WO2000013051A1 - Diffractive vertical cavity surface emitting laser power monitor and system - Google Patents

Diffractive vertical cavity surface emitting laser power monitor and system Download PDF

Info

Publication number
WO2000013051A1
WO2000013051A1 PCT/US1999/019694 US9919694W WO0013051A1 WO 2000013051 A1 WO2000013051 A1 WO 2000013051A1 US 9919694 W US9919694 W US 9919694W WO 0013051 A1 WO0013051 A1 WO 0013051A1
Authority
WO
WIPO (PCT)
Prior art keywords
monitor
power
diffractive
optical element
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/019694
Other languages
English (en)
French (fr)
Inventor
Robert Te Kolste
Alan D. Kathman
Eric G. Johnson
Michael R. Feldman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DigitalOptics Corp East
Original Assignee
Tessera North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera North America Inc filed Critical Tessera North America Inc
Priority to EP99945268.3A priority Critical patent/EP1047970B1/en
Priority to JP2000567979A priority patent/JP2002523910A/ja
Priority to CA002306845A priority patent/CA2306845C/en
Priority to AU57899/99A priority patent/AU5789999A/en
Publication of WO2000013051A1 publication Critical patent/WO2000013051A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Definitions

  • the present invention is directed to monitoring power of a light emitting device
  • VCSELs VCSELs
  • Light emitting devices such as VCSELs need some form of power control to
  • output may be used for the power control.
  • monitoring of the light must be from the same output as used for the desired application
  • VCSELs are much cheaper and their surface emissions make them easier
  • VCSELs is very desirable.
  • the monitored power may change in a way which does
  • splitting off of the beam may require the output of the VCSEL to be
  • Such monitoring may be performed using a diffractive to
  • FIG. 2 is a side view of another embodiment of the present invention.
  • FIG. 3a and 3b are side view of systems incorporating the power monitor of the
  • light emitting device 10 e.g., a VCSEL or a light emitting diode, emits a light beam 15
  • the light beam 15 impinges upon a diffractive
  • the diffractive element 20 preferably on a first surface 25 of a substrate 30.
  • the diffractive element 20 is preferably on a first surface 25 of a substrate 30.
  • the diffractive element 20 transmits a majority of the beam into the zeroth or
  • an appropriately positioned monitor 50 e.g., a
  • a photo detector measures the power of the monitor beam 45 and the measured power is then used to control the operation of the light emitting device 10 in a known manner.
  • surface 35 opposite the diffractive element may include additional optical elements 37,
  • the light 15 has a wavelength of 830 nm, a
  • diffractive element having an eight level blazed grating made in fused silica was
  • the diffractive element 20 also focuses the monitor
  • the focusing of the monitor beam avoids VCSEL feedback
  • the diffractive optical element allows the detector to be smaller. In general, it is preferable that the diffractive optical element
  • element used in the present invention provides optical functioning, e.g., collimation,
  • element is preferably a computer generated hologram.
  • beam 40 may be incorporated with the reflective diffractive element 20 to form a
  • the application beam 40 is
  • n is the refractive index
  • the etch depth is ⁇ /(n-l) for a transmission hologram
  • the reflection hologram may be much shallower than the transmission hologram
  • hologram is 2 ⁇ , four times greater than the ⁇ /2 for the reflection hologram. If sixteen
  • reflection hologram function will only be a small modulation on the transmission
  • holograms could incorporate levels having phase depths in excess of 2 ⁇ .
  • the light emitting device 10 again outputs a beam of light
  • the diffractive element 55 on the first surface deflects some light 60 off to the side.
  • the diffractive element 55 also collimates the monitor beam . This
  • the deflected light 60 is then reflected off of the second surface by total internal
  • the reflected beam 70 then returns to the first surface, where
  • the second surface may include optical elements for performing further
  • the detector may be omitted if the diffractive element 55 is designed to provide focus to the deflected light beam. Such a design would eliminate the additional loss incurred if the
  • the deflected light may be reflected a plurality of times if the angle is
  • additional optical elements may be
  • the application beam 40 either on the first surface or the second surface of the substrate
  • the entire system may be integrated as shown, for example, in FIG. 3a and 3b.
  • FIG. 3a the configuration shown in FIG. 2 is preferred.
  • FIG. 3b the light emitting device
  • the integration may occur on a wafer level.
  • the reflection diffractive element may be any suitable reflection diffractive element.
  • a plastic or glass cap 90 which may go inside a can 95 housing the
  • the cap forms a protective, potentially
  • the cap 85 may be made in many ways, including injection molding.
  • VCSEL 15 impinges upon a diffractive element which both splits off a portion of the
  • a zoom lens may also be used to focus the monitor beam on the detector 50.
  • a zoom lens may also be used to focus the monitor beam on the detector 50.
  • a zoom lens may also be used to focus the monitor beam on the detector 50.
  • refractive element may be provided on a surface adjacent the diffractive element 55 to
  • the focusing element by the focusing element, the relative order of the diffractive element and the focusing
  • a monitor detector is provided for at least one of the VCSELs.
  • one detector typically a corresponding array of detectors, is positioned in the plane of the
  • the monitor beam may be collimated and/or focused by the diffractive element. This collimation and/or focusing is particularly important when
  • the fiber includes incorporating the diffractive element for forming the monitor beam in a
  • diffractive element may create the monitor beam only from the portion of the beam to be
  • the beam which will be delivered to the core region of the fiber may be monitored.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
PCT/US1999/019694 1998-08-31 1999-08-31 Diffractive vertical cavity surface emitting laser power monitor and system Ceased WO2000013051A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP99945268.3A EP1047970B1 (en) 1998-08-31 1999-08-31 Diffractive vertical cavity surface emitting laser power monitor and system
JP2000567979A JP2002523910A (ja) 1998-08-31 1999-08-31 垂直キャビティ表面発光レーザのための回折性パワーモニタおよびシステム
CA002306845A CA2306845C (en) 1998-08-31 1999-08-31 Diffractive vertical cavity surface emitting laser power monitor and system
AU57899/99A AU5789999A (en) 1998-08-31 1999-08-31 Diffractive vertical cavity surface emitting laser power monitor and system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9783098P 1998-08-31 1998-08-31
US60/097,830 1998-08-31

