WO2001038597A3 - Verfahren zur regelung von sputterprozessen - Google Patents

Verfahren zur regelung von sputterprozessen Download PDF

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Publication number
WO2001038597A3
WO2001038597A3 PCT/EP2000/010782 EP0010782W WO0138597A3 WO 2001038597 A3 WO2001038597 A3 WO 2001038597A3 EP 0010782 W EP0010782 W EP 0010782W WO 0138597 A3 WO0138597 A3 WO 0138597A3
Authority
WO
WIPO (PCT)
Prior art keywords
sputtering processes
regulating sputtering
analysis
regulating
frequency
Prior art date
Application number
PCT/EP2000/010782
Other languages
English (en)
French (fr)
Other versions
WO2001038597A2 (de
Inventor
Bernd Szyszka
Niels Malkomes
Original Assignee
Fraunhofer Ges Forschung
Bernd Szyszka
Niels Malkomes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung, Bernd Szyszka, Niels Malkomes filed Critical Fraunhofer Ges Forschung
Priority to AT00977458T priority Critical patent/ATE240423T1/de
Priority to EP00977458A priority patent/EP1232293B1/de
Priority to DE50002220T priority patent/DE50002220D1/de
Priority to US10/148,099 priority patent/US6797128B1/en
Priority to JP2001539934A priority patent/JP2003516472A/ja
Priority to KR1020027006719A priority patent/KR20020069194A/ko
Publication of WO2001038597A2 publication Critical patent/WO2001038597A2/de
Publication of WO2001038597A3 publication Critical patent/WO2001038597A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0042—Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements

Abstract

Die Erfindung betrifft ein Verfahren zur Regelung von MF- oder HF-Sputterprozessen, wobei eine harmonische Analyse der elektrischen Entladungsparameter durchgeführt und aufgrund der Analyseresultate die MF- bzw. HF-Leistung und/oder der Reaktivgasfluß geregelt wird.
PCT/EP2000/010782 1999-11-25 2000-11-02 Verfahren zur regelung von sputterprozessen WO2001038597A2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AT00977458T ATE240423T1 (de) 1999-11-25 2000-11-02 Verfahren zur regelung von sputterprozessen
EP00977458A EP1232293B1 (de) 1999-11-25 2000-11-02 Verfahren zur regelung von sputterprozessen
DE50002220T DE50002220D1 (de) 1999-11-25 2000-11-02 Verfahren zur regelung von sputterprozessen
US10/148,099 US6797128B1 (en) 1999-11-25 2000-11-02 Method for regulating sputtering processes
JP2001539934A JP2003516472A (ja) 1999-11-25 2000-11-02 スパッタプロセスの調整方法
KR1020027006719A KR20020069194A (ko) 1999-11-25 2000-11-02 스퍼터링 프로세스를 조정하는 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19956733.6 1999-11-25
DE19956733A DE19956733A1 (de) 1999-11-25 1999-11-25 Verfahren zur Regelung von Sputterprozessen

Publications (2)

Publication Number Publication Date
WO2001038597A2 WO2001038597A2 (de) 2001-05-31
WO2001038597A3 true WO2001038597A3 (de) 2001-10-25

Family

ID=7930287

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2000/010782 WO2001038597A2 (de) 1999-11-25 2000-11-02 Verfahren zur regelung von sputterprozessen

Country Status (7)

