WO2000073986A1 - Tete pour le depot d'une substance sur un support avec un circuit electronique - Google Patents
Tete pour le depot d'une substance sur un support avec un circuit electronique Download PDFInfo
- Publication number
- WO2000073986A1 WO2000073986A1 PCT/FR2000/001266 FR0001266W WO0073986A1 WO 2000073986 A1 WO2000073986 A1 WO 2000073986A1 FR 0001266 W FR0001266 W FR 0001266W WO 0073986 A1 WO0073986 A1 WO 0073986A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substance
- support
- electronic device
- depositing
- manufacturing
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2405—Shape
- H01L2224/24051—Conformal with the semiconductor or solid-state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Definitions
- dispenser This deposit operation, hereinafter called “dispensation" is carried out for example using a machine sold under the name CAMELOT by the American company CAMELOT System Ink.
- This so-called “dispensation” technique consists in practice of applying a liquid or low viscosity substance by means of a syringe or the like with controlled flow and opening. The displacement and opening parameters of the syringe are controlled by a computer program.
- the thickness of these deposits can be much greater than by a screen printing process, which makes it possible to obtain larger sections therefore of low contact resistance.
- FIG. 1 illustrates a first embodiment of the method for manufacturing smart cards in contact with the deposition technique using a syringe
- FIG. 2 illustrates a variant of this method.
- a card body 1A is produced comprising a cavity 20 which can be produced by injection molding or by colammation of thermoplastic sheets followed by machining of the cavity.
- the chip 2 is placed in the cavity with its active face, in particular its output pads 21, upwards and it is fixed for example by gluing. It is also possible to locally heat the cavity and then place the chip in the thermoplastic material thus melted.
- the active face is not necessarily at the same level as the bottom of the cavity.
- the contact terminal 3 and the connections 30 are made with the output pads 21 by depositing the conductive substance, for example a polymer resin charged with conductive particles. or intrinsically conductive, by means of a syringe which is moved to follow the path of the different contacts of the terminal block and the different connections.
- the conductive substance for example a polymer resin charged with conductive particles. or intrinsically conductive, by means of a syringe which is moved to follow the path of the different contacts of the terminal block and the different connections.
- FIG. 2 illustrates a variant of the process which has just been described in which a cavity is produced on two levels, that is to say a cavity having a "recess" in its bottom.
- this recess are sufficient to receive the chip and its depth is substantially equal to the thickness of the chip so that the active face of the latter is at the bottom of the cavity.
- the present invention provides a new technology for the deposition of such a substance.
- This new technology improves productivity. It proposes the use of a head for depositing a multi-port substance for the manufacture of electronic devices.
- a more particular subject of the invention is a head for depositing a substance on a support of the electronic circuit support type, mainly characterized in that it comprises a plurality of orifices suitable for allowing drops of said substance, the orifices being spaced so that the substance deposited by the orifices forms by spreading on the support one or more continuous lines or a surface.
- the head has a non-planar surface corresponding substantially to the surface of the support and in which said orifices are formed.
- the deposited substance is an electrically conductive substance.
- the deposited substance is an electrically insulating substance.
- the support on which the drops are deposited is a plastic support.
- the support on which the drops are deposited is a paper support.
- the method is a method of manufacturing an electronic device of the chip card type comprising at least one microcircuit embedded in a support and output pads connected to interface elements constituted by a terminal block and / or a antenna
- the connections between the output pads and the interface elements are made by simultaneously depositing a plurality of closely spaced drops forming said connections.
- this reinforcing layer is produced by depositing a plurality of drops of an insulating substance at the periphery of the microcircuit.
- FIG. 1 shows a diagram in cross section and which illustrates a method of manufacturing contact smart cards using the technique of dispensing a substance of low viscosity for making contacts according to the prior art
- Figure 2 illustrates a variant of the method according to Figure 1
- Figure 3 shows the diagram of the face of a deposition head according to a first embodiment according to the present invention
- FIG. 4 represents the diagram of a deposition step carried out by means of a head according to FIG. 3
- Figure 5 shows the head seen along section AA of Figure 3
- FIG. 6 shows the diagram of an alternative embodiment of the head seen in section;
- FIG. 7 represents the diagram of a head according to a second embodiment; - Figure 8, shows the diagram of a deposition step performed by means of a head according to Figure 7,
- Figure 9 shows the diagram of a head seen along the section BB of Figure 7
- the head which is the subject of the invention allows drops of substance to be discharged by means of spaced orifices so as to obtain one or more continuous lines. It also makes it possible to obtain surfaces by juxtaposition of several lines.
