WO1997025840A1 - Appareil electrique - Google Patents

Appareil electrique Download PDF

Info

Publication number
WO1997025840A1
WO1997025840A1 PCT/DE1996/002243 DE9602243W WO9725840A1 WO 1997025840 A1 WO1997025840 A1 WO 1997025840A1 DE 9602243 W DE9602243 W DE 9602243W WO 9725840 A1 WO9725840 A1 WO 9725840A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrical device
printed circuit
carrier plate
circuit boards
electrical
Prior art date
Application number
PCT/DE1996/002243
Other languages
German (de)
English (en)
Inventor
Reinhold Preissl
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO1997025840A1 publication Critical patent/WO1997025840A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Definitions

  • the invention relates to an electrical device with a circuit board arrangement according to the preamble of the main claim.
  • An electrical device is already known from DE 40 35 526 A1, in which a printed circuit board is glued to a metallic carrier plate as a substrate.
  • This printed circuit board is formed from two parts, which are connected to one another by means of flexible conductor tracks over a central region. The two areas are each held on different carrier plates, which are made of good heat-conducting material, so that even power components with a correspondingly high heat output can be accommodated on these circuit boards.
  • the electrical device of the type described at the outset is advantageous in the development according to the invention with the characterizing features of claim 1 in that, by using a versatile support plate for the printed circuit boards, in particular also plugs and connecting webs between several printed circuit boards can be molded out of the support plate .
  • the carrier plate can also have areas that represent cooling elements for power components or a ground connection to housing parts or the housing parts themselves.
  • Figure 2 shows a schematic diagram of the electrical device with a foldable circuit board arrangement. Description of the embodiment
  • printed circuit board arrangements 2 are glued or laminated onto a carrier plate 1.
  • the carrier plate 1 is made of a copper-tin alloy and is connected to a housing during final assembly.
  • the printed circuit board arrangements 2 consist of a base material 3 which is glued onto the carrier plate 1 via an insulating adhesive layer or film 4.
  • On the outside of the base material 3 there are conductor tracks 5 made of a copper layer which can be connected to electrical components (not shown here).
  • plug tongues 6 can be seen, which are formed out of the carrier plate 1 and with which a plug connection between connection points of the conductor tracks 5 and an outer plug part of the electrical device can be produced.
  • FIG. 2 shows a carrier board 1 which can be folded over in a central region 7 and to which circuit boards 2 which are visible from above are glued.
  • the carrier plate 1 also has regions 9 which function as printed circuit board connectors and regions 10 which form a mass part and regions 11 which constitute a cooling element.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un appareil électrique comportant un système de cartes de circuits, qui présente au moins une plaque support (1) métallique sur laquelle est stratifiée au moins une carte de circuits (2) servant de substrat. Afin de parvenir à une structure compacte avec une plaque support (1) à usages multiples, des lames Faston (6), des éléments de refroidissement (11) et des connexions électriques (9) peuvent être façonnés à partir de la plaque support (1) métallique.
PCT/DE1996/002243 1996-01-10 1996-11-22 Appareil electrique WO1997025840A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19600617.1 1996-01-10
DE1996100617 DE19600617A1 (de) 1996-01-10 1996-01-10 Elektrisches Gerät

Publications (1)

Publication Number Publication Date
WO1997025840A1 true WO1997025840A1 (fr) 1997-07-17

Family

ID=7782421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/002243 WO1997025840A1 (fr) 1996-01-10 1996-11-22 Appareil electrique

Country Status (2)

Country Link
DE (1) DE19600617A1 (fr)
WO (1) WO1997025840A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2176134C2 (ru) 1998-07-02 2001-11-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль и способ его изготовления
EP2425687A1 (fr) * 2009-04-30 2012-03-07 Idealec Agencement de barre omnibus

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058759A2 (fr) * 1981-02-25 1982-09-01 Siemens Aktiengesellschaft Appareil de contrôle fabriqué en construction modulaire
GB2165399A (en) * 1984-10-09 1986-04-09 Alps Electric Co Ltd Printed circuit substrate support structures
US4845313A (en) * 1985-07-22 1989-07-04 Tokyo Communication Equipment Co., Ltd. Metallic core wiring substrate
DE9109551U1 (de) * 1991-08-01 1991-09-19 Siemens AG, 8000 München Mehrlagige Leiterplatte
JPH03233999A (ja) * 1990-02-09 1991-10-17 Hitachi Ltd 電子装置の実装構造
DE4035526A1 (de) * 1990-11-08 1992-05-14 Bosch Gmbh Robert Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge, und verfahren zur herstellung
US5220491A (en) * 1990-04-09 1993-06-15 Hitachi, Ltd. High packing density module board and electronic device having such module board
EP0567814A1 (fr) * 1992-04-30 1993-11-03 SIEMENS COMPONENTS, Inc. Plaque à circuit imprimé pour monter des semi-conducteurs et autres composants électroniques

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058759A2 (fr) * 1981-02-25 1982-09-01 Siemens Aktiengesellschaft Appareil de contrôle fabriqué en construction modulaire
GB2165399A (en) * 1984-10-09 1986-04-09 Alps Electric Co Ltd Printed circuit substrate support structures
US4845313A (en) * 1985-07-22 1989-07-04 Tokyo Communication Equipment Co., Ltd. Metallic core wiring substrate
JPH03233999A (ja) * 1990-02-09 1991-10-17 Hitachi Ltd 電子装置の実装構造
US5220491A (en) * 1990-04-09 1993-06-15 Hitachi, Ltd. High packing density module board and electronic device having such module board
DE4035526A1 (de) * 1990-11-08 1992-05-14 Bosch Gmbh Robert Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge, und verfahren zur herstellung
DE9109551U1 (de) * 1991-08-01 1991-09-19 Siemens AG, 8000 München Mehrlagige Leiterplatte
EP0567814A1 (fr) * 1992-04-30 1993-11-03 SIEMENS COMPONENTS, Inc. Plaque à circuit imprimé pour monter des semi-conducteurs et autres composants électroniques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 16, no. 14 (E - 1154) 14 January 1992 (1992-01-14) *

Also Published As

Publication number Publication date
DE19600617A1 (de) 1997-07-17

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