WO1997037522A1 - Device for fitting a component carrier with an electric component - Google Patents

Device for fitting a component carrier with an electric component Download PDF

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Publication number
WO1997037522A1
WO1997037522A1 PCT/DE1997/000626 DE9700626W WO9737522A1 WO 1997037522 A1 WO1997037522 A1 WO 1997037522A1 DE 9700626 W DE9700626 W DE 9700626W WO 9737522 A1 WO9737522 A1 WO 9737522A1
Authority
WO
WIPO (PCT)
Prior art keywords
suction pipette
placement device
component
placement
suction
Prior art date
Application number
PCT/DE1997/000626
Other languages
German (de)
French (fr)
Inventor
Rainer DÜBEL
Ernst Karpfinger
Gerhard Jonke
Johann Melf
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to EP97920552A priority Critical patent/EP0890298A1/en
Priority to JP9534809A priority patent/JP2000507743A/en
Publication of WO1997037522A1 publication Critical patent/WO1997037522A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Definitions

  • Fitting device for placing an electrical component on a component carrier
  • the invention relates to placement devices for placing an electrical component on a carrier for the components with at least one suction pipette that can be lowered toward the carrier.
  • the object of the invention is to accelerate the placement process and to reduce the mechanical load on the device and the components.
  • the tactile sensor makes it possible to directly monitor the placement process with short transmission paths. Reaching the circuit board is signaled without any significant delay and the drive device is stopped. However, this requires a small overtravel, which is compensated for by the interposed telescopic suspension. This can work with a spring tension that limits the placement force to a harmless value. With such a placement device, the component can be placed on the printed circuit board at a constant high speed without it becoming too tight high mechanical stress. This makes it possible to shorten the placement time considerably and to increase the placement performance of the device accordingly.
  • the unsprung masses are reduced to a minimum, whereby the lowering speed can be increased even more.
  • the suspension is integrated in the pipette so that it itself serves as a sensor. This has the advantage that no additional disruptive parts can act on the differently designed components.
  • optical scanning according to claims 3 and 4 can be made very sensitive, so that the brake signals can be triggered after a very short spring travel.
  • the switching travel of the signal ring is 0.1 mm.
  • the drive device After sending the brake signal, the drive device runs on e.g. 0.2 to 0.3 mm, so that the movement of the unsprung part of the pipette can be completed after a distance of 0.3 to 0.4 mm. With such short spring travel, the mechanical load on the telescopic guide is reduced, so that the guide can be made very compact. This results in low unsprung masses and correspondingly low mass forces when the component is placed on the carrier.
  • the development according to claim 5 ensures that the part of the light beam which is aimed next to the signal ring is not thrown back to the reflection light barrier, so that when the signal ring is deflected into the area of the sensor, correspondingly marked differences in intensity at the receiving diode result.
  • the light barrier is mechanically separated from the suction pipette. It is assigned to the drive device and follows its feed movement. When the pipette tip is deflected into the suction pipette, there is a relative movement between the signal ring and the sensor, the input signal of which is modulated accordingly.
  • a particular advantage is that only one sensor is required for 12 suction pipettes of a turret, for example.
  • FIG. 1 shows a section through a turret head 1 of an assembly device (not shown) with an electrical component before it is placed on a printed circuit board
  • FIG. 2 shows part of the turret head according to FIG. 1 when the component is placed on it
  • Figure 3 shows the parts of Figure 2 in an enlarged view shortly after placing the component.
  • a turret 1 can be rotated step by step around a central axis according to the circular arrow shown. It is provided with star-shaped, radially displaceable suction pipettes 2, at the tip 3 of which an electrical component 4 can be held temporarily by means of a vacuum from a suction hose 10. In each case one of the suction pipettes 2 is in a loading position above a carrier 5 for the components 4, for example a printed circuit board.
  • the suction pipette 2 is gripped by a driver 6 of a drive tappet 7 of a drive device (not shown in more detail).
  • the drive plunger 7 can be displaced in the direction of the carrier 5 in accordance with the arrow direction indicated, this movement being transmitted to the suction pipette 2 and the component 4 being placed on the carrier 5.
  • the tip 3 of the suction pipette 2 is spring-mounted in the mounting direction and connected to a signal ring 8 which follows the relative movement between the tip 3 and the suction pipette 2.
  • an optical sensor 9 is attached to the driver 6, which is designed as an RP reflection light barrier. This emits a light beam in the direction of the signal ring 8, which is only partially reflected by the signal ring 8.
  • the other part of the light beam strikes an inclined conical surface 12 of the suction pipette 2 and is deflected by it so strongly that it is not reflected back to the receiving diode of the sensor 9.
  • FIG. 2 shows part of the turret 1 when the component 4 is placed on the carrier 5, the tip 3 not yet being compressed into the rest of the suction pipette 2.
  • the light beam of the sensor 9 indicated by the arrow is still directed unchanged at the upper edge of the signal ring 8.
  • FIG. 3 shows the end position of the suction pipette 2 with the component 4 above the carrier 5.
  • the drive plunger 7 is lowered slightly further toward the carrier 5 with the suction pipette 2 compared to the position according to FIG. 2, the tip 3 having been pressed accordingly into the remaining part of the suction pipette 2.
  • the force acting on the component 4 is limited by a compression spring, not shown, which presses the tip 3 in the direction of the carrier 5.
  • the signal ring 8 is connected to the tip 3 such that it follows the spring movement. It is accordingly raised here in relation to the remaining suction pipette 2 and the sensor 9.
  • the light beam now strikes the white, well reflecting surface of the signal ring 8, for example, and is largely reflected in a receiving diode of the sensor 9.
  • the intensity of the reflected radiation is increased so much that a signal for braking the drive device can be emitted by the sensor 9.
  • the lowering movement has come to a standstill.
  • the vacuum of the suction pipette can now be switched off, for example by means of a valve II (FIG. 1), as a result of which the component 4 detaches from the tip 3.
  • the drive device with the drive plunger 7 can then lift the suction pipette 2 again and pull it back into its starting position for receiving a new component.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)

