AU2331700A - Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell - Google Patents
Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell Download PDFInfo
- Publication number
- AU2331700A AU2331700A AU23317/00A AU2331700A AU2331700A AU 2331700 A AU2331700 A AU 2331700A AU 23317/00 A AU23317/00 A AU 23317/00A AU 2331700 A AU2331700 A AU 2331700A AU 2331700 A AU2331700 A AU 2331700A
- Authority
- AU
- Australia
- Prior art keywords
- substrate
- nozzle
- paste
- aspect ratio
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 39
- 238000001465 metallisation Methods 0.000 title claims description 15
- 239000011888 foil Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000002800 charge carrier Substances 0.000 claims description 2
- 239000000839 emulsion Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Description
WO 00/44051 PCT/NLOO/00026 METHOD AND APPARATUS FOR APPLYING A METALLIZATION PATTERN TO A SUBSTRATE FOR A PHOTOVOLTAIC CELL The invention relates to a method for applying a metallization to at least one of the outer surfaces of a substrate for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which 5 comprises a set of relatively thin lines and a set of relatively wide strips connected thereto for transporting electrical charge carriers, which method comprises the steps of (i) providing said substrate, at least one of the outer surfaces of which is adapted for applying of a 10 metallization thereto, (ii) applying a metal-containing conductive paste to the relevant surface in accordance with said determined pattern, and (iii) drying the paste applied to the surface. It is known to apply a metallization pattern to the 15 front side of a photovoltaic element, for instance a silicon solar cell, using a screen-printing technique. According to this known method an emulsion layer suitable for this purpose is applied to a stainless steel mesh clamped in a frame, into which layer is recessed the 20 pattern of the metallization to be applied. The thus obtained screen is arranged over the front side of a silicon substrate, whereafter the metal-containing conductive paste is applied to the emulsion layer, for instance a paste of silver particles, frit, a binder and a 25 solvent. The paste is skinmed off using a squeegee and pressed via the mesh through the apertures in the emulsion layer onto the substrate. The thus created paste pattern on the substrate is then dried in a furnace, wherein the solvent evaporates, heated while air or oxygen is added to 30 burn organic binders, and sintered to adhere the metal particles to each other and to the substrate. It is an important advantage of the known method that a substrate to which a paste is applied by screen-printing WO 00/44051 PCT/NLOO/00026 2 can be dried, further heated and sintered in one furnace cycle so as to obtain the intended metallization pattern. An inherent drawback of the known method is that the minimum width of the metallization lines to be formed on 5 the substrate is determined by the mesh width of the screen used. A screen of width mesh 325 or higher (i.e. 325 or more meshes per inch) is used for instance to print very fine lines. When the line width is in the order of magnitude of the pitch of the screen (for a screen of 10 width mesh 400 for instance the pitch amounts to 65 pm), the opening in the emulsion layer is critical: the percentage of open surface fluctuates significantly, which results in a correspondingly fluctuating line width of the applied paste. The use of thinner wires for the screen or 15 increasing the distance between the wires thereof increases the uniformity of deposited metal paste lines but reduces the strength of the screen and thereby reduces the lifespan to a level which may be economically unacceptable. 20 During the design of a metallization pattern of a solar cell, the objective is to create the thinnest possible lines in order to keep shadow losses resulting from the metallization as low as possible and thereby the efficiency as high as possible. In order to hold 25 resistance losses in thin lines below determined values, a determined minimum height of these lines is however required. It is another drawback of the screen-printing technique that this imposes an upper limit on the viscosity of a paste for use such that the line height to 30 be realized with this paste is limited to an undesirably low value. It is an object of the invention to provide a method for applying a metallization pattern with relatively thin and well-defined lines which have a height such that 35 resistance losses in a solar cell with such a pattern are negligible, or at least remain below an acceptable level.
