WO1996016796B1 - Electrical contact having a particulate surface - Google Patents
Electrical contact having a particulate surfaceInfo
- Publication number
- WO1996016796B1 WO1996016796B1 PCT/US1995/016044 US9516044W WO9616796B1 WO 1996016796 B1 WO1996016796 B1 WO 1996016796B1 US 9516044 W US9516044 W US 9516044W WO 9616796 B1 WO9616796 B1 WO 9616796B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact
- electrical contact
- conductive particles
- particles
- hardness
- Prior art date
Links
- 239000002245 particle Substances 0.000 claims abstract 24
- 239000000463 material Substances 0.000 claims abstract 8
- 239000007787 solid Substances 0.000 claims abstract 4
- 239000000446 fuel Substances 0.000 claims abstract 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 2
- 239000001301 oxygen Substances 0.000 claims abstract 2
- 238000007750 plasma spraying Methods 0.000 claims abstract 2
- 238000005507 spraying Methods 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 230000023298 conjugation with cellular fusion Effects 0.000 claims 3
- 230000013011 mating Effects 0.000 claims 3
- 230000021037 unidirectional conjugation Effects 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 abstract 2
Abstract
The present invention comprises an electrical contact (84) having solid homogeneous conductive particles on the contact (84) surface. The particles are of greater hardness than that of the contact (84) material to deform the contact (84) material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact (84) surface by a technique which results in the particles being intimately bonded to the contact (84) surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact (84) surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact (84) material.
Claims
1. An electrical contact comprising: a substrate having a contact surface; a plurality of solid homogenous conductive particles permanently applied to the contact surface so as to provide a conductive contact area, wherein the conductive particles have a hardness in the range of 100-7000 on the Knoop scale, and a size range from about 200 microinches to about 1 microinch or less, the particle size being greater than the thickness of an oxide or other contaminating coating on a mating contact surface.
2. The electrical contact of claim 1 wherein the conductive particles are bonded to the contact surface by hypervelocity oxygen fuel spraying.
3. The electrical contact of claim 1 wherein the conductive particles are bonded to the contact surface by plasma spraying.
4. The electrical contact of claim 1 wherein the conductive particles have a hardness greater than that of the contact material as measured on the Knoop scale.
5. The electrical contact of claim 1 wherein the conductive particles are composed of carborundum with a conductive material dispersed therein.
6. The electrical contact of claim 1 wherein the conductive particles are composed of a noble metal.
7. The electrical contact of claim 1 wherein the conductive particles are composed of a conductive compound.
8. An electrical circuit board comprising: an insulating substrate having a surface; a plurality of electrical contact areas on the surface; a plurality of solid homogeneous conductive particles permanently applied to each electrical contact area, the particles having a hardness greater than the hardness of the contact material of the electrical contact areas; wherein the conductive particles have a hardness in the range of 100-7000 on the Knoop scale, and a size range from about 200 microinches to about 1 microinch or less, the particle size being greater than the thickness of an oxide or other contaminating coating on mating contact areas.
9. The circuit board of claim 8 wherein the substrate is rigid and further including a resilient layer between the substrate surface and the electrical contact areas.
10. An electrical device comprising: a substrate of electrically insulating material; an electrical contact material on at least a portion of the substrate; a plurality of solid homogeneous conductive particles permanently applied to the electrical contact material so as to provide a conductive particulate contact area; wherein the conductive particles have a hardness in the range of 100-7000 on the Knoop scale, and a size range from about 200 microinches to about 1 microinch or less, the particle size being greater than the thickness of an oxide or other contaminating coating on the contact area of a mating contact material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/349,042 | 1994-12-02 | ||
| US08/349,042 US5527591A (en) | 1994-12-02 | 1994-12-02 | Electrical contact having a particulate surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1996016796A1 WO1996016796A1 (en) | 1996-06-06 |
| WO1996016796B1 true WO1996016796B1 (en) | 1996-08-01 |
Family
ID=23370666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1995/016044 WO1996016796A1 (en) | 1994-12-02 | 1995-11-30 | Electrical contact having a particulate surface |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5527591A (en) |
| TW (1) | TW312891B (en) |