Abstract

A suction pipette (2) of the fitting device can be lowered together with a suction held component (4) onto a printed circuit board (e.g. 5) by means of a drive. The suction pipette (2) has a spring-mounted point (3) whose deflection when it contacts the printed circuit board triggers a switching off signal for the drive and compensates for the run-on displacement of the drive. Components (4) may thus be quickly and reliably set on the printed circuit board (e.g. 5).

Description

Beschreibungdescription
Bestückeinrichtung zum Aufsetzen eines elektrischen Bauele¬ ments auf einen BauelementeträgerFitting device for placing an electrical component on a component carrier
Die Erfindung bezieht sich auf Bestückeinrichtung zum Aufset¬ zen eines elektrischen Bauelements auf einen Träger für die Bauelemente mit zumindest einer zum Träger hin absenkbaren Saugpipette.The invention relates to placement devices for placing an electrical component on a carrier for the components with at least one suction pipette that can be lowered toward the carrier.
Derartige universelle Bestückeinrichtungen müssen in der Lage sein, unterschiedliche Leiterplattendicken, Abweichungen in der Leiterplattengeometrie sowie unterschiedliche Dicken der Bauelemente auszugleichen. Durch die DE 31 53 389 C2 ist es bekannt, die Stromaufnahme der Antriebseinrichtung zu überwa¬ chen und nach Erreichen eines Schwellwertes die Absenkbewe¬ gung abzubrechen. Dabei sind die abzubremsenden Massen so hoch, daß starke Schläge nur durch eine verringerte Aufsetz- geschwindigkeit vermindert werden können, wodurch allerdings die Stückleistung der Bestückeinrichtung begrenzt bleibt.Such universal placement devices must be able to compensate for different circuit board thicknesses, deviations in the circuit board geometry and different component thicknesses. From DE 31 53 389 C2 it is known to monitor the current consumption of the drive device and to abort the lowering movement after a threshold value has been reached. The masses to be braked are so high that strong impacts can only be reduced by a reduced placement speed, which however limits the piece output of the placement device.
Der Erfindung liegt die Aufgabe zugrunde, den Aufsetzvorgang zu beschleunigen und die mechanische Belastung der Einrich¬ tung sowie der Bauelemente zu verringern.The object of the invention is to accelerate the placement process and to reduce the mechanical load on the device and the components.
Diese Aufgabe wird durch die Erfindung gemäß Anspruch 1 ge¬ löst. Durch den taktilen Sensor ist es möglich, den Aufsetz¬ vorgang bei kurzen Übertragungswegen unmittelbar zu überwa¬ chen. Das Erreichen der Leiterplatte wird ohne nennenswerte Verzögerung signalisiert und die Antriebseinrichtung ge¬ stoppt. Allerdings benötigt diese eine geringe Nachlauf¬ strecke, die durch die zwischengeschaltete Teleskopfederung ausgeglichen wird. Diese kann mit einer Federspannung arbei¬ ten, die die Aufsetzkraft auf einen unschädlichen Wert be- grenzt. Bei einer derartigen Bestückeinrichtung kann das Bau¬ element mit einer gleichbleibend hohen Geschwindigkeit auf die Leiterplatte aufgesetzt werden, ohne daß es zu einer zu hohen mechanischen Belastung kommt. Dadurch ist es möglich, die Bestückzeit erheblich zu verkürzen und die Bestücklei- stung der Einrichtung entsprechend zu erhöhen.This object is achieved by the invention according to claim 1. The tactile sensor makes it possible to directly monitor the placement process with short transmission paths. Reaching the circuit board is signaled without any significant delay and the drive device is stopped. However, this requires a small overtravel, which is compensated for by the interposed telescopic suspension. This can work with a spring tension that limits the placement force to a harmless value. With such a placement device, the component can be placed on the printed circuit board at a constant high speed without it becoming too tight high mechanical stress. This makes it possible to shorten the placement time considerably and to increase the placement performance of the device accordingly.