WO 00/44051 PCT/NLOO/00026 3 It is a further object to provide such a method wherein a paste applied to a substrate can be dried, further heated and sintered in one furnace cycle, so as to obtain the intended metallization pattern. 5 It is another object to provide a method which can be performed in rapid and cost-saving manner. These objects are achieved, and other advantages gained, with the method stated in the preamble, wherein according to the invention-in the second step (ii) a first 10 paste for the set of relatively thin lines is applied using a stencil and a second paste for the set of relatively wide strips is subsequently applied using an apparatus for contact-free application. A stencil is a foil, usually of a metal, for instance 15 nickel or stainless steel, which is placed instead of a screen over the substrate for a solar cell, wherein apertures in the foil are formed in accordance with a line pattern for arranging on the substrate. It has been found that a pattern for very thin, 20 smooth and relatively high lines of a first paste can be applied to the substrate in one print run by means of a stencil. The pattern of relatively wide strips forming the busbars in a solar cell can be applied immediately thereafter in contact-free manner by means of an apparatus 25 suitable for the purpose without intervening drying of the line pattern. A second print run with a second stencil or with a screen, which would be necessary to apply the pattern with the busbars intersecting the thin lines, is hereby dispensed with. The advantage of the screen 30 printing technique, that it is possible to suffice with only one furnace cycle after printing, is hereby retained, while the drawbacks thereof do not occur. The paste for the wide strips is applied for instance using an arrangement for contact-free dispensing or other technique 35 of contact-free application.
WO 00/44051 PCT/NL0O/00026 4 In a first embodiment of the method according to the invention the first paste and the second paste are identical. In a subsequent embodiment the second paste has a lower viscosity than the first paste, which provides the 5 advantage that the second paste has rheological properties such that it can be more easily transported through an apparatus for contact-free dispensing than the first paste, the viscosity of which is chosen such that very thin and relatively high lines can be printed with this 10 paste. The method is particularly suitable for embodiment with a stencil comprising a foil in which are arranged slots which correspond with the set of relatively thin lines and which have a width smaller than about 100 pm, in 15 particular smaller than about 50 pm, wherein the foil has for instance a thickness smaller than about 50 pm. The method according to the invention is for instance performed using an apparatus for contact-free application containing a nozzle placeable above the substrate, wherein 20 the second paste is applied by moving the nozzle and the substrate relative to each other such that the nozzle follows the predetermined pattern of the set of relatively wide strips. The nozzle has for instance a cross-section with an 25 aspect ratio having a value not equal to 1, preferably a value greater than 2, more preferably a value at least equal to 5. The nozzle preferably extends with a long axis of the cross-section parallel to the surface of the substrate and 30 perpendicularly of the direction of the relative movement of nozzle and substrate, wherein the nozzle more preferably has a cross-section with a long axis with a length of about 1.5 mm and a short axis with a length of about 300 pm. 35 The invention further relates to an apparatus for performing the above described method.
WO 00/44051 PCT/NLOO/00026 5 The invention will be elucidated hereinbelow on the basis of embodiments and with reference to the drawings. In the drawings: Fig. 1 shows in top view a substrate of a square 5 solar cell to which according to the invention a first paste is applied in a pattern of thin lines in a first step, Fig. 2 shows in top view the substrate of fig. 1 to which according to the invention a second paste is applied 10 in a pattern of relatively wide strips in a second step, Fig. 3 shows in perspective view a simplified illustration of an embodiment of an arrangement for contact-free dispensing of paste for the busbars to a substrate for a solar cell, 15 Fig. 4 shows the arrangement of fig. 3 at a later point in time, Fig. 5 shows in side view a cross-section through the arrangement of fig. 4, and Fig. 6 shows in side view a detail of an alternative 20 embodiment of an arrangement for contact-free dispensing. Corresponding components in the figures are designated with the same reference numerals. Fig. 1 shows a substrate 1 for a solar cell with a part of a so-called H-pattern. A full H-pattern consists 25 of relatively thin lines or fingers and relatively wide strips or busbars. The fingers have the purpose of carrying the current to be generated by the solar cell over the whole surface to the busbars, which in turn serve as central discharge for the current and for connecting in 30 series a subsequent solar cell by means of conductors for mounting on the busbars. By means of a stencil formed by a 50 pm thick foil of a suitable metal into which are recessed slots with a width of 50 gm, a pattern is printed on substrate 1 of lines 2 of a conductive paste which 35 contains inter alia about 70% by weight of silver in the form of very small spherical particles with a diameter of about 1-2 ym and a small fraction of flocculent particles WO 00/44051 PCT/NLOO/00026 6 or platelets with a largest dimension of about 5 pm. The lines 2 printed with the stencil in question have a width of about 55 yim and a height of about 20 ym in the dried and annealed state. 