WO2000043952A1 - Transpondeur rfid - Google Patents

Transpondeur rfid Download PDF

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Publication number
WO2000043952A1
WO2000043952A1 PCT/US2000/002042 US0002042W WO0043952A1 WO 2000043952 A1 WO2000043952 A1 WO 2000043952A1 US 0002042 W US0002042 W US 0002042W WO 0043952 A1 WO0043952 A1 WO 0043952A1
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WO
WIPO (PCT)
Prior art keywords
radio frequency
package
antenna
lead
accordance
Prior art date
Application number
PCT/US2000/002042
Other languages
English (en)
Inventor
Michael John Brady
Dah-Weih Duan
Paul Andrew Moskowitz
Original Assignee
Intermec Ip Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intermec Ip Corp. filed Critical Intermec Ip Corp.
Publication of WO2000043952A1 publication Critical patent/WO2000043952A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • the present invention relates generally to radio freguency identification (RFID) systems, and more specifically to RFID transponders for use in RFID systems.
  • RFID radio freguency identification
  • RFID Radio Frequency Identification
  • base station or interrogator a radio frequency (RF) transmitter-receiver unit
  • the RFID transponder detects the interrogating signal and transmits a response signal comprising encoded data back to the interrogator's receiver.
  • RFID systems provide identification functions not found in identification technologies such as optical indicia (e.g., bar code) recognition systems.
  • an RFID system may employ RFID transponders containing read/write memory of up to several kilobytes.
  • RFID transponders may be read by a system at one time. These RFID transponders are readable at a distance and do not require direct line-of-sight view by the reading apparatus.
  • RFID IC radio frequency identification integrated circuits
  • plastic packages such as Small Outline Packages (SOP), Miniature Small Outline Packages (MSOP), Small Outline Integrated Circuit (SOIC) packages, and Thin Shrinkable Small Outline Packages (TSSOP)
  • SOP Small Outline Packages
  • MSOP Miniature Small Outline Packages
  • SOIC Small Outline Integrated Circuit
  • TSSOP Thin Shrinkable Small Outline Packages
  • the RF characteristics of the RFID transponder are usually degraded due to discontinuities caused by the bonding wiring, materials, and geometry of the package. Further, the overall size of the RFID transponder usually becomes larger than it would be were the RFID IC directly attached to the substrate.
  • the advantages of using packaged RFID IC's such as robustness, versatility, and availability may be outweighed by the poorer performance and increased size of the RFID transponder.
  • RFID IC's radio frequency integrated circuits
  • the present invention is directed to novel methods and apparatus for packaging radio frequency integrated circuits (RFIC) and in particular radio frequency identification integrated circuits (RFID IC) and mounting packaged RFID IC's in RFID transponders so that the RF characteristics of the transponders are improved and the size of the transponders is reduced.
  • RFIC radio frequency integrated circuits
  • RFID IC radio frequency identification integrated circuits
  • An RFID transponder in accordance with a first aspect of the present invention includes an insulating substrate having an aperture formed therein and an antenna circuit (including an antenna and, optionally, impedance matching circuits) formed as an integral part of the substrate.
  • a packaged RFID IC including one or more leads for coupling the RFID IC to the antenna, is inverted and substantially and operably located within the aperture of the substrate so that the leads extend from the aperture and are coupled to the antenna.
  • a radio frequency integrated circuit (RFIC) chip such as a radio frequency identification integrated circuit (RFID IC) chip of an RFID transponder is packaged and oriented within a plastic package so that the RF characteristics of the packaged chip are improved.
  • the RFID IC chip may also be packaged and orientated with respect to the antenna so that the RF characteristics of the RFID transponder are improved and/or the size (length, width, area, etc.) of the substrate is minimized.
  • FIG. 1 is a block diagram depicting a typical RFID system
  • FIG. 2 is a top plan view of an RFID transponder in accordance with an exemplary embodiment of the present invention having a simple dipole antenna
  • FIG. 3 is a top plan view of an RFID transponder in accordance with an exemplary embodiment of the present invention having a meander dipole antenna
  • FIG. 4 is a partial cross-sectional side elevational view of the RFID transponder shown in FIG. 1 ;
  • FIG. 5 is an isometric view of the RFID transponder shown in FIG. 1 ;
  • FIG. 6 is a top plan view of an RFID transponder in accordance with an exemplary embodiment of the present invention having a linearly polarized patch antenna;
  • FIG. 7 is a top plan view of an RFID transponder in accordance with an exemplary embodiment of the present invention having a circularly polarized patch antenna;
  • FIGS. 8 and 9 are top plan views of RFID transponders in accordance with a further exemplary embodiment of the present invention.
