WO2001033636A1 - Boîtier semi-conducteur optique et procede de fabrication d'un tel boîtier - Google Patents
Boîtier semi-conducteur optique et procede de fabrication d'un tel boîtier Download PDFInfo
- Publication number
- WO2001033636A1 WO2001033636A1 PCT/FR2000/003021 FR0003021W WO0133636A1 WO 2001033636 A1 WO2001033636 A1 WO 2001033636A1 FR 0003021 W FR0003021 W FR 0003021W WO 0133636 A1 WO0133636 A1 WO 0133636A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical connection
- support plate
- front face
- component
- fixing
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 35
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000012780 transparent material Substances 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Definitions
- the present invention relates to a method of manufacturing such a package and an optical semiconductor package.
- the object of the present invention is to provide a structure of an optical semiconductor package comprising several semiconductor components and a method of manufacturing such a package so that this package has a reduced bulk and is capable of being used. immediately to preferably deliver image data from the data of an optical sensor semiconductor component.
- the optical semiconductor package comprises an electrical connection support plate, a first semiconductor component such as a microprocessor, one face of which is carried by a front face of said support plate, a second semi-component conductor, a front face of which comprises an optical sensor and a rear face of which is fixed to a front face of said first component, first means of electrical connection of said first component to the front face of said support plate, second means of electrical connection of said second component on the front face of said support plate, means for encapsulating said components stacked on said plate and said electrical connection means, comprising a transparent material in front of said optical sensor, and external electrical connection means arranged on an exposed part of said support plate.
- a first semiconductor component such as a microprocessor
- said first electrical connection means comprise electrical connection and fixing balls interposed between the rear face of said first component and the front face of said support plate.
- said second electrical connection means comprise electrical connection wires whose ends are respectively connected on the one hand to the front face of said second component and on the other hand to the front face of said plate support.
- said encapsulation means comprise a cup-shaped cover enveloping said components and said electrical connection means at a distance and fixed to said support plate, this cover comprising a bottom at least partly transparent extending opposite said optical sensor.
- the peripheral edge of said cover is preferably fixed to said support plate by gluing.
- said encapsulation means comprise a transparent coating material.
- said support plate carries passive electronic components which are electrically connected to it.
- said passive electronic components are preferably arranged outside said encapsulation means.
- said external electrical connection means comprise electrical connection balls arranged on the rear face of said support plate opposite to said components.
- said external electrical connection means comprise an electrical connection member fixed on said support plate.
- the method for manufacturing an optical semiconductor package successively comprises the following steps: the fixing and the electrical connection of a rear face of a first semiconductor component such as '' a microprocessor on a front face of an electrical connection support plate by means of electrical connection balls arranged between electrical connection zones of said faces, the fixing of the rear face of a second semiconductor component including a front face comprises an optical sensor, on a front face of said first component, the fixing of the ends of electrical connection wires between electrical connection areas of the front face of said second component, the encapsulation of said components stacked on said support plate and of said electrical connection means, by an at least transparent material in front of said optical sensor, and the fixing of external electrical connection means arranged on an exposed part of said support plate.
- said encapsulation operation consists in fixing the edge of a cup-shaped cover on said support plate, enveloping said components at a distance and the bottom of which is transparent opposite said optical sensor.
- said encapsulation operation consists in coating said components with a transparent coating material.
- the method can advantageously consist in fixing on said support plate and electrically connecting to the latter passive electronic components.
- the fixing of external electrical connection means consists of depositing electrical connection balls on the electrical connection zones provided on the rear face of said support plate.
- the attachment of external electrical connection means consists in attaching at least one electrical connection member to the electrical connection zones provided on said support plate.
- FIG. 1 shows a first step in manufacturing a housing according to the present invention
- FIG. 2 shows a second step of manufacturing said housing
- FIG. 3A shows a third step of manufacturing said housing according to a first alternative embodiment of the latter
- FIG. 3B shows a third step of manufacturing said housing, according to a second alternative embodiment of the latter
- - Figure 4A shows a fourth step of manufacturing said housing according to a first alternative embodiment of the latter
- FIG. AB shows a fourth step of manufacturing said housing according to a second alternative embodiment of the latter;
- - And Figure 5 shows a top view of the housing according to Figure 4 A.
- a substrate 1 consisting of a support plate which has internal and / or external lines constituting a network 2 of electrical connections and a first semiconductor component 3 such as a microprocessor or coprocessor.
