WO2000000961A1 - Procede d'application d'un revetement d'attenuation sur des composants a ondes de surface - Google Patents

Procede d'application d'un revetement d'attenuation sur des composants a ondes de surface Download PDF

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Publication number
WO2000000961A1
WO2000000961A1 PCT/DE1999/001608 DE9901608W WO0000961A1 WO 2000000961 A1 WO2000000961 A1 WO 2000000961A1 DE 9901608 W DE9901608 W DE 9901608W WO 0000961 A1 WO0000961 A1 WO 0000961A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating
surface wave
resin
curing
resin composition
Prior art date
Application number
PCT/DE1999/001608
Other languages
German (de)
English (en)
Inventor
Heiner Bayer
Walter Fischer
Hans Krüger
Wolfgang Pahl
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Priority to DE59903262T priority Critical patent/DE59903262D1/de
Priority to EP99936376A priority patent/EP1090387B1/fr
Publication of WO2000000961A1 publication Critical patent/WO2000000961A1/fr

Links

Classifications

    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/36—Devices for manipulating acoustic surface waves

Definitions

  • the present invention relates to a method for the steam coating of surface wave components.
  • Surface wave components for example surface wave filters, are electronic components that are used to process high-frequency electrical signals. Such components are usually used in m TV and video devices and cell phones.
  • the electrical signal carrying the information is converted into mechanical vibrations, so-called surface waves.
  • Interdigital transducers on piezoelectric substrates which consist of certain ceramics or crystalline materials, for example of lithium niobate, are used for the electroacoustic conversion or for generating the surface waves.
  • the acoustic properties of this transducer are influenced by a suitable construction of the transducer, especially by a special geometric configuration of the sound-generating transducer surface. This makes it possible to modify the acoustic signal in a targeted manner and to filter out special wavelength ranges from the overall spectrum.
  • the organic materials for producing a damping structure are mainly applied to the surfaces of surface wave components using the screen printing method. Applying the steaming structure using the screen printing process has various disadvantages.
  • the invention accordingly relates to a method for the steam coating of surface wave components by coating the surface wave component with a steaming, photohardenable resin and curing the resin in accordance with the required damping structure by imagewise exposure with a light beam scanning relative to the substrate surface and removal of the uncured areas.
  • a cationically hardenable, solvent-free epoxy resin is applied in a thin layer to the surface of the surface wave component and exposed with the aid of a computer-controlled UV laser in accordance with the required damping structure.
  • steaming coatings can be inexpensively, precisely and automated generate surface acoustic wave devices, grout the he a ho ⁇ Strukturauflosung and position accuracy. If a computer-controlled UV laser is used for the exposure, the method can be easily adapted to possible component design changes. Changeover times in production, such as screen printing, as well as screen storage and logistics are eliminated.
  • the photocurable resin can be essentially anything that meets the usual requirements for a damping mass. That the resins must be available electronically and, for example, have a suitable glass transition temperature. To separate the component structures, it should also be possible, for example, to announce the substrate without the steaming layer tearing and flaking off the piezoelectric material.
  • epoxy resins with a photoinitiator system matched to the exposure source are preferably used.
  • epoxy resins are described, for example, in DE-A 44 43 946.6, to which reference is made in full here.
  • the corresponding epoxy resin compositions are applied to the respective piezoceramic substrates in a structured manner by screen printing.
  • the resins contain, in particular, additives for the lateral limitation of the hardening in order to increase the structural resolution.
  • additives are preferably basic in nature and can be selected from the group of the salt-like hydroxides and organic nurses. For example, ethanolamm or its organically substituted derivatives are used.
  • the reaction resin composition can be steamed by various methods Substrates are applied.
  • the application can be done, for example, by spin coating, but also by other coating methods, such as roller or curta coatmg.
  • other coating methods such as roller or curta coatmg.
  • Also conceivable is also an order in the screen printing process, whereby here unstructured applying or in broad constructive ⁇ tured can be done, for example, to save material, Rander kept free, etc.
  • the required layer thickness to be applied can be modified by modifying the epoxy resin composition, insofar as this modification does not or only insignificantly affects the damping effect, and the type of application.
  • the required damping structure is then created by image-wise exposure of the applied resin layer.
  • the photo-structuring of organic layers both positive and negative, is known per se and is used in a variety of ways in the manufacture of electronic components and printed circuit boards.
  • scanning photostructuring is not for the steam coating of
  • Laser stereolithography is a method for producing three-dimensional structures from liquid, photosensitive resins and is described, for example, in DE-A 195 41 075.0.
  • a single-layer, steaming coating is also produced on a surface wave component by scanning exposure.
  • the selected vaporizing reaction resin is applied to the surface of a surface wave substrate in a thin layer of 0.2 to 100 ⁇ m, preferably 20 to 50 ⁇ m.
  • the wafer is then suitably positioned under the laser exposure device. This consists, for example, in a manner similar to that described in DE-A 195 41 075.0, of a kissed laser with a suitably designed transfer optics.
  • a helium-cadmium laser with a 325 n wavelength can be used as the laser light source.
  • the radiation power is preferably between 1 and 100 mW.
  • lasers were also suitable in which the laser power is in the specified range or above and suitable photoinitiators are available for their wavelength.
  • An alternative UV laser would be, for example, an argon ion laser with a wavelength at 351 and 364 nm.
  • Other intensive UV light sources are also suitable for the method according to the invention. Short-wave visible light can also be used if it is effective for photo initiation.
  • the light beam is also focused on a focus diameter of 5 to 200 microns, preferably 20 to 50 microns.
  • the focused light beam is now directed by means of a computer-controlled mirror system and transfer optics in a manner corresponding to the required damping structure over the surface wave component coated with reactive resin.
  • a computer-controlled mirror system and transfer optics can be carried out by the wafer.
  • the unexposed resin can be removed by all methods known in the prior art, ie the vaporization structure can be developed. For example, suction, blowing off or washing off the unexposed resin in solvent vapor or m cascade washers are conceivable, as a result of which, as it were, unused resin can be recovered.
  • the method according to the invention there is no running of generated structures, in particular also no different running behavior on different substrates. This property offers a development scope for the selectable resin formulations, since the flow behavior, in particular the viscosity, can be varied within wide limits and does not have to be optimized for precise screen printing. This enables a bubble-free and homogeneous application, which enables high-quality acoustic damping and good adhesion.
  • the exposure can be carried out so that kei ⁇ takes place ne complete curing of the exposed areas.
  • This variation is possible by modifying the resin itself or the exposure intensity and / or duration.
  • the then required thermal post-treatment causes the resin to run slightly, so that damping structures with particularly low-reflection edges are created.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