5 Fig. 2 shows substrate 1 of fig. 1 to which two strips 3 of a second suitable and per se known conductive paste are applied using an arrangement for contact-free dispensing. The strips 3 applied with the arrangement in question have a width of about 1.5 mm and a height of 10 about 300 pm in the dried and annealed state, and form the busbars of the solar cell. Fig. 3 shows a dispensing apparatus 4 for contact free application of paste for the busbars to a substrate 1 for a solar cell at a moment in time t=to. Shown are a 15 container 5 for holding paste under pressure with for instance compressed air, a housing 7 with a drive for a conveyor screw 8 and a nozzle 9 which debouches above a substrate 1 provided with lines 2. The dispensing apparatus is movable relative to substrate 1 along two 20 mutually perpendicular suspension arms 10, 11 and a vertical guide (not shown), wherein the relative movement of substrate 1 and nozzle 9 can be regulated using a control circuit (not shown) such that the nozzle follows the predetermined pattern of the set of busbars for 25 applying. The figure further shows a reference frame for the three mutually perpendicular directions of movement X, Y, Z for nozzle 9. Nozzle 9 has a cross-section with a long axis of about 1.5 mm in the Y-direction and a short axis with a length of about 300 pm in the X-direction (so 30 that the aspect ratio amounts to 5). Fig. 4 shows dispensing apparatus 4 of fig. 3 at a moment in time t=ti, at which the apparatus is displaced along arm 10 over a determined distance in the direction of arrow X. During the displacement paste is carried out 35 of container 5 via conduit 6 to the rotating (rotation symbolized by curved arrow w) conveyor screw 8, and using this conveyor screw 8 applied in contact-free manner to WO 00/44051 PCT/NL0O/00026 7 substrate 1 via nozzle 9 in accordance with a straight wide strip 3 extending transversely over lines 2. Once the whole strip 3 has been applied, successively the feed of paste is interrupted, apparatus 4 is displaced along arm 5 11 over a distance such that nozzle 9 debouches precisely above the location of a following busbar to be applied, whereafter the feed of paste and the movement along arm 10 can be resumed in (opposing) X-direction in order to apply a subsequent busbar 3 to substrate 1. 10 Fig. 5 shows a cross-section along line V-V through the arrangement shown in fig. 4. In the shown embodiment the distance Zo between the underside of nozzle 9 and the surface of substrate 1 is adjustable between 0.020 mm and 5 mm, whereby the thickness d of the paste strip to be 15 applied to substrate 1 can be adjusted in the range of about 10-300 pm. Fig. 6 shows a detail of an alternative embodiment of the dispensing apparatus, wherein the housing 7 with nozzle 9 shown in fig. 5 can be tilted in the X,Z plane so 20 that in the tilted position (drawn in dashed lines) of housing 7 and nozzle 9 at an angle a to the perpendicular the paste 3 can be applied to the surface of substrate 1, whereby when the feed of paste ceases the outer end of strip 3 is prevented from protruding above the level of 25 the remaining part of this strip.
Claims (19)
1. Method for applying a metallization to at least one of the outer surfaces of a substrate (1) for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which comprises a set of 5 relatively thin lines (2) and a set of relatively wide strips (3) connected thereto for transporting electrical charge carriers, which method comprises the steps of (i) providing said substrate (1), at least one of the outer surfaces of which is adapted for applying of a 10 metallization thereto, (ii) applying a metal-containing conductive paste to the relevant surface in accordance with said determined pattern (2, 3), and (iii) drying the paste applied to the surface, 15 characterized in that in the second step (ii) a first paste for the set of relatively thin lines (2) is applied using a stencil and a second paste for the set of relatively wide strips (3) is subsequently applied using an apparatus (4) for contact 20 free application.
2. Method as claimed in claim 1, characterized in that the first paste and the second paste are identical.
3. Method as claimed in claim 1, characterized in that the second paste has a lower viscosity than the first 25 paste.
4. Method as claimed in any of the claims 1-3, characterized in that the stencil comprises a foil in which are arranged slots which correspond with the set of relatively thin lines (2) and which have a width smaller 30 than about 100 pm.