- a rear face 4 of the first component 3 is fixed to a front face 5 of the support plate 1 by means of a multiplicity of metal balls 6 distributed in the form of a matrix. These balls 6 constitute electrical connections respectively between metal studs 7 and metal studs 8 produced on the surface on the rear face 4 of the first component 3 and the front face 5 of the support plate 1.
- the rear face 10 of a second semiconductor component is fixed by means of a layer of adhesive, or other fixing means.
- optic 11 on the front face 9 of the first component 3 the front face 12 of the optical component 11 having in its central part an optical sensor 13.
- one of the ends of the electrical connection wires 14 is fixed to metal studs 15 formed on the surface on the front face 13 of the second component 11 around the optical sensor 13 and the other end of the electrical connection wires 14 is fixed to metal studs 16 of the network 2, formed on the surface on the front face 5 of the plate support 1 and at a distance from the periphery of the first component 3.
- an encapsulation is carried out by arranging, above and at a distance from the components 3 and 11 and the electrical connection wires 14, a cover 17 in made of bowl delimiting a cavity 17a, the peripheral edge 18 of which is fixed on the front face 5 of the support plate 1 and the bottom 19 of which extends parallel to this support plate, at a distance from the optical sensor 13, and is made of a material transparent.
- the edge 18 of the cover 17 extends adjacent to the edge of the support plate 1 while its third side crosses the front face 5 of this support plate so as to leave a portion of this front face 5a not covered.
- the abovementioned encapsulation is obtained by forming on the front face 5 of the support plate 1 a block 20 of a transparent coating material whose front face 21 extends parallel to the support plate 1 and in front of the optical sensor 13.
- passive electronic components 22 such as resistors and / or capacitors, are fixed on the exposed part 5 a of the front face 5 of the support plate 1, laterally to the cover 17 or to the coating block 20, these electronic components 22 being at the same time electrically connected to the network 2 of the support plate 1.
- a multiplicity of metallic balls of external electrical connection 24 is fixed on the rear face 23 of the support plate 1 on metal studs 25 of the network 2 provided on the surface on this rear face 23 and distributed in the form of a matrix .
- a complete optical semiconductor package 26 equipped with an optical semiconductor component 11 and various electronic processing components 3 and 22, electrically connected in a suitable manner by the through the connection network 2 of the support plate 1 and capable of being connected to an external circuit thanks to the metal balls 24.
- the metal balls 24 for external electrical connection are replaced by an external electrical connection member or connector for connection 27 fixed on the front face 5 of the support face 1, at the end of its uncovered part 5a and connected to the network 2.
- a complete optical semiconductor package 26 equipped with an optical semiconductor component 11 and various electronic processing components 3 and 22, electrically connected in a suitable manner via the connection network 2 of the support plate 1 and capable of being connected to an external circuit thanks to the connection connector 27.
- the aforementioned passive components could also be at least partially encapsulated.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/129,297 US6969898B1 (en) | 1999-11-04 | 2000-10-30 | Optical semiconductor housing and method for making same |
EP00974602A EP1234339B1 (fr) | 1999-11-04 | 2000-10-30 | Boîtier semi-conducteur optique et procede de fabrication d'un tel boîtier |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9913777A FR2800910B1 (fr) | 1999-11-04 | 1999-11-04 | Boitier semi-conducteur optique et procede de fabrication d'un tel boitier |
FR99/13777 | 1999-11-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001033636A1 true WO2001033636A1 (fr) | 2001-05-10 |
Family
ID=9551690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2000/003021 WO2001033636A1 (fr) | 1999-11-04 | 2000-10-30 | Boîtier semi-conducteur optique et procede de fabrication d'un tel boîtier |