  • FIG. 10 is a partial cross-sectional side elevational view of the RFID transponder shown in FIG. 6;
  • FIGS. 1 1 , 12 and 13 are block diagrams illustrating interconnection ofthe RFID IC chip to the leads of a plastic-molded package; and FIG. 14 is a partial cross-sectional side elevational view of a prior art RFID transponder having a packaged RFID IC.
  • FIGS. 1 1 , 12 and 13 are block diagrams illustrating interconnection ofthe RFID IC chip to the leads of a plastic-molded package; and FIG. 14 is a partial cross-sectional side elevational view of a prior art RFID transponder having a packaged RFID IC.
  • the RFID system 100 includes an interrogator or base station 112 communicating an RF signal to an RFID transponder 114.
  • the interrogator 112 preferably includes RF transmitter and a receiver sections 116 & 118 for providing two way communication with the RFID transponder 114.
  • the transmitter section 116 preferably includes an RF source 120 and RF amplifier 122 which send RF power to an antenna 124.
  • the transmitter section 116 transmits an RF signal with a transmitter carrier frequency.
  • the transmitter carrier also has a transmitting carrier frequency bandwidth referred to as a transmitting bandwidth.
  • the transmitting bandwidth is preferably wide enough to transmit data at a desired rate.
  • the RFID transponder 114 comprises an antenna 126 and an RFID circuit
  • the front end 130 can be any known front end design used with an antenna. Examples of front ends are well known. See, for example, the Hewlett Packard "Communications Components GaAs & Silicon Products Designer's Catalog” (i.e., page 2-15) which is herein incorporated by reference in its entirety. A typical front end is also described in U.S. Patent Application Serial No. 08/790,639 to Duan, et al. filed January 29, 1997 which is herein incorporated by reference in its entirety.
  • the signal processing section 132 may include logic circuits and memory for processing and storing information.
  • the present invention provides methods and apparatus for packaging RFID IC's which include the front end and signal processing section of the RFID transponder, and mounting the packaged RFID IC's in RFID transponders so that the RF characteristics of the transponders are improved and the size of the transponders is reduced.
  • exemplary RFID transponders in accordance with the present invention are shown.
  • the RFID transponders 200 include an insulating substrate 212 which is preferably formed of a rigid dielectric material such as FR-4 epoxy resin, phenolic, a ceramic, etc., or, alternatively, a flexible material such as polyimide, polyester, or the like.
  • An aperture 214 may be formed in the substrate 212 for receiving a packaged RFID IC 226.
  • the aperture 214 may extend completely through the substrate 212 (e.g., a hole), or, alternatively, only partially through the substrate 212 (e.g., a recess).
  • the substrate 212 may be rectangular in shape and may have a length (I) and a width (w).
  • the substrate may have other geometric or irregular shapes (i.e., circular, oval, sguare, triangular, curvilinear, etc.) without departing from the scope and spirit of the invention.
  • An antenna circuit 216 is integrally formed on the substrate 212.
  • the antenna circuit 216 consists of a thin pattern (typically 18 to 35 micron thick) formed of a conductive metal such as copper. This pattern may be formed by plating, adhering or screening a thin layer of copper (or other conductive metal) onto the substrate 212. The layer is then etched to form the desired geometric configuration of the antenna circuit 216.
  • the antenna circuit 216 of the present invention may employ any of a large number of different antennas having various configurations and geometries (i.e., monopole, dipole, folded dipole, loop, slot, coil, spiral, meander, patch, etc.).
  • the antenna circuit 216 may comprise a simple dipole antenna consisting of dipole elements or traces 218 & 220.
  • the antenna circuit 216 may comprise a meander dipole antenna.
  • the meander dipole antenna may also comprise dipole elements or traces 218 & 220.
  • the antenna circuit 216 may comprise a patch antenna including a patch element 254 and a conducting ground plane 256.
  • the conducting ground plane 256 may comprise a layer of conductive metal (e.g., copper) formed (i.e., by plating, adhering or screening, etc.) on the side of the substrate 212 opposite the pattern.
  • the substrate 212 spaces the antenna's radiating element (e.g., patch element 254, or, alternatively, other structures such as dipole elements, etc. (not shown)) from the ground plane 256.
  • the antenna circuits 216 shown herein, or substitution of other types of antennas by one skilled in the art would not depart from the scope and spirit of the invention.
