AU3968600A - Circuit board with arrangement for cooling power components - Google Patents

Circuit board with arrangement for cooling power components

Info

Publication number
AU3968600A
AU3968600A AU39686/00A AU3968600A AU3968600A AU 3968600 A AU3968600 A AU 3968600A AU 39686/00 A AU39686/00 A AU 39686/00A AU 3968600 A AU3968600 A AU 3968600A AU 3968600 A AU3968600 A AU 3968600A
Authority
AU
Australia
Prior art keywords
arrangement
circuit board
cooling power
power components
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU39686/00A
Inventor
Gosta Baarman
Bjorn Holmstrom
Markku Jamsa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Publication of AU3968600A publication Critical patent/AU3968600A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
AU39686/00A 1999-04-14 2000-04-13 Circuit board with arrangement for cooling power components Abandoned AU3968600A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI990829A FI990829A0 (en) 1999-04-14 1999-04-14 Circuit boards showing an arrangement for cooling power components
FI990829 1999-04-14
PCT/FI2000/000311 WO2000062585A1 (en) 1999-04-14 2000-04-13 Circuit board with arrangement for cooling power components

Publications (1)

Publication Number Publication Date
AU3968600A true AU3968600A (en) 2000-11-14

Family

ID=8554423

Family Applications (1)

Application Number Title Priority Date Filing Date
AU39686/00A Abandoned AU3968600A (en) 1999-04-14 2000-04-13 Circuit board with arrangement for cooling power components

Country Status (3)

Country Link
AU (1) AU3968600A (en)
FI (1) FI990829A0 (en)
WO (1) WO2000062585A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005063281A1 (en) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Integrated electronic component, has printed circuit board, and electronic power components that are arranged on board, where board has inner layer, which is made of heat conducting material e.g. solid copper
DE102009058914A1 (en) * 2009-12-17 2011-06-22 Conti Temic microelectronic GmbH, 90411 High density interconnect-multi layered printed circuit board, has upper and lower board layers with conducting layers, where total surface of conducting layer of upper layer is larger than total surface of conducting layer of lower layer
DE102010039550A1 (en) * 2010-08-20 2012-02-23 Zf Friedrichshafen Ag control module
DE102011077206B4 (en) 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
DE102012223287A1 (en) * 2012-12-14 2014-06-18 Hella Kgaa Hueck & Co. Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper
DE102015222400A1 (en) * 2015-11-13 2017-06-08 Schaeffler Technologies AG & Co. KG Multilayer board and method for its production
CN105955437A (en) * 2016-04-21 2016-09-21 浪潮电子信息产业股份有限公司 Position placing method of power via hole and PCB

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258887A (en) * 1992-06-15 1993-11-02 Eaton Corporation Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
DE19516547A1 (en) * 1995-05-05 1996-11-14 Bosch Gmbh Robert Printed circuit board with an electrically conductive layer and method for producing a printed circuit board

Also Published As

Publication number Publication date
WO2000062585A1 (en) 2000-10-19
FI990829A0 (en) 1999-04-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase