WO1997009622A1 - Polyaxial acceleration sensor beam - Google Patents
Polyaxial acceleration sensor beam Download PDFInfo
- Publication number
- WO1997009622A1 WO1997009622A1 PCT/US1996/014367 US9614367W WO9709622A1 WO 1997009622 A1 WO1997009622 A1 WO 1997009622A1 US 9614367 W US9614367 W US 9614367W WO 9709622 A1 WO9709622 A1 WO 9709622A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ceramic
- polyaxial
- metal plate
- bending
- bent
- Prior art date
Links
- 230000001133 acceleration Effects 0.000 title claims abstract description 26
- 239000000919 ceramic Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 229910010293 ceramic material Inorganic materials 0.000 claims 3
- 238000005452 bending Methods 0.000 abstract description 35
- 238000005549 size reduction Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002033 PVDF binder Substances 0.000 description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002305 electric material Substances 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
- G01P15/0922—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up of the bending or flexing mode type
Abstract
The object of the present invention is to improve heat resistance, allow bending and make size reduction possible in a polyaxial acceleration sensor beam. A metal plate (1), a ceramic piezo-electric body (3) which has electrodes (2a, 2b) on both surfaces, and a flexible film (5), are bonded together in that order, and the resulting element is bent with the flexible film (5) on the inside.
Description
POLYAXIAL ACCELERATION SENSOR BEAM
The present invention concerns a polyaxial acceleration sensor beam using a piezo-electric body, which is used in a polyaxial acceleration sensor.
Acceleration sensors based on piezoelectric materials are designed so that the acceleration acting on the piezo-electric material is measured by detecting the voltage that is generated by the piezoelectric electric material. This is known as the piezoelectric effect . By setting the sensor so that the action of the acceleration is received in the X and Y directions, a biaxial acceleration sensor can be realized. Conventionally, beams used in polyaxial acceleration sensors of this type have been manufactured using polyvinylidene fluoride (PVDF) or PZT type ceramics. Unfortunately, PVDF has a low heat resistance, and loses its polarization characteristics at temperatures above 80°C. Accordingly, PVDF cannot be used in surface-mounted parts requiring heat resistance.
On the other hand, in cases where ceramics with a good heat resistance are used, bending is difficult to accomplish. Accordingly, there have been polyaxial acceleration sensors using sensor elements formed by fastening an actuating body and a piezo-electric element with a plurality of electrodes to a disk-form substrate.
For example as is disclosed in Japanese Patent Application 5-26744. However, since an actuating body is used, the height of the sensor is increased.
Furthermore, accurate positioning of the actuating body is difficult. Moreover, there are also polyaxial acceleration sensors which are formed by combining a plurality of ceramic bodies in a perpendicular direction. Unfortunately, such sensors are problematic as size reduction is difficult, and it is difficult to combine ceramic sensors which have a uniform sensitivity. Accordingly, it has been difficult to use such sensors as surface-mounted parts.
It is an object of the present invention to provide a ceramic beam for use in a polyaxial acceleration sensor which is superior in terms of heat resistance, which can easily be reduced in size, and which is suitable for use as a surface-mounted part.
In the polyaxial acceleration sensor beam of the present invention the ceramic beam is formed by bending an element in which a metal plate, a ceramic piezo- electric body which has electrodes on both surfaces and a flexible film are bonded with the flexible film located on the inside of the bend.
By bending the element with a flexible film surface on the inside, it is possible to provide a ceramic beam in which the scattering of pieces of broken ceramic is prevented even if the ceramic itself should break, and in which the scattering of the electrodes is also prevented so that electrical continuity can be maintained between the electrodes.
Additionally, it is important that the element is bent with the flexible film described above on the inside is that since if the element is bent with the film on the outside, the film itself will break in cases where the bending radius is small. Moreover, for the most efficient detection of acceleration on two perpendicular axes, it is basically desirable that the bending angle be a right angle. However, since it is possible to measure the acceleration as long as the components of the acceleration can be detected, the bending angle is not limited to a right angle.
Invention will now be described by way of example with reference to the accompanying drawings in which:
Figure 1 is a sectional view which illustrates a polyaxial acceleration sensor beam constituting one working configuration of the present invention.
Figure 2 is a plan view illustrating the state of the beam prior to bending.
Figure 3 is a sectional view illustrating the state of the beam prior to bending.
Figure 4 is a sectional view which illustrates a polyaxial acceleration sensor beam constituting another working configuration of the present invention.
Figure 5 is a sectional view which illustrates a polyaxial acceleration sensor beam constituting still another working configuration of the present invention.
