WO2001075424A1

WO2001075424A1 - Solder cream print visual inspection device and inspecting method

Info

Publication number: WO2001075424A1
Application number: PCT/JP2001/002525
Authority: WO
Inventors: Yoshiki Fujii
Original assignee: Omron Corporation
Priority date: 2000-03-30
Filing date: 2001-03-27
Publication date: 2001-10-11
Also published as: JP2001284790A; JP3557993B2

Abstract

A solder cream print visual inspection device has a monitor (17) on which a solder cream print portion to be inspected is displayed. A figure serving as a reference of the shape of good solder cream taught in advance is superposed on the solder cream print portion. These are visually compared to inspect the solder cream print portion. Thus a visual inspection supporting device for enabling easy, reliable visual inspection of a solder cream print is provided.

Description

Description Cream solder printing visual inspection device and inspection method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder printing visual inspection apparatus and a method for visually inspecting the power of a solder paste printed on a printed circuit board by performing cream solder printing normally.

Background art

Conventionally, a surface mount method has been used in which creamy solder is printed at a predetermined position on a printed circuit board, and then electronic components are mounted, the printed circuit board is passed through a reflow furnace, and the electronic components are soldered. .

In this case, using a solder inspection device incorporated in the production line, each printed part of the creamy solder printed on the printed circuit board with a cream solder printing machine is inspected using image processing technology, and print misalignment, print bleeding, printing Defective printing such as blurring was detected.

Conventionally, when the cream solder automatic inspection device detects a defective printing location, the operator stops the solder printing process line and checks the print quality of the solder on the test target board determined to be defective.

At this time, the inspector visually inspected the board after printing the cream solder using a magnifying glass or the like to judge whether printing was normal or not. At this time, the inspector made a judgment by comparing the shape of the printed part of the cream solder with the shape of the pad (also called land) under the cream solder. '

In the case of this conventional visual inspection method, when the amount of cream solder is small, and when the solder is blurred or when there is a problem with the shape, the lower pad can be seen, and it can be easily determined that the defect is defective. However, when the amount of cream solder was large and bleeding occurred, all or part of the lower pad could not be seen, making it difficult to judge and failing to overlook the defect.

Also, since cream solder is smaller than the mask opening size, it is generally Smaller. It is preferable to be able to adjust the process to achieve such a printing state, but if the technology of the factory is not sufficient, the size of the cream solder will vary. (The ratio of products that are considered acceptable) was low.

In addition, when inspecting using an automatic inspection device, the inspection is performed strictly in comparison with data such as the preset area standard and the mask opening shape. However, production was sometimes affected.

For this reason, in the automatic inspection process, an image of a board determined to be defective was displayed on a monitor, and an operator visually determined whether or not the board should be truly determined to be defective. At that time, the above-mentioned visibility problem occurred.

'The present invention has been made to solve the above-mentioned problems, and a visual inspection of a solder paste print that can easily and accurately determine whether cream solder printing is good or bad visually.查 It is an object to provide an apparatus and a method thereof. Disclosure of the invention

A visual inspection device for cream solder printing according to the present invention includes: a display device; an enlarged display unit for displaying an enlarged image of cream solder printing on the display device; And a guide display unit for displaying The reference shape is a figure for comparison with the displayed enlarged image of cream solder printing. As a standard shape, the shape of the mask opening of cream solder printing can be used. Further, when the shape of the printed cream solder tends to be larger or smaller than the mask opening, the shape of the mask opening may be enlarged or reduced as appropriate to obtain a reference shape. As a guideline, it is advantageous to use a cream solder shape or a shape close to it when cream printing is performed well. However, the present invention is not limited to this.For example, when the cream solder shape of a good product is a circle, it is a different shape, such as a square circumscribing the circle, but it is a guide to determine the size and displacement of the cream solder shape. A figure that can be used may be adopted. The standard shape according to the present invention is not a test standard in the sense that when the shape of the cream solder protrudes out of the shape, and is judged as defective, it is not a visual inspection standard. The purpose is to provide the inspector with a comparison object with the cream solder shape. It is left to the visual inspector to determine how much the size of the cream solder is different from that of the reference shape, or if the size is different or the position of the cream solder is determined to be defective. This makes it possible to perform flexible visual inspection suited to the actual situation of each printed circuit board mounting line.

The solder paste printed area to be inspected is enlarged and displayed on the display device, and the guide shape indicated in advance is superimposed on the display, so that it is easy to visually judge whether the solder paste is good or bad. Can be.