Country Link
US (1) US6797128B1 (de)
EP (1) EP1232293B1 (de)
JP (1) JP2003516472A (de)
KR (1) KR20020069194A (de)
AT (1) ATE240423T1 (de)
DE (2) DE19956733A1 (de)
WO (1) WO2001038597A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1681367A4 (de) * 2003-05-26 2008-08-27 Shinmaywa Ind Ltd Fimbildungsvorrichtung und filmbildungsverfahren
DE10359508B4 (de) 2003-12-18 2007-07-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Magnetronsputtern
US8500965B2 (en) * 2004-05-06 2013-08-06 Ppg Industries Ohio, Inc. MSVD coating process
DE102006061324B4 (de) * 2006-06-20 2008-07-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Regelung eines reaktiven Hochleistungs-Puls-Magnetronsputterprozesses und Vorrichtung hierzu
JP5256475B2 (ja) * 2011-02-10 2013-08-07 株式会社ユーテック 対向ターゲット式スパッタ装置及び対向ターゲット式スパッタ方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501016A1 (de) * 1991-03-01 1992-09-02 Leybold Aktiengesellschaft Verfahren zur Regelung eines reaktiven Sputterprozesses und Vorrichtung für die Durchführung des Verfahrens
US5939886A (en) * 1994-10-24 1999-08-17 Advanced Energy Industries, Inc. Plasma monitoring and control method and system

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Publication number Priority date Publication date Assignee Title
ZA884511B (en) * 1987-07-15 1989-03-29 Boc Group Inc Method of plasma enhanced silicon oxide deposition
ATE144004T1 (de) 1991-04-12 1996-10-15 Balzers Hochvakuum Verfahren und anlage zur beschichtung mindestens eines gegenstandes
FR2699934B1 (fr) 1992-12-30 1995-03-17 Lorraine Inst Nat Polytech Procédé de contrôle de la concentration en métalloïde d'un dépôt réalisés par voie physique en phase vapeur réactive à l'aide d'un plasma froid de pulvérisation.
CH686747A5 (de) 1993-04-01 1996-06-14 Balzers Hochvakuum Optisches Schichtmaterial.
DE19537212A1 (de) 1994-10-06 1996-04-11 Leybold Ag Vorrichtung zum Beschichten von Substraten im Vakuum
DE19506515C1 (de) 1995-02-24 1996-03-07 Fraunhofer Ges Forschung Verfahren zur reaktiven Beschichtung
DE19605932A1 (de) * 1996-02-17 1997-08-21 Leybold Systems Gmbh Verfahren zum Ablagern einer optisch transparenten und elektrisch leitenden Schicht auf einem Substrat aus durchscheinendem Werkstoff
DE19609970A1 (de) * 1996-03-14 1997-09-18 Leybold Systems Gmbh Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat
US5770922A (en) 1996-07-22 1998-06-23 Eni Technologies, Inc. Baseband V-I probe
US6351683B1 (en) * 1997-09-17 2002-02-26 Tokyo Electron Limited System and method for monitoring and controlling gas plasma processes
DE19800758C2 (de) * 1998-01-12 2000-08-31 Fraunhofer Ges Forschung Verfahren zum Beschichten von Folie aus Nickel oder einer Nickellegierung und beschichtete Folie aus Nickel oder einer Nickellegierung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501016A1 (de) * 1991-03-01 1992-09-02 Leybold Aktiengesellschaft Verfahren zur Regelung eines reaktiven Sputterprozesses und Vorrichtung für die Durchführung des Verfahrens
US5939886A (en) * 1994-10-24 1999-08-17 Advanced Energy Industries, Inc. Plasma monitoring and control method and system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SOBOLEWSKI M A ET AL: "Electrical measurements for monitoring and control of RF plasma processing", ADVANCED TECHNIQUES FOR INTEGRATED CIRCUIT PROCESSING II, SAN JOSE, CA, USA, 21-23 SEPT. 1992, vol. 1803, Proceedings of the SPIE - The International Society for Optical Engineering, 1993, USA, pages 309 - 320, XP000987027, ISSN: 0277-786X *

Also Published As

Publication number Publication date
EP1232293A2 (de) 2002-08-21
US6797128B1 (en) 2004-09-28
DE19956733A1 (de) 2001-06-28
JP2003516472A (ja) 2003-05-13
WO2001038597A2 (de) 2001-05-31
KR20020069194A (ko) 2002-08-29
ATE240423T1 (de) 2003-05-15
EP1232293B1 (de) 2003-05-14
DE50002220D1 (de) 2003-06-18

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