Vorteilhafte Weiterbildungen der Erfindung sind in den An¬ sprüchen 2 bis 6 gekennzeichnet:Advantageous developments of the invention are characterized in claims 2 to 6:
Durch die Weiterbildung nach Anspruch 2 werden die ungefeder¬ ten Massen auf ein Minimum reduziert, wodurch die Absenkge- schwindigkeit noch mehr gesteigert werden kann. Durch die Verknüpfung der Federung mit dem Sensor ist dieser in die Saugpipette integriert, so daß diese selbst als Sensor dient. Dies hat den Vorteil, daß keine zusätzlichen störenden Teile auf die unterschiedlich ausgebildeten Bauelemente einwirken können.Through the development according to claim 2, the unsprung masses are reduced to a minimum, whereby the lowering speed can be increased even more. By linking the suspension with the sensor, it is integrated in the pipette so that it itself serves as a sensor. This has the advantage that no additional disruptive parts can act on the differently designed components.
Die optische Abtastung nach den Ansprüchen 3 und 4 kann sehr feinfühlig ausgebildet werden, so daß bereits nach einem sehr kurzen Federweg das Bremssignale ausgelöst werden kann. Bei- spielsweise beträgt der Schaltweg des Signalrings 0,1 mm.The optical scanning according to claims 3 and 4 can be made very sensitive, so that the brake signals can be triggered after a very short spring travel. For example, the switching travel of the signal ring is 0.1 mm.
Nach dem Absenden des Bremssignals kommt es zu einem Nachlauf der Antriebseinrichtung von z.B. 0,2 bis 0,3 mm, so daß die Bewegung des ungefederten Teils der Saugpipette bereits nach einer Strecke von 0,3 bis 0,4 mm beendet sein kann. Durch derartig kurze Federwege wird die mechanische Belastung der Teleskopführung verringert, so daß die Führung sehr kompakt ausgeführt werden kann. Dies ergibt geringe ungefederte Mas¬ sen und entsprechend geringe Massenkräfte beim Aufsetzen des Bauelements auf den Träger.After sending the brake signal, the drive device runs on e.g. 0.2 to 0.3 mm, so that the movement of the unsprung part of the pipette can be completed after a distance of 0.3 to 0.4 mm. With such short spring travel, the mechanical load on the telescopic guide is reduced, so that the guide can be made very compact. This results in low unsprung masses and correspondingly low mass forces when the component is placed on the carrier.
Durch die Weiterbildung nach Anspruch 5 wird erreicht, daß der neben den Signalring zielende Teil des Lichtstrahls nicht zur Reflexionslichtschranke zurückgeworfen wird, so daß sich beim Einfedern des Signalrings in den Bereich des Sensors entsprechend deutliche Intensitätsunterschiede an der Emp¬ fangsdiode ergeben. Durch die Weiterbildung nach Anspruch 6 ist die Lichtschranke mechanisch von der Saugpipette getrennt. Sie ist der An- triebsemrichtung zugeordnet und folgt deren Vorschubbewe¬ gung Beim Einfedern der Pipettenspitze in die Saugpipette kommt es zu einer Relativbewegung zwischen dem Signalring und dem Sensor, dessen Eingangssignal dementsprechend moduliert wird. Ein besonderer Vorteil besteht darin, daß hier für z.B. 12 Saugpipetten eines Revolverkopfes nur ein einziger Sensor benötigt wird.The development according to claim 5 ensures that the part of the light beam which is aimed next to the signal ring is not thrown back to the reflection light barrier, so that when the signal ring is deflected into the area of the sensor, correspondingly marked differences in intensity at the receiving diode result. Through the development according to claim 6, the light barrier is mechanically separated from the suction pipette. It is assigned to the drive device and follows its feed movement. When the pipette tip is deflected into the suction pipette, there is a relative movement between the signal ring and the sensor, the input signal of which is modulated accordingly. A particular advantage is that only one sensor is required for 12 suction pipettes of a turret, for example.