It is preferable that the reference shape and the cream solder printed portion are displayed in different colors, or each display state is changed, for example, such that one is indicated by a solid line and the other is indicated by oblique lines.

More preferably, the cream solder printing is automatically printed by a cream solder printing device and then inspected by an automatic cream solder inspection device. Used when it is determined that there is doubt.

The cream solder printing visual inspection device is used only when it is determined that the cream solder printing state is defective or defective, and it is used only when visual inspection is deemed necessary. At the same time, it can be installed on existing inspection equipment.

The cream solder printing visual inspection device according to the present invention is not integrated with the cream solder printing automatic inspection device, and utilizes the imaging function and display function of the automatic inspection device to print the cream solder printing on the display device of the automatic inspection device. This can be realized by displaying the reference shape over the enlarged image of. In this case, it is recommended that the part determined to be defective by the automatic inspection function be subjected to a visual inspection. Further, the automatic inspection device may be an independent device, and a portion determined to be defective by the automatic inspection device may be subjected to a visual inspection.

Furthermore, it can be used as a stand-alone visual inspection device without using the inspection results of the automatic inspection device.

In this case, if all parts of the board are inspected, the cream solder may dry out during that time. Is good.

More preferably, the print pattern of the cream solder printing is created using CAD, and the reference shape is generated from the CAD data.

Since the guide shape, which is used as a criterion for determining whether soldering is good or not, is created using CAD data that forms the print pattern of cream solder printing, an accurate guide shape can be easily generated.

The reference shape may be created based on the original data of the CAD data, or may be created based on the data obtained by imaging the pads on the board and the cream solder of a good product. You can also use a mouse to draw a figure such as a rectangle on an image of a good cream solder, and use that figure as a guide.

In another aspect of the present invention, a cream solder printing visual inspection method includes a step of displaying an enlarged image of cream solder printing on a display device, and superimposing the enlarged shape image of cream solder printing on a display device. The method includes a step of comparing the displayed step with the displayed enlarged image of the cream solder printing and the reference shape to determine a soldering state.

The solder paste print area to be inspected is enlarged and displayed on the display device, and the shape of the solder paste is displayed on the display in order to determine the soldering condition. It is possible to provide a detection method that can be easily judged visually. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a block diagram showing a main part of a cream solder printing visual inspection apparatus according to the present invention.

FIG. 2 is a flowchart showing the processing contents when the reference solder shape is stored. FIGS. 3A and 3B are diagrams showing the positional relationship between the mask opening dimension obtained from the CAD data and the pad portion where the soldering is performed.

FIG. 4 is a flowchart showing the detection processing procedure.

FIG. 5A and FIG. 5B are views showing a state in which a reference solder shape previously taught and superimposed on a cream solder printing part to be inspected is displayed. FIG. 6 is a block diagram showing the overall configuration of the automatic soldering inspection device for lime.

FIG. 7 is a flowchart showing the inspection processing procedure of the automatic inspection device.

FIG. 8 is a flowchart showing a teaching processing procedure of the automatic inspection device. 'FIG. 9 is a schematic diagram showing a state at the time of obtaining continuous information.

FIGS. 10A to 10D are diagrams showing an example of a case where the detection results are displayed in units of lands. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Referring to FIG. 1, the cream solder printing visual inspection device is mounted on an XY table 19 for horizontally moving a substrate on which the solder solder to be inspected is printed, and is mounted on the XY table 19. Camera 11 that captures the state of the printed cream solder on the printed board, monitor 17 that displays the captured image, storage device 21 that stores the approximate shape of good solder, keyboard and mouse, etc. Input / output device 18 and a personal computer 20 as a control device for controlling the entire device. Read the data file 22 from CAD that defines the mask opening that is the original data for performing cream solder printing on the personal computer 20. This data is stored in the storage device 21 as a reference shape, and is drawn on the overlay memory 14. In this embodiment, the reference shape is referred to as a reference solder shape.

The image captured by the camera 11 is converted into a digital signal by the A / D converter 12 and stored in the frame memory 13. The image of the CAD data having the mask opening close to the desired size drawn on the overlay memory 14 and the image of the frame memory 13 actually captured are synthesized by the synthesizing circuit (OR circuit) 15 and the D / D The data is converted into analog data by the A converter 16 and displayed on the monitor 17.