- the invention applies to making connections of the integrated circuit to the contact pads of smart cards as well as to depositing the reinforcing layer placed under the microcircuit of a smart card.
- This first embodiment corresponds to a head which can be used for making the connections between the output pads and the interface elements of an electronic device such as a smart card.
- Figure 6 is a sectional view of an alternative embodiment of a head according to Figure 3.
- the head has a non-planar face corresponding to the relief of the support on which it is desired to deposit the substance.
- this variant shows the cross section of a head capable of corresponding to the process for depositing a substance for making the contacts according to the diagram in FIG. 1.
- FIG. 7 also shows a second embodiment of a head according to the invention.
- the face F intended to be opposite the support on which one proceeds to the deposition, comprises several sets of orifices 12 forming a rectangle.
- This embodiment is suitable for depositing a reinforcing material used in the technique of manufacturing smart cards using the technology called “flip chip” in the case where a reinforcing material is deposited between the chip and the substrate. , this technique is called “underfill” in English terminology.
- Such a deposit is used to reinforce the mechanical strength of the chip on the circuit, in particular when the electronic device undergoes mechanical stresses of torsion or bending, or climatic constraints which can cause thermal expansion.
- the substance used will be chosen for its characteristics, giving it the possibility of migrating under the chip, before their polymerization, by capillary action.
- FIG. 8 illustrates the result of the method when a head such as that shown diagrammatically in FIG. 7 is used.
- Figure 9 illustrates the head as shown in Figure 7 sectional view along section BB.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU44156/00A AU4415600A (en) | 1999-05-27 | 2000-05-11 | Head for depositing a substance on a support with an electronic circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR99/06728 | 1999-05-27 | ||
FR9906728A FR2797203B1 (fr) | 1999-05-27 | 1999-05-27 | Tete pour le depot d'une substance sur un support de type support de circuit electronique et procede de fabrication de dispositifs electroniques |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000073986A1 true WO2000073986A1 (fr) | 2000-12-07 |
Family
ID=9546082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2000/001266 WO2000073986A1 (fr) | 1999-05-27 | 2000-05-11 | Tete pour le depot d'une substance sur un support avec un circuit electronique |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU4415600A (fr) |
FR (1) | FR2797203B1 (fr) |
WO (1) | WO2000073986A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5187123A (en) * | 1988-04-30 | 1993-02-16 | Matsushita Electric Industrial Co., Ltd. | Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots |
DE9315652U1 (de) * | 1993-10-15 | 1993-12-23 | Nordson Corp | Auftragskopf zum Aufbringen von Klebstoff auf ein Substrat, insbesondere für eine Verklebung eines Chips mit einer Karte |
US5423889A (en) * | 1994-06-24 | 1995-06-13 | Harris Corporation | Process for manufacturing a multi-port adhesive dispensing tool |
US5681757A (en) * | 1996-04-29 | 1997-10-28 | Microfab Technologies, Inc. | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process |
-
1999
- 1999-05-27 FR FR9906728A patent/FR2797203B1/fr not_active Expired - Fee Related
-
2000
- 2000-05-11 AU AU44156/00A patent/AU4415600A/en not_active Abandoned
- 2000-05-11 WO PCT/FR2000/001266 patent/WO2000073986A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5187123A (en) * | 1988-04-30 | 1993-02-16 | Matsushita Electric Industrial Co., Ltd. | Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots |
DE9315652U1 (de) * | 1993-10-15 | 1993-12-23 | Nordson Corp | Auftragskopf zum Aufbringen von Klebstoff auf ein Substrat, insbesondere für eine Verklebung eines Chips mit einer Karte |
US5423889A (en) * | 1994-06-24 | 1995-06-13 | Harris Corporation | Process for manufacturing a multi-port adhesive dispensing tool |
US5681757A (en) * | 1996-04-29 | 1997-10-28 | Microfab Technologies, Inc. | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process |
Also Published As
Publication number | Publication date |
---|---|
FR2797203A1 (fr) | 2001-02-09 |
AU4415600A (en) | 2000-12-18 |
FR2797203B1 (fr) | 2002-03-22 |
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