Im folgenden wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert. Es zei¬ gen:The invention is explained in more detail below with reference to an embodiment shown in the drawing. It shows:
Figur 1 einen Schnitt durch einen Revolverkopf 1 einer nicht näher dargestellten Bestückeinrichtung mit einem elektrischen Bauelement vor dem Aufsetzen auf eine Leiterplatte, Figur 2 einen Teil des Revolverkopfes nach Figur 1 beim Auf- setzen des Bauelementes,1 shows a section through a turret head 1 of an assembly device (not shown) with an electrical component before it is placed on a printed circuit board, FIG. 2 shows part of the turret head according to FIG. 1 when the component is placed on it,
Figur 3 die Teile nach Figur 2 in vergrößerter Darstellung kurz nach dem Aufsetzen des Bauelementes .Figure 3 shows the parts of Figure 2 in an enlarged view shortly after placing the component.
Nach Figur 1 ist ein Revolverkopf 1 schrittweise um eine Mit- telachse gemäß dem dargestellten Rundpfeil drehbar. Er ist mit sternförmig verteilten, radial verschiebbaren Saugpipet¬ ten 2 versehen, an deren Spitze 3 jeweils ein elektrisches Bauelement 4 mittels Vakuum aus einem Saugschlauch 10 tempo¬ rär gehalten werden kann. Jeweils eine der Saugpipetten 2 be- findet sich in einer Bestückstellung über einem z.B. als Lei¬ terplatte ausgebildeten Träger 5 für die Bauelemente 4. Die Saugpipette 2 wird von einem Mitnehmer 6 eines Antriebsstö¬ ßels 7 einer nicht näher dargestellten Antriebseinrichtung erfaßt. Der Antriebstößel 7 ist gemäß der angegebenen Pfeil- richtung in die Richtung des Tragers 5 verschiebbar, wobei diese Bewegung auf die Saugpipette 2 übertragen wird und das Bauelement 4 auf den Träger 5 abgesetzt wird. Die Spitze 3 der Saugpipette 2 ist in der Aufsetzrichtung fe¬ dernd gelagert und mit einem Signalring 8 verbunden, der der relativen Bewegung zwischen der Spitze 3 und der Saugpipette 2 folgt. In der Höhe des oberen Randes des Signalringes 8 ist am Mitnehmer 6 ein optischer Sensor 9 befestigt, der als RP- flexionslichtschranke ausgebildet ist. Diese sendet einen Lichtstrahl in die Richtung deε Signalrings 8 aus, der vom Signalring 8 nur partiell reflektiert wird. Der andere Teil des Lichtstrahls trifft auf eine schräge Kegelfläche 12 der Saugpipette 2 und wird von dieser so stark abgelenkt, daß er nicht zur Empfangsdiode des Sensors 9 zurückgeworfen wird.According to FIG. 1, a turret 1 can be rotated step by step around a central axis according to the circular arrow shown. It is provided with star-shaped, radially displaceable suction pipettes 2, at the tip 3 of which an electrical component 4 can be held temporarily by means of a vacuum from a suction hose 10. In each case one of the suction pipettes 2 is in a loading position above a carrier 5 for the components 4, for example a printed circuit board. The suction pipette 2 is gripped by a driver 6 of a drive tappet 7 of a drive device (not shown in more detail). The drive plunger 7 can be displaced in the direction of the carrier 5 in accordance with the arrow direction indicated, this movement being transmitted to the suction pipette 2 and the component 4 being placed on the carrier 5. The tip 3 of the suction pipette 2 is spring-mounted in the mounting direction and connected to a signal ring 8 which follows the relative movement between the tip 3 and the suction pipette 2. At the height of the upper edge of the signal ring 8, an optical sensor 9 is attached to the driver 6, which is designed as an RP reflection light barrier. This emits a light beam in the direction of the signal ring 8, which is only partially reflected by the signal ring 8. The other part of the light beam strikes an inclined conical surface 12 of the suction pipette 2 and is deflected by it so strongly that it is not reflected back to the receiving diode of the sensor 9.