Publications (1)

Publication Number Publication Date
WO2000013051A1 true WO2000013051A1 (en) 2000-03-09

Family

ID=22265343

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/019694 Ceased WO2000013051A1 (en) 1998-08-31 1999-08-31 Diffractive vertical cavity surface emitting laser power monitor and system

Country Status (6)

Country Link
US (3) US6314223B1 (https=)
EP (1) EP1047970B1 (https=)
JP (2) JP2002523910A (https=)
AU (1) AU5789999A (https=)
CA (1) CA2306845C (https=)
WO (1) WO2000013051A1 (https=)

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WO2001080324A3 (en) * 2000-04-12 2002-03-28 Digital Optics Corp Transmission detection for vertical cavity surface emitting laser power monitor and system
WO2002005004A3 (en) * 2000-07-11 2002-07-18 Digital Optics Corp Fiber coupler, system and associated methods for reducing back reflections
US6530697B1 (en) 1998-09-22 2003-03-11 Digital Optics Corp. Multi-mode fiber coupler, system and associated methods
WO2002103426A3 (en) * 2000-12-26 2003-05-22 Emcore Corp Optical power control system
WO2004031824A1 (en) * 2002-09-30 2004-04-15 Intel Corporation System and method for packaging a monitor photodiode with a laser in an optical subassembly
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6863444B2 (en) 2000-12-26 2005-03-08 Emcore Corporation Housing and mounting structure
US6863453B2 (en) 2003-01-28 2005-03-08 Emcore Corporation Method and apparatus for parallel optical transceiver module assembly
US6867377B2 (en) 2000-12-26 2005-03-15 Emcore Corporation Apparatus and method of using flexible printed circuit board in optical transceiver device
US6905260B2 (en) 2000-12-26 2005-06-14 Emcore Corporation Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules
US7021836B2 (en) 2000-12-26 2006-04-04 Emcore Corporation Attenuator and conditioner
US7418016B2 (en) 2003-02-13 2008-08-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for modifying the spread of a laser beam
FR2932562A1 (fr) * 2008-06-12 2009-12-18 Univ Pasteur Dispositif de projection de lumiere structuree au moyen de vcsel et de composants optiques diffractifs de phase.
DE10161308B4 (de) * 2000-12-15 2010-12-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optisches System und Verfahren zur Detektion eines Leistungspegels einer Quelle
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JP5749592B2 (ja) * 2011-07-15 2015-07-15 株式会社エンプラス 光レセプタクルおよびこれを備えた光モジュール
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Cited By (29)

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US7769258B2 (en) 1998-09-22 2010-08-03 Tessera North America, Inc. Optical element and system using the same
US6496621B1 (en) 1998-09-22 2002-12-17 Digital Optics Corp. Fiber coupler system and associated methods for reducing back reflections
US6530697B1 (en) 1998-09-22 2003-03-11 Digital Optics Corp. Multi-mode fiber coupler, system and associated methods
US7343069B2 (en) 1998-09-22 2008-03-11 Tessera North America, Inc. Optical element and system using the same
US7529446B2 (en) 1998-09-22 2009-05-05 Tessera North America, Inc. Optical element and system using the same
US8821035B2 (en) 1998-09-22 2014-09-02 Flir Systems, Inc. Optical element and system using the same
US7221823B2 (en) 1998-09-22 2007-05-22 Digital Optics Corporation Fiber coupler, system and associated methods for reducing back reflections
US8529139B2 (en) 1998-09-22 2013-09-10 Digitaloptics Corporation East Optical element and system using the same
WO2001080324A3 (en) * 2000-04-12 2002-03-28 Digital Optics Corp Transmission detection for vertical cavity surface emitting laser power monitor and system
WO2002005004A3 (en) * 2000-07-11 2002-07-18 Digital Optics Corp Fiber coupler, system and associated methods for reducing back reflections
DE10161308B4 (de) * 2000-12-15 2010-12-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optisches System und Verfahren zur Detektion eines Leistungspegels einer Quelle
DE10161308B8 (de) * 2000-12-15 2011-04-07 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optisches System und Verfahren zur Detektion eines Leistungspegels einer Quelle
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US7021836B2 (en) 2000-12-26 2006-04-04 Emcore Corporation Attenuator and conditioner
US6905260B2 (en) 2000-12-26 2005-06-14 Emcore Corporation Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules
US6867377B2 (en) 2000-12-26 2005-03-15 Emcore Corporation Apparatus and method of using flexible printed circuit board in optical transceiver device
US6863444B2 (en) 2000-12-26 2005-03-08 Emcore Corporation Housing and mounting structure
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JP2011009782A (ja) 2011-01-13
CA2306845C (en) 2005-05-03
US6314223B1 (en) 2001-11-06
US20020150341A1 (en) 2002-10-17
EP1047970A4 (en) 2006-03-22
EP1047970B1 (en) 2014-10-29
EP1047970A1 (en) 2000-11-02
AU5789999A (en) 2000-03-21
JP2002523910A (ja) 2002-07-30
US6591043B2 (en) 2003-07-08
JP5021064B2 (ja) 2012-09-05
CA2306845A1 (en) 2000-03-09
US6404959B1 (en) 2002-06-11

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