WO1998043307A3 - Lotkugel-bestückungsvorrichtung für bga-bauteile - Google Patents

Lotkugel-bestückungsvorrichtung für bga-bauteile Download PDF

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Publication number
WO1998043307A3
WO1998043307A3 PCT/DE1998/000734 DE9800734W WO9843307A3 WO 1998043307 A3 WO1998043307 A3 WO 1998043307A3 DE 9800734 W DE9800734 W DE 9800734W WO 9843307 A3 WO9843307 A3 WO 9843307A3
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
globule
assembly device
bga components
component
Prior art date
Application number
PCT/DE1998/000734
Other languages
English (en)
French (fr)
Other versions
WO1998043307A2 (de
Inventor
Horst Groeninger
Original Assignee
Siemens Ag
Horst Groeninger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Horst Groeninger filed Critical Siemens Ag
Publication of WO1998043307A2 publication Critical patent/WO1998043307A2/de
Publication of WO1998043307A3 publication Critical patent/WO1998043307A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Es ist eine Lotkugel-Bestückungsvorrichtung für BGA-Bauteile vorgesehen, die eine Vorratskammer für Lotkugeln, ein Bestückungsraster und eine Bauteilpositioniereinrichtung aufweist. Das Bestückungsraster ist mit Durchgängen so ausgebildet, daß die Vorratskammer ein in der Positioniereinrichtung angeordnetes Bauteil verbindet, so daß die Lotkugeln auf das Bauteil gelangen können.
PCT/DE1998/000734 1997-03-21 1998-03-12 Lotkugel-bestückungsvorrichtung für bga-bauteile WO1998043307A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19711910 1997-03-21
DE19711910.7 1997-03-21

Publications (2)

Publication Number Publication Date
WO1998043307A2 WO1998043307A2 (de) 1998-10-01
WO1998043307A3 true WO1998043307A3 (de) 1998-12-23

Family

ID=7824190

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000734 WO1998043307A2 (de) 1997-03-21 1998-03-12 Lotkugel-bestückungsvorrichtung für bga-bauteile

Country Status (1)

Country Link
WO (1) WO1998043307A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641030B1 (en) * 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6595408B1 (en) 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
FR2785140B1 (fr) 1998-10-27 2007-04-20 Novatec Sa Soc Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603623A2 (de) * 1992-12-23 1994-06-29 International Business Machines Corporation Verbinden von Schichten und Mehrschichtschaltplatine
US5454159A (en) * 1994-02-18 1995-10-03 Unisys Corporation Method of manufacturing I/O terminals on I/O pads

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603623A2 (de) * 1992-12-23 1994-06-29 International Business Machines Corporation Verbinden von Schichten und Mehrschichtschaltplatine
US5454159A (en) * 1994-02-18 1995-10-03 Unisys Corporation Method of manufacturing I/O terminals on I/O pads

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
H.R. BICKFORD ET AL.: "Silicon Alignment Frame for Spherical Standoff Placement", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 25, no. 5, October 1982 (1982-10-01), NEW YORK US, pages 2590, XP002075759 *

Also Published As

Publication number Publication date
WO1998043307A2 (de) 1998-10-01

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