Various embodiments of the polyaxial acceleration sensor beam of the present invention will be described below with reference to the attached figures. Figure 1 is a sectional view which illustrates one working configuration of the polyaxial acceleration sensor beam of the present invention. Figure 2 is a plan view which illustrates the state of the beam prior to bending, and Figure 3 is a sectional view which illustrates the state of the beam prior to bending. As is shown in Figure 1, the metal plate 1 which supports the structure of the main body of the beam also acts as a terminal which detects the voltage of the piezo-electric element. Furthermore, this metal plate 1 is bonded by an adhesive agent 4 to a piezo-electric element 3 which has electrodes 2a, 2b formed by metallizing both surfaces of the piezo-electric element 3. Here, the electrode 2b has projections and indentations in its surface which are formed naturally in the manufacturing process in accordance with projections and indentations in the ceramic surface, or which are formed by a screen printing process, so that sufficient electrical continuity with the metal plate 1 can be obtained by applying pressure at the time of bonding with the adhesive agent . Furthermore, an insulating layer 5 is formed by a flexible film on the surface of the electrode 2a. In this state,even if the ceramic itself should break along line A-A1 when the element is bent with the flexible film surface on the inside, the scattering of broken pieces of ceramic is prevented by the insulating layer
5. Furthermore, scattering of the electrode 2a is also prevented so that electrical continuity between the electrodes (B-B') can be maintained.
Furthermore, it is also possible to maintain an electrical connection between the portions of the electrode 2a located on both sides of the bent area (following bending) by forming a conductive layer 7 on top of an insulating layer 6 in order to insure conductivity (as shown in Figure 4) . Moreover, by forming a cut-out area in the bent portion of the ceramic beforehand, and forming an insulating layer 6a consisting of a flexible insulating ink and a conductive layer 7a consisting of a flexible conductive ink in this cut-out area (as shown in Figure 5) , it is possible to reduce the possibility of breakage of the ceramic piezo- electric body 3 during bending to the inside, and to reduce the bending radius.
Here, the metal plate 1 functions as a supporting body, and has ductility in order to allow bending. Furthermore, since the metal plate 1 is bonded to a ceramic piezo-electric body 3, a metal plate whose coefficient of thermal expansion is close to that of the ceramic is used in order to prevent peeling caused by heat. Examples of metal plate materials which satisfy these conditions include aluminum, phosphorus bronze, copper, alloy 42 and stainless steel.
Furthermore, the electrodes 2a formed on both surfaces of the piezo-electric body 3 are formed by metallization using a conductive ink. In concrete terms, electrodes formed by firing at a high temperature
of 600 to 1000°C following printing, electrodes formed by heating a carbon type conductive ink to a temperature of approximately 200°C, screen-printed electrodes, or electrodes formed by some other film formation process such as vacuum evaporation or sputtering, may be used. There are no particular restrictions on the adhesive agent which is used to bond the metal plate 1 and the ceramic piezo-electric body 3. However, it is desirable that this adhesive agent be able to withstand soldering temperatures.
Furthermore, the flexible film 5 may be either an insulating film or a conductive film. This film 5 must show flexibility and good adhesion to the electrode 2a; for example, this film 5 may be formed by an insulating ink. Alternatively, this film 5 may be formed as a conductive layer instead by using a conductive ink rather than an insulating ink. Furthermore, in order to insure conductivity, it is also possible to form a multi-layer structure consisting of an insulating layer and a conductive layer. Generally, in cases where a conductive layer is formed, the admixture of metal particles (powdered carbon or the like) causes a drop in flexibility; accordingly, this drop in flexibility may be compensated for by using a multi-layer structure. Examples of insulating flexible film materials include synthetic rubbers such as SBR (styrene-butadiene rubber) , NBR (acrylonitrile-butadiene rubber) or the like, silicone rubber, flexible polyesters and flexible epoxy resins.
On the other hand, examples of conductive flexible film materials include materials formed by dispersing conductive particles in the insulating materials described above. Examples of conductive particles which can be used include carbon particles and particles of metals such as Ag or Cu. Alternatively, a material formed by forming a metal plating on the particle surfaces of a particle-form resin may also be used.
Furthermore, the thickness of the electrodes 2a, 2b applied to both surfaces of the piezo-electric body 3 is 2 to 5 microns, the thickness of the adhesive agent 4 which is used to bond the metal plate is close to 0 microns, and the thickness of the flexible film 5 is 0.5 to 100 microns (preferably around 10 microns) .