  • One or more impedance adjustment elements 220 may likewise be integrally formed on the substrate 212 to modify the impedance of the antenna circuit 216.
  • the impedance adjustment elements 220 may be, for example, lumped circuit elements, distributed microwave circuit elements, or parasitic elements that are electromagnetically coupled to the antenna (i.e., not electrically connected).
  • the antenna circuit 216 may, for example, include a tuning stub 222 having a length and width adjusted to tune the impedance of the antenna.
  • the tuning stub 222 acts as a two conductor transmission line and may be terminated either in a short-circuit or open-circuit.
  • a short circuited stub acts as a lumped inductor while an open-circuit stub acts as a lumped capacitor.
  • the magnitude of the reactance of the tuning stub 222 is affected by the stub's length, width, and spacing.
  • one or more impedance loading bars 224 may be integrally formed on the substrate 212 adjacent to the antenna in the same manner.
  • the impedance loading bars 224 are electromagnetically coupled to the antenna to modify its impedance.
  • the antenna circuit 216 may include impedance matching circuits (i.e., microst p lines, or the like) 258 & 260. These circuits 258 & 260 which are connected to the packaged RFID IC 226, may interconnect the RFID IC 226 to the radiating element of the antenna circuit 216 (e.g., impedance matching circuit 260) to carry RF signal and energy from the RFID IC 226 to the antenna (e.g., patch antenna element 254) and/or from the antenna 254 to the RFID IC 226.
  • impedance matching circuits i.e., microst p lines, or the like
  • the circuits 260 have a length and width chosen to at least partially match the impedance of the antenna 254 and the RFID IC 226.
  • the packaged radio frequency identification integrated circuit (RFID IC) 226 is mounted to the substrate 212 and electrically interconnected to the antenna circuit 216.
  • the packaged RFID IC 226 preferably comprises an RFID IC chip 228 encapsulated within a plastic- molded package 230.
  • the package 230 may be a single in-line package (SIP), dual in-line package, or flat pack package (shown).
  • Typical flat pack IC packages which may be utilized by the present invention include, but are not limited to Small Outline Package (SOP), Miniature Small Outline Package (MSOP), Small Outline Integrated Circuit (SOIC), Plastic Ball Grid Array (PBGA), Thin Quad Flat Pack (TQFP), Low Profile Quad Flat Pack (LQFP), Metric Quad Flat Pack (MQFP), Plastic Quad Flat Pack (PQFP), Plastic Leaded Chip Carrier (PLCC), Thin Shrinkable Small Outline Package (TSSOP), Sh nkable Small Outline Package (SSOP), Quad Small Outline Package (QSOP), Plastic Dual Inline Package (PDIP), SC 70, SC-79, Small Outline Transistor (SOT-23, SOT- 143), and Small Outline Diode (SOD-323) packages.
  • SOP Small Outline Package
  • MSOP Miniature Small Outline Package
  • SOIC Small Outline Integrated Circuit
  • PBGA Plastic Ball Grid Array
  • TQFP Thin Quad Flat Pack
  • LQFP Low Profile Quad Flat Pack
  • the package 230 includes a plurality of external leads or pins 232 which electrically couple the packaged IC 230 to the copper pattern or traces formed on the substrate 212.
  • the leads or pins 232 may be arranged in rows along all four sides 234, 235, 236 & 237 of the package 230 (i.e., a quad-flat-pack package), or, alternatively, only on opposite sides 234 & 236 of the package 230 (i.e., an MSOP, or the like) depending on the type of package 230 employed.
  • the leads 232 may be electrically connected to contacts 238 & 240 on the RFID IC chip 228 via connectors 246 & 248 formed using conventional techniques such as wire bonding or the like (see FIGS. 4 and 10).
  • the leads 232 may then be soldered to the circuit (e.g., antenna circuit 216) formed on the substrate 212 to, for example, connect the contacts 238 & 240 of the RFID IC chip 228 to the antenna circuit 216 (i.e., directly to the antenna, or, alternatively, to impedance adjustment elements 220 such as impedance matching circuits 258 & 260).
  • the circuit e.g., antenna circuit 216
  • impedance adjustment elements 220 such as impedance matching circuits 258 & 260.
  • the packaged RFID IC 312 of the RFID transponder 300 includes a generally rectangular body 314 having a top surface 316, a bottom surface 318, first and second side surfaces 320 & 322, and first and second end surfaces (not shown).
  • the package includes a plurality of leads 324 which extend outwardly from each side surface 320 & 322.