5. Method as claimed in claim 4, characterized in that the width is smaller than about 50 pm. WO 00/44051 PCT/NLOO/00026 9
6. Method as claimed in either of the claims 4 or 5, characterized in that the foil has a thickness smaller than about 50 pm.
7. Method as claimed in any of the foregoing claims, 5 wherein the apparatus (4) for contact-free application comprises a nozzle (9) placeable above the substrate (1), characterized in that the second paste is applied by moving the nozzle (9) and the substrate (1) relative to each other such that the nozzle (9) follows the 10 predetermined pattern of the set of relatively wide strips (3).
8. Method as claimed in claim 7, characterized in that the nozzle (9) has a cross-section with an aspect ratio having a value not equal to 1. 15
9. Method as claimed in claim 8, characterized in that the aspect ratio has a value greater than 2.
10. Method as claimed in claim 9, characterized in that the aspect ratio has a value at least equal to 5.
11. Method as claimed in any of the claims 8-10, 20 characterized in that the nozzle (9) extends with a long axis of the cross-section parallel to the surface of the substrate (1) and perpendicularly of the direction of the relative movement of nozzle (9) and substrate (1).
12. Method as claimed in any of the claims 8-11, 25 wherein the nozzle (9) has a cross-section with a long axis with a length of about 1.5 nun and a short axis with a length of about 300 ym.
13. Apparatus (4) for contact-free application of a second paste for a set of relatively wide strips (3) to at 30 least one of the outer surfaces of a substrate (1) for a photovoltaic element in accordance with a method as claimed in any of the claims 1-6, characterized in that it comprises a nozzle (9) placeable above the substrate, wherein the substrate (1) and this nozzle (9) are movable 35 relative to each other such that during a relative movement of substrate (1) and nozzle (9) the nozzle (9) WO 00/44051 PCT/NLOO/00026 10 follows the predetermined pattern of the set of relatively wide strips (3).
14. Apparatus (4) as claimed in claim 13 for performing a method as claimed in claim 7, characterized 5 in that the nozzle (9) has a cross-section with an aspect ratio having a value not equal to 1.
15. Apparatus (4) as claimed in claim 14 for performing a method as claimed in claim 8, characterized in that the aspect ratio has a value greater than 2. 10
16. Apparatus (4) as claimed in claim 15 for performing a method as claimed in claim 9, characterized in that the aspect ratio has a value at least equal to 5.
17. Apparatus (4) as claimed in any of the claims 14 16 for performing a method as claimed respectively in any 15 of the claims 8-10, characterized in that the nozzle (9) extends with a long axis of the cross-section parallel to the surface of the substrate (1) and perpendicularly of the direction of the relative movement of nozzle (9) and substrate (1). 20
18. Apparatus (4) as claimed in any of the claims 14 17 for performing a method as claimed respectively in any of the claims 8-11, characterized in that the nozzle (9) has a cross-section with a long axis with a length of about 1.5 mm and a short axis with a length of about 300 25 pm.
