WO1998023697A1 - Composition et procede de polissage de disques durs - Google Patents

Composition et procede de polissage de disques durs Download PDF

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Publication number
WO1998023697A1
WO1998023697A1 PCT/US1997/021730 US9721730W WO9823697A1 WO 1998023697 A1 WO1998023697 A1 WO 1998023697A1 US 9721730 W US9721730 W US 9721730W WO 9823697 A1 WO9823697 A1 WO 9823697A1
Authority
WO
WIPO (PCT)
Prior art keywords
dispersion
chemical mechanical
mechanical polishing
weight percent
polishing slurry
Prior art date
Application number
PCT/US1997/021730
Other languages
English (en)
Inventor
Christopher C. Streinz
Matthew Neville
Steven K. Grumbine
Brian L. Mueller
Original Assignee
Cabot Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/753,482 external-priority patent/US5958288A/en
Application filed by Cabot Corporation filed Critical Cabot Corporation
Priority to AU54608/98A priority Critical patent/AU5460898A/en
Publication of WO1998023697A1 publication Critical patent/WO1998023697A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Cette invention concerne un procédé de polissage de disques durs d'ordinateurs qui consiste à amener au moins une surface du disque dur en contact avec un tampon de polissage et à appliquer une dispersion sur le disque dur de façon à obtenir un disque dur poli possédant une rugosité rms inférieure ou égale à 1,4 nm environ. L'invention se rapporte également à une dispersion et à une pâte de polissage destinées au polissage des disques durs.
PCT/US1997/021730 1996-11-26 1997-11-21 Composition et procede de polissage de disques durs WO1998023697A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU54608/98A AU5460898A (en) 1996-11-26 1997-11-21 Composition and method for polishing rigid disks

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/753,482 1996-11-26
US08/753,482 US5958288A (en) 1996-11-26 1996-11-26 Composition and slurry useful for metal CMP
US08/844,195 US6015506A (en) 1996-11-26 1997-04-18 Composition and method for polishing rigid disks
US08/844,195 1997-04-18

Publications (1)

Publication Number Publication Date
WO1998023697A1 true WO1998023697A1 (fr) 1998-06-04

Family

ID=27115754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/021730 WO1998023697A1 (fr) 1996-11-26 1997-11-21 Composition et procede de polissage de disques durs

Country Status (3)

Country Link
AU (1) AU5460898A (fr)
TW (1) TW442364B (fr)
WO (1) WO1998023697A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162268A (en) * 1999-05-03 2000-12-19 Praxair S. T. Technology, Inc. Polishing slurry
EP1069168A1 (fr) * 1999-07-16 2001-01-17 Eternal Chemical Co., Ltd. Composition abrasive chimio-mécanique pour le traitement de semi-conducteurs
US6261476B1 (en) 2000-03-21 2001-07-17 Praxair S. T. Technology, Inc. Hybrid polishing slurry
EP1118647A1 (fr) * 2000-01-18 2001-07-25 Praxair S.T. Technology, Inc. Boue de polissage
US6299795B1 (en) 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
SG94338A1 (en) * 1999-09-20 2003-02-18 Eternal Chemical Co Ltd Chemical mechanical abrasive composition for use in semiconductor processing
WO2003020839A1 (fr) * 2001-09-03 2003-03-13 Showa Denko K.K. Composition de polissage
US6604987B1 (en) 2002-06-06 2003-08-12 Cabot Microelectronics Corporation CMP compositions containing silver salts
GB2354769B (en) * 1999-09-28 2004-04-14 Fujimi Inc Polishing composition and method for producing a memory hard disk
WO2004111145A1 (fr) * 2003-06-13 2004-12-23 Showa Denko K.K. Composition de polissage et procede de polissage
US8013024B2 (en) 2007-06-29 2011-09-06 Deborah D. L. Chung High-performance interface materials for improving thermal contacts

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113001418B (zh) * 2021-01-28 2024-01-26 广东朗旗新材料科技有限公司 超硬磨料工具的陶瓷结合剂和超硬磨料工具及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63274782A (ja) * 1987-05-02 1988-11-11 Mishima Kosan Co Ltd ステンレス鋼のラッピング液
GB2247892A (en) * 1990-08-08 1992-03-18 Uyemura & Co Limited C Abrasive composition for scratch-free finish buffing
EP0708160A2 (fr) * 1994-10-06 1996-04-24 Cabot Corporation Suspension pour le polissage mécano-chimique de couches métalliques
WO1996016436A1 (fr) * 1994-11-18 1996-05-30 Advanced Micro Devices, Inc. Procede de fabrication d'une suspension chimio-mecanique destinee au polissage et la suspension elle-meme

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63274782A (ja) * 1987-05-02 1988-11-11 Mishima Kosan Co Ltd ステンレス鋼のラッピング液
GB2247892A (en) * 1990-08-08 1992-03-18 Uyemura & Co Limited C Abrasive composition for scratch-free finish buffing
EP0708160A2 (fr) * 1994-10-06 1996-04-24 Cabot Corporation Suspension pour le polissage mécano-chimique de couches métalliques
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
WO1996016436A1 (fr) * 1994-11-18 1996-05-30 Advanced Micro Devices, Inc. Procede de fabrication d'une suspension chimio-mecanique destinee au polissage et la suspension elle-meme

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 095 (C - 573) 6 March 1989 (1989-03-06) *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162268A (en) * 1999-05-03 2000-12-19 Praxair S. T. Technology, Inc. Polishing slurry
EP1069168A1 (fr) * 1999-07-16 2001-01-17 Eternal Chemical Co., Ltd. Composition abrasive chimio-mécanique pour le traitement de semi-conducteurs
SG94338A1 (en) * 1999-09-20 2003-02-18 Eternal Chemical Co Ltd Chemical mechanical abrasive composition for use in semiconductor processing
GB2354769B (en) * 1999-09-28 2004-04-14 Fujimi Inc Polishing composition and method for producing a memory hard disk
US6491837B1 (en) 2000-01-18 2002-12-10 Praxair S.T. Technology, Inc. Polishing slurry
US6299795B1 (en) 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
EP1118647A1 (fr) * 2000-01-18 2001-07-25 Praxair S.T. Technology, Inc. Boue de polissage
EP1136534A1 (fr) * 2000-03-21 2001-09-26 Praxair S.T. Technology, Inc. Boue de polissage hybride
US6261476B1 (en) 2000-03-21 2001-07-17 Praxair S. T. Technology, Inc. Hybrid polishing slurry
WO2003020839A1 (fr) * 2001-09-03 2003-03-13 Showa Denko K.K. Composition de polissage
US6604987B1 (en) 2002-06-06 2003-08-12 Cabot Microelectronics Corporation CMP compositions containing silver salts
WO2004111145A1 (fr) * 2003-06-13 2004-12-23 Showa Denko K.K. Composition de polissage et procede de polissage
US8013024B2 (en) 2007-06-29 2011-09-06 Deborah D. L. Chung High-performance interface materials for improving thermal contacts

Also Published As

Publication number Publication date
TW442364B (en) 2001-06-23
AU5460898A (en) 1998-06-22

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