WO1998042031A1 - Diode luminescente - Google Patents
Diode luminescente Download PDFInfo
- Publication number
- WO1998042031A1 WO1998042031A1 PCT/RU1997/000070 RU9700070W WO9842031A1 WO 1998042031 A1 WO1998042031 A1 WO 1998042031A1 RU 9700070 W RU9700070 W RU 9700070W WO 9842031 A1 WO9842031 A1 WO 9842031A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- crystal
- emitting diode
- fact
- radiation
- Prior art date
Links
- 239000013078 crystal Substances 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims abstract 3
- 239000004065 semiconductor Substances 0.000 claims abstract 2
- 230000005855 radiation Effects 0.000 claims description 29
- 238000004020 luminiscence type Methods 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 9
- 238000009413 insulation Methods 0.000 claims 2
- 239000003086 colorant Substances 0.000 claims 1
- 239000003643 water by type Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 230000000284 resting effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/RU1997/000070 WO1998042031A1 (fr) | 1997-03-18 | 1997-03-18 | Diode luminescente |
EP97915782A EP0976589A4 (en) | 1997-03-18 | 1997-03-18 | LUMINESCENT DIODE |
US09/381,392 US6365920B1 (en) | 1997-03-18 | 1997-03-18 | Luminescent diode |
JP10540402A JP2000511711A (ja) | 1997-03-18 | 1997-03-18 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/RU1997/000070 WO1998042031A1 (fr) | 1997-03-18 | 1997-03-18 | Diode luminescente |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998042031A1 true WO1998042031A1 (fr) | 1998-09-24 |
Family
ID=20130093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/RU1997/000070 WO1998042031A1 (fr) | 1997-03-18 | 1997-03-18 | Diode luminescente |
Country Status (4)
Country | Link |
---|---|
US (1) | US6365920B1 (ru) |
EP (1) | EP0976589A4 (ru) |
JP (1) | JP2000511711A (ru) |
WO (1) | WO1998042031A1 (ru) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6683325B2 (en) * | 1999-01-26 | 2004-01-27 | Patent-Treuhand-Gesellschaft-für Elektrische Glühlampen mbH | Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture |
JP3887124B2 (ja) * | 1999-04-30 | 2007-02-28 | ローム株式会社 | チップ型半導体発光素子 |
CN1169436C (zh) * | 2000-04-21 | 2004-10-06 | 拉博斯费尔株式会社 | 威吓装置 |
DE10038213A1 (de) * | 2000-08-04 | 2002-03-07 | Osram Opto Semiconductors Gmbh | Strahlungsquelle und Verfahren zur Herstellung einer Linsensform |
JP3930710B2 (ja) * | 2000-09-13 | 2007-06-13 | シチズン電子株式会社 | チップ型発光ダイオード及びその製造方法 |
AUPR245601A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus (WSM09) |
US7019335B2 (en) * | 2001-04-17 | 2006-03-28 | Nichia Corporation | Light-emitting apparatus |
US20040183081A1 (en) * | 2003-03-20 | 2004-09-23 | Alexander Shishov | Light emitting diode package with self dosing feature and methods of forming same |
JP2004342781A (ja) * | 2003-05-14 | 2004-12-02 | Nichia Chem Ind Ltd | 発光装置およびディスプレイ装置 |
US6903382B2 (en) * | 2003-07-07 | 2005-06-07 | Lightop Technology Co., Ltd. | Light emitting diode mounting structure |
KR100867516B1 (ko) | 2005-05-02 | 2008-11-07 | 삼성전기주식회사 | 발광소자 패키지 |
US7989827B2 (en) * | 2005-05-19 | 2011-08-02 | Advanced Optoelectronic Technology, Inc. | Multichip light emitting diode package |
CN100538421C (zh) * | 2005-06-14 | 2009-09-09 | 罗姆股份有限公司 | 发光装置 |
DE102005054184B4 (de) | 2005-11-14 | 2020-10-29 | Carl Zeiss Microscopy Gmbh | Multispektrale Beleuchtungsvorrichtung und Messverfahren |
JP4013077B2 (ja) | 2005-11-21 | 2007-11-28 | 松下電工株式会社 | 発光装置およびその製造方法 |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
KR100738933B1 (ko) * | 2006-03-17 | 2007-07-12 | (주)대신엘이디 | 조명용 led 모듈 |
US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
US7852015B1 (en) * | 2006-10-11 | 2010-12-14 | SemiLEDs Optoelectronics Co., Ltd. | Solid state lighting system and maintenance method therein |
US8772802B2 (en) | 2009-02-18 | 2014-07-08 | Everlight Electronics Co., Ltd. | Light emitting device with transparent plate |
US8405105B2 (en) | 2009-02-18 | 2013-03-26 | Everlight Electronics Co., Ltd. | Light emitting device |
US8378358B2 (en) | 2009-02-18 | 2013-02-19 | Everlight Electronics Co., Ltd. | Light emitting device |
CN102141208B (zh) * | 2010-02-03 | 2013-04-17 | 亿光电子工业股份有限公司 | 灯具 |
US8962359B2 (en) | 2011-07-19 | 2015-02-24 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
US20140301069A1 (en) * | 2013-04-08 | 2014-10-09 | GEM Weltronics TWN Corporation | Light emitting diode light tube |
DE102016113514A1 (de) * | 2016-07-21 | 2018-01-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
US11530141B2 (en) | 2018-11-02 | 2022-12-20 | Crystal Is, Inc. | Systems and methods for fluid disinfection with ultraviolet light |
US11279632B2 (en) | 2019-04-22 | 2022-03-22 | Crystal Is, Inc. | Fluid treatment reactor |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4152618A (en) * | 1977-04-05 | 1979-05-01 | Tokyo Shibaura Electric Co., Ltd. | Light-emitting display device including light diffusing film |
US5187547A (en) * | 1988-05-18 | 1993-02-16 | Sanyo Electric Co., Ltd. | Light emitting diode device and method for producing same |
EP0632511A2 (en) * | 1993-06-29 | 1995-01-04 | MITSUBISHI CABLE INDUSTRIES, Ltd. | A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module |
RU2055420C1 (ru) * | 1992-06-03 | 1996-02-27 | Абрамов Александр Владимирович | Светоизлучающий диод |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3805347A (en) * | 1969-12-29 | 1974-04-23 | Gen Electric | Solid state lamp construction |
DE2062309B2 (de) | 1970-12-17 | 1972-12-07 | Engelhardt, Friedrich, 8502 Zirn dorf | Vorrichtung zum voruebergehenden, lagekonstanten absetzen eines etwa horizontal bewegten gegenstands auf eine ruheflaeche |
US3774086A (en) * | 1972-09-25 | 1973-11-20 | Gen Electric | Solid state lamp having visible-emitting phosphor at edge of infrated-emitting element |
JPS5527463B2 (ru) * | 1973-02-28 | 1980-07-21 | ||
US4159648A (en) * | 1977-11-03 | 1979-07-03 | Electromedics, Inc. | Electrical circuit board with directly attached display unit and method of assembling same |
FR2471014A1 (fr) * | 1979-11-28 | 1981-06-12 | Radiotechnique Compelec | Dispositif d'affichage a diodes electroluminescentes |
JPS587887A (ja) * | 1981-07-06 | 1983-01-17 | Fujitsu Ltd | 光半導体装置 |
JPS59180515A (ja) * | 1983-03-31 | 1984-10-13 | Toshiba Corp | 光フアイバ結合用発光素子 |
DE3532821A1 (de) | 1985-09-13 | 1987-03-26 | Siemens Ag | Leuchtdiode (led) mit sphaerischer linse |
JPS62174980A (ja) * | 1986-01-28 | 1987-07-31 | Mitsubishi Cable Ind Ltd | 光フアイバ通信用発光装置 |
JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
DE3732075A1 (de) * | 1987-09-23 | 1989-04-06 | Siemens Ag | Hermetisch dichtes glas-metallgehaeuse fuer halbleiterbauelemente und verfahren zu dessen herstellung |
DE8713875U1 (ru) | 1987-10-15 | 1988-02-18 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
US4935665A (en) * | 1987-12-24 | 1990-06-19 | Mitsubishi Cable Industries Ltd. | Light emitting diode lamp |
ES2150409T3 (es) * | 1989-05-31 | 2000-12-01 | Osram Opto Semiconductors Gmbh | Procedimiento para montar un opto-componente que se puede montar sobre una superficie. |
US5302778A (en) * | 1992-08-28 | 1994-04-12 | Eastman Kodak Company | Semiconductor insulation for optical devices |
JP3420612B2 (ja) * | 1993-06-25 | 2003-06-30 | 株式会社東芝 | Ledランプ |
AU7841594A (en) | 1993-09-30 | 1995-04-18 | Universal Electronics Inc. | Led assembly with enhanced power output |
JPH08116096A (ja) * | 1994-10-14 | 1996-05-07 | Hamamatsu Photonics Kk | 発光装置 |
DE19535777A1 (de) * | 1995-09-26 | 1997-03-27 | Siemens Ag | Optoelektronisches Halbleiter-Bauelement und Verfahren zur Herstellung |
-
1997
- 1997-03-18 WO PCT/RU1997/000070 patent/WO1998042031A1/ru not_active Application Discontinuation
- 1997-03-18 JP JP10540402A patent/JP2000511711A/ja active Pending
- 1997-03-18 EP EP97915782A patent/EP0976589A4/en not_active Withdrawn
- 1997-03-18 US US09/381,392 patent/US6365920B1/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4152618A (en) * | 1977-04-05 | 1979-05-01 | Tokyo Shibaura Electric Co., Ltd. | Light-emitting display device including light diffusing film |
US5187547A (en) * | 1988-05-18 | 1993-02-16 | Sanyo Electric Co., Ltd. | Light emitting diode device and method for producing same |
RU2055420C1 (ru) * | 1992-06-03 | 1996-02-27 | Абрамов Александр Владимирович | Светоизлучающий диод |
EP0632511A2 (en) * | 1993-06-29 | 1995-01-04 | MITSUBISHI CABLE INDUSTRIES, Ltd. | A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module |
Non-Patent Citations (1)
Title |
---|
See also references of EP0976589A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP0976589A1 (en) | 2000-02-02 |
US6365920B1 (en) | 2002-04-02 |
EP0976589A4 (en) | 2006-11-08 |
JP2000511711A (ja) | 2000-09-05 |
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