FIG. 2 is a flowchart showing a procedure for storing a reference solder shape. Referring to FIG. 2, in storing the reference solder shape, first, the shape of the mask opening of the target substrate is calculated using CAD data (step S11; hereinafter, the steps are abbreviated). Next, when it is desired to make the reference solder shape different from the size of the mask opening shape, a process of enlarging or reducing is performed (S12). In this way, the reference solder shape is It is necessary to make the size of the opening portion different from the size of the opening portion for the following reason.

That is, when the shape of the mask opening is large, the shape of the cream solder and the shape of the mask opening are almost the same, but when the shape of the mask opening is small, as in the case of ICs with small pins, the shape of the cream solder Is smaller than the mask opening shape. When the viscosity of the cream solder is high, it becomes smaller than the mask opening shape, and when it is low, it becomes larger than the mask opening shape. Also, if the processing of the edge portion of the mask opening is not smooth, the shape of the cream solder becomes small because the cream solder adheres to the edge portion and hardly comes off.

After the reference solder shape to be adopted is determined in this way, the shape is stored in the storage device 21 (S13).

Here, the relationship between the CAD data and the mask opening shape will be described. FIGS. 3A and 3B are enlarged schematic diagrams showing the relationship between the mask 31 and the substrate 30 placed on the substrate. FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view of a portion indicated by ΉΙ-BIB in FIG. 3A.

Referring to FIGS. 3A and 3B, the opening dimension a of the mask 31 for printing cream solder on the pad portion does not necessarily correspond to the dimension b of the pad 32. Specifically, the dimension a of the opening of the mask 31 is smaller than the dimension b of the pad 32. The standard solder shape specified here refers to this mask opening dimension a ο ο

FIG. 4 is a flowchart showing a processing procedure at the time of inspection in the inspection device. Referring to FIG. 4, at the time of inspection, first, the substrate is loaded onto the table 19 (S21).

Χ Υ Move the table 19 and image the board with the camera 11.

Next, an image of the board taken by the camera 11 and the reference solder shape stored in the shape memory device 16 are displayed on the moeta 17 superimposed (S23).

Next, the worker visually checks the monitor 17 to determine whether or not it is a non-defective product (S24). This is repeated until the entire substrate is inspected (S25).

When the inspection of the entire substrate is completed, the substrate is unloaded from the table 19.

FIGS. 5A and 5B are diagrams showing a state in which the reference solder shape is superimposed and displayed on the board imaging screen on the monitor 17. FIG. Figure 5A shows the basic concept and Figure 5 B shows a specific display example.

Referring to FIG. 5A, on monitor 17 is displayed a pre-learned reference solder shape 41 stored in shape memory device 21 and the actual cream image taken by camera 11 is displayed there. The status of the printed solder 4 2 is displayed. Here, the captured image of the substrate is indicated by dots.

From FIG. 5A, it can be seen that too much cream solder protrudes in the right direction in the figure. FIG. 5B is a diagram showing an actual screen display on the monitor 11 displaying a part of the substrate. In the figure, the solid line indicates the reference solder shape 41, and the hatched portion indicates the actual soldered state.

In this example, it can be seen that the amount of solder is small and shifted. Here, some pads are visible, but often not.

In FIG. 5B, the soldering state is shown by hatching, but it may be displayed in a desired color such as yellow on the actual monitor 11.

Next, a description will be given of an automatic cream solder inspection apparatus which requires the judgment of a soldering state using the cream solder printing visual inspection apparatus according to the present invention. FIG. 6 is a block diagram showing a main part of the automatic inspection device.

Referring to FIG. 6, this solder inspection apparatus obtains the parameters (judgment data) of the inspection area obtained by imaging the model board 134, which is the reference at the time of the inspection, and the imaging board 1335. It is to check whether the cream-like solder is correctly printed on each land of the board under test 135 by comparing the parameters of the area under test (data under test).

This automatic inspection device includes an image data input unit 101 and an image data processing unit 102. The image data input unit 101 captures an image of the cream-like solder printed on the substrates 134 and 135. Then, the imaging signal is input to the image data processing unit 102. The image data processing unit 102 converts the input imaging signal into image data, creates judgment data and data to be inspected based on the image data, compares the two data, and compares the two data with each other. Inspect the printed state of the creamy solder above.

Next, a specific description will be given. The image data input section 101 is connected to the conveyor 1 3 2 on which the model board 1 3 4 and the board to be inspected 1 3 5 are placed. (A front side of the table), and an imaging unit 105 for imaging the substrates 134 and 135 placed on the conveyor 132.

