WO2000044051A1 - Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell - Google Patents

Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell Download PDF

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Publication number
WO2000044051A1
WO2000044051A1 PCT/NL2000/000026 NL0000026W WO0044051A1 WO 2000044051 A1 WO2000044051 A1 WO 2000044051A1 NL 0000026 W NL0000026 W NL 0000026W WO 0044051 A1 WO0044051 A1 WO 0044051A1
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WO
WIPO (PCT)
Prior art keywords
substrate
nozzle
paste
applying
aspect ratio
Prior art date
Application number
PCT/NL2000/000026
Other languages
French (fr)
Inventor
Arthur Wouter Weeber
Original Assignee
Stichting Energieonderzoek Centrum Nederland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stichting Energieonderzoek Centrum Nederland filed Critical Stichting Energieonderzoek Centrum Nederland
Priority to JP2000595386A priority Critical patent/JP2003536240A/en
Priority to EP00902199A priority patent/EP1149422A1/en
Priority to AU23317/00A priority patent/AU2331700A/en
Publication of WO2000044051A1 publication Critical patent/WO2000044051A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to a method for applying a metallization to at least one of the outer surfaces of a substrate for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which comprises a set of relatively thin lines and a set of relatively wide strips connected thereto for transporting electrical charge carriers, which method comprises the steps of (i) providing said substrate, at least one of the outer surfaces of which is adapted for applying of a metallization thereto, (ii) applying a metal -containing conductive paste to the relevant surface in accordance with said determined pattern, and (iii) drying the paste applied to the surface.
  • a metallization pattern to the front side of a photovoltaic element, for instance a silicon solar cell, using a screen-printing technique.
  • an emulsion layer suitable for this purpose is applied to a stainless steel mesh clamped in a frame, into which layer is recessed the pattern of the metallization to be applied.
  • the thus obtained screen is arranged over the front side of a silicon substrate, whereafter the metal -containing conductive paste is applied to the emulsion layer, for instance a paste of silver particles, frit, a binder and a solvent.
  • the paste is skimmed off using a squeegee and pressed via the mesh through the apertures in the emulsion layer onto the substrate.
  • the thus created paste pattern on the substrate is then dried in a furnace, wherein the solvent evaporates, heated while air or oxygen is added to burn organic binders, and sintered to adhere the metal particles to each other and to the substrate.
  • a substrate to which a paste is applied by screen-printing can be dried, further heated and sintered in one furnace cycle so as to obtain the intended metallization pattern.
  • An inherent drawback of the known method is that the minimum width of the metallization lines to be formed on the substrate is determined by the mesh width of the screen used.
  • a screen of width mesh 325 or higher i.e. 325 or more meshes per inch is used for instance to print very fine lines .
  • the opening in the emulsion layer is critical: the percentage of open surface fluctuates significantly, which results in a correspondingly fluctuating line width of the applied paste.
  • the use of thinner wires for the screen or increasing the distance between the wires thereof increases the uniformity of deposited metal paste lines but reduces the strength of the screen and thereby reduces the lifespan to a level which may be economically unacceptable.
  • the objective is to create the thinnest possible lines in order to keep shadow losses resulting from the metallization as low as possible and thereby the efficiency as high as possible.
  • a stencil is a foil, usually of a metal, for instance nickel or stainless steel, which is placed instead of a screen over the substrate for a solar cell, wherein apertures in the foil are formed in accordance with a line pattern for arranging on the substrate.
  • a pattern for very thin, smooth and relatively high lines of a first paste can be applied to the substrate in one print run by means of a stencil.
  • the pattern of relatively wide strips forming the busbars in a solar cell can be applied immediately thereafter in contact-free manner by means of an apparatus suitable for the purpose without intervening drying of the line pattern.
  • a second print run with a second stencil or with a screen, which would be necessary to apply the pattern with the busbars intersecting the thin lines, is hereby dispensed with.
  • the advantage of the screen- printing technique that it is possible to suffice with only one furnace cycle after printing, is hereby retained, while the drawbacks thereof do not occur.
  • the paste for the wide strips is applied for instance using an arrangement for contact-free dispensing or other technique of contact-free application.
  • the first paste and the second paste are identical.
