WO1998026107A1 - Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same - Google Patents
Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same Download PDFInfo
- Publication number
- WO1998026107A1 WO1998026107A1 PCT/US1997/023414 US9723414W WO9826107A1 WO 1998026107 A1 WO1998026107 A1 WO 1998026107A1 US 9723414 W US9723414 W US 9723414W WO 9826107 A1 WO9826107 A1 WO 9826107A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sputtering target
- backing plate
- target assembly
- assembly
- diffusion
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
- C22F1/186—High-melting or refractory metals or alloys based thereon of zirconium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52706598A JP3485577B2 (en) | 1996-12-13 | 1997-12-04 | Diffusion bonded sputter target assembly having a precipitation hardened backing plate and method of making same |
US09/125,906 US6274015B1 (en) | 1996-12-13 | 1997-12-04 | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same |
KR1019980706274A KR100315076B1 (en) | 1996-12-13 | 1997-12-04 | Diffusion-bonded sputtering target assembly with precipitation hardened backplate and method of manufacturing the same |
EP97952525A EP0904423A4 (en) | 1996-12-13 | 1997-12-04 | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76662996A | 1996-12-13 | 1996-12-13 | |
US08/766,629 | 1996-12-13 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/125,906 A-371-Of-International US6274015B1 (en) | 1996-12-13 | 1997-12-04 | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same |
US09/902,071 Continuation US6451185B2 (en) | 1998-08-12 | 2001-07-09 | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998026107A1 true WO1998026107A1 (en) | 1998-06-18 |
Family
ID=25077032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/023414 WO1998026107A1 (en) | 1996-12-13 | 1997-12-04 | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0904423A4 (en) |
JP (1) | JP3485577B2 (en) |
KR (1) | KR100315076B1 (en) |
CN (1) | CN1211287A (en) |
TW (2) | TWI232887B (en) |
WO (1) | WO1998026107A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6071389A (en) * | 1998-08-21 | 2000-06-06 | Tosoh Smd, Inc. | Diffusion bonded sputter target assembly and method of making |
WO2001068937A2 (en) * | 2000-03-10 | 2001-09-20 | Honeywell International Inc. | Methods of bonding a target to a backing plate |
US6451185B2 (en) | 1998-08-12 | 2002-09-17 | Honeywell International Inc. | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same |
US6555250B2 (en) * | 1997-03-19 | 2003-04-29 | Honeywell International Inc. | Ni-plated target diffusion bonded to a backing plate and method of making same |
US6579431B1 (en) | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
US6619537B1 (en) | 2000-06-12 | 2003-09-16 | Tosoh Smd, Inc. | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers |
US6780794B2 (en) | 2000-01-20 | 2004-08-24 | Honeywell International Inc. | Methods of bonding physical vapor deposition target materials to backing plate materials |
US9546418B2 (en) | 2011-02-14 | 2017-01-17 | Tosoh Smd, Inc. | Diffusion-bonded sputter target assembly and method of manufacturing |
US10774408B2 (en) | 2014-01-24 | 2020-09-15 | Magna International Inc. | High strength aluminum stamping |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4519981B2 (en) * | 2000-03-15 | 2010-08-04 | アルバックマテリアル株式会社 | Solid phase diffusion bonding sputtering target assembly and manufacturing method thereof |
JP2006144119A (en) * | 2004-10-19 | 2006-06-08 | Kobelco Kaken:Kk | Layered product for sputtering aluminum-neodymium alloys |
CN101283114B (en) * | 2005-10-07 | 2012-04-18 | 国立大学法人东北大学 | Magnetron sputtering apparatus |
KR20160008655A (en) * | 2009-12-24 | 2016-01-22 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Gadolinium sputtering target and method for manufacturing the target |
JP2014051693A (en) * | 2012-09-05 | 2014-03-20 | Mitsubishi Materials Corp | Ti SPUTTERING TARGET HAVING Al BACKING PLATE BONDED THERETO AND MANUFACTURING METHOD OF THE SAME |
JP6271798B2 (en) * | 2016-07-13 | 2018-01-31 | 住友化学株式会社 | Manufacturing method of sputtering target |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4732312A (en) * | 1986-11-10 | 1988-03-22 | Grumman Aerospace Corporation | Method for diffusion bonding of alloys having low solubility oxides |
