WO1998028108A1 - Fabrication de tampon de polissage poreux - Google Patents

Fabrication de tampon de polissage poreux Download PDF

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Publication number
WO1998028108A1
WO1998028108A1 PCT/SG1996/000020 SG9600020W WO9828108A1 WO 1998028108 A1 WO1998028108 A1 WO 1998028108A1 SG 9600020 W SG9600020 W SG 9600020W WO 9828108 A1 WO9828108 A1 WO 9828108A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
manufacture
pad
filings
porous
Prior art date
Application number
PCT/SG1996/000020
Other languages
English (en)
Inventor
Kazunori Tani
Original Assignee
Unique Technology International Private Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unique Technology International Private Limited filed Critical Unique Technology International Private Limited
Priority to PCT/SG1996/000020 priority Critical patent/WO1998028108A1/fr
Publication of WO1998028108A1 publication Critical patent/WO1998028108A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
    • B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure

Definitions

  • This invention relates to the manufacture of a porous polishing pad to yield a super mirror polished surface, that is both planar and scratch-free.
  • Polishing pad is used in several industries, such as in the manufacture of magnetic disk substrate and silicon wafer fabrication, where a smooth planar surface must be produced.
  • Stock removal rate during polishing is proportional to pressure, velocity, time and abrasive grain size.
  • the circumferential speed is higher, so is the removal rate. This is aggravated by the ready supply of abrasive near the circumference of the work piece.
  • the work piece invariably, becomes non-planar; this is normally overcome by polishing the workpiece in planetary motions.
  • a polishing pad must ideally be planar, rigid and durable and the surface must be porous and capable of holding the abrasive; as the workpiece is being rotated and moved in orbits, the polishing pad discharges the abrasive slurry.
  • the problem with the current polyurethane foam is that the pocket-type pore's size and shape are not consistent and they are easily plugged up; once this occurs, the polishing efficiency is low and the foam surface has to be dressed periodically.
  • the polyurethane material also changes its elasticity as it ages; the abrasive slurry is, therefore, not effectively discharged and the resultant non-uniform distribution of the abrasive over the polishing surface is not desirable.
  • the polyurethane foam surface is ground flat with a belt grinder; however, the ground surface is invariably wavy and, therefore, not desired.
  • a porous polishing pad comprising of implanting the metallic or polymeric filings onto the adhesive layer of a backing cloth in an electric field, roll coating of the pad polymer and after curing, etch away the metallic filings with acid or dissolve the polymeric filings with a solvent/acid to yield a porous polishing pad, which has consistent pore size, shape, orientation, density and pattern, and a flat surface that can maintain constant polishing conditions and, hence, able to produce a super mirror-polished surface, which is both planar and scratch-free.
  • This polishing pad with controllable pore size, shape, orientation, density and pattern allows uniform distribution of abrasives across the polishing surface and hence able to give a super mirror-polished surface to the workpiece.
  • Figure 1 shows the set up for the manufacturing of the new polishing pad.
  • Figure 2 shows the porous polishing pad with different pore sizes, shapes, orientation, density and patterns. Description of the invention:
  • Figure 1 shows one embodiment of the present invention.
  • a backing cloth 1 is coated with an adhesive 2.
  • One means of preferred coating is known as roll coating 3.
  • Metallic filings 4 are dispersed on the backing cloth in an electrostatic field E. They are dispersed evenly by mutual repulsion, but aligned longitudinally to the electric field.
  • another set of roll coating 5 apply a layer of pad polymer 6 onto the implanted filings.
  • the coating roller surface can be plain or patterned; a plain roller will coat a uniform layer of the pad polymer onto the implanted filings; a patterned roller will apply the polymer according to the pattern of the roller surface.
  • the thickness of the pad polymer is controlled by metering the roller gap;
  • Many pad polymers can be used, such as polyurethane, polyamide, ultra high molecular weight polyethene and so on.
  • the polymer pad is subjected to an acid, which etches away the metal filings and produces a uniform strip of porous pad; the pore size and shape can be controlled by the filing size and shape, while the pore orientation can be controlled by the inclination of the backing cloth with respect to the electric field direction.
  • an electromagnetic field B perpendicular to the electric field can be applied and the orientation of the plate-like filings in the x-z plane can be controlled; a porous polymer with rectangular pores in different patterns can then be manufactured.
  • the pore density can be controlled by both the electrostatic field strength E and the backing cloth feed speed, F.
  • Figure 2 shows some examples of the porous polishing pad with different pore sizes, shapes, orientation and patterns.
  • the patterned porous pad is desirable because the polishing debris can be discharged during polishing, and prevents scratching the newly polished surface.
  • the filings 4 are made of another polymer, such as cellulose acetate for example.
  • the polymeric filings are longitudinally aligned with the field and implanted on the adhesive. By roll coating the pad polymer, just as is described above and, thereafter, dissolving away the polymeric filings with a solvent, such as acetone for example or an acid, a porous polymer pad is also obtained.
  • a solvent such as acetone for example or an acid
  • a plastic film such as polyethene and so on, can be used instead of a backing cloth.
  • the tape is coated with an adhesive by roll coating, implanted with metallic or polymeric filings and the pad polymer is coated onto the implanted filings, the filings are then etched or dissolved to produce a porous polishing pad; the plastic film is then peeled off and a new backing cloth is adhered to the polishing pad to give it strength.
  • the pad polymer 6 can be applied onto the implanted filings by other printing methods, such as screen printing for example, either uniformly or patterned, instead of roll coating as described earlier.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

