WO1998050810A1 - Module electro-optique - Google Patents

Module electro-optique Download PDF

Info

Publication number
WO1998050810A1
WO1998050810A1 PCT/DE1998/000107 DE9800107W WO9850810A1 WO 1998050810 A1 WO1998050810 A1 WO 1998050810A1 DE 9800107 W DE9800107 W DE 9800107W WO 9850810 A1 WO9850810 A1 WO 9850810A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
converging lens
depression
module
broad side
Prior art date
Application number
PCT/DE1998/000107
Other languages
German (de)
English (en)
Inventor
Heiner Hauer
Albrecht Kuke
Eberhard Moess
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO1998050810A1 publication Critical patent/WO1998050810A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Definitions

  • the invention is based on a module according to the genus of the main claim.
  • Optoelectronic modules are required in optical communications technology for converting electrical to optical signals or optical to electrical signals.
  • Transmitter or receiver modules are customary in which the optoelectronic converter, usually a semiconductor laser diode or a photodiode, is mounted in a coaxially constructed and hermetically sealed housing, a so-called TO housing.
  • a fiber is then coupled to this TO housing via imaging optics, the entire arrangement being combined in a module housing.
  • the electrical connections of the electro-optical converter are led out of the base of the TO housing via lead-through wires. This limits the frequency bandwidth to ⁇ 1 Gbit / s. For higher bit rates, it is necessary to use housings with high-frequency feedthroughs, for example butterfly housings, but these are considerably more expensive.
  • SMD Surface Mounted Device
  • the module according to the invention with the features of the main claim has the following advantage.
  • the invention and its exemplary embodiments enable a cost-effective and automatable production of optoelectronic transmission and reception modules in SMD construction, which can be assembled together with electronic components on a printed circuit board in the same operation. If the modules according to the invention are manufactured as receptacles, no fiber end interferes with assembly on the printed circuit board. The attachment of the modules on the circuit board is so stable due to the features of the invention that all common connector systems can be used.
  • FIG. 1 the cross section through a transmitter module which is already mounted on a printed circuit board
  • Figure 2 a so-called lead frame for the assembly of a
  • FIG. 3 the same lead frame in a later processing state
  • FIG. 4 the module from the outside (view from the left to FIG. 1)
  • FIG. 5 a variant of FIG. 1,
  • FIG. 1 shows the cross section through a transmitter module already mounted on a circuit board.
  • a laser diode 1 is mounted as a converter 1 in a depression 2 on a broad side (“front side”) of a tabular silicon substrate 3.
  • the depression 2 was produced by anisotropic etching in the crystallographically (100) -oriented silicon substrate 3.
  • a further depression 4 was etched into the silicon substrate 3.
  • the light bundle 5 emerging from the end face of the laser diode strikes the end face 6 of the depression 2, which is covered with an anti-reflection layer, so that the light bundle can enter the silicon with low reflection losses.
  • the end faces and side faces of the anisotropically etched depressions have an angle of repose of
  • the light beam strikes the end face of the second depression 4, which has the same angle of repose in the opposite direction.
  • the angle of incidence there is so large that the light beam is totally reflected.
  • the light beam passes through the silicon substrate almost perpendicular to the broad side of the substrate.
  • the beam direction of the center beam of the totally reflected bundle depends on the medium between the laser end face and the end face 6 of the depression 2.
  • One fills this depression with a transparent medium with a refractive index of ro 1.5, then the center beam of the light beam reflected on the end face 7 runs at an angle of 1.4 ° with respect to the normal to the broad side of the silicon substrate 3.
  • the light bundle strikes a converging lens 8, which is preferably generated by reactive ion beam etching (RIE) directly on the rear side of the silicon substrate.
