WO1999002295A3 - Appareil et procede de decoupe en tranches d'une piece a travailler au moyen d'un fil diamante - Google Patents

Appareil et procede de decoupe en tranches d'une piece a travailler au moyen d'un fil diamante Download PDF

Info

Publication number
WO1999002295A3
WO1999002295A3 PCT/US1998/014040 US9814040W WO9902295A3 WO 1999002295 A3 WO1999002295 A3 WO 1999002295A3 US 9814040 W US9814040 W US 9814040W WO 9902295 A3 WO9902295 A3 WO 9902295A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
wire
longitudinal axis
diamond
ingot
Prior art date
Application number
PCT/US1998/014040
Other languages
English (en)
Other versions
WO1999002295A2 (fr
Inventor
John B Hodsden
Original Assignee
Laser Technology West Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/888,952 external-priority patent/US5878737A/en
Priority claimed from US09/108,864 external-priority patent/US6024080A/en
Application filed by Laser Technology West Limited filed Critical Laser Technology West Limited
Priority to JP2000501861A priority Critical patent/JP2001510742A/ja
Priority to KR1020007000097A priority patent/KR20010021539A/ko
Priority to EP98933215A priority patent/EP1009569A2/fr
Publication of WO1999002295A2 publication Critical patent/WO1999002295A2/fr
Publication of WO1999002295A3 publication Critical patent/WO1999002295A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D31/00—Shearing machines or shearing devices covered by none or more than one of the groups B23D15/00 - B23D29/00; Combinations of shearing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un appareil et un procédé permettant de couper en tranches une pièce à travailler, en particulier, un lingot de polysilicium ou de silicium monocristallin, au moyen d'un fil-scie diamanté. Selon cette invention on fait tourner, de manière alternative ou continue, la pièce à travailler (ou lingot) autour de son axe longitudinal, ou alors on fait tourner le fil-scie diamant, de manière alternative ou continue, autour de l'axe longitudinal de la pièce à travailler, le fil diamant étant actionné dans le sens orthogonal à l'axe longitudinal de la pièce à travailler. Lorsque le mouvement de rotation relatif est continu, on fait avancer le fil d'une position tangentiellement contiguë au diamètre extérieur ('OD') du lingot à une position tangentielle par rapport à son centre ou à son diamètre intérieur ('ID'). Lorsque le mouvement de rotation est alternatif, on fait avancer le fil d'une position tangentiellement contiguë au diamètre extérieur à une position traversant la pièce de travail. Dans les deux cas, le fil diamant coupe la pièce à travailler de part en part, en un point sensiblement tangentiel à la découpe, au lieu de traverser directement tout le diamètre de la pièce en partant du haut. Cette invention permet de découper, relativement rapidement, des lingots de silicium monocristallin de 300 à 400 mm ou plus en plaques, avec des pertes minimes dues à l'entaille et des opérations de rodage ultérieures plus courtes.
PCT/US1998/014040 1997-07-07 1998-07-06 Appareil et procede de decoupe en tranches d'une piece a travailler au moyen d'un fil diamante WO1999002295A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000501861A JP2001510742A (ja) 1997-07-07 1998-07-06 ダイヤモンドインプリグネイテッドワイヤを利用して加工物を薄切りにするための装置および方法
KR1020007000097A KR20010021539A (ko) 1997-07-07 1998-07-06 다이아몬드 함유 와이어를 이용하여 작업물을 얇게절단하기 위한 장치 및 방법
EP98933215A EP1009569A2 (fr) 1997-07-07 1998-07-06 Appareil et procede de decoupe en tranches d'une piece a travailler au moyen d'un fil diamante

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US08/888,952 US5878737A (en) 1997-07-07 1997-07-07 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US08/888,952 1997-07-07
US99307797A 1997-12-18 1997-12-18
US08/993,077 1997-12-18
US09/108,864 1998-07-01
US09/108,864 US6024080A (en) 1997-07-07 1998-07-01 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire

Publications (2)