Country Status (4)
Country | Link |
---|---|
US (1) | US6969898B1 (fr) |
EP (1) | EP1234339B1 (fr) |
FR (1) | FR2800910B1 (fr) |
WO (1) | WO2001033636A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2827467B1 (fr) * | 2001-07-13 | 2003-12-12 | Kingpak Tech Inc | Structure de boitier empilee de detecteur d'image |
US7205532B2 (en) * | 2004-08-24 | 2007-04-17 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Integrated ball grid array optical mouse sensor packaging |
US7301242B2 (en) * | 2004-11-04 | 2007-11-27 | Tabula, Inc. | Programmable system in package |
US20060108672A1 (en) * | 2004-11-24 | 2006-05-25 | Brennan John M | Die bonded device and method for transistor packages |
US8201124B1 (en) | 2005-03-15 | 2012-06-12 | Tabula, Inc. | System in package and method of creating system in package |
TWI261932B (en) * | 2005-05-06 | 2006-09-11 | Harvatek Corp | Fabrication method of optoelectronic chip package structure having control chip |
DE102005053682A1 (de) * | 2005-11-10 | 2007-05-16 | Bosch Gmbh Robert | Sensor, Sensorbauelement und Verfahren zur Herstellung eines Sensors |
SG149725A1 (en) * | 2007-07-24 | 2009-02-27 | Micron Technology Inc | Thin semiconductor die packages and associated systems and methods |
SG149724A1 (en) | 2007-07-24 | 2009-02-27 | Micron Technology Inc | Semicoductor dies with recesses, associated leadframes, and associated systems and methods |
CN101944492A (zh) * | 2008-10-20 | 2011-01-12 | 联合科技公司 | 板上收缩封装 |
FR3014242A1 (fr) * | 2013-11-29 | 2015-06-05 | St Microelectronics Grenoble 2 | Dispositif electronique comprenant une puce de circuits integres et une plaque optique empilees |
CN204632759U (zh) * | 2015-03-25 | 2015-09-09 | 精材科技股份有限公司 | 一种芯片尺寸等级的感测芯片封装体 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01228178A (ja) * | 1988-03-09 | 1989-09-12 | Hitachi Ltd | 固体撮像装置 |
US5763943A (en) * | 1996-01-29 | 1998-06-09 | International Business Machines Corporation | Electronic modules with integral sensor arrays |
JPH11261044A (ja) * | 1998-03-11 | 1999-09-24 | Matsushita Electric Ind Co Ltd | 固体撮像素子付半導体装置及び該半導体装置の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04152772A (ja) * | 1990-10-17 | 1992-05-26 | Olympus Optical Co Ltd | 固体撮像装置 |
TW332348B (en) * | 1992-06-23 | 1998-05-21 | Sony Co Ltd | Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin. |
JPH06132423A (ja) * | 1992-10-19 | 1994-05-13 | Sharp Corp | 半導体装置の製造方法 |
JPH08172177A (ja) * | 1994-12-16 | 1996-07-02 | Toshiba Corp | 固体撮像モジュールおよび内視鏡装置 |
US5932875A (en) * | 1997-07-07 | 1999-08-03 | Rockwell Science Center, Inc. | Single piece integrated package and optical lid |
TW445608B (en) * | 2000-05-19 | 2001-07-11 | Siliconware Precision Industries Co Ltd | Semiconductor package and manufacturing method thereof of lead frame without flashing |
US20020096729A1 (en) * | 2001-01-24 | 2002-07-25 | Tu Hsiu Wen | Stacked package structure of image sensor |
EP1357605A1 (fr) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Boitier avec supports latérales pour un capteur d'image à semi-conducteur |
EP1357606A1 (fr) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Boítier pour un capteur d'image à semi-conducteur |
-
1999
- 1999-11-04 FR FR9913777A patent/FR2800910B1/fr not_active Expired - Fee Related
-
2000
- 2000-10-30 US US10/129,297 patent/US6969898B1/en not_active Expired - Lifetime
- 2000-10-30 EP EP00974602A patent/EP1234339B1/fr not_active Expired - Lifetime
- 2000-10-30 WO PCT/FR2000/003021 patent/WO2001033636A1/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01228178A (ja) * | 1988-03-09 | 1989-09-12 | Hitachi Ltd | 固体撮像装置 |
US5763943A (en) * | 1996-01-29 | 1998-06-09 | International Business Machines Corporation | Electronic modules with integral sensor arrays |
JPH11261044A (ja) * | 1998-03-11 | 1999-09-24 | Matsushita Electric Ind Co Ltd | 固体撮像素子付半導体装置及び該半導体装置の製造方法 |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 013, no. 551 (E - 857) 8 December 1989 (1989-12-08) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 14 22 December 1999 (1999-12-22) * |
Also Published As
Publication number | Publication date |
---|---|
FR2800910A1 (fr) | 2001-05-11 |
US6969898B1 (en) | 2005-11-29 |
EP1234339B1 (fr) | 2012-02-01 |
EP1234339A1 (fr) | 2002-08-28 |
FR2800910B1 (fr) | 2003-08-22 |
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