| WO (1) | WO1996016796A1 (en) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6733036B2 (en) | 1995-06-07 | 2004-05-11 | Automotive Technologies International, Inc. | Automotive electronic safety network |
| US6533316B2 (en) | 1995-06-07 | 2003-03-18 | Automotive Technologies International, Inc. | Automotive electronic safety network |
| US6326704B1 (en) | 1995-06-07 | 2001-12-04 | Automotive Technologies International Inc. | Vehicle electrical system |
| US6648367B2 (en) | 1995-06-07 | 2003-11-18 | Automotive Technologies International Inc. | Integrated occupant protection system |
| US6271482B1 (en) | 1994-08-23 | 2001-08-07 | Thomas & Betts International, Inc. | Conductive elastomer interconnect |
| US5949029A (en) * | 1994-08-23 | 1999-09-07 | Thomas & Betts International, Inc. | Conductive elastomers and methods for fabricating the same |
| US5607882A (en) * | 1994-12-20 | 1997-03-04 | Lucent Technologies Inc. | Multi-component electronic devices and methods for making them |
| US9443358B2 (en) | 1995-06-07 | 2016-09-13 | Automotive Vehicular Sciences LLC | Vehicle software upgrade techniques |
| US5692050A (en) * | 1995-06-15 | 1997-11-25 | Binaura Corporation | Method and apparatus for spatially enhancing stereo and monophonic signals |
| US7744122B2 (en) | 1995-12-12 | 2010-06-29 | Automotive Technologies International, Inc. | Driver side aspirated airbags |
| US6072324A (en) * | 1996-03-19 | 2000-06-06 | Micron Technology, Inc. | Method for testing semiconductor packages using oxide penetrating test contacts |
| CA2245413C (en) * | 1997-09-16 | 2001-09-18 | Thomas & Betts International, Inc. | Conductive elastomer for grafting to an elastic substrate |
| US6019609A (en) * | 1998-05-15 | 2000-02-01 | Thomas & Betts International, Inc. | Elastomeric shielded connector |
| US10240935B2 (en) | 1998-10-22 | 2019-03-26 | American Vehicular Sciences Llc | Vehicle software upgrade techniques |
| US6165628A (en) | 1999-08-30 | 2000-12-26 | General Electric Company | Protective coatings for metal-based substrates and related processes |
| US6590324B1 (en) * | 1999-09-07 | 2003-07-08 | Veeco Instruments, Inc. | Charged particle beam extraction and formation apparatus |
| US6200146B1 (en) | 2000-02-23 | 2001-03-13 | Itt Manufacturing Enterprises, Inc. | Right angle connector |
| CA2350853A1 (en) * | 2001-06-15 | 2002-12-15 | Groupe Minutia Inc. | Method of establishing electrical conductivity between oxide-coated electrical conductors |
| DE10223209A1 (en) * | 2002-05-24 | 2003-12-04 | Delphi Tech Inc | Process for improving the electrical conductivity and the corrosion and wear resistance of a flexible circuit |
| US7825512B2 (en) * | 2005-09-12 | 2010-11-02 | Hewlett-Packard Development Company, L.P. | Electronic package with compliant electrically-conductive ball interconnect |
| US9985295B2 (en) * | 2005-09-26 | 2018-05-29 | General Electric Company | Solid oxide fuel cell structures, and related compositions and processes |
| CN101784471B (en) * | 2007-08-24 | 2013-07-03 | 因温特奥股份公司 | Method for applying an anti-slip coating on moving walkways or escalators |
| KR101339166B1 (en) * | 2012-06-18 | 2013-12-09 | 주식회사 아이에스시 | Test socket with conductive powder having through-hole and fabrication method thereof |
| US9459285B2 (en) * | 2013-07-10 | 2016-10-04 | Globalfoundries Inc. | Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly |
| US20150093923A1 (en) * | 2013-09-27 | 2015-04-02 | Lotes Co., Ltd | Terminal |
| JP6485465B2 (en) * | 2017-01-18 | 2019-03-20 | アンデン株式会社 | Contact device and electromagnetic relay |
| CN108241240B (en) * | 2018-02-08 | 2021-05-14 | 上海天马微电子有限公司 | Display panel and display device |
| US10670653B2 (en) | 2018-05-15 | 2020-06-02 | International Business Machines Corporation | Integrated circuit tester probe contact liner |
| US11509080B2 (en) | 2020-07-22 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
| US11128072B1 (en) | 2020-07-22 | 2021-09-21 | TE Connectivity Services Gmbh | Electrical connector assembly having variable height contacts |
| US11509084B2 (en) | 2020-07-24 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
| US11894629B2 (en) | 2021-03-09 | 2024-02-06 | Tyco Electronics Japan G.K. | Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU612771B2 (en) * | 1988-02-26 | 1991-07-18 | Minnesota Mining And Manufacturing Company | Electrically conductive pressure-sensitive adhesive tape |
| US5137461A (en) * | 1988-06-21 | 1992-08-11 | International Business Machines Corporation | Separable electrical connection technology |
| US5083697A (en) * | 1990-02-14 | 1992-01-28 | Difrancesco Louis | Particle-enhanced joining of metal surfaces |
| US5118299A (en) * | 1990-05-07 | 1992-06-02 | International Business Machines Corporation | Cone electrical contact |
-
1994
- 1994-12-02 US US08/349,042 patent/US5527591A/en not_active Expired - Lifetime
-
1995
- 1995-11-30 WO PCT/US1995/016044 patent/WO1996016796A1/en active Application Filing
- 1995-12-04 TW TW084112896A patent/TW312891B/zh not_active IP Right Cessation
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