EP0904423A4 - Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same - Google Patents

Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same

Info

Publication number
EP0904423A4
EP0904423A4 EP97952525A EP97952525A EP0904423A4 EP 0904423 A4 EP0904423 A4 EP 0904423A4 EP 97952525 A EP97952525 A EP 97952525A EP 97952525 A EP97952525 A EP 97952525A EP 0904423 A4 EP0904423 A4 EP 0904423A4
Authority
EP
European Patent Office
Prior art keywords
backing plate
sputtering target
making same
target assembly
diffusion bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97952525A
Other languages
German (de)
French (fr)
Other versions
EP0904423A1 (en
Inventor
Anthony F Beier
Janine K Kardokus
Susan D Strothers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson Matthey Electronics Inc
Original Assignee
Johnson Matthey Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Electronics Inc filed Critical Johnson Matthey Electronics Inc
Publication of EP0904423A1 publication Critical patent/EP0904423A1/en
Publication of EP0904423A4 publication Critical patent/EP0904423A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18—High-melting or refractory metals or alloys based thereon
    • C22F1/186—High-melting or refractory metals or alloys based thereon of zirconium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
EP97952525A 1996-12-13 1997-12-04 Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same Withdrawn EP0904423A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US766629 1985-08-19
US76662996A 1996-12-13 1996-12-13
PCT/US1997/023414 WO1998026107A1 (en) 1996-12-13 1997-12-04 Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same

Publications (2)

Publication Number Publication Date
EP0904423A1 EP0904423A1 (en) 1999-03-31
EP0904423A4 true EP0904423A4 (en) 1999-09-08

Family

ID=25077032

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97952525A Withdrawn EP0904423A4 (en) 1996-12-13 1997-12-04 Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same

Country Status (6)

Country Link
EP (1) EP0904423A4 (en)
JP (1) JP3485577B2 (en)
KR (1) KR100315076B1 (en)
CN (1) CN1211287A (en)
TW (2) TWI232887B (en)
WO (1) WO1998026107A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010005546A (en) * 1997-03-19 2001-01-15 존슨매테이일렉트로닉스, 인코퍼레이티드 Ni-Plated Target Diffusion Bonded To A Backing Plate And Method Of Making Same
US6579431B1 (en) 1998-01-14 2003-06-17 Tosoh Smd, Inc. Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers
US6451185B2 (en) 1998-08-12 2002-09-17 Honeywell International Inc. Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
US6071389A (en) * 1998-08-21 2000-06-06 Tosoh Smd, Inc. Diffusion bonded sputter target assembly and method of making
US6780794B2 (en) 2000-01-20 2004-08-24 Honeywell International Inc. Methods of bonding physical vapor deposition target materials to backing plate materials
US6698647B1 (en) * 2000-03-10 2004-03-02 Honeywell International Inc. Aluminum-comprising target/backing plate structures
JP4519981B2 (en) * 2000-03-15 2010-08-04 アルバックマテリアル株式会社 Solid phase diffusion bonding sputtering target assembly and manufacturing method thereof
US6619537B1 (en) 2000-06-12 2003-09-16 Tosoh Smd, Inc. Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers
JP2006144119A (en) * 2004-10-19 2006-06-08 Kobelco Kaken:Kk Layered product for sputtering aluminum-neodymium alloys
JP5147000B2 (en) * 2005-10-07 2013-02-20 国立大学法人東北大学 Magnetron sputtering equipment
JP5175978B2 (en) * 2009-12-24 2013-04-03 Ｊｘ日鉱日石金属株式会社 Gadolinium sputtering target and method of manufacturing the same
JP6051492B2 (en) 2011-02-14 2016-12-27 トーソー エスエムディー，インク． Diffusion bonding sputtering target assembly manufacturing method
JP2014051693A (en) * 2012-09-05 2014-03-20 Mitsubishi Materials Corp Ti SPUTTERING TARGET HAVING Al BACKING PLATE BONDED THERETO AND MANUFACTURING METHOD OF THE SAME
WO2015112799A1 (en) 2014-01-24 2015-07-30 Magna International Inc. High strength aluminum stamping
JP6271798B2 (en) * 2016-07-13 2018-01-31 住友化学株式会社 Manufacturing method of sputtering target

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342496A (en) * 1993-05-18 1994-08-30 Tosoh Smd, Inc. Method of welding sputtering target/backing plate assemblies

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4732312A (en) * 1986-11-10 1988-03-22 Grumman Aerospace Corporation Method for diffusion bonding of alloys having low solubility oxides
DE3839775C2 (en) * 1988-11-25 1998-12-24 Vaw Ver Aluminium Werke Ag Cathode sputtering target and process for its manufacture
JPH06158296A (en) * 1992-11-24 1994-06-07 Japan Energy Corp Diffusion-bonded sputtering target assembly and its production
TW234767B (en) * 1992-09-29 1994-11-21 Nippon En Kk

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342496A (en) * 1993-05-18 1994-08-30 Tosoh Smd, Inc. Method of welding sputtering target/backing plate assemblies

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9826107A1 *

Also Published As

Publication number Publication date
JPH11504391A (en) 1999-04-20
TW490499B (en) 2002-06-11
TWI232887B (en) 2005-05-21
KR100315076B1 (en) 2002-02-28
EP0904423A1 (en) 1999-03-31
JP3485577B2 (en) 2004-01-13
KR19990082538A (en) 1999-11-25
CN1211287A (en) 1999-03-17
WO1998026107A1 (en) 1998-06-18

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20060703