  • the second paste has a lower viscosity than the first paste, which provides the advantage that the second paste has rheological properties such that it can be more easily transported through an apparatus for contact- free dispensing than the first paste, the viscosity of which is chosen such that very thin and relatively high lines can be printed with this paste.
  • the method is particularly suitable for embodiment with a stencil comprising a foil in which are arranged slots which correspond with the set of relatively thin lines and which have a width smaller than about 100 ⁇ m, in particular smaller than about 50 ⁇ m, wherein the foil has for instance a thickness smaller than about 50 ⁇ m.
  • the method according to the invention is for instance performed using an apparatus for contact-free application containing a nozzle placeable above the substrate, wherein the second paste is applied by moving the nozzle and the substrate relative to each other such that the nozzle follows the predetermined pattern of the set of relatively wide strips.
  • the nozzle has for instance a cross -section with an aspect ratio having a value not equal to 1, preferably a value greater than 2, more preferably a value at least equal to 5.
  • the nozzle preferably extends with a long axis of the cross-section parallel to the surface of the substrate and perpendicularly of the direction of the relative movement of nozzle and substrate, wherein the nozzle more preferably has a cross -section with a long axis with a length of about 1.5 mm and a short axis with a length of about 300 ⁇ m.
  • the invention further relates to an apparatus for performing the above described method. The invention will be elucidated hereinbelow on the basis of embodiments and with reference to the drawings.
  • Fig. 1 shows in top view a substrate of a square solar cell to which according to the invention a first paste is applied in a pattern of thin lines in a first step
  • Fig. 2 shows in top view the substrate of fig. 1 to which according to the invention a second paste is applied in a pattern of relatively wide strips in a second step
  • Fig. 3 shows in perspective view a simplified illustration of an embodiment of an arrangement for contact-free dispensing of paste for the busbars to a substrate for a solar cell
  • Fig. 4 shows the arrangement of fig. 3 at a later point in time
  • Fig. 5 shows in side view a cross -section through the arrangement of fig. 4,
  • Fig. 6 shows in side view a detail of an alternative embodiment of an arrangement for contact-free dispensing.
  • Fig. 1 shows a substrate 1 for a solar cell with a part of a so-called H-pattern.
  • a full H-pattern consists of relatively thin lines or fingers and relatively wide strips or busbars. The fingers have the purpose of carrying the current to be generated by the solar cell over the whole surface to the busbars, which in turn serve as central discharge for the current and for connecting in series a subsequent solar cell by means of conductors for mounting on the busbars.
  • a pattern is printed on substrate 1 of lines 2 of a conductive paste which contains inter alia about 70% by weight of silver in the form of very small spherical particles with a diameter of about 1-2 ⁇ m and a small fraction of flocculent particles or platelets with a largest dimension of about 5 ⁇ m.
  • the lines 2 printed with the stencil in question have a width of about 55 ⁇ m and a height of about 20 ⁇ m in the dried and annealed state.
  • Fig. 2 shows substrate 1 of fig.
  • the strips 3 applied with the arrangement in question have a width of about 1.5 mm and a height of about 300 ⁇ m in the dried and annealed state, and form the busbars of the solar cell.
  • Shown are a container 5 for holding paste under pressure with for instance compressed air, a housing 7 with a drive for a conveyor screw 8 and a nozzle 9 which debouches above a substrate 1 provided with lines 2.
  • the dispensing apparatus is movable relative to substrate 1 along two mutually perpendicular suspension arms 10, 11 and a vertical guide (not shown) , wherein the relative movement of substrate 1 and nozzle 9 can be regulated using a control circuit (not shown) such that the nozzle follows the predetermined pattern of the set of busbars for applying.
  • Nozzle 9 has a cross -section with a long axis of about 1.5 mm in the Y-direction and a short axis with a length of about 300 ⁇ m in the X-direction (so that the aspect ratio amounts to 5) .
  • t time
  • t ⁇ time in which the apparatus is displaced along arm 10 over a determined distance in the direction of arrow X.
  • During the displacement paste is carried out of container 5 via conduit 6 to the rotating (rotation symbolized by curved arrow ⁇ ) conveyor screw 8, and using this conveyor screw 8 applied in contact-free manner to substrate 1 via nozzle 9 in accordance with a straight wide strip 3 extending transversely over lines 2.
  • Fig. 5 shows a cross -section along line V-V through the arrangement shown in fig. 4.
