DE102010039550A1 - control module - Google Patents

Abstract

Control module (1), in particular for a transmission control of a motor vehicle, wherein the control module (1) has a multi-layer printed circuit board (2) made uniformly as an HDI printed circuit board for networking control electronics (3) of the control module (1), the printed circuit board (2) forms a cooling area (11) in which inner conductor layers (9) provided for conducting power current are connected to one another in a thermally conductive manner, at least one circuit board surface (2a, 2b) formed by an outer circuit board layer (10) in the stacking direction (X) of the circuit board layers (6 ) is formed electrically insulated from the inner conductor layers (9) at least in the cooling area (11).

Description

The present invention relates to a control module according to the preamble of claim 1.

In the prior art is from the patent application DE 10 2010 003 678.1 a multi-layer printed circuit board for producing a control module, in particular a control module for a transmission control of a motor vehicle known, which is assembled from modules and has an integrated circuit in the HDI area. In the known printed circuit board, power currents can be conducted via conductors of enlarged cross section fitted in the printed circuit board. However, the known printed circuit board requires several complex process steps for its production.

Proceeding from this, the present invention seeks to propose a control module whose printed circuit board is small, can be made in a simple manner low and especially with a low process step volume and which is easily Entwärmbar in a simple way with simultaneous electrical insulation.

This object is achieved by the features of claim 1.

According to the invention, a control module is proposed, in particular for a transmission control of a motor vehicle, wherein the control module has a multilayer printed circuit board uniformly manufactured as HDI circuit board for networking control electronics of the control module, wherein the circuit board forms a cooling zone, in which provided for example for guiding power current inner conductor layers are thermally conductively connected to each other, wherein at least one of a printed circuit board surface formed by an outer circuit board layer in the stacking direction of the printed circuit board layers is formed electrically insulated at least in the heat dissipation against the power current carrying inner conductor layers.

According to the invention, a control module is furthermore proposed, wherein two printed circuit board surfaces which are opposite one another in the stacking direction of the printed circuit board layers and formed by an outer printed circuit board layer are formed so as to be electrically insulated against the inner conductor layers, at least in the cooling zone.

The inner conductor layers can be either thermally or electrically or thermally and electrically conductive.

In one embodiment of the control module according to the invention, an outer printed circuit board layer, in particular an outer printed circuit board substrate layer which forms a printed circuit board surface in the stacking direction of the printed circuit board layers, forms the printed circuit board surface in the stacking direction of the printed circuit board layers electrically insulating at least in the heat dissipation region.

In a further embodiment of the control module according to the invention are opposing outer printed circuit board layers, in particular outer PCB carrier layers, each forming a circuit board surface in the stacking direction of the PCB layers, the PCB surfaces in the stacking direction of the PCB layers at least in the heat dissipation against the inner conductor layers each electrically insulating.

In yet another embodiment of the control module according to the invention, a cooling element is arranged in the cooling area on at least one printed circuit board surface which is electrically insulated from the inner conductor layers and formed by an outer printed circuit board layer.

According to one aspect of the control module according to the invention, the inner conductor layers are thermally and electrically conductively connected to one another in the cooling area, in particular all of them.

According to a further aspect of the control module according to the invention, the inner conductor layers, in particular all inner conductor layers, are thermally and / or electrically conductively connected to one another in the cooling area by means of blind holes and / or buried vias, in particular exclusively by means of buried vias.

According to yet another aspect of the control module according to the invention is a Wärmeleitschicht, in particular a Wärmeleitpaste, further preferably an electrically non-insulating Wärmeleitschicht, arranged between the cooling element and an electrically insulated against the inner conductor layers, formed by an outer circuit board PCB surface in the stacking direction of the PCB layers in the cooling area.

According to the invention, a control module is proposed, wherein the printed circuit board carrier material layers of the printed circuit board are made of an epoxy resin material, in particular FR4.

In one embodiment of the control module according to the invention, the HDI printed circuit board is supported on the cooling element, in particular vibration.

There is the possibility that heat is generated directly on a component, for example Waste heat. This heat is passed directly into the inner conductor layers, which may be either the power-conducting inner conductor layer or else any other thermally or electrically conductive inner conductor layer, and from there into the cooling zone, in which the heat is dissipated, for example via vias, to the cooling elements.

