WO1999062667A1 - Fixation d'elements metalliques - Google Patents

Fixation d'elements metalliques Download PDF

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Publication number
WO1999062667A1
WO1999062667A1 PCT/GB1999/001733 GB9901733W WO9962667A1 WO 1999062667 A1 WO1999062667 A1 WO 1999062667A1 GB 9901733 W GB9901733 W GB 9901733W WO 9962667 A1 WO9962667 A1 WO 9962667A1
Authority
WO
WIPO (PCT)
Prior art keywords
bonding
elements
interlayer
region
metallic
Prior art date
Application number
PCT/GB1999/001733
Other languages
English (en)
Inventor
Amir Abbas Shirzadi-Ghoshouni
Eric Robert Wallach
Original Assignee
Cambridge University Technical Services Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge University Technical Services Limited filed Critical Cambridge University Technical Services Limited
Priority to AU41563/99A priority Critical patent/AU4156399A/en
Priority to EP99925179A priority patent/EP1084007A1/fr
Publication of WO1999062667A1 publication Critical patent/WO1999062667A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal

Definitions

  • This invention relates to diffusion bonding.
  • Diffusion bonding can be used to join advanced materials for particular applications when conventional welding methods have proved unsuccessful.
  • the materials joined by diffusion bonding include titanium alloys, aluminium-based alloys or composites, nickel-based superalloys and intermetallics.
  • Diffusion bonding can be carried out in the solid or liquid state.
  • solid state diffusion bonding bonds form as a result of the interdiffusion of atoms across the interface due to an applied pressure at elevated temperature.
  • TLP Transient Liquid Phase
  • diffusion bonding relies on the formation of a liquid phase at the bond line during an isothermal bonding cycle as a result of interdiffusion between an interlayer, inserted at the interface, and the base material.
  • the liquid phase forms generally as a consequence of the reduced liquidus temperature in either eutectic or peritectic alloy systems.
  • Some materials have stable oxide layers which can inhibit the interdiffusion of atoms across the interface. Therefore, diffusion bonding of these materials is normally conducted in vacuum in order to minimise further oxidation of the faying surfaces. Aluminium-based materials, in particular, are notoriously difficult to diffusion bond due to the presence of tenacious and chemically stable surface oxide layers.
  • Transient liquid phase (TLP) diffusion bonding in which the formation of a liquid phase enhances the disruption of the oxide layer and consequently improves the bond strength) has the potential to overcome the problem caused by the presence of stable surface oxides.
  • TLP Transient liquid phase
  • the bonding process usually has to be carried out in vacuum, typically 10 -10 bar, to prevent any increase in the thickness of surface oxide layers and also to avoid high temperature oxidation of the interlayer.
  • a method of bonding two metallic elements together comprising the steps of: placing the two elements adjacent to one another, with a metallic interlayer therebetween to form a bonding region; applying an external load to the bonding region; and heating the region, such that the temperature of the region increases at a rate sufficient to minimise oxidation of the elements and the thickness of any oxide layer formed on the surface thereof.
  • the heating is such that the heating rate is at least 20°C per second.
  • the elements may be formed from aluminium or an alloy thereof .
  • the heating rate and load may be such that solid phase diffusion bonding occurs.
  • the heating rate and load may be such that liquid phase diffusing bonding occurs.
  • the interlayer may be formed, by the use of a foil, sputtering or a similar technique, on one of the elements.
  • the method may be performed in a vacuum or, advantageously can be performed in air.
  • the metallic interlayer may be formed from copper or other suitable metal or alloy thereof.
  • a new method for diffusion bonding has been developed which is capable of reliably producing high strength aluminium bonds in air.
  • the use of this method drastically reduces both the initial investment and the running costs of the bonding process, therefore a much wider range of applications for TLP diffusion bonding is possible.
  • This method is applicable to the diffusion bonding in air of other materials in addition to aluminium- based materials.
  • Figure 1 is a schematic diagram of an arrangement for preparing elements to be joined
  • Figure 2 is a schematic diagram showing an apparatus for performing the invention.
  • Figure 3 is a graph showing shear strength for sample elements bonded according to the invention and compared with a continued element formed from the same material.
  • the method is, however, applicable to a much wider range of parent materials and interlayers.
  • Aluminium and oxygen have such a high chemical affinity that a new oxide layer forms immediately after surface cleaning.
  • a few nanometres of oxide are sufficient to isolate the base materials from ambient oxygen, therefore the rate of oxidation decreases rapidly following initial oxidation (in a fraction of a second) .
  • This intrinsic feature of aluminium-based materials has been considered to be an obstacle when diffusion bonding these materials.
  • the copper interlayer particularly used for TLP diffusion bonding, can act also as a sealant and reduce the oxidation of itself and the aluminum alloy during the heating stage, provided the thickness of interlayer is adequate.
  • the faying surfaces should be flat and smooth to ensure proper contact between the interlayer and alloy.
  • good contact is required to seal the bond and hence reduce the oxidation due to the exposure of the interface to air.
  • the higher the bonding pressure the better is the sealing of the interface, providing that the bonding pressure does not exceed the yield stress of the parent material at the bonding temperature. It should be noted that lack of good contact at the initial stage of conventional TLP diffusion bonding in vacuum can be tolerated as the liquid phase forms, normally with a thickness of a few times that of the thickness of the interlayer, and consequently fills any crevices.
  • the faying surfaces should be ground to produce flat surfaces without rounded edges.
  • Elements to be bonded are manually ground on a rotary wheel 1 with silicon carbide paper 1 of 1200 grit.
  • a steel jig 3 and retaining screw 4 is used to hold the elements 2 to be in order to produce flat surfaces, see figure 1.
  • All elements 2 and the copper interlayers are degreased, for example by acetone and then methanol, before being inserted in the diffusion bonder.
  • the design of the bonding set-up is shown schematically in figure 2.
  • Insulation rods 6 are machined precisely to produce parallel ends.
  • a load 8 is applied by an electric motor via a transmission system including a steel rod 9 with a round tip. The point contact between the rod and the centre of the upper insulator prevents any undesirable eccentric loading.
  • An r.f. induction coil 10 is kept as close as possible to the elements 2 in order to increase the coupling effect and consequently to achieve the highest possible heating rate.
  • Other forms of heating e.g. laser sources, are suitable.
  • Other methods of pressure generation, such as differential thermal expansion may be employed.
  • aluminium alloy 6082 was used as the parent material and copper foils as the interlayer.
  • the effects of bonding pressure (5 and 7 MPa) , time (5 and 10 minutes including 30 seconds for the heating stage) and the thickness of copper interlayer (0.7, 1,7 and 12.5 ⁇ m) on bond strength were investigated.
  • the rapid thermal expansion of the specimens during the heating stage increased the pressure up to 10 MPa for a short time before the loading system resumed the pre-set pressure (5 or 7 MPa) .
  • the thickness of interlayer should be optimised for each particular alloy and interlayer combination. Increasing the bonding time up to 10 minutes did not seem to improve the bond strength.
  • the bonding pressure should ideally be set as close as possible to the maximum pressure that the parent material can withstand without substantial deformation at the bonding temperature. A high bonding pressure not only reduces the likelihood of oxidation but also expels excessive liquid from the interface during the bonding cycle.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Ce procédé de fixation entre eux de deux éléments métalliques comprend les étapes consistant à placer les deux éléments de manière adjacente, à disposer entre eux une couche métallique afin de former une région de fixation, à appliquer une charge extérieure sur la région de fixation et à chauffer cette région de façon que la température de celle-ci augmente à une vitesse suffisante pour minimiser l'oxydation des éléments et l'épaisseur de toute couche d'oxyde formée sur la surface de ceux-ci.
PCT/GB1999/001733 1998-06-02 1999-06-02 Fixation d'elements metalliques WO1999062667A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU41563/99A AU4156399A (en) 1998-06-02 1999-06-02 Bonding of metallic elements
EP99925179A EP1084007A1 (fr) 1998-06-02 1999-06-02 Fixation d'elements metalliques