  • the distance Z 0 between the underside of nozzle 9 and the surface of substrate 1 is adjustable between 0.020 mm and 5 mm, whereby the thickness d of the paste strip to be applied to substrate 1 can be adjusted in the range of about 10-300 ⁇ m.
  • Fig. 6 shows a detail of an alternative embodiment of the dispensing apparatus, wherein the housing 7 with nozzle 9 shown in fig. 5 can be tilted in the X,Z plane so that in the tilted position (drawn in dashed lines) of housing 7 and nozzle 9 at an angle to the perpendicular the paste 3 can be applied to the surface of substrate 1, whereby when the feed of paste ceases the outer end of strip 3 is prevented from protruding above the level of the remaining part of this strip.

Abstract

Method for applying a metallization to at least one of the outer surfaces of a substrate for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which comprises a set of relatively thin lines (fingers) and a set of relatively wide strips (busbars) connected thereto for transporting electrical charge carriers, which method comprises the steps of: (i) applying a metal-containing conductive paste to the relevant surface in accordance with said determined pattern, and (ii) drying the paste applied to the surface, wherein in the first step (i) a first paste for the set of the finger lines is applied using a stencil and a second paste for the set of the busbar strips is subsequently applied using an apparatus for contact-free application; apparatus for performing this method and photovoltaic element with substrate manufactured according to this method.

Description

METHOD AND APPARATUS FOR APPLYING A METALLIZATION PATTERN TO A SUBSTRATE FOR A PHOTOVOLTAIC CELL
The invention relates to a method for applying a metallization to at least one of the outer surfaces of a substrate for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which comprises a set of relatively thin lines and a set of relatively wide strips connected thereto for transporting electrical charge carriers, which method comprises the steps of (i) providing said substrate, at least one of the outer surfaces of which is adapted for applying of a metallization thereto, (ii) applying a metal -containing conductive paste to the relevant surface in accordance with said determined pattern, and (iii) drying the paste applied to the surface.
It is known to apply a metallization pattern to the front side of a photovoltaic element, for instance a silicon solar cell, using a screen-printing technique. According to this known method an emulsion layer suitable for this purpose is applied to a stainless steel mesh clamped in a frame, into which layer is recessed the pattern of the metallization to be applied. The thus obtained screen is arranged over the front side of a silicon substrate, whereafter the metal -containing conductive paste is applied to the emulsion layer, for instance a paste of silver particles, frit, a binder and a solvent. The paste is skimmed off using a squeegee and pressed via the mesh through the apertures in the emulsion layer onto the substrate. The thus created paste pattern on the substrate is then dried in a furnace, wherein the solvent evaporates, heated while air or oxygen is added to burn organic binders, and sintered to adhere the metal particles to each other and to the substrate.
It is an important advantage of the known method that a substrate to which a paste is applied by screen-printing can be dried, further heated and sintered in one furnace cycle so as to obtain the intended metallization pattern. An inherent drawback of the known method is that the minimum width of the metallization lines to be formed on the substrate is determined by the mesh width of the screen used. A screen of width mesh 325 or higher (i.e. 325 or more meshes per inch) is used for instance to print very fine lines . When the line width is in the order of magnitude of the pitch of the screen (for a screen of width mesh 400 for instance the pitch amounts to 65 μm) , the opening in the emulsion layer is critical: the percentage of open surface fluctuates significantly, which results in a correspondingly fluctuating line width of the applied paste. The use of thinner wires for the screen or increasing the distance between the wires thereof increases the uniformity of deposited metal paste lines but reduces the strength of the screen and thereby reduces the lifespan to a level which may be economically unacceptable. During the design of a metallization pattern of a solar cell, the objective is to create the thinnest possible lines in order to keep shadow losses resulting from the metallization as low as possible and thereby the efficiency as high as possible. In order to hold resistance losses in thin lines below determined values, a determined minimum height of these lines is however required. It is another drawback of the screen-printing technique that this imposes an upper limit on the viscosity of a paste for use such that the line height to be realized with this paste is limited to an undesirably low value.
It is an object of the invention to provide a method for applying a metallization pattern with relatively thin and well-defined lines which have a height such that resistance losses in a solar cell with such a pattern are negligible, or at least remain below an acceptable level. It is a further object to provide such a method wherein a paste applied to a substrate can be dried, further heated and sintered in one furnace cycle, so as to obtain the intended metallization pattern. It is another object to provide a method which can be performed in rapid and cost-saving manner.