In Figur 2 ist ein Teil des Revolverkopfes 1 im Moment des Aufsetzens des Bauelementes 4 auf den Träger 5 dargestellt, wobei die Spitze 3 noch nicht in die restliche Saugpipette 2 eingefedert ist. Der durch den Pfeil angedeutete Lichtstrahl des Sensors 9 ist hier noch unverändert auf den oberen Rand des Signalrings 8 gerichtet.FIG. 2 shows part of the turret 1 when the component 4 is placed on the carrier 5, the tip 3 not yet being compressed into the rest of the suction pipette 2. The light beam of the sensor 9 indicated by the arrow is still directed unchanged at the upper edge of the signal ring 8.
In Figur 3 ist die Endstellung der Saugpipette 2 mit dem Bau¬ element 4 über dem Träger 5 dargestellt. Der Antriebstößel 7 ist mit der Saugpipette 2 im Vergleich zur Stellung nach Fi¬ gur 2 geringfügig weiter zum Träger 5 hin abgesenkt, wobei die Spitze 3 entsprechend in den restlichen Teil der Saug¬ pipette 2 hineingedrückt worden ist . Dabei ist die auf das Bauelement 4 einwirkende Kraft durch eine nicht dargestellte Druckfeder begrenzt, die die Spitze 3 in die Richtung des Trägers 5 drückt.FIG. 3 shows the end position of the suction pipette 2 with the component 4 above the carrier 5. The drive plunger 7 is lowered slightly further toward the carrier 5 with the suction pipette 2 compared to the position according to FIG. 2, the tip 3 having been pressed accordingly into the remaining part of the suction pipette 2. The force acting on the component 4 is limited by a compression spring, not shown, which presses the tip 3 in the direction of the carrier 5.
Der Signalring 8 ist mit der Spitze 3 derart verbunden, daß er deren Federbewegung folgt. Er ist hier also entsprechend gegenüber der restlichen Saugpipette 2 und dem Sensor 9 ange¬ hoben. Der Lichtstrahl trifft nun voll auf die z.B. weiße, gut reflektierende Oberfläche des Signalrings 8 und wird zu einem hohen Anteil in eine Empfangsdiode des Sensors 9 re¬ flektiert. Bereits nach einem Federweg von z.B. 0, 1 mm wird die Intensität der reflektierten Strahlung so stark erhöht, daß vom Sensor 9 ein Signal zum Abbremsen der Antriebsein¬ richtung abgegeben werden kann. Nach weiteren 0,2 bis 0,3 mm ist dann die Absenkbewegung zum Stillstand gekommen. Das Va- kuum der Saugpipette kann nun z.B. mittels eines Ventils ll (Figur 1) abgeschaltet werden, wodurch sich das Bauelement 4 von der Spitze 3 löst. Danach kann die Antriebsvorrichtung mit dem Antriebsstößel 7 die Saugpipette 2 wieder anheben und in ihre Ausgangsstellung zur Aufnahme eines neuen Bauelements zurückziehen. The signal ring 8 is connected to the tip 3 such that it follows the spring movement. It is accordingly raised here in relation to the remaining suction pipette 2 and the sensor 9. The light beam now strikes the white, well reflecting surface of the signal ring 8, for example, and is largely reflected in a receiving diode of the sensor 9. Already after a spring travel of 0.1 mm, for example the intensity of the reflected radiation is increased so much that a signal for braking the drive device can be emitted by the sensor 9. After a further 0.2 to 0.3 mm, the lowering movement has come to a standstill. The vacuum of the suction pipette can now be switched off, for example by means of a valve II (FIG. 1), as a result of which the component 4 detaches from the tip 3. The drive device with the drive plunger 7 can then lift the suction pipette 2 again and pull it back into its starting position for receiving a new component.