Publication Number Publication Date
WO1999002295A2 WO1999002295A2 (fr) 1999-01-21
WO1999002295A3 true WO1999002295A3 (fr) 1999-10-07

Family

ID=27380559

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/014040 WO1999002295A2 (fr) 1997-07-07 1998-07-06 Appareil et procede de decoupe en tranches d'une piece a travailler au moyen d'un fil diamante

Country Status (4)

Country Link
EP (1) EP1009569A2 (fr)
JP (1) JP2001510742A (fr)
KR (1) KR20010021539A (fr)
WO (1) WO1999002295A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697024A5 (fr) * 2000-09-28 2008-03-31 Hct Shaping Systems Sa Dispositif de sciage par fil.
RU2193486C1 (ru) * 2001-11-27 2002-11-27 Левон Мурадович Мурадян Станок для резки твердых материалов
US8623137B1 (en) * 2008-05-07 2014-01-07 Silicon Genesis Corporation Method and device for slicing a shaped silicon ingot using layer transfer
WO2010009881A1 (fr) * 2008-07-23 2010-01-28 Meyer Burger Ag Dispositif de coupe à fils multiples avec un élément de pièce à usiner rotatif
DE102009040665B4 (de) * 2009-09-09 2012-08-30 HK Präzisionstechnik GmbH Verfahren und Trennsystem mit Vorrichtung zum trennenden Bearbeiten von kristallinen Materialien
CN101913210B (zh) * 2010-08-19 2012-08-08 英利能源（中国）有限公司 多晶硅破锭方法
CN101927533B (zh) * 2010-08-19 2012-07-04 英利能源（中国）有限公司 单晶棒破方方法
JP5185419B2 (ja) * 2011-08-22 2013-04-17 コマツＮｔｃ株式会社 ワイヤソー
JP6598438B2 (ja) * 2014-08-20 2019-10-30 富士電機株式会社 半導体装置の製造方法
CN107030909A (zh) * 2017-05-15 2017-08-11 南通综艺新材料有限公司 一种使用金刚线截断多晶硅锭的切割工艺
CN110103346A (zh) * 2019-06-04 2019-08-09 泰州市晨虹数控设备制造有限公司 一种大尺寸碳化硅晶片金刚石线切割机床
CN110202709A (zh) * 2019-07-09 2019-09-06 深圳市雯逸水晶有限公司 一种单晶产品的可调式切割水洗脱胶装置
EP4029670A1 (fr) * 2021-01-15 2022-07-20 Lapmaster Wolters GmbH Dispositif et procédé pour couper un substrat solide

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3478732A (en) * 1967-03-15 1969-11-18 David J Clark Wire saw drum
US4727852A (en) * 1983-05-05 1988-03-01 Crystal Systems Inc. Multi-wafer slicing with a fixed abrasive
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece
US5628301A (en) * 1995-07-14 1997-05-13 Tokyo Seimitsu Co., Ltd. Wire traverse apparatus of wire saw
US5699782A (en) * 1995-05-31 1997-12-23 Shin-Etsu Handotai Co., Ltd. Wire saw apparatus
US5715806A (en) * 1994-12-15 1998-02-10 Sharp Kabushiki Kaisha Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3478732A (en) * 1967-03-15 1969-11-18 David J Clark Wire saw drum
US4727852A (en) * 1983-05-05 1988-03-01 Crystal Systems Inc. Multi-wafer slicing with a fixed abrasive
US5715806A (en) * 1994-12-15 1998-02-10 Sharp Kabushiki Kaisha Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece
US5699782A (en) * 1995-05-31 1997-12-23 Shin-Etsu Handotai Co., Ltd. Wire saw apparatus
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
US5628301A (en) * 1995-07-14 1997-05-13 Tokyo Seimitsu Co., Ltd. Wire traverse apparatus of wire saw

Also Published As

Publication number Publication date
JP2001510742A (ja) 2001-08-07
KR20010021539A (ko) 2001-03-15
EP1009569A2 (fr) 2000-06-21
WO1999002295A2 (fr) 1999-01-21

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