These objects are achieved, and other advantages gained, with the method stated in the preamble, wherein according to the invention in the second step (ii) a first paste for the set of relatively thin lines is applied using a stencil and a second paste for the set of relatively wide strips is subsequently applied using an apparatus for contact-free application.
A stencil is a foil, usually of a metal, for instance nickel or stainless steel, which is placed instead of a screen over the substrate for a solar cell, wherein apertures in the foil are formed in accordance with a line pattern for arranging on the substrate.
It has been found that a pattern for very thin, smooth and relatively high lines of a first paste can be applied to the substrate in one print run by means of a stencil. The pattern of relatively wide strips forming the busbars in a solar cell can be applied immediately thereafter in contact-free manner by means of an apparatus suitable for the purpose without intervening drying of the line pattern. A second print run with a second stencil or with a screen, which would be necessary to apply the pattern with the busbars intersecting the thin lines, is hereby dispensed with. The advantage of the screen- printing technique, that it is possible to suffice with only one furnace cycle after printing, is hereby retained, while the drawbacks thereof do not occur. The paste for the wide strips is applied for instance using an arrangement for contact-free dispensing or other technique of contact-free application. In a first embodiment of the method according to the invention the first paste and the second paste are identical.
In a subsequent embodiment the second paste has a lower viscosity than the first paste, which provides the advantage that the second paste has rheological properties such that it can be more easily transported through an apparatus for contact- free dispensing than the first paste, the viscosity of which is chosen such that very thin and relatively high lines can be printed with this paste.
The method is particularly suitable for embodiment with a stencil comprising a foil in which are arranged slots which correspond with the set of relatively thin lines and which have a width smaller than about 100 μm, in particular smaller than about 50 μm, wherein the foil has for instance a thickness smaller than about 50 μm.
The method according to the invention is for instance performed using an apparatus for contact-free application containing a nozzle placeable above the substrate, wherein the second paste is applied by moving the nozzle and the substrate relative to each other such that the nozzle follows the predetermined pattern of the set of relatively wide strips.
The nozzle has for instance a cross -section with an aspect ratio having a value not equal to 1, preferably a value greater than 2, more preferably a value at least equal to 5.
The nozzle preferably extends with a long axis of the cross-section parallel to the surface of the substrate and perpendicularly of the direction of the relative movement of nozzle and substrate, wherein the nozzle more preferably has a cross -section with a long axis with a length of about 1.5 mm and a short axis with a length of about 300 μm. The invention further relates to an apparatus for performing the above described method. The invention will be elucidated hereinbelow on the basis of embodiments and with reference to the drawings.
In the drawings :
Fig. 1 shows in top view a substrate of a square solar cell to which according to the invention a first paste is applied in a pattern of thin lines in a first step,
Fig. 2 shows in top view the substrate of fig. 1 to which according to the invention a second paste is applied in a pattern of relatively wide strips in a second step,
Fig. 3 shows in perspective view a simplified illustration of an embodiment of an arrangement for contact-free dispensing of paste for the busbars to a substrate for a solar cell, Fig. 4 shows the arrangement of fig. 3 at a later point in time,
Fig. 5 shows in side view a cross -section through the arrangement of fig. 4, and
Fig. 6 shows in side view a detail of an alternative embodiment of an arrangement for contact-free dispensing.
Corresponding components in the figures are designated with the same reference numerals.
Fig. 1 shows a substrate 1 for a solar cell with a part of a so-called H-pattern. A full H-pattern consists of relatively thin lines or fingers and relatively wide strips or busbars. The fingers have the purpose of carrying the current to be generated by the solar cell over the whole surface to the busbars, which in turn serve as central discharge for the current and for connecting in series a subsequent solar cell by means of conductors for mounting on the busbars. By means of a stencil formed by a 50 μm thick foil of a suitable metal into which are recessed slots with a width of 50 μm, a pattern is printed on substrate 1 of lines 2 of a conductive paste which contains inter alia about 70% by weight of silver in the form of very small spherical particles with a diameter of about 1-2 μm and a small fraction of flocculent particles or platelets with a largest dimension of about 5 μm. The lines 2 printed with the stencil in question have a width of about 55 μm and a height of about 20 μm in the dried and annealed state. Fig. 2 shows substrate 1 of fig. 1 to which two strips 3 of a second suitable and per se known conductive paste are applied using an arrangement for contact-free dispensing. The strips 3 applied with the arrangement in question have a width of about 1.5 mm and a height of about 300 μm in the dried and annealed state, and form the busbars of the solar cell.
