WO2005027209A3 - Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure - Google Patents

Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure Download PDF

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Publication number
WO2005027209A3
WO2005027209A3 PCT/FR2004/050430 FR2004050430W WO2005027209A3 WO 2005027209 A3 WO2005027209 A3 WO 2005027209A3 FR 2004050430 W FR2004050430 W FR 2004050430W WO 2005027209 A3 WO2005027209 A3 WO 2005027209A3
Authority
WO
WIPO (PCT)
Prior art keywords
light radiation
multiple zone
zone
radiation annealing
structure capable
Prior art date
Application number
PCT/FR2004/050430
Other languages
English (en)
Other versions
WO2005027209A2 (fr
Inventor
Bernard Andre
Jean Hue
Berangere Hyot
Original Assignee
Commissariat Energie Atomique
Bernard Andre
Jean Hue
Berangere Hyot
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique, Bernard Andre, Jean Hue, Berangere Hyot filed Critical Commissariat Energie Atomique
Priority to US10/571,128 priority Critical patent/US20070036994A1/en
Priority to EP04816130A priority patent/EP1665351A2/fr
Publication of WO2005027209A2 publication Critical patent/WO2005027209A2/fr
Publication of WO2005027209A3 publication Critical patent/WO2005027209A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Recrystallisation Techniques (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

L’invention concerne un procédé de modification par effet thermique d’une caractéristique d’une première zone (4) d’un premier matériau, procédé dans lequel on dirige un faisceau laser vers une deuxième zone (2) en un deuxième matériau, la diffusion de l’énergie thermique de la deuxième zone vers la première zone permettant la modification thermique de celle-ci.
PCT/FR2004/050430 2003-09-17 2004-09-14 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure WO2005027209A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/571,128 US20070036994A1 (en) 2003-09-17 2004-09-14 Multiple zone structure capable of light radiation annealing and method using said structure
EP04816130A EP1665351A2 (fr) 2003-09-17 2004-09-14 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0350562 2003-09-17
FR0350562A FR2859820B1 (fr) 2003-09-17 2003-09-17 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure

Publications (2)

Publication Number Publication Date
WO2005027209A2 WO2005027209A2 (fr) 2005-03-24
WO2005027209A3 true WO2005027209A3 (fr) 2005-12-08

Family

ID=34203558

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2004/050430 WO2005027209A2 (fr) 2003-09-17 2004-09-14 Structure multi-zones apte a subir un recuit par irradiation lumineuse et procede de mise en oeuvre de ladite structure

Country Status (4)

Country Link
US (1) US20070036994A1 (fr)
EP (1) EP1665351A2 (fr)
FR (1) FR2859820B1 (fr)
WO (1) WO2005027209A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2921752B1 (fr) * 2007-10-01 2009-11-13 Aplinov Procede de chauffage d'une plaque par un flux lumineux.
US8546172B2 (en) 2008-01-18 2013-10-01 Miasole Laser polishing of a back contact of a solar cell
US8536054B2 (en) * 2008-01-18 2013-09-17 Miasole Laser polishing of a solar cell substrate
US8586398B2 (en) * 2008-01-18 2013-11-19 Miasole Sodium-incorporation in solar cell substrates and contacts
FR2938116B1 (fr) * 2008-11-04 2011-03-11 Aplinov Procede et dispositif de chauffage d'une couche d'une plaque par amorcage et flux lumineux.
US9859121B2 (en) * 2015-06-29 2018-01-02 International Business Machines Corporation Multiple nanosecond laser pulse anneal processes and resultant semiconductor structure
WO2020212736A1 (fr) * 2019-04-17 2020-10-22 Arcelormittal Procédé de fabrication d'un ensemble par soudage au laser
WO2020212737A1 (fr) * 2019-04-17 2020-10-22 Arcelormittal Procédé de fabrication d'un substrat métallique revêtu par dépôt de métal au laser

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140385A (ja) * 1992-10-26 1994-05-20 Fujitsu Ltd 高誘電率誘電体薄膜の製造方法
US5897381A (en) * 1996-07-11 1999-04-27 Lsi Logic Corporation Method of forming a layer and semiconductor substrate
WO2002023615A1 (fr) * 2000-09-11 2002-03-21 Ultratech Stepper, Inc. Procede de recuit d'une couche absorbante partielle exposee a une energie rayonnante et article comportant ladite couche
US6380044B1 (en) * 2000-04-12 2002-04-30 Ultratech Stepper, Inc. High-speed semiconductor transistor and selective absorption process forming same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4437139A (en) * 1982-12-17 1984-03-13 International Business Machines Corporation Laser annealed dielectric for dual dielectric capacitor
JPH073908B2 (ja) * 1987-07-16 1995-01-18 三菱電機株式会社 半導体発光装置の製造方法
JPH0241785A (ja) * 1988-08-02 1990-02-09 Toyo Seikan Kaisha Ltd レーザマーキング部材
GB9206086D0 (en) * 1992-03-20 1992-05-06 Philips Electronics Uk Ltd Manufacturing electronic devices comprising,e.g.tfts and mims

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140385A (ja) * 1992-10-26 1994-05-20 Fujitsu Ltd 高誘電率誘電体薄膜の製造方法
US5897381A (en) * 1996-07-11 1999-04-27 Lsi Logic Corporation Method of forming a layer and semiconductor substrate
US6380044B1 (en) * 2000-04-12 2002-04-30 Ultratech Stepper, Inc. High-speed semiconductor transistor and selective absorption process forming same
WO2002023615A1 (fr) * 2000-09-11 2002-03-21 Ultratech Stepper, Inc. Procede de recuit d'une couche absorbante partielle exposee a une energie rayonnante et article comportant ladite couche

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 442 (E - 1593) 17 August 1994 (1994-08-17) *
SUGII N ET AL: "CHANGE IN SURFACE MORPHOLOGIES WITH PULSED-LASER-DEPOSITION- TEMPERATURE FOR SRTIO3 AND BA0.7SR0.3TIO3 THIN FILMS ON PT ELECTRODES", THIN SOLID FILMS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH, vol. 323, no. 1/2, 22 June 1998 (1998-06-22), pages 63 - 67, XP000667921, ISSN: 0040-6090 *

Also Published As

Publication number Publication date
FR2859820B1 (fr) 2006-06-09
US20070036994A1 (en) 2007-02-15
FR2859820A1 (fr) 2005-03-18
EP1665351A2 (fr) 2006-06-07
WO2005027209A2 (fr) 2005-03-24

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