  • the leads 324 may be generally "S" or "Z” shaped in profile so that they extend downwardly past the bottom surface 318 of the RFID IC's body 314.
  • the leads 324 may be soldered 332 to antenna elements 328 and/or other circuits 330 of substrate 326 so that the body 314 of the RFID IC 312 is supported above the substrate 326 and antenna elements 328 and/or circuits 330.
  • the RFID transponder 300 may have a thickness (t) which comprises the combined thicknesses ofthe packaged RFID IC 312, the substrate 326, the antenna elements 328 and/or circuits 330 and/or the space between the RFID IC body 314 and the substrate 326 or antenna elements 328 and/or circuits 330, if any. As shown in FIGS. 2 through 10, and particularly in FIGS.
  • the packaged RFID IC 226 of the RFID transponder 200 may be inverted (compared to the orientation of the RFID IC 314 of the prior art RFID transponder 300 shown in FIG. 8) and substantially located within the aperture 214 of the substrate 212.
  • This orientation reduces the thickness (f) form factor of the RFID transponder 200 by eliminating the space between the RFID IC and the substrate of the prior art RFID transponder (314, 326 & 300 in FIG. 8), and reducing the thickness of the RFID IC 226 by an amount equal to the thickness of the RFID IC 226 contained within the aperture 214 of the substrate 212.
  • the leads 232 of the RFID IC package 230 extend upwardly from the aperture 214 and are coupled to the antenna circuit 216 (and/or other circuits formed on the substrate 212).
  • the leads 232 may be bent (i.e., an MSOP or the like) so that they are somewhat "S" or "Z” shaped and have an end extending over the edge of the aperture 214.
  • the leads 232 may be straight (i.e., a SIP, a DIP, etc., not shown).
  • the leads 232 may support the packaged RFID IC 226 within the aperture 214 and may engage the antenna circuit 216 (and/or other circuits) formed on the substrate 212.
  • the leads 232 may be soldered to the antenna circuit 216 (and/or other circuits) to secure the RFID IC 226 to the substrate 212.
  • an encapsulant 242 may be applied to secure the packaged RFID IC 226 within the aperture 214 and to protect the lead/circuit connections 244. Referring now to FIGS. 1 1 , 12, and 13, radio frequency integrated circuit
  • RFID IC chips such as RFID IC 226 may be packaged and orientated with respect to the antenna circuit 216 so that the RF characteristics of the RFID transponder are optimized.
  • the RFID IC package 230 may be generally rectangular in shape and may have a length (/ p ) and a width (w p ).
  • An RFID IC chip 228 is encapsulated within the package 230.
  • the RFID IC chip 228 includes first and second antenna contacts or pads 238 & 240 (e.g., signal pad and a ground pad) which may be electrically connected to first and second leads 250 & 252 of the package's lead frame via connectors such as wire bonds 246 & 248.
  • the wire bonds 246 & 248 are formed via conventional wire bonding methods.
  • RFID IC 226 may extend from the first side 234 of the package 230.
  • the first lead 250 may be connected to the antenna circuit 216 (i.e., dipole element 218 shown in FIG. 2, or, alternatively, impedance matching circuit 258 shown in FIG. 8).
  • a second lead (Pin 8) 252 may extend from the second side 236 of the package 230 opposite the first, where it may likewise be attached to the antenna circuit 216 (i.e., dipole element 220 shown in FIG. 2, or, alternatively, impedance matching circuit 260 shown in FIG. 8).
  • the first lead (Pin 2) 246 and the second lead (Pin 3) 248 may both be on the same side 234 of the package 230 where they may be attached to the antenna circuit 216 (i.e., the first lead 250 may be connected to the dipole antenna element 218 and the second lead 248 may be attached to the dipole antenna element 220 as shown in FIG. 3, or the first lead 250 may be attached to impedance matching element 258 and the second lead 252 may be attached to impedance matching element 260 as shown in FIG. 9).
  • the first lead (Pin 1 ) 250 may extend from a first side 234 of the package 230.
  • the first lead 250 may be connected to the antenna circuit 216 (i.e., impedance matching circuits 260 shown in FIGS. 6 and 7).
  • the second lead (Pin 16) 252 may extend from a second side 235 of the package 230 where it may be attached to the antenna circuit 216 (i.e., impedance matching circuits 258 shown in FIGS. 6 and 7).
  • the first and second sides 234 & 235 form a corner of the package 230.
  • the first and second leads 250 & 252 may be positioned one on each side of the corner at a substantially right angle to each other.
