WO1999057340A3 - Chemical mixing, replenishment, and waste management system - Google Patents

Chemical mixing, replenishment, and waste management system Download PDF

Info

Publication number
WO1999057340A3
WO1999057340A3 PCT/US1999/009541 US9909541W WO9957340A3 WO 1999057340 A3 WO1999057340 A3 WO 1999057340A3 US 9909541 W US9909541 W US 9909541W WO 9957340 A3 WO9957340 A3 WO 9957340A3
Authority
WO
WIPO (PCT)
Prior art keywords
plating solution
mix
predetermined
plating
humidified
Prior art date
Application number
PCT/US1999/009541
Other languages
French (fr)
Other versions
WO1999057340A2 (en
Inventor
Todd Alan Balisky
Original Assignee
Dj Parker Company Inc
Todd Alan Balisky
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dj Parker Company Inc, Todd Alan Balisky filed Critical Dj Parker Company Inc
Priority to KR1020007012130A priority Critical patent/KR20010052287A/en
Priority to EP99920246A priority patent/EP1080253A2/en
Priority to JP2000547288A priority patent/JP2002513861A/en
Priority to US09/674,635 priority patent/US7147827B1/en
Priority to AU37789/99A priority patent/AU3778999A/en
Publication of WO1999057340A2 publication Critical patent/WO1999057340A2/en
Publication of WO1999057340A3 publication Critical patent/WO1999057340A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Abstract

A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containing a plating solution delivered from the mix container. A precision delivery arrangement delivers a precise predetermined quantum of a predetermined constituent of the plating solution to multiple mix containers and the hold containers. Transfer of plating solution between the mix and hold containers is effected by a transfer pump. Nitrogen gas that has been humidified with deionized water protects the plating solution from either acquiring water or becoming dehydrated, the humidified nitrogen gas being humidified to a predetermined relative humidity with respect to the temperature of the plating solution in the mix container. This is achieved by urging the nitrogen gas through a column that is at the same temperature as the plating solution. Precise delivery of the chemical constituents is achieved by a pneumatic pump arranged serially with an orifice and an inexpensive flow meter. The pneumatic pump is a positive displacement, double diaphragm pump.
PCT/US1999/009541 1998-05-01 1999-04-30 Chemical mixing, replenishment, and waste management system WO1999057340A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020007012130A KR20010052287A (en) 1998-05-01 1999-04-30 Chemical mixing, replenishment, and waste management system
EP99920246A EP1080253A2 (en) 1998-05-01 1999-04-30 Chemical mixing, replenishment, and waste management system
JP2000547288A JP2002513861A (en) 1998-05-01 1999-04-30 Chemical mixing, replenishment and waste management systems
US09/674,635 US7147827B1 (en) 1998-05-01 1999-04-30 Chemical mixing, replenishment, and waste management system
AU37789/99A AU3778999A (en) 1998-05-01 1999-04-30 Chemical mixing, replenishment, and waste management system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8381198P 1998-05-01 1998-05-01
US60/083,811 1998-05-01

Publications (2)

Publication Number Publication Date
WO1999057340A2 WO1999057340A2 (en) 1999-11-11
WO1999057340A3 true WO1999057340A3 (en) 2000-02-03

Family

ID=22180863

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/009541 WO1999057340A2 (en) 1998-05-01 1999-04-30 Chemical mixing, replenishment, and waste management system

Country Status (5)

Country Link
EP (1) EP1080253A2 (en)
JP (1) JP2002513861A (en)
KR (1) KR20010052287A (en)
AU (1) AU3778999A (en)
WO (1) WO1999057340A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6733656B2 (en) * 2002-04-03 2004-05-11 Eci Technology Inc. Voltammetric reference electrode calibration
JP4303484B2 (en) 2003-01-21 2009-07-29 大日本スクリーン製造株式会社 Plating equipment
US7913644B2 (en) * 2005-09-30 2011-03-29 Lam Research Corporation Electroless deposition system
US7972652B2 (en) * 2005-10-14 2011-07-05 Lam Research Corporation Electroless plating system
AT13262U1 (en) * 2012-05-16 2013-09-15 Koerner Chemieanlagen analyzer
KR101679351B1 (en) 2015-06-11 2016-11-24 와이엠티 주식회사 Mixed solution analysis sensor and mixed solution management system using the sensor

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2097039A2 (en) * 1970-07-29 1972-03-03 Nickel Le Rapid nickel plating bath - with automatic control of constituents
DE2535608A1 (en) * 1975-08-07 1977-02-17 Schering Ag Automatic additive metering for electrochemical baths - having two pulse transmitters in current integrator for pump and display
US4102756A (en) * 1976-12-30 1978-07-25 International Business Machines Corporation Nickel-iron (80:20) alloy thin film electroplating method and electrochemical treatment and plating apparatus
US4326940A (en) * 1979-05-21 1982-04-27 Rohco Incorporated Automatic analyzer and control system for electroplating baths
EP0180090A2 (en) * 1984-10-30 1986-05-07 International Business Machines Corporation System and method for automatically monitoring and maintaining desired concentrations of metal plating baths
JPS6230898A (en) * 1985-07-31 1987-02-09 Sumitomo Metal Ind Ltd Method and apparatus for replenishing metallic component to plating bath
JPH04314883A (en) * 1991-04-15 1992-11-06 Nippon Steel Corp Tin electroplating method
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
DE4405741C1 (en) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Electrolytic deposition of metal coating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602033A (en) * 1969-06-30 1971-08-31 Exxon Production Research Co Calibration method for percent oil detector
US3887110A (en) * 1970-09-10 1975-06-03 Upjohn Co Dispensing methods and apparatus
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
FR2692983B1 (en) * 1992-06-30 1994-10-14 Hospal Ind Method for calibrating a pair of sensors placed in a dialysis circuit and artificial kidney for implementing the method.
EP0655518B1 (en) * 1993-11-30 1997-10-22 DANIELI & C. OFFICINE MECCANICHE S.p.A. System to re-circulate treatment material in processes of surface treatment and finishing

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2097039A2 (en) * 1970-07-29 1972-03-03 Nickel Le Rapid nickel plating bath - with automatic control of constituents
DE2535608A1 (en) * 1975-08-07 1977-02-17 Schering Ag Automatic additive metering for electrochemical baths - having two pulse transmitters in current integrator for pump and display
US4102756A (en) * 1976-12-30 1978-07-25 International Business Machines Corporation Nickel-iron (80:20) alloy thin film electroplating method and electrochemical treatment and plating apparatus
US4326940A (en) * 1979-05-21 1982-04-27 Rohco Incorporated Automatic analyzer and control system for electroplating baths
EP0180090A2 (en) * 1984-10-30 1986-05-07 International Business Machines Corporation System and method for automatically monitoring and maintaining desired concentrations of metal plating baths
JPS6230898A (en) * 1985-07-31 1987-02-09 Sumitomo Metal Ind Ltd Method and apparatus for replenishing metallic component to plating bath
JPH04314883A (en) * 1991-04-15 1992-11-06 Nippon Steel Corp Tin electroplating method
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
DE4405741C1 (en) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Electrolytic deposition of metal coating

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 011, no. 214 (C - 434) 10 July 1987 (1987-07-10) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 146 (C - 1039) 24 March 1993 (1993-03-24) *

Also Published As

Publication number Publication date
EP1080253A2 (en) 2001-03-07
WO1999057340A2 (en) 1999-11-11
AU3778999A (en) 1999-11-23
KR20010052287A (en) 2001-06-25
JP2002513861A (en) 2002-05-14

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