Claims

Patentansprüche claims
1. Bestückeinrichtung zum Aufsetzen eines elektrischen Bau¬ elements (4) auf einen Träger (5) für die Bauelemente (4) mit zumindest einer zum Träger (5) hin absenkbaren Saugpipette (2), wobei die Bestückeinrichtung eine Antriebseinrichtung (z.B. 7) zum Absenken der Saugpipette (2) aufweist, wobei die Bestückeinrichtung eine Sensoreinrichtung (z.B. 9) aufweist, die das Aufsetzen des Bauelements (4) auf den Träger (5) de- tektiert und ein Abbremsen der Antriebseinrichtung (z.B.) auslöst, d a d u r c h g e k e n n z e i c h n e t , daß die Saugpipette (2) einen taktilen Sensor aufweist, der ein Steuersignal zum Beenden der Absenkbewegung erzeugt, daß zwischen der Antriebseinrichtung (z.B. 7) und der das1. placement device for placing an electrical component (4) on a carrier (5) for the components (4) with at least one suction pipette (2) which can be lowered towards the carrier (5), the placement device being a drive device (eg 7) for Lowering the suction pipette (2), the placement device having a sensor device (eg 9) which detects the placement of the component (4) on the carrier (5) and triggers braking of the drive device (eg), characterized in that the Suction pipette (2) has a tactile sensor which generates a control signal for ending the lowering movement, that between the drive device (for example 7) and that
Bauelement (9) haltenden Spitze (3) der Saugpipette (2) eine teleskopartige Federung vorgesehen ist.Component (9) holding tip (3) of the suction pipette (2) is provided a telescopic suspension.
2. Bestückeinrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Spitze (3) der Saugpipette (3) in der Absenkrichtung federnd auslenkbar gelagert ist und daß das Einfedern der Spitze (3) in die Saugpipette (2) das Steuersignal auslöst.2. Placement device according to claim 1, so that the tip (3) of the suction pipette (3) is resiliently deflectable in the lowering direction and that the deflection of the tip (3) into the suction pipette (2) triggers the control signal.
3. Bestückeinrichtung nach Anspruch 2, d a d u r c h g e k e n n z e i c h n e t , daß die Spitze (3) mit einem Signalstück, insbesondere einem Signalring (8) kinematisch gekoppelt ist, dessen Stellung von einem optischen Sensor (9) abgetastet wird.3. Placement device according to claim 2, so that the tip (3) is kinematically coupled to a signal piece, in particular a signal ring (8), the position of which is sensed by an optical sensor (9).
4. Bestückeinrichtung nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t , daß der optische Sensor (9) als Reflexionslichtschranke aus¬ gebildet ist, die auf einen Rand des Signalrings (8) gerich- tet ist. 4. placement device according to claim 3, characterized in that the optical sensor (9) is formed as a reflection light barrier, which is directed to an edge of the signal ring (8).
5. Bestückeinrichtung nach Anspruch 4, d a d u r c h g e k e n n z e i c h n e t , daß die Saugpipette (2) im Anschluß an den Rand des Signal- rings (8) einen schräg verlaufenden Abschnitt, insbesondere eine Kegelfläche 12 aufweist.5. Placement device according to claim 4, so that the suction pipette (2) has an inclined section, in particular a conical surface 12, following the edge of the signal ring (8).
6. Bestückeinrichtung nach Anspruch 3, 4 oder 5, d a d u r c h g e k e n n z e i c h n e t , daß eine Vielzahl der Saugpipetten (2) an einem schrittweise drehbaren Revolverkopf (l) der Bestückeinrichtung geführt ist, daß die Antriebseinrichtung einen Antriebsstößel (7) aufweist, der jeweils die in der Aufsetzstellung befindliche Saugpipette (2) erfaßt und zum Träger (5) für die Bauelemente (4) hin absenkt und nach dem Aufsetzen wieder zurückzieht und daß der optische Sensor (9) an dem Antriebsstößel (7) befe¬ stigt ist. 6. placement device according to claim 3, 4 or 5, characterized in that a plurality of the suction pipettes (2) on a gradually rotatable turret (l) of the placement device is guided in that the drive device has a drive plunger (7), each of which in the mounting position located suction pipette (2) is detected and lowered towards the support (5) for the components (4) and withdrawn again after the attachment and that the optical sensor (9) is attached to the drive plunger (7).
PCT/DE1997/000626 1996-03-28 1997-03-27 Device for fitting a component carrier with an electric component WO1997037522A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP97920552A EP0890298A1 (en) 1996-03-28 1997-03-27 Device for fitting a component carrier with an electric component
JP9534809A JP2000507743A (en) 1996-03-28 1997-03-27 Mounting device for mounting an electrical component on a carrier for the component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19612391 1996-03-28
DE19612391.7 1996-03-28