Fig. 3 shows a dispensing apparatus 4 for contact- free application of paste for the busbars to a substrate 1 for a solar cell at a moment in time t=t0. Shown are a container 5 for holding paste under pressure with for instance compressed air, a housing 7 with a drive for a conveyor screw 8 and a nozzle 9 which debouches above a substrate 1 provided with lines 2. The dispensing apparatus is movable relative to substrate 1 along two mutually perpendicular suspension arms 10, 11 and a vertical guide (not shown) , wherein the relative movement of substrate 1 and nozzle 9 can be regulated using a control circuit (not shown) such that the nozzle follows the predetermined pattern of the set of busbars for applying. The figure further shows a reference frame for the three mutually perpendicular directions of movement X, Y, Z for nozzle 9. Nozzle 9 has a cross -section with a long axis of about 1.5 mm in the Y-direction and a short axis with a length of about 300 μm in the X-direction (so that the aspect ratio amounts to 5) .
Fig. 4 shows dispensing apparatus 4 of fig. 3 at a moment in time t=tι, at which the apparatus is displaced along arm 10 over a determined distance in the direction of arrow X. During the displacement paste is carried out of container 5 via conduit 6 to the rotating (rotation symbolized by curved arrow ω) conveyor screw 8, and using this conveyor screw 8 applied in contact-free manner to substrate 1 via nozzle 9 in accordance with a straight wide strip 3 extending transversely over lines 2. Once the whole strip 3 has been applied, successively the feed of paste is interrupted, apparatus 4 is displaced along arm 11 over a distance such that nozzle 9 debouches precisely above the location of a following busbar to be applied, whereafter the feed of paste and the movement along arm 10 can be resumed in (opposing) X-direction in order to apply a subsequent busbar 3 to substrate 1. Fig. 5 shows a cross -section along line V-V through the arrangement shown in fig. 4. In the shown embodiment the distance Z0 between the underside of nozzle 9 and the surface of substrate 1 is adjustable between 0.020 mm and 5 mm, whereby the thickness d of the paste strip to be applied to substrate 1 can be adjusted in the range of about 10-300 μm.
Fig. 6 shows a detail of an alternative embodiment of the dispensing apparatus, wherein the housing 7 with nozzle 9 shown in fig. 5 can be tilted in the X,Z plane so that in the tilted position (drawn in dashed lines) of housing 7 and nozzle 9 at an angle to the perpendicular the paste 3 can be applied to the surface of substrate 1, whereby when the feed of paste ceases the outer end of strip 3 is prevented from protruding above the level of the remaining part of this strip.

Claims

1. Method for applying a metallization to at least one of the outer surfaces of a substrate (1) for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which comprises a set of relatively thin lines (2) and a set of relatively wide strips (3) connected thereto for transporting electrical charge carriers, which method comprises the steps of
(i) providing said substrate (1) , at least one of the outer surfaces of which is adapted for applying of a metallization thereto,
(ii) applying a metal -containing conductive paste to the relevant surface in accordance with said determined pattern (2, 3), and
(iii) drying the paste applied to the surface, characterized in that in the second step (ii) a first paste for the set of relatively thin lines (2) is applied using a stencil and a second paste for the set of relatively wide strips (3) is subsequently applied using an apparatus (4) for contact- free application.
2. Method as claimed in claim 1, characterized in that the first paste and the second paste are identical.
3. Method as claimed in claim 1, characterized in that the second paste has a lower viscosity than the first paste.
4. Method as claimed in any of the claims 1-3, characterized in that the stencil comprises a foil in which are arranged slots which correspond with the set of relatively thin lines (2) and which have a width smaller than about 100 μm.
5. Method as claimed in claim 4, characterized in that the width is smaller than about 50 μm.
6. Method as claimed in either of the claims 4 or 5, characterized in that the foil has a thickness smaller than about 50 μm.