Embodiments of the present invention will be described in detail below:
In a first embodiment a ceramic beam was prepared in which an alloy 42 metal plate with a thickness of 50 microns was bonded to a PZT type piezo-electric ceramic having a thickness of about 50 microns manufactured by Megasera K.K., which had been coated on both sides with an Ag conductive ink. On a portion of this material, the surface of the conductive ink was coated with an ultraviolet-curable resist ink UVCF-530G (manufactured by Shikoku Kasei K.K.) so that a flexible film was formed. Next, bending dies with tip shapes ranging from a radius of 0.2 to 1 mm were prepared, and samples of the ceramic beam were subjected to bending with the
metal plate on the front side or back side. Afterward, the electrical continuity was checked. The results obtained are shown in Table 1.
Table 1
Bent beam continuity for various types of ceramic beams bent at various bending radii.
Bending Radius R (mm) 0.2 0.4 0.6 1.0 Resist present/metal 0 0 0 0 Embodiment surface on outside
Resist present/ceramic X X X Comparative Example surface on outside
No resist/metal surface X X X X Comparative Example on outside
No resist/ceramic X X X X Comparative Example surface on outside o = good electrical continuity, X = faulty electrical continuity due to damage in bent area. Thus, electrical continuity was obtained only when a resist ink was applied and the beam was bent with the metal plate surface on the outside.
In a further embodiment, a ceramic beam was prepared in which an alloy 42 metal plate with a thickness of 50 microns was bonded to a PZT type piezo- electric ceramic (thickness: 50 microns) manufactured by Megasera K.K., which had been coated on both sides with an Ag conductive ink. A thermosetting conductive ink RP-151 (manufactured by Nippon Kokuen Kogyo K.K.) was then applied as a conductive ink so that a flexible film was formed. Next, bending dies with tip shapes ranging in radius from 0.1 to 2mm were prepared, and
samples of the ceramic beam were subjected to bending with the metal plate on the front side or back side. Afterward, the electrical continuity was checked. The results obtained are shown in Table 2. Here and below, O and X indicate the same evaluation grades as in Embodiment 1.
Table 2 Bent beam continuity for various types of ceramic beams bent at various bending radii.
Bending Radius R (mm) 0.2 0.4 0.6 l.o
Metal surface on outside 0 0 0 0 Embodiment
Ceramic surface on outside X X X x Comparative Example
Thus, electrical continuity was obtained only when the beam was bent with the metal plate surface on the outside.
In a further embodiment, a ceramic beam was prepared in which an alloy 42 metal plate with a thickness of 50 microns was bonded to a PZT type piezo- electric ceramic having a thickness of about 50 microns manufactured by Megasera K.K. , which had been coated on both sides with an Ag conductive ink. A thermosetting resist ink CF-30GK-10 (manufactured by Shikoku Kasei K.K.) or a thermosetting resist ink CCR-2200FX (manufactured by Asahi Kagaku Kenkyujo K.K.) was applied as a resist ink so that a flexible insulating film 6 (see Figure 4) was formed. Next, a thermosetting conductive ink LS-411 (manufactured by Asahi Kagaku Kenkyujo K.K.) was applied to the surface of the flexible insulating film 6 as a conductive ink, so that
a conductive film 7 (see Figure 4) was formed. Next, bending dies with tip shapes ranging in radius from 0.2 to 1.0 mm were prepared, and samples of the ceramic beam were subjected to bending with the metal plate on the front side or back side. Afterward, the electrical continuity was checked. The results obtained are shown in Table 3.
Table 3. Bent beam continuity for various types of ceramic beams bent at various bending radii.
Bending Radius R (mm) 0.2 0.4 0.6 1.0
1) CF-30GK-10 and S-411 0 0 0 0 Embodiment applied/bent with metal surface on the outside
2) CF-30GK-10 and LS-411 X Comparative Example applied/bent with ceramic surface on the outside
3) CCR-2200FX and LS-411 Embodiment applied/bent with metal surface on the outside
4) CCR-2200FX and LS-411 X Comparative Example applied/bent with ceramic surface on the outside
Thus, electrical continuity was obtained only when the element was bent with the metal plate surface on the outside.