The light projecting unit 103 includes two fluorescent lamps that emit orange and blue light that becomes white light when both lights are superimposed on the substrates 134 and 135. The configuration of this light emitting unit is different in a board inspection device after reflow soldering. In this configuration, the imaging unit 105 includes a color television camera and an X-axis table 104 for moving the color television camera in the X direction (the direction of the arrow in the figure).

The Υ axis table 131 and the X axis table 104 each include a motor (not shown) that operates based on a control signal from the image data processing unit 102. The drive of these motors causes the Υ-axis table 131 to move the conveyor 132 in the Υ direction, the X-axis table 104 to move the color TV camera 105 in the X direction, and color the entire surface of the substrates 134, 135. It is configured so that an image can be captured by the TV camera 105.

Next, the image data processing unit 102 will be described. The image data processing unit 102 includes an imaging unit 107 connected to a color television camera 105, an imaging controller 108, an image processing unit 109, an X-axis table 104, and a ΧΥtable controller 110 that controls the Υ-axis table 131. , An inspection unit 111, a teaching unit 112, a designated location storage unit 113, an information acquisition and storage unit 122, a memory 114, and an information output unit 123, all of which are controlled by the CPU 130. .

To the CPU 130, a keyboard 116, a 01 display 117, a printer 118, a communication device 119, and a floppy disk device 120 are connected.

The imaging unit 107 converts the color signals R, G, and B supplied from the color television camera 105 from analog to digital and outputs the image data to the CPU 130 as image data. The memory unit 114 has a RAM (Random Access Memory) and is used as a control area of the CPU 130.

The imaging controller 115 includes an interface for connecting the CPU 130 to the light emitting unit 103 and the image capturing unit 107, adjusts the amount of light of each illuminant of the light emitting unit 103 based on an instruction from the CPU 130, and controls the color of the image capturing unit 107. TV camera 105 And the mutual balance of each hue light output.

The image processing unit 109 processes the image data supplied via the CPU 130, creates determination data by the model board 134 and data to be inspected by the board 135 to be inspected, and supplies the data to the CPU 130 and the inspection unit 111.

The XY table controller 110 has a CPU 130, X-axis table 104 and

An interface for connecting to the Y-axis table 131 is provided, and the X-axis table 104 and the Y-axis table 131 are controlled based on an instruction from the CPU 130. The inspection unit 111 compares the judgment data supplied from the CPU 130 in the inspection mode with the data to be inspected transferred from the image processing unit 109, and determines whether the printing state of the creamy solder on the substrate to be inspected 135 is good or bad. Is determined, and the result is output to the CPU 130.

The teaching unit 112 stores the determination data when supplied from the CPU 130 in the teaching mode. Further, when a transfer request is received from the CPU 130 in the inspection mode, the determination data is supplied to the CPU 130 and the inspection unit 111 in response to the request.

The information acquisition and storage unit 122 stores the inspection result data from the inspection unit 111 at the time of inspection. The inspection result data includes the position data of the land corresponding to each solder printing location, the position data of each component, and each land. And the data on the content of defects in the solder printing status.

In this case, the inspection results can be output in land units for each solder print location as needed, or multiple solder print locations can be output in one component unit for each component so that each land can be output. The position data and the position data of each part are stored in association with each other.

The keyboard 116 has various keys necessary for inputting operation information, data on the model board 134, and data on lands and parts on the model board 134.Data input from the keyboard 116 is sent to the CPU 130. Supplied. In addition, the keyboard 116 gives an instruction to display the detection result data stored in the information acquisition and storage unit 122 on the CRT display 117.

The display 117 is an image display such as an LCD (Liquid Crystal Display). It may be a vessel. The image data, the determination result, the key input data, and the like supplied from the CPU 130 are displayed on the screen. In addition, based on the inspection result data stored in the information acquisition / storage unit 122, a board image indicating the quality of each solder printed portion of the test board 135, an individual image showing a specific defective printing portion in an enlarged manner, and a defect image. Display the contents on the screen.

Next, a specific inspection procedure will be described with reference to FIG. The operation of inspecting the printed state of the creamy solder applied to the substrate to be inspected 135 will be described.

In the inspection, the CPU 130 acquires the date data of the day and the ID number (identification number) of the circuit board 135 to be inspected from the teaching unit 112 and the keyboard 116, reads the judgment data from the teaching unit 112, and inspects the data. It is supplied to the section 111 (S31).

