WO2001020674A3 - Assembly for electrical/electronic components - Google Patents

Assembly for electrical/electronic components Download PDF

Info

Publication number
WO2001020674A3
WO2001020674A3 PCT/GB2000/003348 GB0003348W WO0120674A3 WO 2001020674 A3 WO2001020674 A3 WO 2001020674A3 GB 0003348 W GB0003348 W GB 0003348W WO 0120674 A3 WO0120674 A3 WO 0120674A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical
assembly
electronic components
component
component carrier
Prior art date
Application number
PCT/GB2000/003348
Other languages
French (fr)
Other versions
WO2001020674A2 (en
Inventor
Gareth Thomas
Original Assignee
Llanelli Radiators Ltd
Gareth Thomas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Llanelli Radiators Ltd, Gareth Thomas filed Critical Llanelli Radiators Ltd
Priority to EP00956698A priority Critical patent/EP1254481A2/en
Priority to AU68565/00A priority patent/AU6856500A/en
Publication of WO2001020674A2 publication Critical patent/WO2001020674A2/en
Publication of WO2001020674A3 publication Critical patent/WO2001020674A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

An assembly for electrical/electronic components has one or more component carriers arranged to mate with receiving stations provided in a heatsink body and be in thermal communication contact with the heatsink body. Electrical or electronic components are carried by the component carrier and an electrical contact arrangement for a respective component/component carrier sub-assembly, is configured for connection to an electric/electronic circuit.
PCT/GB2000/003348 1999-09-10 2000-08-31 Assembly for electrical/electronic components WO2001020674A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP00956698A EP1254481A2 (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components
AU68565/00A AU6856500A (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9921307.6 1999-09-10
GB9921307A GB2354116B (en) 1999-09-10 1999-09-10 Assembly for electrical/electronic components

Publications (2)

Publication Number Publication Date
WO2001020674A2 WO2001020674A2 (en) 2001-03-22
WO2001020674A3 true WO2001020674A3 (en) 2001-09-27

Family

ID=10860626

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2000/003348 WO2001020674A2 (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components

Country Status (4)

Country Link
EP (1) EP1254481A2 (en)
AU (1) AU6856500A (en)
GB (1) GB2354116B (en)
WO (1) WO2001020674A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244791B4 (en) * 2002-09-26 2009-03-26 Robert Bosch Gmbh Device for cooling electronic components
DE102016212289B4 (en) 2016-07-06 2018-08-02 Conti Temic Microelectronic Gmbh Power electronics assembly with extruded cooling and protection element

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US4340902A (en) * 1977-11-18 1982-07-20 Fujitsu Limited Semiconductor device
EP0079238A2 (en) * 1981-11-10 1983-05-18 Fujitsu Limited Semiconductor devices provided with heat-dissipating means
US4396935A (en) * 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
US5018050A (en) * 1987-11-17 1991-05-21 Omron Tateisi Electronics Co. Solid state relay
US5463530A (en) * 1993-02-05 1995-10-31 The Bergquist Company Dual sided laminated semiconductor mounting
US5598322A (en) * 1994-09-27 1997-01-28 Watlow Winona, Inc. Power control system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7216999U (en) * 1971-05-05 1972-08-03 Soncini G Device for assembling electrical or electronic circuits
US3909679A (en) * 1974-11-07 1975-09-30 Rock Ola Mfg Corp Cabinet and heat sink for amplifier components
WO1981003734A1 (en) * 1980-06-19 1981-12-24 Digital Equipment Corp Heat pin integrated circuit packaging
DE3315583A1 (en) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München AN ELECTRICAL COMPONENT-CARRYING, EASILY COOLABLE CIRCUIT MODULE
DE3633625A1 (en) * 1985-12-04 1987-06-11 Vdo Schindling CARRIER PLATE
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US5179503A (en) * 1991-04-19 1993-01-12 United Technologies Automotive, Inc. Modular automobile power distribution box

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US4340902A (en) * 1977-11-18 1982-07-20 Fujitsu Limited Semiconductor device
US4396935A (en) * 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
EP0079238A2 (en) * 1981-11-10 1983-05-18 Fujitsu Limited Semiconductor devices provided with heat-dissipating means
US5018050A (en) * 1987-11-17 1991-05-21 Omron Tateisi Electronics Co. Solid state relay
US5463530A (en) * 1993-02-05 1995-10-31 The Bergquist Company Dual sided laminated semiconductor mounting
US5598322A (en) * 1994-09-27 1997-01-28 Watlow Winona, Inc. Power control system

Also Published As

Publication number Publication date
EP1254481A2 (en) 2002-11-06
GB2354116B (en) 2003-12-03
AU6856500A (en) 2001-04-17
WO2001020674A2 (en) 2001-03-22
GB2354116A (en) 2001-03-14
GB9921307D0 (en) 1999-11-10

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