WO2000003219A2 - Ensemble capteur de pression, en particulier pour mesurer la pression dans une zone sous pression d'huile d'une boite de vitesses de vehicule automobile - Google Patents

Ensemble capteur de pression, en particulier pour mesurer la pression dans une zone sous pression d'huile d'une boite de vitesses de vehicule automobile Download PDF

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Publication number
WO2000003219A2
WO2000003219A2 PCT/DE1999/001906 DE9901906W WO0003219A2 WO 2000003219 A2 WO2000003219 A2 WO 2000003219A2 DE 9901906 W DE9901906 W DE 9901906W WO 0003219 A2 WO0003219 A2 WO 0003219A2
Authority
WO
WIPO (PCT)
Prior art keywords
pressure sensor
pressure
sensor element
carrier
sensor arrangement
Prior art date
Application number
PCT/DE1999/001906
Other languages
German (de)
English (en)
Other versions
WO2000003219A3 (fr
Inventor
Helmut Gander
Herbert Rödig
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2000003219A2 publication Critical patent/WO2000003219A2/fr
Publication of WO2000003219A3 publication Critical patent/WO2000003219A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • Pressure sensor arrangement in particular for pressure detection in an oil-loaded pressure area of a motor vehicle transmission
  • the invention relates to a pressure sensor arrangement for pressure detection in a pressure area, in particular an oil-loaded pressure area of a motor vehicle transmission, with the features specified in the preamble of claim 1.
  • the preamble of claim 1 is based on the currently applicable technology. It is provided that pressure sensors enclosed in a housing are arranged outside the electronics room which has the electronic circuitry and the further signal processing. This will a separation between the electronics room to be protected and the pressure area, the pressure of which is to be recorded.
  • the invention has for its object to mount the pressure sensor element so that the manufacturing effort is significantly reduced.
  • the support of the pressure sensor arrangement is designed as a mechanical partition between the pressure area and the electronic space having the electronic circuit.
  • the preferably housing-free pressure sensor element is in the region of an opening in the carrier with hermetic sealing of the
  • the (or more) pressure sensor (s) are thus installed directly in the electronics space, the pressure sensor elements being processed directly in or on the electronics substrate. They are mounted on the carrier so that, on the one hand, evaluation electronics integrated on the sensor chip against the aggressive environmental conditions in the pressure range, such as, for. B. Oil pressure, moisture, aggressive atmosphere is protected.
  • a media separation is realized at the same time by the type of mounting according to the invention, which separates the electronics room from Pressure area, the pressure of which must be recorded, separates.
  • the support of the pressure sensor element and the pressure sensor element itself are involved in this separation.
  • the specified breakthrough serves as a pressure channel for the connection between the pressure area and the pressure detector.
  • the proposed integration of pressure sensors combines assembly technologies with housing technologies.
  • the specified mounting method of the sensor element fulfills both electrical functions and mechanical stabilization - in practice, pressure differences in the example of a transmission control can be up to 100 bar - as well as the function of separating the different functional spaces and thus the sealing function. This represents a pronounced dual function, which also leads to a reduction in device manufacturing costs.
  • a further improvement in this regard results from the avoidance of the housing inclusion of the pressure sensors.
  • manufacturing tolerances can be reduced by calibrating the sensor element on the associated electronic circuit, for example by programming.
  • the fields of application of the pressure sensor arrangement according to the invention are not limited to motor vehicle transmissions.
  • the intake vacuum or the ambient pressure in engine controls, the system pressure of reducing agents (e.g. aqueous urea solution) for exhaust gas aftertreatment in diesel vehicles, the exhaust gas pressure as part of a catalyst or soot filter monitoring in diesel vehicles, etc. can be measured.
  • 1 to 4 are schematic vertical sections through different pressure sensor arrangements for measuring transmission oil pressure.
  • gearbox control units for the operation of which the gearbox oil pressure must be measured.
  • a pressure sensor element 9 is provided, which in the exemplary embodiment according to FIG. 1 is fixed on the upper mounting surface 17 of the substrate 8 via an opening 10 which penetrates the base plate 6 and the substrate 8.
  • a corresponding pressure detection opening 11 is provided in the area of the hydraulic unit 3, so that the pressure prevailing in the pressure area 2 reaches the physical pressure detector 12 of the sensor element 9 via the pressure detection opening 11 and the opening 10.