Nouveau procédé de fabrication d'un tampon de polissage poreux, consistant à implanter des éléments métalliques ou polymères formateurs de pores sur un film/revêtement de support à l'intérieur d'un champ électrique et/ou magnétique, à appliquer le polymère de tampon sur les éléments implantés et, ensuite, à enlever par attaque ou à dissoudre le formateur de pores. Les pores du polymère poreux peuvent être régulés par la taille et la forme des éléments. L'orientation, la densité et la configuration peuvent également être déterminés. Ledit tampon de polissage poreux possède une taille, forme, orientation et densité régulière des pores et une surface plate. Le polymère de tampon peut être appliqué selon différents motifs. Le nouveau tampon de polissage est capable de maintenir des conditions de polissage constantes et, partant, de produire une surface plane et à poli optique.
PCT/SG1996/000020 1996-12-20 1996-12-20 Fabrication de tampon de polissage poreux WO1998028108A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/SG1996/000020 WO1998028108A1 (fr) 1996-12-20 1996-12-20 Fabrication de tampon de polissage poreux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG1996/000020 WO1998028108A1 (fr) 1996-12-20 1996-12-20 Fabrication de tampon de polissage poreux

Publications (1)

Publication Number Publication Date
WO1998028108A1 true WO1998028108A1 (fr) 1998-07-02

Family

ID=20429174

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG1996/000020 WO1998028108A1 (fr) 1996-12-20 1996-12-20 Fabrication de tampon de polissage poreux

Country Status (1)

Country Link
WO (1) WO1998028108A1 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001098027A1 (fr) * 2000-06-19 2001-12-27 Struers A/S Feuille de meulage et/ou de polissage a zones multiples
WO2005000526A1 (fr) * 2003-06-17 2005-01-06 Cabot Microelectronics Corporation Tampon de polissage presentant une structure a pores orientes
US6896593B2 (en) 2002-05-23 2005-05-24 Cabot Microelectronic Corporation Microporous polishing pads
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
CN112045556A (zh) * 2015-10-16 2020-12-08 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE827938A (nl) * 1974-07-17 1975-07-31 Schuurinrichting
GB2115322A (en) * 1982-03-02 1983-09-07 Nippon Tenshashi Kk Manufacturing a polishing element
EP0280657A2 (fr) * 1987-02-27 1988-08-31 Abrasive Technology N.A., Inc. Abrasifs flexibles
EP0291480A2 (fr) * 1987-05-15 1988-11-17 Sandvik Aktiebolag Outil plan pour le doucissage abrasif de surfaces
GB2223966A (en) * 1988-05-27 1990-04-25 D K Holdings Limited Making flexible abrasive member
US5100506A (en) * 1990-12-04 1992-03-31 Grace Manufacturing Inc. Chemically machined sheet metal cutting tools and method
EP0597723A1 (fr) * 1992-11-13 1994-05-18 De Beers Industrial Diamond Division (Proprietary) Limited Dispositif de polissage

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE827938A (nl) * 1974-07-17 1975-07-31 Schuurinrichting
GB2115322A (en) * 1982-03-02 1983-09-07 Nippon Tenshashi Kk Manufacturing a polishing element
EP0280657A2 (fr) * 1987-02-27 1988-08-31 Abrasive Technology N.A., Inc. Abrasifs flexibles
EP0291480A2 (fr) * 1987-05-15 1988-11-17 Sandvik Aktiebolag Outil plan pour le doucissage abrasif de surfaces
GB2223966A (en) * 1988-05-27 1990-04-25 D K Holdings Limited Making flexible abrasive member
US5100506A (en) * 1990-12-04 1992-03-31 Grace Manufacturing Inc. Chemically machined sheet metal cutting tools and method
EP0597723A1 (fr) * 1992-11-13 1994-05-18 De Beers Industrial Diamond Division (Proprietary) Limited Dispositif de polissage

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004823B2 (en) 2000-06-19 2006-02-28 Struers A/S Multi-zone grinding and/or polishing sheet
WO2001098027A1 (fr) * 2000-06-19 2001-12-27 Struers A/S Feuille de meulage et/ou de polissage a zones multiples
US6896593B2 (en) 2002-05-23 2005-05-24 Cabot Microelectronic Corporation Microporous polishing pads
US6899598B2 (en) 2002-05-23 2005-05-31 Cabot Microelectronics Corporation Microporous polishing pads
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US6935931B2 (en) 2002-05-23 2005-08-30 Cabot Microelectronics Corporation Microporous polishing pads
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6998166B2 (en) 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
WO2005000526A1 (fr) * 2003-06-17 2005-01-06 Cabot Microelectronics Corporation Tampon de polissage presentant une structure a pores orientes
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN112045556A (zh) * 2015-10-16 2020-12-08 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
CN112045556B (zh) * 2015-10-16 2022-06-28 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

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