L'invention concerne un procédé permettant de réaliser un revêtement d'atténuation sur des composants à ondes de surface, à l'aide d'une résine d'amortissement photodurcissable. Ladite résine est durcie conformément à la structure d'atténuation exigée, par exposition à la lumière, selon un balayage et en fonction d'une image, les zones de résine non durcies étant ensuite enlevées. Pour l'exposition à la lumière de la résine, on utilise de préférence un laser UV.
PCT/DE1999/001608 1998-06-26 1999-06-01 Procede d'application d'un revetement d'attenuation sur des composants a ondes de surface WO2000000961A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE59903262T DE59903262D1 (de) 1998-06-26 1999-06-01 Verfahren zur dämpfenden beschichtung von oberflächenwellenbauelementen
EP99936376A EP1090387B1 (fr) 1998-06-26 1999-06-01 Procede d'application d'un revetement d'attenuation sur des composants a ondes de surface

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19828608.2 1998-06-26
DE19828608 1998-06-26

Publications (1)

Publication Number Publication Date
WO2000000961A1 true WO2000000961A1 (fr) 2000-01-06

Family

ID=7872164

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/001608 WO2000000961A1 (fr) 1998-06-26 1999-06-01 Procede d'application d'un revetement d'attenuation sur des composants a ondes de surface

Country Status (3)

Country Link
EP (1) EP1090387B1 (fr)
DE (1) DE59903262D1 (fr)
WO (1) WO2000000961A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001059827A1 (fr) * 2000-02-14 2001-08-16 Epcos Ag Encapsulage d'un composant electrique et son procede de production

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996018182A1 (fr) * 1994-12-09 1996-06-13 Siemens Aktiengesellschaft Composant a ondes de surface et procede permettant de realiser une structure d'attenuation appropriee
US5576143A (en) * 1991-12-03 1996-11-19 Fuji Photo Film Co., Ltd. Light-sensitive composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5576143A (en) * 1991-12-03 1996-11-19 Fuji Photo Film Co., Ltd. Light-sensitive composition
WO1996018182A1 (fr) * 1994-12-09 1996-06-13 Siemens Aktiengesellschaft Composant a ondes de surface et procede permettant de realiser une structure d'attenuation appropriee

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001059827A1 (fr) * 2000-02-14 2001-08-16 Epcos Ag Encapsulage d'un composant electrique et son procede de production
US6984421B2 (en) 2000-02-14 2006-01-10 Epcos Ag Encapsulation for an electrical component and method for producing the same

Also Published As

Publication number Publication date
DE59903262D1 (de) 2002-12-05
EP1090387A1 (fr) 2001-04-11
EP1090387B1 (fr) 2002-10-30

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