Next, the CPU 130 starts the inspection after setting the imaging conditions and the data processing conditions (S32). If the substrate to be inspected 135 is supplied (S33), the substrate to be inspected 135 is set on the Y-axis table 131 (S34), and each hue pattern is processed by the image processing unit 102 in the same manner as in the tin tinder mode. Is detected, and test data is created based on each hue pattern and land position data (S35). ·

Next, the CPU 130 transfers the inspected data to the inspecting unit 111, compares the inspected data with the determination data, and determines the quality of the solder printing state for each land of the inspected board 135 (S 36, S 37).

If the judgment result is good, the inspection result is stored in the information acquisition / storage unit 122, and the test board 135 is unloaded (S39). If the judgment result is not good (NO in S38), the judgment result is supplied to the CRT display 117 or the printer 118 to be displayed and printed out (S42, S43). The inspection result is memorized and the substrate to be inspected 135 is carried out (S39). The contents to be displayed and printed out include the position of a defective portion on the board to be inspected 135, the component name, the content of the defect, and the like.

The board judged to be defective is subjected to a detailed inspection as to whether or not a force has been accurately determined using the cream solder printing visual inspection apparatus shown in FIG. sand That is, when the ratio of non-defective products judged to be defective is high, the traverse rate decreases and the efficiency deteriorates. In the opposite case, raise the standard because the incidence of defective products as substrates increases. Thus, the standard for performing appropriate processing is set in the teaching mode described later.

This series of processing (S33 to S45) is repeated as long as the supply of the board to be inspected 135 continues. When the supply of the board to be inspected 135 is interrupted, the inspection of the board to be inspected 135 is stopped. Determine whether or not the test has been completed, and repeat the inspection mode until the process is completed.

Next, a teaching mode for determining the reference of the above-described inspection apparatus will be described. That is, an operation of determining a criterion for judging the printing state of the creamy solder printed on the printed circuit board under the control of the CPU 130 is called a teaching mode. When inspecting a new substrate to be inspected 135, the CPU 130 executes the teaching mode in order to create judgment data serving as a reference at the time of inspection using the model substrate 134. The model board 13 4 is a board on which cream solder is correctly printed on each land.

First, the light emitting unit 103 and the imaging unit 107 are turned on by controlling each unit of the apparatus, and the imaging conditions and data processing conditions are adjusted. Next, the model board 13 4 is set on the Y-axis table 13 1, and the X-axis table 104 and the Y-axis tape 31 are controlled to control the imaging section 10 at each predetermined position on the model board 13 4. 7 is used to image the model substrate 1 3 4.

The model substrate 134 is imaged by the color television camera 105 of the imaging unit 107 while receiving irradiation light from the light projecting unit 103. That is, the light projecting unit 103 irradiates orange and blue light at different incident angles based on a control signal from the imaging controller 108, and projects the model substrate 134 with the mixed light. The imaging unit 107 captures the reflected light with a color television camera 105 and converts it into an electric signal.

In addition, the light emitting unit 103 receives the light of each hue emitted from the luminous body in order to detect the printing state of the creamy solder on the model board 134 under the illumination. The image is controlled by the imaging controller 108 so that the white light is completely obtained.

That is, the luminous body is composed of an luminous body that emits light of an orange light spectrum and a blue light spectrum having a band-wavelength luminous energy distribution such that white light is obtained by mixing colors. At the same time, the amount of each hue light is adjusted so that the light emitted from each illuminant mixes into white light.

The imaging unit 107 converts reflected light from the model substrate 134 into color signals R, G, and B of three primary colors by a color television camera 105 disposed above the light projecting unit 103, and supplies the signals to the image data processing unit 102. .

The color signals R, G, and B of the three primary colors obtained by this imaging operation are A / D converted, converted into image data, and stored in the memory 114 in real time. Next, the CPU 130 transfers the image data corresponding to each hue from the memory unit 114 to the image processing unit 109. The image processing unit 109 extracts red, green, and blue patterns by binarizing the image data of each hue with an appropriate threshold value for each hue.

In addition, the CPU 130 controls the image processing unit 109 to identify the position of each land by checking the brightness of the imaging button of each land. Thereafter, the CPU 130 creates determination data necessary for inspecting the substrate 135 to be inspected based on each hue pattern and land position data, stores it in the teaching unit 122, and ends the teaching mode. .

FIG. 8 is a flowchart showing a processing procedure in the above-mentioned tin inder mode. Referring to FIG. 8, in the teaching mode, first, it is determined whether or not a board is registered (S51). If there is a board registration (YES in S51), move to the target land (S52). Next, the parameters are corrected, and the substrate is loaded (S53, S54).