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9811860.7 1998-06-02
GBGB9811860.7A GB9811860D0 (en) 1998-06-02 1998-06-02 Bonding

Publications (1)

Publication Number Publication Date
WO1999062667A1 true WO1999062667A1 (fr) 1999-12-09

Family

ID=10833085

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1999/001733 WO1999062667A1 (fr) 1998-06-02 1999-06-02 Fixation d'elements metalliques

Country Status (4)

Country Link
EP (1) EP1084007A1 (fr)
AU (1) AU4156399A (fr)
GB (1) GB9811860D0 (fr)
WO (1) WO1999062667A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2902938A1 (fr) * 2006-06-22 2007-12-28 Batscap Sa Procede de realisation des connexions electriques d'un ensemble de stockage d'energie electrique
DE102016208193A1 (de) * 2016-05-12 2017-11-16 Technische Universität Dresden Verfahren zum Sichern einer Schraubverbindung gegen unerwünschtes Lösen und Schraube zur Verwendung bei dem Verfahren
CN109926678A (zh) * 2017-12-18 2019-06-25 天津大学 一种液态薄膜冶金连接高温合金的方法
US10556292B2 (en) * 2010-08-31 2020-02-11 Nissan Motor Co., Ltd. Method for bonding aluminum-based metals

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046305A (en) * 1974-11-15 1977-09-06 Associated Engineering Limited Metallic bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046305A (en) * 1974-11-15 1977-09-06 Associated Engineering Limited Metallic bonding method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2902938A1 (fr) * 2006-06-22 2007-12-28 Batscap Sa Procede de realisation des connexions electriques d'un ensemble de stockage d'energie electrique
US10556292B2 (en) * 2010-08-31 2020-02-11 Nissan Motor Co., Ltd. Method for bonding aluminum-based metals
DE102016208193A1 (de) * 2016-05-12 2017-11-16 Technische Universität Dresden Verfahren zum Sichern einer Schraubverbindung gegen unerwünschtes Lösen und Schraube zur Verwendung bei dem Verfahren
CN109926678A (zh) * 2017-12-18 2019-06-25 天津大学 一种液态薄膜冶金连接高温合金的方法
CN109926678B (zh) * 2017-12-18 2021-12-31 天津大学 一种液态薄膜冶金连接高温合金的方法

Also Published As

Publication number Publication date
EP1084007A1 (fr) 2001-03-21
AU4156399A (en) 1999-12-20
GB9811860D0 (en) 1998-07-29

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