Publications (1)

Publication Number Publication Date
WO1997037522A1 true WO1997037522A1 (en) 1997-10-09

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ID=7789759

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000626 WO1997037522A1 (en) 1996-03-28 1997-03-27 Device for fitting a component carrier with an electric component

Country Status (3)

Country Link
EP (1) EP0890298A1 (en)
JP (1) JP2000507743A (en)
WO (1) WO1997037522A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0906010A2 (en) * 1997-09-30 1999-03-31 Siemens Aktiengesellschaft Apparatus for mounting of electrical components on component carriers
EP0997801A2 (en) * 1998-10-27 2000-05-03 Karl-Heinz Schmall Linear drive means for machining tools
US6250538B1 (en) 1999-04-30 2001-06-26 Siemens Aktiengesellschaft Method and apparatus for mounting electrical components that employs a compensation element
US6516514B1 (en) 1999-06-01 2003-02-11 Siemens Aktiengesellschaft Method for mounting components onto a substrate
US6973713B1 (en) 1999-04-30 2005-12-13 Siemens Aktiengesellschaft Apparatus and system for operating an automatic component mounting unit for mounting components onto a substrate of an electrical assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657470A (en) * 1984-11-15 1987-04-14 Westinghouse Electric Corp. Robotic end effector
US5420488A (en) * 1993-12-03 1995-05-30 Motorola, Inc. Vacuum nozzle having dynamically adjustable placement force

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657470A (en) * 1984-11-15 1987-04-14 Westinghouse Electric Corp. Robotic end effector
US5420488A (en) * 1993-12-03 1995-05-30 Motorola, Inc. Vacuum nozzle having dynamically adjustable placement force

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0906010A2 (en) * 1997-09-30 1999-03-31 Siemens Aktiengesellschaft Apparatus for mounting of electrical components on component carriers
EP0906010A3 (en) * 1997-09-30 2000-05-24 Siemens Aktiengesellschaft Apparatus for mounting of electrical components on component carriers
EP0997801A2 (en) * 1998-10-27 2000-05-03 Karl-Heinz Schmall Linear drive means for machining tools
EP0997801A3 (en) * 1998-10-27 2001-08-08 Karl-Heinz Schmall Linear drive means for machining tools
US6250538B1 (en) 1999-04-30 2001-06-26 Siemens Aktiengesellschaft Method and apparatus for mounting electrical components that employs a compensation element
US6973713B1 (en) 1999-04-30 2005-12-13 Siemens Aktiengesellschaft Apparatus and system for operating an automatic component mounting unit for mounting components onto a substrate of an electrical assembly
US6516514B1 (en) 1999-06-01 2003-02-11 Siemens Aktiengesellschaft Method for mounting components onto a substrate

Also Published As

Publication number Publication date
EP0890298A1 (en) 1999-01-13
JP2000507743A (en) 2000-06-20

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