  • packaged RFID IC's may be mounted in the inverted fashion in accordance with the first aspect of the present invention shown in FIGS. 2, 3 and 6, or, alternatively in the conventional manner (so that body of the RFID IC package is completely above the upper surface of the substrate of the RFID transponder) as shown in FIG. 14.
  • the frequency of an RFID system i.e., RFID system 100 shown in FIG. 1
  • the wavelength is very short (i.e., within the microwave range)
  • it is desirable to maximize coupling of external RF energy into the RFID IC chip 228 especially were the RFID transponder 200 is passive).
  • the lines e.g., leads 250 & 252 and wire bonds 246 & 248, interconnecting the antenna circuit 216 and antenna contacts 238 & 240 are preferably symmetrical, short in length, and have very few discontinuities so coupling of the RF signal into the RFID IC chip 228 is maximized.
  • the arrangement and orientation of the RFID IC chip 228, package 230, and wire bonds 246 & 248 in accordance with the present invention as shown in FIGS. 11 , 12, and 13 result in less discontinuity in the interconnection, which reduces the amount of reflections and spurious radiations, improving the radiation efficiency when connected to an antenna and reducing the mismatch loss and radiation loss when connected to a circuit.
  • the RFID IC chip 228 is preferably oriented within the package 230 so each of the antenna contacts 238 & 240 is substantially adjacent to the lead 250 & 252 to which it is bonded. This orientation allows the package 230 to have a shorter, smoother wire bonds connecting the contacts 238 & 240 to the leads 250 & 252.
  • Shorter wire bonds 246 & 248 are desirable because the lengths of the wire bonds 246 & 248 and leads 250 & 252 contribute to the inductance of the antenna circuit 216. Further, when added together, impedance contributed by the wire bonds 246 & 248 and leads 250 & 252 may become a significant portion of the antenna circuit's total impedance. Preferably, the orientation also allows the wire bonds 246 & 248 to have similar lengths.
  • the lines (e.g., leads 250 & 252 and wire bonds 246 & 248) interconnecting the RFID IC 228 to the antenna circuit 216 preferably have similar cross-sections, and good conductivity (i.e., are not resistive). In this manner, a smoother transition is provided for the RF wave (e.g., microwave) between the antenna circuit 216 and the antenna contacts 238 & 240 thereby providing improved RF characteristics.
  • RF wave e.g., microwave
  • Orientation of the RFID IC 228, package 230, and wire bonds 246 & 248 in accordance with the present invention also prevents crossover, bending or kinking of the wire bonds 246 & 248.
  • Crossovers introduce cross-talk and additional parasitic capacitance or inductance which may degrade performance of the RFID transponder 200.
  • Bending or kinking introduces discontinuities in the RF wave (e.g., microwave) structure. Such discontinuities are sources of leakage, radiation loss, etc. which reduce the efficiency of the RFID transponder 200.
  • the RFID IC 228 collects power from the RF field via the antenna circuit 216.
  • the efficiency of the lines e.g., leads 250 & 252 and wire bonds 246 & 248, transmitting RF power between the antenna circuit 216 and the RFID IC 228 helps prevent a reduction in power available to the RFID IC 228.
  • the 248 may also allow the size (e.g., length (/), width (w), or total area) of the substrate 212 of the RFID transponder 200 to be minimized.
  • the antenna circuit 216 may comprise a simple dipole antenna which includes a first dipole element 218 and a second dipole element 220 formed on the surface of the substrate 212 on each side of the packaged RFID IC 226.
  • the first lead (Pin 1 ) 250 extends from the first side 234 of the package 230 and is connected to the first antenna circuit element 218 while the second lead (Pin 8) 252 extends from the second side 236 of the package 230 opposite the first and is attached to the second antenna circuit element 220.
  • the package 230 to be positioned on the substrate 212 so that the length (/ p ) of the package 230 is perpendicular to the dipole elements 218 & 220 of the antenna circuit 216, and the length (/) of the substrate 212 while the width (w p ) of the package 230 is parallel to the dipole elements 218 & 220 and width (w) of the substrate 212.
  • the length (/ p ) of the substrate 212 may be reduced.
  • the width (w) ofthe substrate 212 may be reduced.
  • the antenna circuit 216 may comprise a meander dipole antenna which includes a first dipole element 218 and a second dipole element 220 formed on the surface of the substrate 212 adjacent to the packaged RFID IC 226.
  • the first lead (Pin 2) 246 and the second lead (Pin 3) 248 are both located on the same side 234 of the package 230.