Further features and advantages of the invention will become apparent from the following description of embodiments of the invention, with reference to the figures of the drawings, which show details essential to the invention, and from the claims. The individual features can be realized individually for themselves or for several in any combination in a variant of the invention.

Preferred embodiments of the invention are explained below with reference to the accompanying drawings. Show it:

1 by way of example and schematically a sectional view of a control module shown aborted according to a possible embodiment of the invention;

2 by way of example and schematically, a sectional view of a control module shown aborted according to another possible embodiment of the invention;

3 by way of example and schematically a side view of a control module according to the invention supported according to FIG 3 ; and

4 an example and schematically a sectional view of a control module according to the invention, which is accommodated in a housing cooling element.

In the following description of the figures, the same elements or functions are provided with the same reference numerals.

The 1 to 4 show by way of example and schematically in each case a control module according to the invention 1 , where the 1 and 2 illustrate preferred embodiments in each case a broken sectional view. The control module 1 is intended for use in a motor vehicle, in particular a control module of a transmission control of a motor vehicle, furthermore in particular an integrated mechatronic transmission control of a motor vehicle.

The control module 1 has a multilayer printed circuit board, which according to the invention advantageously as HDI circuit board 2 (High-density interconnect circuit board) is formed, ie as a highly integrated circuit board, in particular all or uniform. Such an HDI circuit board 2 has finer wire structures and smaller vias than conventional circuit boards, eg. As conventional PCBs (Printed Circuit Boards). According to the invention, by using an HDI printed circuit board 2 a control module 1 can be realized with extremely compact dimensions, ie highly integrated.

The HDI printed circuit board according to the invention 2 is intended to be connected to the circuit board 2 recorded control electronics or the TCU 3 , z. B. 3 and 4 , the control module 1 to crosslink with other cooperating components, for. As with actuators, valves, sensors, etc. The control electronics 3 is z. B. a housing 4 housed, 3 and 4 , z. B. next to a likewise in the HDI circuit board 2 integrated, housed EMC filter assembly 5 ,

The multi-layered HDI printed circuit board or printed circuit board 2 has several PCB layers 6 on, which in each case an electrically insulating printed circuit board carrier material or base material layer 7 include. A circuit board layer 6 can continue at least one conductor layer 8th or a conductor layer, which on a carrier material layer 7 arranged and adapted to guide currents. The conductor layers 8th are each formed flat, the conductor layers 8th in particular form conductive surfaces and / or flat conductor tracks. The PCB layers 6 are in a stacking direction X for forming the multilayer printed circuit board 2 stacked, z. B. 1 and 2 ,

The multilayer printed circuit board 2 is formed 6-ply, ie has six electrically conductive, in particular planar layers or conductor layers 8th on which z. B. designed as copper layers and printed circuit board carrier material layers 7 are arranged. Alternatively, the HDI circuit board 2 also have a different number of layers, z. B. 8-ply be formed. The material from which the respective PCB carrier material layers 6 are manufactured, according to the invention is an epoxy resin material or an epoxy resin fiberglass material, preferably FR4.

The HDI circuit board 2 is designed to guide power currents, which can be accompanied by a sometimes significant heat development. Such power currents are z. B. to supply with the control module 1 or its control electronics 3 networked actuators guided or directed. Heat is also generated by power loss and is forwarded directly from components in inner conductor layers.

In order to be able to carry the power currents and at the same time a simple circuit board construction with good heat dissipation possibility of the HDI circuit board 2 To realize or heat to dissipate power loss, has the HDI PCB 2 According to the invention, a plurality of electrically conductive provided, in particular planar inner conductor layers 9 on, which below as inner conductor layers 9 are designated and which between PCB carrier material layers 7 are arranged, for. B. 1 and 2 , By forming such flat conductor layers can be a simple layer structure of the circuit board 2 can be achieved, which requires only a few conventional manufacturing steps.