  • RIE reactive ion beam etching
  • the position of the laser diode 1 is defined by the side walls of the depression 2 serving as stops. As a result, the mutual position of the laser diode 1 to the converging lens 8 is pre-disturbed with high accuracy by lithographic processes.
  • the converging lens 8 focuses the light bundle in a pixel 9.
  • the end face of a fiber 11 is positioned at the location of the pixel 9.
  • the focal length of the Sairtnell lens 8 is chosen so that there is a magnification ratio for an optimal beam transformation of the laser beam into a beam accepted by the fiber 11 used, in order to achieve an optimal coupling efficiency. If a multimode fiber with a core diameter of approximately 45 ⁇ m is used as the fiber, an active adjustment can be dispensed with. With a single-mode fiber with a core diameter of approximately 10 ⁇ m, active adjustment is required.
  • the transmitter module is preferably produced as a so-called receptacle, in which the fiber 11 is not firmly connected to the module, but is part of a plug 15 which is guided in a receptacle (in particular socket) 12 in a detachable and non-rotatable manner.
  • the receptacle has a flange 14, the end face perpendicular to the fiber and Connector axis and runs parallel to the broad sides of the silicon substrate 3.
  • the axial position of the plug 15 is determined by a stop 10 on the end face of the receptacle 12.
  • the normal on the end face of the fiber is inclined by an angle ⁇ with respect to the fiber axis, as is customary in the prior art.
  • This angle can preferably be set by a defined displacement of the Saimellensmitte to the beam center (center beam), so that the receptacle (socket) 12 for the fiber 11 or for the connector 15 can run in the direction of the substrate normal, which is the manufacture and assembly of the flange 14 relieved.
  • the street guidance was calculated as an example for a silicon substrate 3 with the standard thickness of 525 ⁇ m and a silicon converging lens 8 etched on the back of the substrate.
  • the output variables and result values are listed below.
  • Waist radius of the laser beam w 0L 2, 0 ⁇ m
  • the center beam of the transformed laser beam bundle is deflected by a defined offset of the etched silicon S-irrigation lens of 2.7 ⁇ m relative to the center of the beam into the required directional angle of 3.69 °, which is for a fiber with a cutting angle of 8 ° is required.
  • the end face of the fiber must be 550 ⁇ m from the Sa ⁇ ml lens.
  • a so-called lead frame is used to hold the silicon substrate 3 and to make the electrical connections.
  • Lead frames of this type are used to contact electronic semiconductor chips and then to encase them with a sealing compound.
  • Leadframes have a central mounting surface for the chip and in the Periphery for this spider-like etched connecting fingers that extend from an outer frame to close to the central mounting surface, as well as webs that connect the central mounting surface to the outer frame.
  • the contact areas of the chip are connected to the connection fingers of the lead frame by means of bond connections.
  • the lead frames are used in the form of tapes that are automatically fed to the chip assembly and bonding stations. After assembling and potting the modules, the outer frames are cut off to remove the short circuits between the individual lines and the connecting fingers are bent as required.
  • the receptacle according to the invention is therefore designed so that the fiber 11 does not need to be inserted until after the SMD assembly.
  • FIG. 2 shows, as a first example, a leadframe for the mounting of a transmitter module according to FIG. 1.
  • a frame 20 (leadframe) there is a mounting surface 22 — connected by webs 21.
  • the silicon substrate is on a central, lowered part 23 of this mounting surface 3 mounted with the two wells 2 and 4.
  • This bonding area 25, which is conductively connected to the underside of the laser diode (of the laser chip) 1, is connected to a connecting finger 26 of the leadframe 20 via a bonding wire.
  • the for the contacting of the laser diode 1 and a possibly present monitor diode 30 necessary contact areas 31 and 32 connected to connecting fingers 27, 28 and 29 via bonding wires.