US5032468A (en) * | 1988-11-25 | 1991-07-16 | Vereinigte Aluminium Werke | Composite aluminum plate and target for physical coating processes produced therefrom and methods for producing same |
EP0590904A1 (en) * | 1992-09-29 | 1994-04-06 | Japan Energy Corporation | Diffusion-bonded sputtering target assembly and method of manufacturing the same |
JPH06158296A (en) * | 1992-11-24 | 1994-06-07 | Japan Energy Corp | Diffusion-bonded sputtering target assembly and its production |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5342496A (en) * | 1993-05-18 | 1994-08-30 | Tosoh Smd, Inc. | Method of welding sputtering target/backing plate assemblies |
-
1997
- 1997-12-04 KR KR1019980706274A patent/KR100315076B1/en not_active IP Right Cessation
- 1997-12-04 JP JP52706598A patent/JP3485577B2/en not_active Expired - Fee Related
- 1997-12-04 CN CN97192237A patent/CN1211287A/en active Pending
- 1997-12-04 WO PCT/US1997/023414 patent/WO1998026107A1/en not_active Application Discontinuation
- 1997-12-04 EP EP97952525A patent/EP0904423A4/en not_active Withdrawn
- 1997-12-12 TW TW091105167A patent/TWI232887B/en not_active IP Right Cessation
- 1997-12-12 TW TW086118776A patent/TW490499B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4732312A (en) * | 1986-11-10 | 1988-03-22 | Grumman Aerospace Corporation | Method for diffusion bonding of alloys having low solubility oxides |
US5032468A (en) * | 1988-11-25 | 1991-07-16 | Vereinigte Aluminium Werke | Composite aluminum plate and target for physical coating processes produced therefrom and methods for producing same |
EP0590904A1 (en) * | 1992-09-29 | 1994-04-06 | Japan Energy Corporation | Diffusion-bonded sputtering target assembly and method of manufacturing the same |
JPH06158296A (en) * | 1992-11-24 | 1994-06-07 | Japan Energy Corp | Diffusion-bonded sputtering target assembly and its production |
Non-Patent Citations (1)
Title |
---|
See also references of EP0904423A4 * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6555250B2 (en) * | 1997-03-19 | 2003-04-29 | Honeywell International Inc. | Ni-plated target diffusion bonded to a backing plate and method of making same |
US6579431B1 (en) | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
US6451185B2 (en) | 1998-08-12 | 2002-09-17 | Honeywell International Inc. | Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same |
US6071389A (en) * | 1998-08-21 | 2000-06-06 | Tosoh Smd, Inc. | Diffusion bonded sputter target assembly and method of making |
US6797362B2 (en) | 2000-01-20 | 2004-09-28 | Honeywell International Inc. | Physical vapor deposition target constructions |
US6780794B2 (en) | 2000-01-20 | 2004-08-24 | Honeywell International Inc. | Methods of bonding physical vapor deposition target materials to backing plate materials |
WO2001068937A3 (en) * | 2000-03-10 | 2002-04-04 | Honeywell Int Inc | Methods of bonding a target to a backing plate |
US6698647B1 (en) * | 2000-03-10 | 2004-03-02 | Honeywell International Inc. | Aluminum-comprising target/backing plate structures |
WO2001068937A2 (en) * | 2000-03-10 | 2001-09-20 | Honeywell International Inc. | Methods of bonding a target to a backing plate |
US6840431B1 (en) | 2000-03-10 | 2005-01-11 | Honeywell International Inc. | Methods of bonding two aluminum-comprising masses to one another |
EP1672092A1 (en) * | 2000-03-10 | 2006-06-21 | Honeywell International, Inc. | Method of bonding a first aluminium comprising mass to a second aluminium comprising mass and target/backing plate structure. |
US6619537B1 (en) | 2000-06-12 | 2003-09-16 | Tosoh Smd, Inc. | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers |
US9546418B2 (en) | 2011-02-14 | 2017-01-17 | Tosoh Smd, Inc. | Diffusion-bonded sputter target assembly and method of manufacturing |
US10774408B2 (en) | 2014-01-24 | 2020-09-15 | Magna International Inc. | High strength aluminum stamping |
Also Published As
Publication number | Publication date |
---|---|
KR100315076B1 (en) | 2002-02-28 |
EP0904423A4 (en) | 1999-09-08 |
JP3485577B2 (en) | 2004-01-13 |
KR19990082538A (en) | 1999-11-25 |
TW490499B (en) | 2002-06-11 |
JPH11504391A (en) | 1999-04-20 |
CN1211287A (en) | 1999-03-17 |
EP0904423A1 (en) | 1999-03-31 |
TWI232887B (en) | 2005-05-21 |
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