19. Photovoltaic element provided with a metallization pattern (2, 3) applied in accordance with a method as claimed in any of the claims 1-12.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1011081A NL1011081C2 (en) | 1999-01-20 | 1999-01-20 | Method and device for applying a metallization pattern to a substrate for a photovoltaic cell. |
| NL1011081 | 1999-01-20 | ||
| PCT/NL2000/000026 WO2000044051A1 (en) | 1999-01-20 | 2000-01-14 | Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2331700A true AU2331700A (en) | 2000-08-07 |
Family
ID=19768510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU23317/00A Abandoned AU2331700A (en) | 1999-01-20 | 2000-01-14 | Method and apparatus for applying a metallization pattern to a substrate for a photovoltaic cell |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1149422A1 (en) |
| JP (1) | JP2003536240A (en) |
| AU (1) | AU2331700A (en) |
| NL (1) | NL1011081C2 (en) |
| WO (1) | WO2000044051A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4121928B2 (en) | 2003-10-08 | 2008-07-23 | シャープ株式会社 | Manufacturing method of solar cell |
| JP5025135B2 (en) * | 2006-01-24 | 2012-09-12 | 三洋電機株式会社 | Photovoltaic module |
| ATE460750T1 (en) * | 2006-10-24 | 2010-03-15 | Commissariat Energie Atomique | METALLIZING DEVICE AND METHOD |
| WO2010118906A2 (en) | 2009-04-16 | 2010-10-21 | Applied Materials, Inc. | Thin-film solar cell module |
| EP2242109A1 (en) * | 2009-04-16 | 2010-10-20 | Applied Materials, Inc. | Thin-film solar cell module |
| JP5676863B2 (en) * | 2009-09-15 | 2015-02-25 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern forming method and pattern forming apparatus |
| JP5395646B2 (en) * | 2009-12-14 | 2014-01-22 | 大日本スクリーン製造株式会社 | Pattern forming method and pattern forming apparatus |
| JP5395690B2 (en) * | 2010-01-26 | 2014-01-22 | 大日本スクリーン製造株式会社 | Pattern forming method and pattern forming apparatus |
| JP5022462B2 (en) * | 2010-03-18 | 2012-09-12 | 大日本スクリーン製造株式会社 | Electrode forming method and electrode forming apparatus |
| JP2012043876A (en) * | 2010-08-17 | 2012-03-01 | Dainippon Screen Mfg Co Ltd | Pattern formation method, pattern formation device, photoelectric conversion device manufacturing method, and photoelectric conversion device |
| EP2612361B1 (en) * | 2010-08-30 | 2018-09-19 | Commissariat à l'Énergie Atomique et aux Énergies Alternatives | Photovoltaic cell having discontinuous conductors |
| FR2964250B1 (en) * | 2010-08-30 | 2013-07-12 | Commissariat Energie Atomique | METHOD OF PRINTING CONDUCTORS ON A PHOTOVOLTAIC CELL |
| KR101180794B1 (en) | 2010-10-12 | 2012-09-10 | (주)솔라세라믹 | Method manufacturing electrode of dye-sensitized solar cell and dye-sensitized solar cell having electrode thereof |
| WO2012090293A1 (en) * | 2010-12-27 | 2012-07-05 | 株式会社Sat | Solar cell collecting electrode formation device and method, and coating head |
| JP5901010B2 (en) * | 2010-12-27 | 2016-04-06 | 株式会社Sat | Solar cell collecting electrode forming apparatus and method and coating head |
| DE102011052902A1 (en) * | 2011-07-21 | 2013-01-24 | Centrotherm Photovoltaics Ag | Method for printing metal contact on solar cell substrate for solar cell module, involves imprinting metalliferous paste on contact finger by printing device such that height of contact finger section is enlarged |
| US9899546B2 (en) | 2014-12-05 | 2018-02-20 | Tesla, Inc. | Photovoltaic cells with electrodes adapted to house conductive paste |
| US9991412B2 (en) * | 2014-12-05 | 2018-06-05 | Solarcity Corporation | Systems for precision application of conductive adhesive paste on photovoltaic structures |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5151377A (en) * | 1991-03-07 | 1992-09-29 | Mobil Solar Energy Corporation | Method for forming contacts |
| ATE146304T1 (en) * | 1993-07-30 | 1996-12-15 | Ibm | DEVICE AND METHOD FOR DEPOSING A FINE METAL LINE ON A SUBSTRATE |
| EP0729189A1 (en) * | 1995-02-21 | 1996-08-28 | Interuniversitair Micro-Elektronica Centrum Vzw | Method of preparing solar cells and products obtained thereof |
-
1999
- 1999-01-20 NL NL1011081A patent/NL1011081C2/en not_active IP Right Cessation
-
2000
- 2000-01-14 EP EP00902199A patent/EP1149422A1/en not_active Withdrawn
- 2000-01-14 JP JP2000595386A patent/JP2003536240A/en active Pending
- 2000-01-14 WO PCT/NL2000/000026 patent/WO2000044051A1/en active Search and Examination
- 2000-01-14 AU AU23317/00A patent/AU2331700A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000044051A1 (en) | 2000-07-27 |
| NL1011081C2 (en) | 2000-07-21 |
| EP1149422A1 (en) | 2001-10-31 |
| JP2003536240A (en) | 2003-12-02 |
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