They are inner conductor layers 9 electrically connected to each other, preferably all. Due to the electrical Ankontaktierung each other, a uniform current distribution of the power currents within the HDI circuit board 2 adjust and thus a uniform heating. The power-conducting inner conductor layers 9 are in particular between two outer PCB layers 10 arranged, i. e in a sandwich arrangement. In other words, preferably each is a single outer circuit board layer 10 adjacent to the plurality of power conducting inner conductor layers 9 in the stacking direction X on opposite sides of the ply stack on the power current carrying inner conductor layers 9 arranged. Such an outer circuit board position 10 has a strength of z. B. 100 microns. To guide the power currents, the power current carrying inner conductor layers 9 a suitable layer or conductor layer thickness, wherein the power current carrying inner conductor layers 9 each in the form of z. B. a copper layer are formed.

It forms the circuit board 2 at least one cooling area 11 out, which for the dissipation of heat from the circuit board 2 , in particular the inner conductor layers 9 is provided, double arrow A 1 and 2 , The HDI circuit board 2 or the control module formed therewith 1 has z. B. two Entwärmungsbereiche 11 , z. B. 3 or 4 , on. Within the respective cooling area 11 are at least two inner conductor layers 9 thermally conductive, ie with high thermal conductivity, connected together or against each other, reference numerals 13 , Preferably, all inner conductor layers 9 in the cooling area 11 thermally conductive interconnected, z. B. 1 and 2 , Due to the thermally conductive connection, heat can be as close as possible to an outer circuit board layer 10 , on the surface in the cooling area 11 According to the invention a heat dissipation is provided with simultaneous electrical insulation, transported.

It is at least one of an outer circuit board layer 10 formed PCB surface 2a . 2 B in the stacking direction X of the printed circuit board layers 6 at least in the cooling area 11 against the power-conducting inner conductor layers 9 formed electrically insulated, preferably z. B. the entire PCB surface 2a respectively. 2 B , A cooling element 12 for cooling can thus without further electrical insulation against the power currents conducted on the circuit board surface 2a respectively. 2 B in the stacking direction X of the printed circuit board layers 6 in the cooling area 11 be arranged and heat from the cooling area 11 dissipate.

In particular, provision is made for them to be in the stacking direction X of the printed circuit board layers 6 opposite, each of an outer circuit board position 10 formed PCB surfaces 2a . 2 B at least in the cooling area 11 against the inner conductor layers 9 are formed electrically insulated, z. B. in each case the entire circuit board surface 2a . 2 B , Per cooling area 11 can thus each on both outer sides 2a . 2 B or surfaces of the HDI circuit board 2 in the stacking direction X each have a cooling element 12 for cooling against the inner conductor layers 9 be arranged electrically insulated without having to take further insulation. PCB surfaces 2a . 2 B in the cooling area 11 are preferably even.

According to the invention, at least one outer circuit board layer 10 , in particular an outer printed circuit board carrier material layer 7 , z. B. 1 which is a circuit board surface 2a respectively. 2 B in the stacking direction X of the printed circuit board layers 6 forms, the PCB surface 2a respectively. 2 B in the stacking direction X of the printed circuit board layers 6 at least in the cooling area 11 against the inner conductor layers 9 formed electrically insulating.

In particular, it is provided that mutually opposite, outer printed circuit board layers 10 , in particular outer printed circuit board carrier material layers 7 , which each have a circuit board surface 2a . 2 B in the stacking direction X of the printed circuit board layers 6 train, the PCB surfaces 2a . 2 B in the stacking direction X of the printed circuit board layers 6 at least in the cooling area 11 against the inner conductor layers 9 are each formed electrically insulating.

To a circuit board surface 2a respectively. 2 B in the stacking direction X of the printed circuit board layers 6 at least in the cooling area 11 against the inner conductor layers 9 each form electrically insulating, is the outer PCB carrier material layer 7 , which between the power-conducting inner conductor layers 9 and the circuit board surface 2a respectively. 2 B in the cooling area 11 is arranged, in particular formed in each case as a continuous insulating layer, ie without electrical contact possibility of the power current carrying inner conductor layers 9 to the PCB surface 2a respectively. 2 B in the cooling area 11 , Any electrically conductive outer layer 8th , z. B. 1 , the respective outer Printed circuit board layer 10 is according to the invention at least in the cooling area 11 each potential-free, 1 , or z. B. removed, z. B. etched away, 2 such that the respective circuit board surface 2a . 2 B in the stacking direction X of the printed circuit board layers 6 at least in the cooling area 11 no electrically conductive connection with the inner conductor layers 9 having.