  • the first lead 246 may be connected to the first dipole element 218, and the second lead 248 attached to the second dipole element 220.
  • the package 230 to be positioned on the substrate 212 so that the length (/ p ) of the package 230 is parallel to the longitudinal length of the antenna 216 and length (/) of the substrate 212 while the width (w p ) of the package 230 is perpendicular to the longitudinal length of the antenna 216 and width (w) of the substrate 212.
  • the length (/ p ) of the substrate 212 may be reduced.
  • the width (w) of the substrate 212 may be reduced.
  • the antenna circuit 216 may further comprise a patch antenna including a patch element 254, one or more impedance matching circuits 258 & 260, and a conducting ground plane 256.
  • the patch antenna may be a linearly polarized patch antenna as shown in FIGS. 6, 8, and 9, or, as shown in FIG. 7, a circularly polarized patch antenna.
  • the first lead (Pin 1 ) 250 and second lead (Pin 16) 252 may be arranged at a right angle to each other at a corner of the package 230.
  • FIGS. 1 the first lead
  • second lead (Pin 16) 252 may be arranged at a right angle to each other at a corner of the package 230.
  • the first lead (Pin 1 ) 250 may extend from the first side 234 of the package 230 while the second lead (Pin 8) 252 extends from the second side 236 of the package 230 opposite the first. Further, as shown in FIGS. 9 and 12, the first lead (Pin 2) 246 and the second lead (Pin 3) 248 are both located on the same side 234 of the package 230.
  • the packaged RFID IC 226 may be oriented and mounted on the substrate 212 and bonded to the antenna circuit 216 to provide a smoother transition for the RF wave (e.g., microwave) between the antenna and the RFID IC 226 and/or to reduce or minimize the surface area of the RFID transponder 200.
  • the RF wave e.g., microwave

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention se rapporte à une puce de circuit intégré d'identification radioélectrique (RFID IC) qui est montée et orientée à l'intérieur d'un boîtier moulé en plastique de sorte que les caractéristiques radioélectriques du circuit intégré RFID en boîtier soient améliorées. Le circuit intégré RFID peut être mis en boîtier et orienté par rapport au circuit de l'antenne de sorte que les caractéristiques radioélectriques du transpondeur soient améliorées et/ou la dimension (longueur, largeur, surface, etc.) du substrat réduite. Ce circuit intégré RFID mis sous boîtier peut également être inversé et placé sensiblement et fonctionnellement dans une ouverture pratiquée dans le substrat du transpondeur RFID de manière à réduire l'épaisseur du transpondeur.
PCT/US2000/002042 1999-01-22 2000-01-21 Transpondeur rfid WO2000043952A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23524399A 1999-01-22 1999-01-22
US09/235,243 1999-01-22

Publications (1)

Publication Number Publication Date
WO2000043952A1 true WO2000043952A1 (fr) 2000-07-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/002042 WO2000043952A1 (fr) 1999-01-22 2000-01-21 Transpondeur rfid

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WO (1) WO2000043952A1 (fr)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093249A1 (fr) 2003-04-10 2004-10-28 Avery Dennison Corporation Dispositifs rfid a antenne auto-compensatrice et a blindage conducteur
WO2004093243A2 (fr) * 2003-04-10 2004-10-28 Avery Dennison Corporation Antennes autocompensees pour substrats presentant des valeurs de constante dielectrique differentes
WO2005048476A1 (fr) * 2003-11-14 2005-05-26 Trolley Scan (Proprietary) Limited Transpondeur radiofrequence a antenne uhf raccourcie sur le plan electrique
WO2005054030A1 (fr) * 2003-12-05 2005-06-16 Ansaldo Segnalamento Ferroviario S.P.A. Balise ferroviaire et procede de production associe
US6914562B2 (en) 2003-04-10 2005-07-05 Avery Dennison Corporation RFID tag using a surface insensitive antenna structure
