WO1998052154A1 - Procede et dispositif pour la fabrication de cartes a puce - Google Patents

Procede et dispositif pour la fabrication de cartes a puce Download PDF

Info

Publication number
WO1998052154A1
WO1998052154A1 PCT/EP1998/002704 EP9802704W WO9852154A1 WO 1998052154 A1 WO1998052154 A1 WO 1998052154A1 EP 9802704 W EP9802704 W EP 9802704W WO 9852154 A1 WO9852154 A1 WO 9852154A1
Authority
WO
WIPO (PCT)
Prior art keywords
card body
component
sinking
contact section
contact
Prior art date
Application number
PCT/EP1998/002704
Other languages
German (de)
English (en)
Inventor
Tomas Meinen
Bernd Göbel
Original Assignee
Meinen, Ziegel & Co. Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7829442&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO1998052154(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Meinen, Ziegel & Co. Gmbh filed Critical Meinen, Ziegel & Co. Gmbh
Publication of WO1998052154A1 publication Critical patent/WO1998052154A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the invention relates to a method and an apparatus for producing chip cards.
  • passive transmission elements in particular coils or electrically conductive ones
  • a chip card of this type is known from DE 195 00 925 AI, in which a separate, ie additional, transmission module is used in order to establish the electrically conductive connection between the component embedded in the card body and the chip.
  • This arrangement and this method are also complex.
  • the invention has for its object to show a way how a secure component contacting can be achieved in a simple manner.
  • An essential point of the invention is that real control of the lowering process is carried out by including the component to be contacted itself or its position in the machining process or in the control. It is therefore no longer assumed that the layer to be contacted lies at a certain depth below the surface of the card - which can be very different due to manufacturing tolerances - it is rather assumed that the distance between the sinking tool and the layer to be contacted is assumed can measure at least so that the direct contact between the sinking tool and the contact section can be determined.
  • the electrical impedance between the electrical component and at least one measuring electrode connected to the sinking tool is measured.
  • Capacity measurement (or a loss factor measurement), since at the start of the sinking process the component embedded in the card body is initially "isolated".
  • the sinking tool which is electrically connected to the measuring electrode, comes into an electrically conductive connection to the contact section, this impedance is short-circuited, and therefore undergoes an extremely strong change.
  • This capacitance or loss factor measurement can be carried out by determining a resonant frequency (and / or damping) of an oscillating circuit, in which the measuring electrode and the embedded component as well as the card material in between are included.
  • it is raining the oscillating circuit by means of short pulses (blips) and observes the decay process of the oscillation with regard to the zero crossings in order to determine the resonance frequency or the damping of the oscillating circuit.
  • blips short pulses
  • this swing-out process undergoes an extremely strong change.
  • the impedance is preferably measured between the embedded component and a holding device on which the card body rests with its lower surface opposite the surface. Then when the die tool makes electrical contact with the contact portion of the embedded
  • Manufactures component and this electrically connects to the measuring electrode, the capacitance between the holding device and the measuring electrode increases.
  • FIG. 1 a plan view of a map cut in its central plane
  • FIG. 2 a section through a complete map in a position as indicated by line II-II in FIG. 1,
  • FIG. 3 shows a longitudinal section corresponding to that of FIG. 2 through a card body and a processing device in which the card body is inserted
  • FIG. 4 an electrical equivalent circuit diagram of the measuring arrangement, including the device according to FIG. 3,
  • FIG. 5 shows a second embodiment of the invention in a view similar to that of FIG. 3, but with an adapted measuring electrode
  • FIG. 6 an electrical equivalent circuit diagram for the embodiment of the invention according to FIG. 5,
  • Figure 7 another embodiment of the invention with a representation similar to that of Figures 3 and 5, and
  • FIG. 8 an electrical equivalent circuit diagram of the arrangement according to FIG. 7.
  • a card body 10 is shown in very schematic form in FIGS. 1 and 2, in which a component 11, here a coil consisting of a conductor track 14 and a first and a second contact section 12 and 13, is embedded.
  • the contact sections 12 and 13 must now be exposed in such a way that the metal layer (usually copper), which is very thin, is not broken through.
  • the card body 10 as shown schematically in FIGS. 3, 5 and 7, is placed on a holding device 20, which presses the card body 10 with its upper side, into which recesses 15 are to be made, against a pressure plate 30 and holds it in this position .
  • the card body is completely fixed during processing.
  • the pressure plate 30 has a first and a second bore 31 and 32, which are provided in the pressure plate 30 such that they are arranged above the contact sections 12 and 13. They are dimensioned such that the milling head 28 of a milling tool 29 can be passed through the bores 31, 32 and can be moved into the material of the card body 10.
  • the holding device 20 now comprises a stamp 21 which can be moved up and down in order to clamp and release a card body 10.
  • a stamp 21 which can be moved up and down in order to clamp and release a card body 10.
  • an electrode 22 is kept insulated via an insulator 23, on which the card body 10 rests.
  • the electrode 22 is connected to a connection contact A.
  • the pressure plate 30 is in turn connected to ground, as is the milling tool 29 together with the milling head 28.
  • a possible measuring device is explained below with reference to FIG. 4, by means of which it can be determined when the milling head 28 makes electrical contact with the component 11 or with its first contact section 13.
  • the measuring arrangement shown in FIG. 4 can be recognized (of course at first glance) as a Wheatstone bridge, one of which is formed by a pair of branches of ohmic resistors R1, R2 and the other (one) branch of which is formed by a measuring capacitor C1 is.
  • the other capacitor is on the one hand due to the area of the electrode 22 formed, on the other hand, by the opposite surface of the pressure plate 30.
  • the component 11 or its contact sections 12, 13 and its conductor track 14 form a further capacitor surface, which lies opposite the electrode 22.
  • the electrical component (the contact sections 12, 13 and the conductor track 14) hangs in the air, so to speak.
  • the switch shown in Figure 4 is open.
  • the component 11 is grounded so that the surface sections - formed from the contact sections 12 and 13 and the conductor track 14 - are electrically connected in parallel to the pressure plate 30.
  • This increases the Capacitance in the Wheatstone bridge W, so that when the bridge is suitably tuned beforehand, an AC voltage emitted by a measuring generator G is no longer compensated for, but rather via a measuring rectifier to one
  • Differential amplifier A is given and can be supplied by this as an amplified signal to a control device S, which stops a feed mechanism (not shown) for the milling tool 29 and ends the sinking process.
  • the variant of the invention shown in FIGS. 5 and 6 differs from that according to FIGS. 3 and 4 only in that the electrode 22 is not adapted over the whole area as shown in FIG. 3 but rather to the shape of the component 11 or its conductor track 14. As a result, the capacitance between the pressure plate 30 and the electrode 22 is reduced, but not between the electrode 22 and the component 11 or the conductor track 14. This in turn leads to a larger change in capacitance when the milling head 28 and the second contact section 13 come into contact is opposite the
  • FIGS. 7 and 8 differs from that according to FIGS. 5 and 6 in that no fixed measuring capacitor C1 is provided. Rather, the second section of the capacitive bridge branch is formed by a capacitor, one surface of which is formed by the pressure plate 30 and the other surface of which is formed by an electrode 22 'which, like the electrode 22, is held in the plunger 21 via an insulator 23' .
  • This electrode 22 ' is now arranged at a location on the stamp 21 (for example in its center) at which not the conductor track 14 but exclusively the pressure plate 30 is arranged. This makes it possible to set up the overall arrangement (with a corresponding coordination of the measuring resistors R1 and R2) according to the respective card thickness, so to speak, in a self-calibrating manner.
  • the electrodes 22 can of course not only be provided in the stamp 21 but also in the pressure plate 30.
  • Card body component first contact section second contact section conductor track recess holding device stamp electrode insulator milling head milling tool pressure plate first hole second hole