7. Method as claimed in any of the foregoing claims, wherein the apparatus (4) for contact-free application comprises a nozzle (9) placeable above the substrate (1), characterized in that the second paste is applied by moving the nozzle (9) and the substrate (1) relative to each other such that the nozzle (9) follows the predetermined pattern of the set of relatively wide strips (3) .
8. Method as claimed in claim 7, characterized in that the nozzle (9) has a cross -section with an aspect ratio having a value not equal to 1.
9. Method as claimed in claim 8, characterized in that the aspect ratio has a value greater than 2.
10. Method as claimed in claim 9, characterized in that the aspect ratio has a value at least equal to 5.
11. Method as claimed in any of the claims 8-10, characterized in that the nozzle (9) extends with a long axis of the cross -section parallel to the surface of the substrate (1) and perpendicularly of the direction of the relative movement of nozzle (9) and substrate (1) .
12. Method as claimed in any of the claims 8-11, wherein the nozzle (9) has a cross -section with a long axis with a length of about 1.5 mm and a short axis with a length of about 300 μm.
13. Apparatus (4) for contact-free application of a second paste for a set of relatively wide strips (3) to at least one of the outer surfaces of a substrate (1) for a photovoltaic element in accordance with a method as claimed in any of the claims 1-6, characterized in that it comprises a nozzle (9) placeable above the substrate, wherein the substrate (1) and this nozzle (9) are movable relative to each other such that during a relative movement of substrate (1) and nozzle (9) the nozzle (9) follows the predetermined pattern of the set of relatively wide strips (3) .
14. Apparatus (4) as claimed in claim 13 for performing a method as claimed in claim 7, characterized in that the nozzle (9) has a cross -section with an aspect ratio having a value not equal to 1.
15. Apparatus (4) as claimed in claim 14 for performing a method as claimed in claim 8, characterized in that the aspect ratio has a value greater than 2.
16. Apparatus (4) as claimed in claim 15 for performing a method as claimed in claim 9, characterized in that the aspect ratio has a value at least equal to 5.
17. Apparatus (4) as claimed in any of the claims 14-
16 for performing a method as claimed respectively in any of the claims 8-10, characterized in that the nozzle (9) extends with a long axis of the cross -section parallel to the surface of the substrate (1) and perpendicularly of the direction of the relative movement of nozzle (9) and substrate (1) .
18. Apparatus (4) as claimed in any of the claims 14-
17 for performing a method as claimed respectively in any of the claims 8-11, characterized in that the nozzle (9) has a cross -section with a long axis with a length of about 1.5 mm and a short axis with a length of about 300 μ .
19. Photovoltaic element provided with a metallization pattern (2, 3) applied in accordance with a method as claimed in any of the claims 1-12.
PCT/NL2000/000026 1999-01-20 2000-01-14 Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell WO2000044051A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000595386A JP2003536240A (en) 1999-01-20 2000-01-14 Method and apparatus for applying a metallization pattern to a substrate for photovoltaic cells
EP00902199A EP1149422A1 (en) 1999-01-20 2000-01-14 Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell
AU23317/00A AU2331700A (en) 1999-01-20 2000-01-14 Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1011081A NL1011081C2 (en) 1999-01-20 1999-01-20 Method and device for applying a metallization pattern to a substrate for a photovoltaic cell.