US7055754B2 (en) 2003-11-03 2006-06-06 Avery Dennison Corporation Self-compensating antennas for substrates having differing dielectric constant values
DE102005018803A1 (de) * 2005-04-22 2006-10-26 Mühlbauer Ag Transponder mit einer Dipol-Antenne
EP1724714A2 (fr) * 2005-05-13 2006-11-22 NRC International Inc. Antenne Patch pour l'étiquette RFID
WO2007000578A2 (fr) 2005-06-25 2007-01-04 Omni-Id Limited Decoupleur de rayonnement electromagnetique
EP1887653A1 (fr) * 2006-08-09 2008-02-13 Fujitsu Ltd. Étiquette Rfid et procédé de fabrication correspondant
US7755484B2 (en) 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
US7760104B2 (en) 2005-04-08 2010-07-20 Entegris, Inc. Identification tag for fluid containment drum
US7880619B2 (en) 2006-06-16 2011-02-01 Omni-Id Limited Electromagnetic enhancement and decoupling
US7937241B2 (en) 2007-04-23 2011-05-03 Grammer Ag Method and device for analyzing the effects of the vibrations of a vehicle acting on a person
US7958783B2 (en) 2007-04-23 2011-06-14 Grammer Ag Method and device for analyzing the effects of the vibrations of a vehicle transmitted to a person
US8684705B2 (en) 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
US8727744B2 (en) 2010-02-26 2014-05-20 Entegris, Inc. Method and system for optimizing operation of a pump
US8753097B2 (en) 2005-11-21 2014-06-17 Entegris, Inc. Method and system for high viscosity pump
US20150028517A1 (en) * 2008-09-25 2015-01-29 Contitech Luftfedersysteme Gmbh Identification device for a pneumatic spring
US9115781B2 (en) 2009-01-21 2015-08-25 Grammar Ag Device for springing a mass, and method for adjusting and/or operating a fluid spring
US9297374B2 (en) 2010-10-20 2016-03-29 Entegris, Inc. Method and system for pump priming
RU173877U1 (ru) * 2016-12-05 2017-09-15 Олег Николаевич Гашников Rfid-метка регистрационного знака
RU2654081C1 (ru) * 2016-12-05 2018-05-16 Олег Николаевич Гашников Rfid-метка регистрационного знака
JP2020080487A (ja) * 2018-11-13 2020-05-28 Ｎｅｃプラットフォームズ株式会社 アンテナ、無線通信機器およびアンテナ形成方法
US11705617B2 (en) 2019-12-04 2023-07-18 Avery Dennison Retail Information Services, Llc Pad structures for antennas that allow multiple orientations with RFID straps

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
DE4431754C1 (de) * 1994-09-06 1995-11-23 Siemens Ag Trägerelement
EP0756244A2 (fr) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Unité électronique et procédé de fabrication de cette unité
DE19703057A1 (de) * 1996-12-20 1998-07-02 Siemens Ag Trägerelement zum Einbau in Kombi-Chipkarten und Kombi-Chipkarte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
DE4431754C1 (de) * 1994-09-06 1995-11-23 Siemens Ag Trägerelement
EP0756244A2 (fr) * 1995-07-26 1997-01-29 Giesecke & Devrient GmbH Unité électronique et procédé de fabrication de cette unité
DE19703057A1 (de) * 1996-12-20 1998-07-02 Siemens Ag Trägerelement zum Einbau in Kombi-Chipkarten und Kombi-Chipkarte

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2309597A1 (fr) * 2003-04-10 2011-04-13 Avery Dennison Corporation Dispositif RFID avec système d'auto adaptation de l'antenne et écran conducteur
WO2004093243A2 (fr) * 2003-04-10 2004-10-28 Avery Dennison Corporation Antennes autocompensees pour substrats presentant des valeurs de constante dielectrique differentes
WO2004093243A3 (fr) * 2003-04-10 2005-01-20 Avery Dennison Corp Antennes autocompensees pour substrats presentant des valeurs de constante dielectrique differentes
WO2004093249A1 (fr) 2003-04-10 2004-10-28 Avery Dennison Corporation Dispositifs rfid a antenne auto-compensatrice et a blindage conducteur
US6914562B2 (en) 2003-04-10 2005-07-05 Avery Dennison Corporation RFID tag using a surface insensitive antenna structure
US7055754B2 (en) 2003-11-03 2006-06-06 Avery Dennison Corporation Self-compensating antennas for substrates having differing dielectric constant values
WO2005048476A1 (fr) * 2003-11-14 2005-05-26 Trolley Scan (Proprietary) Limited Transpondeur radiofrequence a antenne uhf raccourcie sur le plan electrique