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

La fabrication de cartes à puce avec des composants intégrés, notamment des antennes, donc dans le cas de cartes à puce sans contact, pose des problèmes lorsque l'on veut pratiquer des évidements dans le corps de la carte de telle manière que les surfaces de contact de l'antenne soient accessibles. Selon l'invention, le processus de matriçage avec un outil de matriçage est interrompu lorsqu'une mesure électrique détermine que l'outil de matriçage touche une section de contact de l'antenne.
PCT/EP1998/002704 1997-05-14 1998-05-08 Procede et dispositif pour la fabrication de cartes a puce WO1998052154A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1997120226 DE19720226C5 (de) 1997-05-14 1997-05-14 Verfahren und Vorrichtung zur Herstellung von Chipkarten
DE19720226.8 1997-05-14

Publications (1)

Publication Number Publication Date
WO1998052154A1 true WO1998052154A1 (fr) 1998-11-19

Family

ID=7829442

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/002704 WO1998052154A1 (fr) 1997-05-14 1998-05-08 Procede et dispositif pour la fabrication de cartes a puce

Country Status (2)

Country Link
DE (1) DE19720226C5 (fr)
WO (1) WO1998052154A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
DE10130393C1 (de) * 2001-06-23 2002-10-10 Melzer Maschinenbau Gmbh Verfahren und Vorrichtung zum Freilegen von Anschlußflächen einer Leiterbahn
DE10223509B4 (de) * 2002-05-27 2005-11-24 Mühlbauer Ag Vorrichtung zum definierten Materialabtrag sowie Verfahren zur Steuerung einer Vorrichtung
DE10228373B4 (de) * 2002-06-25 2010-06-17 Sagem Orga Gmbh Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer Chipkarte
PT1536372E (pt) * 2003-11-25 2006-12-29 Trub Ag Processo para a produção de portadores de dados e portadores de dados produzidos de acordo com este processo
CN109186449A (zh) * 2018-10-25 2019-01-11 广州明森合兴科技有限公司 一种双界面智能卡内天线的深度检测方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
DE19500925A1 (de) * 1995-01-16 1996-07-18 Orga Kartensysteme Gmbh Chipkarte zur kontaktlosen Datenübertragung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4241482A1 (de) * 1992-12-09 1994-06-16 Siemens Ag Verfahren und Einrichtung zur Herstellung von IC-Karten
FR2703806B1 (fr) * 1993-04-06 1995-07-13 Leroux Gilles Sa Objet portatif et procede de fabrication.
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
DE19500925A1 (de) * 1995-01-16 1996-07-18 Orga Kartensysteme Gmbh Chipkarte zur kontaktlosen Datenübertragung

Also Published As

Publication number Publication date
DE19720226C1 (de) 1998-10-01
DE19720226C5 (de) 2007-11-22

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