  • An electronic circuit is provided on the sensor element 9, which in the exemplary embodiment according to FIG. 1 comprises an evaluation and adjustment circuit. Between the bottom plate 6 and the hydraulic unit 3, an O-ring seal 13 is interposed, so that a pressure-tight connection between the opening 10 and the pressure area 2 is given.
  • the pressure sensor element 9 is of a housing-less design and is electrically connected to corresponding conductor tracks on the substrate 8 via so-called flip-chip contacts 14 on its underside. These flip-chip contacts 14 are embedded in an underfill seal 15, which hermetically seals the gap between the underside of the pressure sensor element 9 and the opening 10. This underfill seal 15, together with the chip passivation, protects the circuit parts of the chip arranged in the lower region of the pressure sensor element 9. Furthermore, the underfill seal 15 also largely ensures the mechanical strength of the pressure sensor element 9.
  • the electronics room 5 is closed off by a housing cover 16 seated tightly on the carrier 4 or the base plate 6.
  • FIG. 2 differs only in the design of the pressure sensor element 9 ', which will be explained in more detail. Components that otherwise correspond to the exemplary embodiment according to FIG. 1 are provided with identical reference numerals and do not require any further explanation.
  • the pressure sensor element 9 in the so-called “surface micromachining technology” is designed as a capacitively operating pressure sensor in the embodiment according to FIG. 1
  • the pressure sensor element 9 ′ in the embodiment according to FIG. 2 is also designed as a housing-less one "Bare die element", however, implemented in "bulk silicon technology”.
  • the physical pressure detector 12 ' works piezoresistively and is implemented as a pressure receiving layer on the top of the chip of the pressure sensor element 9'.
  • the latter has a Wheatstone bridge as an electronic circuit. This is used to adjust the pressure detector 12 '.
  • the pressure sensor element 9 ' can also be implemented using BSOI silicon technology in a capacitive or piezorestive design.
  • the pressure sensor element 9 ' is also fastened to the substrate 8 by a full-surface soldering 26 on the top mounting surface 17, so that the pressure area 2 is again hermetically separated from the electronics space 5 by the pressure sensor element 9'.
  • the measured value evaluation circuit located on the upper side of the pressure sensor element 9 ' is thus protected from the pressure area as well as the electronic transmission control implemented on the substrate 8.
  • the evaluation circuit is connected to the electronic transmission control via schematically indicated bonding wires 18. Contacting by so-called “thermocompression bonding” is also possible.
  • the chip-shaped pressure sensor element 9 ′′ is arranged in the opening 10 ′ of the carrier 4 embodied as an aluminum base plate 6 and on the downward-facing mounting surface 19 of the so-called wiring level 20 of the switching arranged for transmission control.
  • this “wiring level 20” is formed by a Kapton E film with a conductor track structure located thereon.
  • the carrier can in turn also be designed, for example, as a ceramic, in particular LTCC ceramic, as a conventional printed circuit board or as a cast housing Flip-chip technology or a direct contacting method (not shown in detail) on the underside of the wiring level 20, as a result of which the circuit thereon remains insulated from the oil-loaded pressure area 2.
  • FIG. 4 again shows the use of a pressure sensor arrangement according to the invention for the transmission oil pressure measurement.
  • the carrier 4 is realized here by a base plate 6 with a substrate 8 glued thereon.
  • the opening 10 is widened in stages towards the substrate to a receiving opening 23 in which the chip-shaped pressure sensor element 9 '' 'is accommodated.
  • This is attached and contacted via flip chip contacts 14 'on the lower mounting surface 19.
  • the flip-chip contacts 14 ' are embedded in an underfill seal 15', so that the pressure area 2 is in turn hermetically sealed from the electronics compartment 5.
  • Physical pressure detector 12 '' 'and evaluation circuit are located on the top of the chip-shaped pressure sensor element 9' ''. The evaluation circuit is in turn protected by the chip passivation and the underfill seal 15 '.
  • the mechanical strength of the pressure sensor element 9 '' ' is primarily guaranteed by this design.
  • the substrate 8 has an opening 24 above the physical pressure detector 12 ′′ ′′ of the pressure sensor element 9 '''.
  • the electronics room 5 acts as a counter pressure area to the pressure area 2.
  • an overflow groove 25 for adhesives in the base plate 6 is provided laterally outside the receiving opening 23. This makes it possible to be able to apply different adhesives (for example ATF-resistant adhesives and flexible adhesives) for producing the adhesive 7.
  • pressurization P acts through the opening 10 on the pressure sensor element 9, 9 ', 9' ', 9' '', which in turn together with the substrate for hermetically sealing the pressure area 2 from the electronics room 5 cares.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Control Of Transmission Device (AREA)

