härten von Werkstückoberflächen mittels Laserstrahlung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04327391A (ja) * 1991-04-25 1992-11-16 Nec Corp レーザ加工機
JPH1158665A (ja) * 1997-08-27 1999-03-02 Asahi Chem Ind Co Ltd レーザ製版装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1310321A4 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1500484A1 (en) * 2002-03-12 2005-01-26 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
EP1500484A4 (en) * 2002-03-12 2008-07-23 Mitsuboshi Diamond Ind Co Ltd METHOD AND SYSTEM FOR MACHINE PROCESSING OF BRUSH MATERIAL
JP2013248659A (ja) * 2012-06-04 2013-12-12 Micronics Japan Co Ltd 照射装置及び照射方法
WO2016059893A1 (ja) * 2014-10-15 2016-04-21 株式会社アマダホールディングス 半導体レーザ発振器
JP2016082219A (ja) * 2014-10-15 2016-05-16 株式会社アマダホールディングス 半導体レーザ発振器
WO2017026596A1 (ko) * 2015-08-12 2017-02-16 주식회사 포스코 강판 채색장치 및 채색방법

Also Published As

Publication number Publication date
DE60139698D1 (de) 2009-10-08
EP1310321A1 (en) 2003-05-14
EP1310321B1 (en) 2009-08-26
US20020148818A1 (en) 2002-10-17
EP1310321A4 (en) 2007-08-08
US6838638B2 (en) 2005-01-04

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