WO1999035611A1 - Element support pour puce a semi-conducteur - Google Patents

Element support pour puce a semi-conducteur Download PDF

Info

Publication number
WO1999035611A1
WO1999035611A1 PCT/DE1998/003622 DE9803622W WO9935611A1 WO 1999035611 A1 WO1999035611 A1 WO 1999035611A1 DE 9803622 W DE9803622 W DE 9803622W WO 9935611 A1 WO9935611 A1 WO 9935611A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
semiconductor chip
tongue
deformation
contact lugs
Prior art date
Application number
PCT/DE1998/003622
Other languages
German (de)
English (en)
Inventor
Jürgen Fischer
Frank PÜSCHNER
Josef Heitzer
Annemarie Seidl
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1999035611A1 publication Critical patent/WO1999035611A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the invention relates to a carrier element for a semiconductor chip, preferably for installation in a chip card, with contact lugs punched out of a lead frame and a casting compound which protects the semiconductor chip and the connecting lines between the chip and the contact lugs and is arranged only on one side of the contact lugs is connected to ⁇ means of a deformation of at least one of the contact lugs with this.
  • Such a carrier element is known from EP 0 399 868 A2.
  • the contact lugs are deformed by a through-hole in a part of the contact lug which is set back by a double bend relative to the base of a contact lug.
  • the casting compound can pass through the through hole into the area of the contact lug created on the other side of this contact lug part, so that the casting compound is better anchored to the contact lug.
  • the twofold angling which can occur, for example, through deep drawing, is difficult to manufacture.
  • the perforation alone would not bring about a sufficient improvement in adhesion, although the edges of the perforation are bulged in the direction of the casting compound.
  • the object of the present invention is therefore to achieve good anchoring of the casting compound and the contact tabs in a generic carrier element in the simplest possible way.
  • a tongue is cut free, for example punched out, in the region of a contact lug which is covered by the casting compound. It would also be possible to use a laser to provide an approximately U-shaped cut through which the tongue is formed.
  • the tongue is plastically bent away from the contact lug in order to act as an anchor in the casting compound.
  • the contact lugs are usually rolled up in a long band on a roll in the lead frame or lead frame assembly in order to be easier to transport.
  • the tongues are pressed back into the contact lug plane when they are rolled onto the roll, but due to the plastic deformation they spring up again when they roll off.
  • the tongue has at least one beveled edge, on the side facing away from the casting compound side of the contact lugs.
  • FIG. 1 shows a first embodiment of a carrier element according to the invention
  • FIG. 2 shows a top view of the tongue according to FIG. 1,
  • FIG 3 shows a first manufacturing step for a second embodiment of a carrier element
  • Figure 4 shows a second manufacturing step for the second embodiment of the carrier element.
  • a semiconductor chip 1 is arranged on one of a number of contact lugs 2.
  • the tabs 2 are already punched in the illustration according to Figure 1 from a holding them and ver during manufacture of the carrier element ⁇ binding leadframe or leadframe.
  • the semiconductor chip 1 is connected by means of bonding wires 3 is electrically connected to some of the contact tags 2 to an external Ge ⁇ advises be contacted back.
  • a cast housing 4 is arranged on one side of the contact lugs 2 in order to protect the semiconductor chip 1 and the bonding wires 3.
  • the cast housing 4 is provided only on one side of the contact lugs 2 in order to be able to contact them from the other side, since the carrier element is to be installed in a chip card.
  • the middle contact lug 2 has a tongue 5 which is bent upwards in the direction of the cast housing 4.
  • the bend is plastic, so that the tongue 5 springs up again if it was previously pressed down onto a spool, for example when the contact lugs still in a band were rolled up.
  • FIG. 2 shows a top view of a section of a contact tab 2 provided with a tongue 5.
  • the tongue 5 was produced by an approximately U-shaped cut in the contact tab 2 and then bent upwards.
  • FIGS. 3 and 4 show two production steps in the production of a carrier element according to the invention in accordance with a second embodiment.
  • the tongue 5 is not pre-bent, but it has at least one beveled edge 9 on the side facing away from the casting compound side of the contact lugs.
  • the casting compound ER- testify 4 the contact lugs 2 between two mold halves 6, 7 placed, and the Gußma 'sse introduced through an opening 8 in the mold.
  • arrows 10 is indicated that the casting mass comes under the tongue 5 due to the bevelled edge 9 of the tongue 5 and bends it in the direction of arrow 11 upwards.
  • the finished casting compound 4 is shown with the tongue 5 bent.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un élément support pour puce à semi-conducteur (1), qui comprend une lamelle de contact (2) matricée à partir d'un cadre conducteur et une matière de remplissage (4) placée sur une face des plots de contact (2) et protégeant la puce à semi-conducteur (1) et les lignes de connexion (3), entre la puce (1) et les plots de contact (2). Cette matière de remplissage est liée à un des plots de contact (2), notamment par déformation dudit plot de contact. Cette déformation consiste en une languette (5) dégagée par découpage du plot de contact (2), et cintrée de manière plastique hors dudit plot de contact (2). La déformation plastique peut être remplacée par biseautage d'au moins une des arêtes (9) de la languette, opposée à la face de la matière de remplissage du plot de contact (2).
PCT/DE1998/003622 1998-01-09 1998-12-09 Element support pour puce a semi-conducteur WO1999035611A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19800646A DE19800646C2 (de) 1998-01-09 1998-01-09 Trägerelement für einen Halbleiterchip
DE19800646.2 1998-01-09