The position and type of the land are taught (S55). When the teaching is completed, the board is unloaded (S56, S57).

If the board is not registered in S51 (NO in S51), the board name is selected, the teaching operation is performed, and the board is loaded (S58, S59, S60). Next, it moves to the target land (S61), and corrects the parameters (S61, S62). This is repeated until it is completed (S63).

Upon completion, it is determined whether or not to replace the board (S64). If there is a board replacement (YES in S64), the process returns to S61.

If the board is not replaced (NO in S64), the process is repeated until the correction is completed. When the processing is completed (YES in S65), the substrate is unloaded (S66).

FIG. 9 is a schematic diagram showing a processing state when acquiring continuous information of a substrate. As shown in Fig. 9, data at the same location on each board is acquired continuously.

FIG. 10A to FIG. 10D are diagrams showing display states of each board at the time of inspection.Information acquisition ・ A state in which the inspection results stored in the storage unit 122 are displayed on the CRT display 117. FIG.

Referring to FIG. 10A, on board 1, the inspection result is OK and the measured value is 0 because there is no displacement between the land and the cream solder portion.

In the case of the substrate 2 shown in FIG. 10B, the measured value is 1 and the inspection result is determined to be OK.

In the example of the substrate 3 shown in FIG. 10C, although the measured value is offset 2, the inspection result is determined to be OK.

In the substrate N shown in FIG. 10D, there is a deviation of 5 and exceeds a predetermined threshold value, so that the detection result is determined to be NG.

In the above embodiment, CAD data for creating data for forming lands on a substrate is used as reference data. However, the present invention is not limited to this, and CAD data for creating CAD data is not limited to this. Original data may be used. In addition, the image may be obtained by imaging the substrate, or the data may be manually created by a person.

The visual inspection device described above can be used for visually inspecting a portion determined to be defective by such an automatic inspection device. The automatic inspection device may be provided with the function of the visual inspection device of the present invention, and the CRT display 117 may display a guide shape superimposed on the enlarged image of the cream solder printing.

The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. Industrial applicability.

The cream solder printing visual inspection device has a display device and a cream solder on the display device. The display includes an enlarged display section for displaying an enlarged image of the solder printing, and a guide display section for displaying a pre-taught guide shape superimposed on the enlarged image of the cream solder printing.

A guide for providing a visual inspector with a target to be compared with the cream solder shape, which is displayed on the display device with the cream solder print area to be inspected enlarged and displayed in advance and superimposed on the display. Since the shape is displayed, it is possible to provide a visual inspection apparatus and a method for a tarim solder print that can easily determine whether soldering is good or bad by visual inspection. .

Claims

The scope of the claims

1. display device (17),

An enlarged display unit (13, 15) for displaying an enlarged image of the cream solder printing on the display device (17);

A cream solder print visual inspection device, comprising: a guide display unit (14, 15) for displaying a guide shape previously taught on the enlarged image of the cream solder print.

2. The cream solder printing is scheduled to be performed at a predetermined position in a predetermined shape.

The visual inspection of claim 1, wherein the reference shape is a shape for determining whether or not the cream solder printing is performed at a predetermined size at the predetermined position. Inspection equipment.

3. The cream solder printing visual inspection according to claim 1, wherein the cream solder printing is performed using a predetermined mask (31), and the reference shape is a shape of an opening of the mask (31).查 Equipment.

4. The cream solder printing visualization according to any one of claims 1 to 3, wherein the enlarged image of the cream solder printing and the reference shape are displayed in different modes.

5. The cream solder printing visual inspection device according to claim 4, wherein the different aspects include different colors.

6. The cream solder printing is automatically printed by the cream solder printing device and then inspected by the cream solder automatic inspection device.

The cream according to claim 1, wherein the cream solder printing visual inspection device is used when the automatic soldering device determines that the printing condition of the cream solder is defective or suspected to be defective. Visual inspection equipment for solder printing.

7. The cream solder printing visual inspection device according to claim 6, wherein the cream solder printing visual inspection device and the cream solder automatic inspection device are integrated.

8. The print pattern of the cream solder printing is created using CAD, and the reference shape is generated from the CAD data (22). Item 20. A cream solder printing visual inspection device according to item 9.

9. A step of displaying an enlarged image of the cream solder printing on a display device, and a step of displaying a guide shape previously taught on the enlarged image of the cream solder printing.

A step of comparing the displayed enlarged image of the cream solder printing with a reference shape to determine a soldering state, and visually inspecting the cream solder printing.