A ceramic beam was prepared in which an alloy 42 metal plate with a thickness of 50 microns was bonded to a PZT type piezo-electric ceramic having a thickness of about 50 microns manufactured by Megasera K.K., which had been coated on both sides with an Ag conductive ink. The ceramic in the area to be bent was ground away with
a polisher, so that the underlying metal was exposed. A thermosetting resist ink CF-30GK-10 (manufactured by Shikoku Kasei K.K.) or a thermosetting resist ink CCR- 2200FX (manufactured by Asahi Kagaku Kenkyujo K.K.) was applied as a resist ink to this portion so that a flexible insulating film 6a (see Figure 5) was formed; next, a thermosetting conductive ink LS-411 (manufactured by Asahi Kagaku Kenkyujo K.K.) was applied to the surface of the flexible insulating film 6a as a conductive ink, sc that a conductive film 7a (see Figure 5) was formed. Next, bending dies with tip shapes ranging from R 0.1 to R 1.0 were prepared, and samples of the ceramic beam were subjected to bending with the metal plate on the front side or back side. Afterward, the electrical continuity was checked. The results obtained are shown in Table 4.
Table 4 . Bent beam continuity for various types of ceramic beams bent at various bending radii .
Bending Radius R (mm) 0.1 0.2 0.4 0.6 1.0
1) CF-30GK-10 and LS-411 0 0 0 0 0 Embodiment applied/bent with metal surface on the outside 2 ) CF-30GK-10 and LS-411 X X Comparative Example applied/bent with ceramic surface on the outside
3 ) CCR-2200FX and LS-411 0 0 0 0 0 Embodiment applied/bent with metal surface on the outside
4 ) CCR-2200FX and LS-411 X X X X Comparative Example applied/bent with ceramic surface on the outside
Thus, electrical continuity was obtained only when the element was bent with the metal plate surface on the outside. Furthermore, as a result of the ceramic being cut away, bending was possible even when the bending radius was 0.1 mm.
Thus, as is clear from the results shown in Tables 1 through 4 for Embodiments 1 through 4, the ceramic beam of the present invention is able to withstand bending, and can be used as a polyaxial acceleration sensor which has biaxial sensitivity. Furthermore, the beam of the present invention can be used as a biaxial acceleration sensor with a small size and good heat resistance, without any need to combine a plurality of sensors. Moreover, a polyaxial sensor which has triaxial sensitivity can easily be realized by combining a plurality of bending directions.
Claims
1. A polyaxial acceleration sensor beam having a metal plate disposed between piezo ceramic material, characterized in that: said metal plate said piezo ceramic material have a bend of approximately 90° with a flexible film located on an inside section of said bend.
2. A polyaxial sensor as recited in claim 1 further characterized in that : electrodes are located on both surfaces of said piezo ceramic material.
3. A polyaxal acceleration sensor beam having a metal plate and a piezo electric ceramic body, characterized in that: a groove is located in a portion of said body.
4. A polyaxial sensor beam as recited in claim 3 further characterized in that: a flexible insulating film and a conductive film are disposed in said groove.
5. A polyaxial sensor beam as recited in claim 4 further characterized in that: said metal plate, said body, said insulating film and said conductive film have a bend of approximately
90°.
6. A polyaxial sensor beam as recited in claim 5 further characterized in that : said body has electrodes on both sides.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7230311A JPH0972929A (en) | 1995-09-07 | 1995-09-07 | Multiaxial accelerometer beam |
| JP7/230311 | 1995-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1997009622A1 true WO1997009622A1 (en) | 1997-03-13 |
Family
ID=16905852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1996/014367 WO1997009622A1 (en) | 1995-09-07 | 1996-09-09 | Polyaxial acceleration sensor beam |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0972929A (en) |
| WO (1) | WO1997009622A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0526744A (en) * | 1991-07-17 | 1993-02-02 | Kazuhiro Okada | Force, acceleration, or magnet sensor using piezoelectric element |
| EP0538976A1 (en) * | 1991-10-18 | 1993-04-28 | Seagate Technology International | Apparatus for sensing operating shock on a disk drive |
| WO1993013426A1 (en) * | 1991-12-23 | 1993-07-08 | Elf Atochem North America Inc. | Multi-mode accelerometer |
-
1995
- 1995-09-07 JP JP7230311A patent/JPH0972929A/en active Pending
-
1996
- 1996-09-09 WO PCT/US1996/014367 patent/WO1997009622A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0526744A (en) * | 1991-07-17 | 1993-02-02 | Kazuhiro Okada | Force, acceleration, or magnet sensor using piezoelectric element |
| EP0549807A1 (en) * | 1991-07-17 | 1993-07-07 | OKADA, Kazuhiro | Sensor for force, acceleration and magnetism using piezoelectric devices |
| EP0538976A1 (en) * | 1991-10-18 | 1993-04-28 | Seagate Technology International | Apparatus for sensing operating shock on a disk drive |
| WO1993013426A1 (en) * | 1991-12-23 | 1993-07-08 | Elf Atochem North America Inc. | Multi-mode accelerometer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0972929A (en) | 1997-03-18 |
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