  • the space in the depression 2 between the end faces of the laser chip 1 and the end faces of the depression 2 is filled with a medium which is transparent to laser light.
  • the silicon substrate 3 is mounted in the lowered part 23 of the mounting surface.
  • the depression 23 is approximately as deep as the silicon substrate is thick.
  • the lowered part 23 of the mounting surface 22 has an opening 40 (FIG. 1) at the point opposite the converging lens 8, which opening has at least the size of the converging lens 8.
  • the mounting surface of the leadframe consists at least on the flat rear side 41 (FIG. 1) of the lowered part 23 from a laser-weldable material such as Kovar or stainless steel, which is not coated with gold there like the connecting fingers 26-29.
  • This rear side 41 serves as a bearing surface for the flange surface on the end face of the flange 14.
  • the receptacle 12 has at its front end the flange 14, the end surface of which serves as the second flange surface is slightly smaller than the rear side 41 serving as the first flange surface.
  • the flange 14 also consists of a laser-weldable material. During the active adjustment, the laser diode 1 is put into operation and the plug 15 is inserted into the receptacle 12. The flange 14 is moved with its flange surface parallel to the first flange surface 41 either slidingly or at a very close distance and the light output coupled into the fiber is measured in the process.
  • the movement of the flange 14 is expediently controlled by an automated search algorithm in order to quickly find the optimal lateral coupling position.
  • the axial coupling position is considerably less critical than the lateral one and can be preset due to the exact prepositioning of the etched Sarrtuell lens to the laser diode 1.
  • the axial coupling position is determined by the position of the stop 10 (for the connector 15) in the receptacle 12.
  • the flange 14 is welded to the rear side 41 by laser welding spots 43.
  • the plug 15 can then be removed from the receptacle 12 and the receptacle 12 can be provided with a protective cap for protection during the subsequent encapsulation process.
  • the laser diode 1 For active adjustment of the flange 14, the laser diode 1 must be contacted electrically. The following problem arises: If the connection pads of the laser diode are connected to the connection fingers 26 and 27 via bond wires, they are short-circuited until the frame 20 is separated. The frame 20 can only be separated if the module is encased, otherwise the connecting fingers will fall off. After the wrapping, however, the rear side 41 is no longer free or this surface would first have to be kept free and wrapped after the flange fixation, which would involve considerable additional expenditure.
  • the flange 14 is adjusted and fixed before the bonding process for the laser connections.
  • the apparatus for automatic flange adjustment and fixation contains a receiving device into which the leadframe with mounted silicon substrate 3 and laser chip 1 can be inserted so that the side with the laser chip is directed downwards and the other side up.
  • the receiving device has contact pins opposite the contact surfaces of the laser diode, via which the laser operating current is conducted during the adjustment. Since many lead frames are arranged next to each other as a band in series production, they can easily automatically guided into the adjustment and fixing station and contacted there via the contact pins. In the adjustment and fixing station, the flange 14 then only has to be fed to each module, expediently from a magazine.
  • the fiber 11 with plug 15 required for laser light detection can be the same for all modules to be adjusted and can be permanently connected to a light detector of the adjustment and fixing station, the plug being automatically inserted into the respective receptacle 12. In this way, not only the adjustment and fixing process can be automated, but also the feeding of the components.
  • the bond connections are made and then the covering material (covering) 50 is attached.
  • This casing can expediently consist, as usual, of an inner casing 70 and an outer casing 50 (FIG. 1).
  • the inner sheath 70 which covers the area of the bond wires, is made of a softer material to protect the bond wires.