By means of such insulation by at least one outer PCB carrier material layer 7 or by at least one outer PCB substrate layer 7 and at least the cooling area 11 electrically against the power-conducting inner conductor layers 9 insulating outer conductor layer 8th is in particular a housing or sealing the HDI PCB 2 on the respective circuit board surface 2a respectively. 2 B at least in the cooling area 11 z. B. unnecessary to gear oil or foreign substances, ie in the entire compared to the inner conductor layers 9 electrically insulated surface area.

A derivative of the heat from the cooling area 11 can be carried out in an advantageous manner such that at least one electrically against the inner conductor layers 9 isolated, from an outer PCB layer 10 formed circuit board surface 2a . 2 B in the cooling area 11 a cooling element 12 is arranged. A cooling element 12 is z. B. a heat sink, a cooling plate, a housing according to z. B. 5 , etc., preferably a thermally well conductive element, e.g. As aluminum or an aluminum alloy.

Preferably, each is electrically against the inner conductor layers 9 isolated, from an outer PCB layer 10 formed circuit board surface 2a . 2 B in the stacking direction X of the printed circuit board layers 6 in the cooling area 11 a cooling element 12 arranged for cooling. Such can with respect to a one-sided cooling element 12 z. B. increased heat dissipated.

Preferably, the inner conductor layers 9 in the cooling area 11 thermally and, in particular simultaneously, electrically conductively connected to each other, in particular all. In order to minimize the necessary connection points for heat dissipation and for uniform power distribution, the electrically conductive connection is simultaneously realized according to the invention by means of a thermally conductive connection or contacting. The thermally and preferably also electrically conductive connection with each other in the cooling area 11 takes place in particular by means of contacts in the form of vias 13 (Vertical Interference Access), z. B. 1 and 2 , or blind holes (not shown).

In particular, the invention provides the inner conductor layers 9 by means of buried contacts or buried vias 13 , Especially exclusively by means of such, in the cooling area 11 connect to, 1 and 2 , Alternatively, a thermally and / or electrically conductive connection of the power current carrying inner conductor layers 9 in the cooling area 11 z. B. by inlays, for. B. in the form of metallic deposits, z. B. copper inlays.

It is advantageous a heat conducting layer 14 , in particular in the form of a thermal paste, between the cooling element 12 and one electrically against the inner conductor layers 9 isolated, from an outer PCB layer 10 in the stacking direction X of the PCB layers in the cooling area 11 formed circuit board surface 2a respectively. 2 B arranged. The heat conducting layer 14 is in particular an electrically non-insulating Wärmeleitschicht, which due to the heat in the area 11 according to the invention electrically against the inner conductor layers 9 insulated trained circuit board surface 2a . 2 B in the cooling area 11 is usable. Such has z. B. a much better thermal conductivity than z. B. an insulating thermal compound. Such a heat conducting layer 14 can also advantageously bumps on the outside of the cooling element 12 or the HDI circuit board 2 compensate.

According to z. B. 3 and 4 can by means of at least one cooling element 12 Furthermore, advantageously a support of the HDI circuit board 2 done so that the HDI board 2 is protected against occurring vibrations. The cooling element 12 in turn, on a carrier plate 15 , z. B. a transmission component, or another carrier element to be mounted, 3 , The circuit board 2 is thus stored more stable compared to the prior art.

According to 4 can the control module 1 by means of two cooling elements 12 of the control module 1 advantageous vibration-proof stored and encapsulated at the same time. Due to the simple layer structure of the uniformly manufactured HDI circuit board 2 for the conduction of the power currents, the HDI circuit board 2 be manufactured with a few process steps, the HDI circuit board 2 or the control module formed by means of this 1 at the same time good and electrically safe by the inventive design is Entwärmbar.