Abstract

L'invention concerne un ensemble capteur de pression qui est pourvu d'un élément capteur de pression (9) comprenant un détecteur de pression physique (12) et un câble électronique intégré, d'un support (4) destiné à l'élément capteur de pression (9) et d'un circuit électronique (22), placé sur ledit support (4), ce dernier formant une paroi de séparation entre la zone de pression (2) et le compartiment électronique (5). L'élément capteur (9) est placé dans un passage (10) ménagé dans le support (4) et rendu hermétique.
PCT/DE1999/001906 1998-07-08 1999-07-01 Ensemble capteur de pression, en particulier pour mesurer la pression dans une zone sous pression d'huile d'une boite de vitesses de vehicule automobile WO2000003219A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19830538.9 1998-07-08
DE19830538A DE19830538A1 (de) 1998-07-08 1998-07-08 Drucksensor-Anordnung, insbesondere zur Druckerfassung in einem ölbeaufschlagten Druckbereich eines Kraftfahrzeuggetriebes

Publications (2)

Publication Number Publication Date
WO2000003219A2 true WO2000003219A2 (fr) 2000-01-20
WO2000003219A3 WO2000003219A3 (fr) 2002-09-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/001906 WO2000003219A2 (fr) 1998-07-08 1999-07-01 Ensemble capteur de pression, en particulier pour mesurer la pression dans une zone sous pression d'huile d'une boite de vitesses de vehicule automobile

Country Status (2)

Country Link
DE (1) DE19830538A1 (fr)
WO (1) WO2000003219A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11668211B2 (en) * 2017-12-19 2023-06-06 Vitesco Technologies GmbH Pressure measuring unit and connection unit for a motor vehicle transmission

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001060736A2 (fr) * 2000-02-18 2001-08-23 Motorola, Inc. Procedes et appareil destines a une structure de capteur a integration verticale
DE10059813A1 (de) * 2000-12-01 2002-06-13 Hahn Schickard Ges Vorrichtung zur Erfassung eines Fluiddrucks
DE10327476A1 (de) * 2003-06-18 2005-01-05 Conti Temic Microelectronic Gmbh Drucksensor-Anordnung
AT412815B (de) * 2003-11-24 2005-07-25 Siemens Ag Oesterreich Steuergerät für ein getriebe in einem kraftfahrzeug
DE102004011203B4 (de) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
US7243552B2 (en) 2005-05-09 2007-07-17 Delphi Technologies, Inc. Pressure sensor assembly
DE102007001855B4 (de) 2007-01-12 2013-08-22 Continental Automotive Gmbh Gehäuseanbindung für Drucksensoren
DE102007042449B4 (de) 2007-09-06 2021-11-18 Vitesco Technologies GmbH Integriertes Sensormodul für Mechatroniken, Verfahren zur Herstellung des integrierten Sensormoduls sowie Verwendung des integrierten Sensormoduls
DE102010029868A1 (de) * 2010-06-09 2011-12-15 Zf Friedrichshafen Ag Getriebesteuerung
DE102012205280A1 (de) 2012-03-30 2013-10-02 Zf Friedrichshafen Ag Drucksensoranordnung
DE102017220059A1 (de) * 2017-11-10 2019-05-16 Conti Temic Microelectronic Gmbh Anschlussbaueinheit für Getriebe-Öldrucksensoren

Citations (1)

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WO1998005935A1 (fr) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Procede d'assemblage de microdetecteurs

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JPS58107681A (ja) * 1981-12-21 1983-06-27 Mitsubishi Electric Corp 半導体圧力検出装置
JPH06132545A (ja) * 1992-10-19 1994-05-13 Mitsubishi Electric Corp 圧力検出装置
US5686698A (en) * 1994-06-30 1997-11-11 Motorola, Inc. Package for electrical components having a molded structure with a port extending into the molded structure
US5889211A (en) * 1995-04-03 1999-03-30 Motorola, Inc. Media compatible microsensor structure and methods of manufacturing and using the same
JPH09210828A (ja) * 1996-01-31 1997-08-15 Tokin Corp 圧力センサおよびその調整方法
JPH09243492A (ja) * 1996-03-06 1997-09-19 Matsushita Electric Works Ltd 圧力センサ
DE19612964A1 (de) * 1996-04-01 1997-10-02 Bosch Gmbh Robert Drucksensor und Verfahren zur Herstellung eines Drucksensors
DE19637763A1 (de) * 1996-09-16 1998-03-19 Trw Fahrzeugelektrik Drucksensoreinheit, insbesondere für die Kraftfahrzeugtechnik

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Publication number Priority date Publication date Assignee Title
WO1998005935A1 (fr) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Procede d'assemblage de microdetecteurs

Non-Patent Citations (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11668211B2 (en) * 2017-12-19 2023-06-06 Vitesco Technologies GmbH Pressure measuring unit and connection unit for a motor vehicle transmission

Also Published As

Publication number Publication date
DE19830538A1 (de) 2000-01-20
WO2000003219A3 (fr) 2002-09-26

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