WO2005054030A1 (fr) * 2003-12-05 2005-06-16 Ansaldo Segnalamento Ferroviario S.P.A. Balise ferroviaire et procede de production associe
MD20060180A (ro) * 2003-12-05 2006-11-30 Ansaldo Segnalamento Ferroviario S.P.A. Baliză de cale ferată şi procedeu de confecţionare a acesteia
AU2004294404B2 (en) * 2003-12-05 2009-04-02 Ansaldo Sts S.P.A. Railway beacon and related production method
US7639160B2 (en) 2003-12-05 2009-12-29 Ansaldo Sts S.P.A. Railway beacon and related production method
MD40Z (ro) * 2003-12-05 2010-01-31 Ansaldo Segnalamento Ferroviario S.P.A. Baliză de cale ferată şi procedeu de fabricare a acesteia
US7755484B2 (en) 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
US8464499B2 (en) 2005-04-08 2013-06-18 Entegris, Inc. Method of filling a drum having an RFID identification tag
US7760104B2 (en) 2005-04-08 2010-07-20 Entegris, Inc. Identification tag for fluid containment drum
DE102005018803A1 (de) * 2005-04-22 2006-10-26 Mühlbauer Ag Transponder mit einer Dipol-Antenne
EP1724714A2 (fr) * 2005-05-13 2006-11-22 NRC International Inc. Antenne Patch pour l'étiquette RFID
EP1724714A3 (fr) * 2005-05-13 2006-12-13 NRC International Inc. Antenne Patch pour l'étiquette RFID
US7605706B2 (en) 2005-05-13 2009-10-20 The Kennedy Group, Inc. Patch antenna for RFID tag
US7768400B2 (en) 2005-06-25 2010-08-03 Omni-Id Limited Electromagnetic radiation decoupler
WO2007000578A2 (fr) 2005-06-25 2007-01-04 Omni-Id Limited Decoupleur de rayonnement electromagnetique
WO2007000578A3 (fr) * 2005-06-25 2007-03-22 Qinetiq Ltd Decoupleur de rayonnement electromagnetique
US9646241B2 (en) 2005-06-25 2017-05-09 Omni-Id Cayman Limited Electromagnetic radiation decoupler
US9104952B2 (en) 2005-06-25 2015-08-11 Omni-Id Cayman Limited Electromagnetic radiation decoupler
US8753097B2 (en) 2005-11-21 2014-06-17 Entegris, Inc. Method and system for high viscosity pump
US7880619B2 (en) 2006-06-16 2011-02-01 Omni-Id Limited Electromagnetic enhancement and decoupling
US8022878B2 (en) 2006-08-09 2011-09-20 Fujitsu Limited RFID tag and manufacturing method thereof
US8462052B2 (en) 2006-08-09 2013-06-11 Fujitsu Limited RFID tag and manufacturing method thereof
EP1887653A1 (fr) * 2006-08-09 2008-02-13 Fujitsu Ltd. Étiquette Rfid et procédé de fabrication correspondant
US7937241B2 (en) 2007-04-23 2011-05-03 Grammer Ag Method and device for analyzing the effects of the vibrations of a vehicle acting on a person
US7958783B2 (en) 2007-04-23 2011-06-14 Grammer Ag Method and device for analyzing the effects of the vibrations of a vehicle transmitted to a person
US9833947B2 (en) * 2008-09-25 2017-12-05 Contitech Luftfedersysteme Gmbh Method for making an air spring member
US20150028517A1 (en) * 2008-09-25 2015-01-29 Contitech Luftfedersysteme Gmbh Identification device for a pneumatic spring
US9115781B2 (en) 2009-01-21 2015-08-25 Grammar Ag Device for springing a mass, and method for adjusting and/or operating a fluid spring
US9354637B2 (en) 2010-02-26 2016-05-31 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
US8727744B2 (en) 2010-02-26 2014-05-20 Entegris, Inc. Method and system for optimizing operation of a pump
US8684705B2 (en) 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
US9297374B2 (en) 2010-10-20 2016-03-29 Entegris, Inc. Method and system for pump priming
RU173877U1 (ru) * 2016-12-05 2017-09-15 Олег Николаевич Гашников Rfid-метка регистрационного знака
RU2654081C1 (ru) * 2016-12-05 2018-05-16 Олег Николаевич Гашников Rfid-метка регистрационного знака
JP2020080487A (ja) * 2018-11-13 2020-05-28 Ｎｅｃプラットフォームズ株式会社 アンテナ、無線通信機器およびアンテナ形成方法
JP7014425B2 (ja) 2018-11-13 2022-02-15 Ｎｅｃプラットフォームズ株式会社 アンテナ、無線通信機器およびアンテナ形成方法
US11705617B2 (en) 2019-12-04 2023-07-18 Avery Dennison Retail Information Services, Llc Pad structures for antennas that allow multiple orientations with RFID straps

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