NL1011081 1999-01-20

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WO2000044051A1 true WO2000044051A1 (en) 2000-07-27

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JP (1) JP2003536240A (en)
AU (1) AU2331700A (en)
NL (1) NL1011081C2 (en)
WO (1) WO2000044051A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008049816A1 (en) * 2006-10-24 2008-05-02 Commissariat A L'energie Atomique Metallizing device and method
EP2242109A1 (en) * 2009-04-16 2010-10-20 Applied Materials, Inc. Thin-film solar cell module
WO2010118906A2 (en) 2009-04-16 2010-10-21 Applied Materials, Inc. Thin-film solar cell module
CN102354710A (en) * 2006-01-24 2012-02-15 三洋电机株式会社 Photovoltaic module
FR2964250A1 (en) * 2010-08-30 2012-03-02 Commissariat Energie Atomique Photovoltaic device i.e. HET photovoltaic cell, for photovoltaic power station, has first conductors interrupted at interconnection zones, and second conductor electrically connecting first conductors with each other at zones
US8178777B2 (en) 2003-10-08 2012-05-15 Sharp Kabushiki Kaisha Method of manufacturing solar cell and solar cell manufactured thereby
WO2012028537A3 (en) * 2010-08-30 2012-11-29 Commissariat A L'energie Atomique Et Aux Energies Alternatives Photovoltaic cell having discontinuous conductors
DE102011052902A1 (en) * 2011-07-21 2013-01-24 Centrotherm Photovoltaics Ag Method for printing metal contact on solar cell substrate for solar cell module, involves imprinting metalliferous paste on contact finger by printing device such that height of contact finger section is enlarged
US8563346B2 (en) 2010-10-12 2013-10-22 Hyundai Motor Company Method for manufacturing electrode of dye-sensitized solar cell and dye-sensitized solar cell having electrode thereof
US8826518B2 (en) 2010-03-18 2014-09-09 Dainippon Screen Mfg. Co., Ltd. Electrode forming apparatus
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US9793421B2 (en) 2014-12-05 2017-10-17 Solarcity Corporation Systems, methods and apparatus for precision automation of manufacturing solar panels

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US8178777B2 (en) 2003-10-08 2012-05-15 Sharp Kabushiki Kaisha Method of manufacturing solar cell and solar cell manufactured thereby
CN102354710A (en) * 2006-01-24 2012-02-15 三洋电机株式会社 Photovoltaic module
WO2008049816A1 (en) * 2006-10-24 2008-05-02 Commissariat A L'energie Atomique Metallizing device and method
EP2242109A1 (en) * 2009-04-16 2010-10-20 Applied Materials, Inc. Thin-film solar cell module
WO2010118906A2 (en) 2009-04-16 2010-10-21 Applied Materials, Inc. Thin-film solar cell module
WO2010118906A3 (en) * 2009-04-16 2011-07-14 Applied Materials, Inc. Thin-film solar cell module
US8826518B2 (en) 2010-03-18 2014-09-09 Dainippon Screen Mfg. Co., Ltd. Electrode forming apparatus
WO2012028537A3 (en) * 2010-08-30 2012-11-29 Commissariat A L'energie Atomique Et Aux Energies Alternatives Photovoltaic cell having discontinuous conductors
CN103155160A (en) * 2010-08-30 2013-06-12 原子能及能源替代委员会 Photovoltaic cell having discontinuous conductors
KR20130112878A (en) * 2010-08-30 2013-10-14 꼼미사리아 아 레네르지 아토미끄 에뜨 옥스 에너지스 앨터네이티브즈 Photovoltaic cell having discontinuous conductors
FR2964250A1 (en) * 2010-08-30 2012-03-02 Commissariat Energie Atomique Photovoltaic device i.e. HET photovoltaic cell, for photovoltaic power station, has first conductors interrupted at interconnection zones, and second conductor electrically connecting first conductors with each other at zones
KR102032151B1 (en) * 2010-08-30 2019-10-15 꼼미사리아 아 레네르지 아토미끄 에뜨 옥스 에너지스 앨터네이티브즈 Photovoltaic cell having discontinuous conductors
US10453975B2 (en) 2010-08-30 2019-10-22 Commissariat à l'Energie Atomique et aux Energies Alternatives Photovoltaic cell having discontinuous conductors
US8563346B2 (en) 2010-10-12 2013-10-22 Hyundai Motor Company Method for manufacturing electrode of dye-sensitized solar cell and dye-sensitized solar cell having electrode thereof
DE102011052902A1 (en) * 2011-07-21 2013-01-24 Centrotherm Photovoltaics Ag Method for printing metal contact on solar cell substrate for solar cell module, involves imprinting metalliferous paste on contact finger by printing device such that height of contact finger section is enlarged
WO2016090304A1 (en) * 2014-12-05 2016-06-09 Solarcity Corporation Methods and systems for precision application of conductive adhesive paste on photovoltaic structures
US9793421B2 (en) 2014-12-05 2017-10-17 Solarcity Corporation Systems, methods and apparatus for precision automation of manufacturing solar panels
US9991412B2 (en) 2014-12-05 2018-06-05 Solarcity Corporation Systems for precision application of conductive adhesive paste on photovoltaic structures

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