LIST OF REFERENCE NUMBERS

1

control module

2

HDI PCB

2a, 2b

Outside HDI circuit board

3

control electronics

4

Control electronics housing

5

EMC assembly

6

Printed circuit board layer

7

PCB substrate layers

8th

conductor layers

9

Inner conductor layers

10

outer PCB layers

11

cooling area

12

cooling element

13

Via, Buried Via

14

heat conducting

15

support plate

A

Dissipation heat

X

Stacking direction of the printed circuit board layers

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102010003678 [0002]

Claims (10)

Control module ( 1 ), in particular for a transmission control of a motor vehicle, characterized in that the control module ( 1 ) a uniformly manufactured as HDI printed circuit board multilayer printed circuit board ( 2 ) has for networking a control electronics ( 3 ) of the control module ( 1 ), the printed circuit board ( 2 ) a cooling area ( 11 ) in which provided inner conductor layers ( 9 ) are thermally conductively connected to each other, wherein at least one of an outer circuit board layer ( 10 ) formed PCB surface ( 2a . 2 B ) in the stacking direction (X) of the printed circuit board layers ( 6 ) at least in the cooling area ( 11 ) against the power-conducting inner conductor layers ( 9 ) is formed electrically isolated. Control module ( 1 ) according to claim 1, characterized in that two in the stacking direction (X) of the printed circuit board layers ( 6 ), each of an outer circuit board layer ( 10 ) formed PCB surfaces ( 2a . 2 B ) at least in the cooling area ( 11 ) against the power-conducting inner conductor layers ( 9 ) are formed electrically isolated. Control module ( 1 ) according to one of the preceding claims, characterized in that an outer circuit board layer ( 10 ), in particular an outer PCB carrier material layer ( 7 ), which has a printed circuit board surface ( 2a . 2 B ) in the stacking direction (X) of the printed circuit board layers ( 6 ), the PCB surface ( 2a . 2 B ) in the stacking direction (X) of the printed circuit board layers ( 6 ) at least in the cooling area ( 11 ) against the power-conducting inner conductor layers ( 9 ) is formed electrically insulating. Control module ( 1 ) according to one of the preceding claims, characterized in that mutually opposite, outer printed circuit board layers ( 10 ), in particular outer printed circuit board carrier layers ( 7 ), each of which has a printed circuit board surface ( 2a . 2 B ) in the stacking direction (X) of the printed circuit board layers ( 6 ), the PCB surfaces ( 2a . 2 B ) in the stacking direction (X) of the printed circuit board layers ( 6 ) at least in the cooling area ( 11 ) against the power-conducting inner conductor layers ( 9 ) are each formed electrically insulating. Control module ( 1 ) according to one of the preceding claims, characterized in that on at least one electrically against the power current carrying inner conductor layers ( 9 ) isolated from an outer circuit board layer ( 10 ) formed PCB surface ( 2a . 2 B ) in the cooling area ( 11 ) a cooling element ( 12 ) is arranged. Control module ( 1 ) according to one of the preceding claims, characterized in that the power-conducting inner conductor layers ( 9 ) in the cooling area ( 11 ) are thermally and electrically conductive with each other, in particular all. Control module ( 1 ) according to one of the preceding claims, characterized in that the power-conducting inner conductor layers ( 9 ), in particular all power-conducting inner conductor layers ( 9 ), in the cooling area ( 11 ) using blind holes and / or buried vias ( 13 ) are thermally and / or electrically conductively connected to one another, in particular exclusively by means of buried vias (US Pat. 13 ). Control module ( 1 ) according to one of the preceding claims, characterized in that a heat conducting layer ( 14 ), in particular a thermal compound, furthermore in particular an electrically non-insulating heat conducting layer ( 14 ), between the cooling element ( 12 ) and an electrically against the power current carrying inner conductor layers ( 9 ) isolated from an outer circuit board layer ( 10 ) formed PCB surface ( 2a . 2 B ) in the stacking direction (X) of the printed circuit board layers ( 6 ) in the cooling area ( 11 ) is arranged. Control module ( 1 ) according to one of the preceding claims, characterized in that the printed circuit board carrier material layers ( 7 ) of the printed circuit board ( 2 ) are made of an epoxy resin material, in particular FR4. Control module ( 1 ) according to one of the preceding claims, characterized in that the HDI printed circuit board ( 2 ) on the cooling element ( 12 ) is supported, in particular vibration.

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