  • the outer casing 50 which is later to provide mechanical protection, is made of a stronger material.
  • the frame 20 is then removed by severing the webs 21 at markings 21a and the connecting fingers 26 to 29 at markings 26a to 29a.
  • the connecting fingers 26 to 29 are bent at right angles on the underside of the casing 50, so that they can lie in recesses 51 (FIGS. 1 and 4).
  • FIG. 3 shows the module from the front after wrapping and after processing the connecting fingers and webs in a cross section in the plane of the lead frame.
  • FIG. 4 shows the module from the outside with the printed circuit board 60 shown in cross section.
  • a first leadframe 100 contains the mounting surface 122 for receiving the silicon substrate 3 with the depressions 2 and 4, the laser chip 1 (see FIG. 1) and possibly the monitor diode 30 (see FIG. 2).
  • the mounting surface 122 is connected to a frame 120 via webs 121.
  • a lowering of the inner area of the mounting surface, as in the first exemplary embodiment, can be dispensed with here.
  • a second lead frame 200 contains only the connecting fingers 26 to 29.
  • the frame 220 of the second Lead frames 200 are aligned with the frame 120 of the first lead frame 100 via latching structures 201 and 101.
  • the two lead frames are spaced apart from one another in the central region, which corresponds to the thickness of the silicon substrate.
  • the webs 121 are cranked according to this distance.
  • the use of two lead frames 100 and 200 has the advantage over the first exemplary embodiment that different materials and material thicknesses can be used for the two lead frames in accordance with their different tasks.
  • the leadframe 100 which carries the mounting surface and the webs 121, should have a greater material thickness for reasons of stability. It must also be made of a laser weldable material such as Kovar or stainless steel.
  • the leadframe 200, which carries the connection fingers, should be thinner since these have to be bent later. In addition, its surface must be gold-plated because it has to be bonded and soldered.
  • the first lead frame 100 is equipped and, as described for the first version, contacted via contact pins in the adjustment device and automatically actively adjusted. Then the tape with the second leadframes 200 is added and with the latching structures 201 on its frame 220 is latched into the latching structures 101 on the frame 120 of the first leadframe band, so that both are aligned with one another for the subsequent production of the bond connections of the connection spots on the silicon Substrate with the connecting fingers. The further processing, bonding, casting, trimming and bending of the connecting fingers is carried out as described for the first version.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention porte sur un module électro-optique destiné à la technique de télécommunication pour convertir des signaux électriques en signaux optiques, voire des signaux optiques en signaux électriques. Le module comprend une interface électrique pour fibres optiques (11), un substrat au silicium en forme de plaque (3), qui présente sur l'un de ses côtés larges deux dépressions (2, 4) obtenues par décapage anisotropique sur un plan cristallographique (100), un convertisseur (1) électriquement métallisé étant logé dans la première dépression (4). La seconde dépression (4) présente une surface frontale à réflexion totale, et le trajet prévu pour le rayonnement optique est tel que les rayons optiques activés croisent la surface du côté large du substrat (3, 303), tourné vers l'interface. Le rayon central activé est incident sur une face frontale (6) de la première dépression et se reflète contre la face frontale (7) à réflexion totale. Là où le rayon le rayon central traverse la surface du second côté large, est placée une lentille convergente (8). Ce module s'intègre dans un composant permettant un montage peut coûteux sur une plaquette à circuit imprimé (60) selon la technologie CMS.
PCT/DE1998/000107 1997-05-05 1998-01-14 Module electro-optique WO1998050810A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19718949A DE19718949A1 (de) 1997-05-05 1997-05-05 Elektrooptisches Modul
DE19718949.0 1997-05-05