Publications (1)

Publication Number Publication Date
WO1999035611A1 true WO1999035611A1 (fr) 1999-07-15

Family

ID=7854272

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/003622 WO1999035611A1 (fr) 1998-01-09 1998-12-09 Element support pour puce a semi-conducteur

Country Status (2)

Country Link
DE (1) DE19800646C2 (fr)
WO (1) WO1999035611A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0880107A2 (fr) * 1997-05-21 1998-11-25 ODS Landis & Gyr GmbH & Co. KG Module pour carte à puce
FR2895548A1 (fr) * 2005-12-26 2007-06-29 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit, et carte a microcircuit associee
CN102770958A (zh) * 2010-01-25 2012-11-07 贺利氏材料工艺有限责任两合公司 通过压铸件上的自由段对平坦度的改善
US9595455B1 (en) 2016-06-09 2017-03-14 Nxp B.V. Integrated circuit module with filled contact gaps

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10202257B4 (de) 2002-01-21 2005-12-01 W.C. Heraeus Gmbh Verfahren zum Fixieren von Chipträgern

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0207852A1 (fr) * 1985-06-26 1987-01-07 Bull S.A. Procédé de montage d'un circuit intégré sur un support, dispositif en résultant et son application à une carte à microcircuits électroniques
EP0326822A2 (fr) * 1988-02-01 1989-08-09 Motorola Inc. Module de circuit de données
EP0399868A2 (fr) * 1989-05-26 1990-11-28 ESEC (Far East) Limited Procédé de fabrication d'une carte dite carte à puce, et carte obtenue par ce procédé
DE19625228A1 (de) * 1996-06-24 1998-01-02 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990000813A1 (fr) * 1988-07-08 1990-01-25 Oki Electric Industry Co., Ltd. Dispositif semi-conducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0207852A1 (fr) * 1985-06-26 1987-01-07 Bull S.A. Procédé de montage d'un circuit intégré sur un support, dispositif en résultant et son application à une carte à microcircuits électroniques
EP0326822A2 (fr) * 1988-02-01 1989-08-09 Motorola Inc. Module de circuit de données
EP0399868A2 (fr) * 1989-05-26 1990-11-28 ESEC (Far East) Limited Procédé de fabrication d'une carte dite carte à puce, et carte obtenue par ce procédé
DE19625228A1 (de) * 1996-06-24 1998-01-02 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0880107A2 (fr) * 1997-05-21 1998-11-25 ODS Landis & Gyr GmbH & Co. KG Module pour carte à puce
EP0880107A3 (fr) * 1997-05-21 2002-10-02 Gemplus GmbH Module pour carte à puce
FR2895548A1 (fr) * 2005-12-26 2007-06-29 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit, et carte a microcircuit associee
WO2007077356A2 (fr) * 2005-12-26 2007-07-12 Oberthur Technologies Procede de fabrication d'une carte a microcircuit, et carte a microcircuit associee
WO2007077356A3 (fr) * 2005-12-26 2007-09-07 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit, et carte a microcircuit associee
CN102770958A (zh) * 2010-01-25 2012-11-07 贺利氏材料工艺有限责任两合公司 通过压铸件上的自由段对平坦度的改善
US9595455B1 (en) 2016-06-09 2017-03-14 Nxp B.V. Integrated circuit module with filled contact gaps

Also Published As

Publication number Publication date
DE19800646C2 (de) 2000-05-04
DE19800646A1 (de) 1999-07-22

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