WO1998021780A3 - A connection between two contacts and a process for producing such a connection - Google Patents

A connection between two contacts and a process for producing such a connection Download PDF

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Publication number
WO1998021780A3
WO1998021780A3 PCT/DE1997/002642 DE9702642W WO9821780A3 WO 1998021780 A3 WO1998021780 A3 WO 1998021780A3 DE 9702642 W DE9702642 W DE 9702642W WO 9821780 A3 WO9821780 A3 WO 9821780A3
Authority
WO
WIPO (PCT)
Prior art keywords
connection
producing
contacts
contact surfaces
case
Prior art date
Application number
PCT/DE1997/002642
Other languages
German (de)
French (fr)
Other versions
WO1998021780A2 (en
Inventor
Robert Hagen
Bernd Goller
Original Assignee
Siemens Ag
Robert Hagen
Bernd Goller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Robert Hagen, Bernd Goller filed Critical Siemens Ag
Publication of WO1998021780A2 publication Critical patent/WO1998021780A2/en
Publication of WO1998021780A3 publication Critical patent/WO1998021780A3/en

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L2224/858—Bonding techniques
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    • H01L2224/8581—Soldering or alloying involving forming an intermetallic compound at the bonding interface
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    • H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

This invention concerns a process for producing a bonded wire connection between two contact surfaces (2) wherein the connecting wire (5) in each case is connected by means of two auxiliary connections (41, 42) applied to the contact surfaces (2).
PCT/DE1997/002642 1996-11-11 1997-11-11 A connection between two contacts and a process for producing such a connection WO1998021780A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19646431 1996-11-11
DE19646431.5 1996-11-11

Publications (2)

Publication Number Publication Date
WO1998021780A2 WO1998021780A2 (en) 1998-05-22
WO1998021780A3 true WO1998021780A3 (en) 1998-06-25

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015541A (en) 1999-06-28 2001-01-19 Sumitomo Electric Ind Ltd Semiconductor device and its manufacture
JP2004519860A (en) 2001-03-23 2004-07-02 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Chip module with low loop height adhesive wiring connection
EP1367644A1 (en) * 2002-05-29 2003-12-03 STMicroelectronics S.r.l. Semiconductor electronic device and method of manufacturing thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041236A (en) * 1983-08-17 1985-03-04 Nec Corp Connecting method of electronic part
JPH01293626A (en) * 1988-05-23 1989-11-27 Ricoh Co Ltd Wire bonding method in flexible wiring board
EP0397426A2 (en) * 1989-05-09 1990-11-14 Citizen Watch Co., Ltd. IC packaging structure and packaging method
JPH04294552A (en) * 1991-03-25 1992-10-19 Matsushita Electron Corp Wire-bonding method
WO1994022166A1 (en) * 1993-03-19 1994-09-29 National Semiconductor Corporation A method of and arrangement for bond wire connecting together certain integrated circuit components
WO1997012394A1 (en) * 1995-09-26 1997-04-03 Siemens Aktiengesellschaft Method of electrically connecting a semiconductor chip to at least one contact surface

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041236A (en) * 1983-08-17 1985-03-04 Nec Corp Connecting method of electronic part
JPH01293626A (en) * 1988-05-23 1989-11-27 Ricoh Co Ltd Wire bonding method in flexible wiring board
EP0397426A2 (en) * 1989-05-09 1990-11-14 Citizen Watch Co., Ltd. IC packaging structure and packaging method
JPH04294552A (en) * 1991-03-25 1992-10-19 Matsushita Electron Corp Wire-bonding method
WO1994022166A1 (en) * 1993-03-19 1994-09-29 National Semiconductor Corporation A method of and arrangement for bond wire connecting together certain integrated circuit components
WO1997012394A1 (en) * 1995-09-26 1997-04-03 Siemens Aktiengesellschaft Method of electrically connecting a semiconductor chip to at least one contact surface

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 165 (E - 327) 10 July 1985 (1985-07-10) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 082 (E - 0889) 15 February 1990 (1990-02-15) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 110 (E - 1329) 8 March 1993 (1993-03-08) *

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