Publications (1)

Publication Number Publication Date
WO1998050810A1 true WO1998050810A1 (fr) 1998-11-12

Family

ID=7828676

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000107 WO1998050810A1 (fr) 1997-05-05 1998-01-14 Module electro-optique

Country Status (2)

Country Link
DE (1) DE19718949A1 (fr)
WO (1) WO1998050810A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100391066C (zh) * 2003-09-19 2008-05-28 安华高科技光纤Ip（新加坡）私人有限公司 集成光电子器件
US9300112B2 (en) 2013-12-18 2016-03-29 Lumentum Operations Llc Packaged laser diode and method of packaging a laser diode

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1146570A1 (fr) * 2000-04-14 2001-10-17 Infineon Technologies AG Dispositif émetteur de lumière à semi-conducteur et methode pour la fabrication d'un support
US20100098374A1 (en) * 2008-10-20 2010-04-22 Avago Technologies Fiber Ip (Signgapore) Pte. Ltd. Optoelectronic component based on premold technology

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0413489A2 (fr) * 1989-08-17 1991-02-20 AT&T Corp. Assemblage optique comprenant des moyens de couplage à fibre optique
EP0498169A1 (fr) * 1991-02-08 1992-08-12 Siemens Aktiengesellschaft Composant opto-électronique pour couplage et découplage de rayonnement
EP0607881A1 (fr) * 1993-01-20 1994-07-27 Robert Bosch Gmbh Dispositif pour coupler un guide d'onde optique
DE4431285C1 (de) * 1994-09-02 1995-12-07 Ant Nachrichtentech Lasermodul

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0413489A2 (fr) * 1989-08-17 1991-02-20 AT&T Corp. Assemblage optique comprenant des moyens de couplage à fibre optique
EP0498169A1 (fr) * 1991-02-08 1992-08-12 Siemens Aktiengesellschaft Composant opto-électronique pour couplage et découplage de rayonnement
EP0607881A1 (fr) * 1993-01-20 1994-07-27 Robert Bosch Gmbh Dispositif pour coupler un guide d'onde optique
DE4431285C1 (de) * 1994-09-02 1995-12-07 Ant Nachrichtentech Lasermodul

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100391066C (zh) * 2003-09-19 2008-05-28 安华高科技光纤Ip（新加坡）私人有限公司 集成光电子器件
US9300112B2 (en) 2013-12-18 2016-03-29 Lumentum Operations Llc Packaged laser diode and method of packaging a laser diode

Also Published As

Publication number Publication date
DE19718949A1 (de) 1998-11-12

Similar Documents

Publication Publication Date Title
DE19640423C1 (de) Optoelektronisches Modul zur bidirektionalen optischen Datenübertragung
DE19947889C2 (de) Optoelektronisches, bidirektionales Sende- und Empfangsmodul in Leadframe-Technik
EP1174745B1 (fr) Module optoélectronique montable en surface
DE69416016T2 (de) Faseroptische Kopplungseinrichtung
EP0664585B1 (fr) Module de transmission et de réception pour système de communication bidirectionnel
DE102005019562B4 (de) Optisches Sende- und Empfangsmodul
DE3687063T2 (de) Optische komponente mit wellenleiter.
DE10348675B3 (de) Modul für eine bidirektionale optische Signalübertragung
DE69431512T2 (de) Lichtempfängerstruktur für optische Vorrichtungen vom Wellenleitertyp
DE69611282T2 (de) Optische Unteranordnung mit niedriger Abmessung
DE19617921A1 (de) Integrierter optischer Modul mit Wellenleiter und Fotoempfangsvorrichtung
EP0395854A2 (fr) Arrangement pour coupler un guide d'onde avec un émetteur ou récepteur optique
EP0111263B1 (fr) Appareil de transmission ou réception contenant une diode dans une monture
DE102004025775A1 (de) Oberflächenemissionslasergehäuse, das ein integriertes optisches Element und einen integrierten Ausrichtungspfosten aufweist
DE19616969A1 (de) Optische Baugruppe zur Ankopplung eines Lichtwellenleiters und Verfahren zur Herstellung derselben
DE10004411A1 (de) Elektrooptisches Sende-/Empfangsmodul und Verfahren zu seiner Herstellung
DE102004025661B4 (de) Optische-Vorrichtung -Gehäuse mit Drehspiegel und Ausrichtungspfosten
WO2001009962A1 (fr) Composant optoelectronique et son procede de production
DE3809396A1 (de) Optischer sende- und empfangsmodul
DE69015588T2 (de) Optischer Kopf integrierbar in einem hybriden Schaltkreis.
DE19640421A1 (de) Optoelektronisches Modul zur bidirektionalen optischen Datenübertragung
EP0942302A2 (fr) Module électrooptique
WO1998050811A1 (fr) Module electro-optique
DE4313492C1 (de) Anordnung zur Ankopplung eines optoelektronischen Empfangselementes an ein optoelektronisches Sendeelement
WO1998050810A1 (fr) Module electro-optique

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase